2002-2012 Microchip Technology Inc. DS21362C-page 1
TC1173
Features
Extremel y Low Supply Current for Lo nger Battery Life
Very Low Dropout Voltage
300mA Output Current
Standard or Custom Output Voltages
ERROR Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
Power Saving Shutdow n Mode
Bypass Input for Ultra Quiet Operation
Over Current and Over Temperature Protection
Space-Saving MSOP Package Option
Applications
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
Device Selection Table
NOTE: xx indicates output voltages
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
General Description
The TC1173 is a precision output (typically ±0.5%)
CMOS low dropout regulator. Total supply current is
typically 50A at full load (20 to 60 times lower than in
bipolar regu lat ors ).
TC1173 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load) and internal feed-forward
compensation for fast response to step changes in
load. An error output (ERROR) is asserted when the
TC1173 is out-of-regulation (due to a low input voltage
or excessive output current). ERROR can be set as a
low battery warning or as a processor RESET signal
(with the addition of an external RC network). Supply
current is reduced to 0.05A (typical) and V
OUT
and
ERROR fall to zero when the shutdown input is low.
The TC1173 incorporates both over temperature and
over current protection. The TC1173 is stable with an
output capacitor of only 1F and has a maximum
output cu rrent of 300mA.
Typical Application
Package Type
Part Number Package Junction
Temp. Range
TC1173-xxVOA 8-Pin SOIC -40°C to +125°C
TC1173-xxVUA 8-Pin MSOP -40°C to +125°C
TC1173
1
2
3
45
6
7
8
V
OUT
V
OUT
C
BYPASS
470pF
(Optional)
Shutdown Control
(from Power Control Logic)
C1
1μF
GND
NC
Bypass
V
IN
V
IN
NC
SHDN
+
ERROR
R3
1M
ERROR
8-Pin SOIC
1
2
3
4
VIN
5
6
7
8
NC
VOUT
GND
NC
Bypass
TC1173VOA
8-Pin MSOP
1
2
3
4
VIN
5
6
7
8
NC
VOUT
GND
NC
Bypass
SHDN
TC1173VUA
ERROR SHDN
ERROR
300mA CMOS LDO with Shutdown ERROR Output and Bypass
TC1173
DS21362C-page 2 2002-2012 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage... ...... ...... ...(VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range......-40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and funct ional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1173 ELECTRICAL SPECIFICATIO NS
Electrical Characteristics: VIN = V OUT + 1V, IL = 0.1mA, CL = 3.3F, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperat ures of -40°C to +125°C.
Symbol Parameter Min Typ Max Units Test Conditions
VIN Input Operating Voltage 2.7 6.0 VNote 8
IOUTMAX Maximum Output Current 300 ——mA
VOUT Output Voltage
VR – 2.5% VR ±0.5%
VR + 2.5% VNote 1
VOUT/TV
OUT Temperature Coefficient 40 ppm/°C Note 2
VOUT/VIN Line Regulation 0.05 0.35 %(V
R + 1V) VIN6V
VOUT/VOUT Load Regulation 0.5 2.0 %I
L = 0.1mA to IOUTMAX (Note 3)
VIN-VOUT Dropout Voltage
20
80
240
30
160
480
mV IL = 0.1mA
IL = 100mA
IL = 300mA (Note 4)
ISS1 Supply Current 50 90 A SHDN = VIH,
ISS2 Shutdown Supply Current 0.05 0.5 A SHDN = 0V
PSRR Power Supply Rejection Ratio 60 dB FRE 1kHz
IOUTSC Output Short Circuit Current 550 650 mA VOUT = 0V
VOUT/PDThermal Regulation 0.04 V/W Note 5
eN Output Noise 260 nV/Hz F = 1kHz, COUT = 1F,
RLOAD = 50
SHDN Input
VIH SHDN Input High Threshold 45 ——%V
IN
VIL SHDN Input Low Threshold 15 %VIN
ERROR Output
VMIN Minimum Operating Voltage 1.0 V
VOL Output Logic Low Voltage 400 mV 1 mA Flows to ERROR
VTH ERROR Threshold Vol tage 0.95 x VR—V
VOL ERROR Positive Hysteresis 50 mV Note 7
Note 1: VR is the user-programmed regulator output voltage setting.
2:
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regula-
tion specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Cons id er ations for more details.
7: Hysteresis voltage is referenced by VR.
8: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x T
2002-2012 Microchip Technology Inc. DS21362C-page 3
TC1173
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin MSOP) Symbol Description
1V
OUT Regulated voltage output.
2 GND Ground terminal.
3 NC No connect.
4 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise.
5 ERROR Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance
by approximately – 5%.
6 SHDN S hutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05A (typical).
7 NC No connect.
8V
IN Unregulated supply input.
TC1173
DS21362C-page 4 2002-2012 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
The TC1173 is a fixed output, low drop-out regulator.
Unlike bipolar regulators, the TC1173’s supply current
does not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to IOUTMAX operating load current range, (an
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be co nne cted directl y to the inp ut sup pl y. While
in shutdown, supply current decreases to 0.05A
(typical), VOUT falls to zero and ERROR is disabled.
FIGURE 3-1: TYPICAL APPLICATION
CIRCUIT
3.1 ERROR Output
ERROR is driven low whenever VOUT falls out of
regulation by more than – 5% (typical). This condition
may be caused by low input voltage, output current
limiting, or thermal limiting. The ERROR threshold is
5% below rated VOUT regardless of the programmed
output voltage value (e.g., ERROR = VOL at 4.75V
(typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V
regulator). ERROR output operation is shown in
Figure 3-2.
Note that ERROR is active when VOUT is at or below
VTH, and inactive when VOUT is above VTH + VH.
As shown in Figure 3-1, ERROR can be used as a
battery low flag, or as a processor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maint ain ERROR bel ow V IH of the processor
RESET input for a t least 2 00 msec t o allow ti me for th e
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
FIGURE 3-2: ERROR OUTPUT
OPERATION
3.2 Output Capacitor
A 1F (min) capacitor from VOUT to ground is
recommended. The output capacitor should have an
effective series resistance greater than 0.1 and less
than 5.0. A 1F c apacit or shou ld be connect ed fro m
VIN to GND if there is more than 10 inches of wire
between the regul ator and th e AC filt er capaci tor, or if a
battery is used as the power source. Aluminum
electrolytic or tantalum capacitor types can be used.
(Since man y alum inum e lectrolyti c cap aci tors free ze at
approximately -30°C, solid tantalums are recom-
mended for applications operating below -25°C.)
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
3.3 Bypass Input
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but res ult s in a longe r time peri od to rated ou tput
voltage when power is initially applied.
TC1173
1
2
3
4
V
OUT
V
OUT
C
BYPASS
470pF
(Optional)
Shutdown Control
(from Power Control Logic)
C1
1μF
GND
NC
Bypass
V
IN
NC
SHDN
+
ERROR 5
6
7
8
C3 required only if ERROR
is used as a processor RESET signal.
(see text)
Battery
RESET or
Battery Low
R3
1M
C2
1μF
C3
0.2μF
+
+
V
TH
V
OUT
ERROR
V
IH
V
OL
HYSTERESIS (V
H
)
2002-2012 Microchip Technology Inc. DS21362C-page 5
TC1173
4.0 THERMAL CONSIDERATION S
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
4.2 Power Dis sipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the ma ximu m ambient tempe rature
(TA
MAX
), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(JA). The 8-Pin SOIC package has a JA of approxi-
mately 160°C/Watt, while the 8-Pin MSOP package
has a JA of approximately 200°C /Watt.
EQUATION 4-2:
Equation 4-1 can be used in con ju nct ion wi th Equa tio n
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
VINMAX = 3.0V ± 10%
VOUTMIN = 2.7V ± 0.5%
ILOADMAX = 250mA
TJMAX = 125°C
TAMAX = 55°C
JA = 200°C/W
8-Pin MSOP Package
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD (VINMAX – VOUTMIN)ILOADMAX
= [(3.0 x 1.1) – (2.7 x .995)]250 x 10–3
= 155mW
Maximum allowable power dissipation:
In this example, the TC1173 dissipates a maximum of
155mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 250mW into Equation 4-1, from
which VINMAX = 4.1V.
4.3 Layout Considerations
The prima ry path of he at conductio n out of the p ackage
is via the package leads. Therefore, layouts having a
groun d plane , wide trace s at the p ads , and wide po wer
supply bus lines combine to lower JA and therefore
increase the maximum allowable power dissipation
limit.
Where:
PD (VINMAX – VOUTMIN)ILOADMAX
PD
VINMAX
VOUTMIN
ILOADMAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on VIN
PDMAX = (TJMAX – TAMAX)
JA
Where all terms are previously defined.
PDMAX = (TJMAX – TAMAX)
JA
= (125 – 55)
200
= 350mW
TC1173
DS21362C-page 6 2002-2012 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are pro vided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Output Noise
FREQUENCY (kHz)
NOISE (μV/HZ)
10.0
1.0
0.01 0.01 1 10 100 1000
0.1
0.0
R
LOAD
= 50Ω
C
OUT
= 1μF
0.012
0.010
0.008
0.004
0.002
0.000
-0.002
-0.004
0.006
-40°-20°0°20°40°60°80°100°120°
TEMPERATURE (
°
C)
Line Regulation
LINE REGULATION (%)
2.00
1.80
1.60
1.20
1.00
0.80
0.60
0.40
0.20
0.00
1.40
-40°-20°0°20°40°60°80°100°120°
TEMPERATURE (
°
C)
Load Regulation
LOAD REGULATION (%)
1 to 300mA
1 to 50mA
1 to 100mA
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
050 100 150 200 250 300
LOAD CURRENT (mA)
DROPOUT VOLTAGE (V)
100.0
90.0
70.0
80.0
50.0
40.0
60.0
-40°-20°0°20°40°60°80°100°120°
TEMPERATURE (°C)
Supply Current
SUPPLY CURRENT (μA)
3.075
3.025
2.925
2.975
-40°-20°0°20°40°60°80°100°120°
TEMPERATURE (°C)
VOUT vs. Temperature
VOUT (V)
12
°
C
8
85
°
C
C
7
0
°
C
2
5
°
C
0
°
C
C
-4
0
°
C
V
IN
= 4V
I
LOAD
= 100μA
C
LOAD
= 3.3μF
2002-2012 Microchip Technology Inc. DS21362C-page 7
TC1173
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Pack age marking data not availab le at this time.
6.2 Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
PIN 1
User Direction of Feed
Standard Reel Component Orientation
for TR Suffix Device
W
P
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N) 12 mm 8 mm 2500 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
Standard Reel Component Orientation
for TR Suffix Device
PIN 1
User Direction of Feed
P
W
TC1173
DS21362C-page 8 2002-2012 Microchip Technology Inc.
6.3 Package Dimensions
8-Pin MSOP
.122 (3.10)
.114 (2.90)
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.006 (0.15)
.002 (0.05)
.016 (0.40)
.010 (0.25)
.197 (5.00)
.189 (4.80)
.008 (0.20)
.005 (0.13)
.028 (0.70)
.016 (0.40)
6° MAX.
.026 (0.65) TYP.
PIN 1
Dimensions: inches (mm)
Note: For th e mo s t c urr e nt pac kag e d r awi n gs , plea se se e th e M ic roc hi p Pa c ka gi n g Spe ci ficati on lo c at ed
at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21362C-page 9
TC1173
.050
(
1.27
)
TYP.
8
°
MAX.
PIN 1
.244
(
6.20
)
.228
(
5.79
)
.157
(
3.99
)
.150
(
3.81
)
.197
(
5.00
)
.189
(
4.80
)
.020
(
0.51
)
.013
(
0.33
)
.010
(
0.25
)
.004
(
0.10
)
.069
(
1.75
)
.053
(
1.35
)
.010
(
0.25
)
.007
(
0.18
)
.050
(
1.27
)
.016
(
0.40
)
.
8
-Pin
SO
I
C
Dimensions: inches (mm)
Note: For the most cu rr e nt pac ka ge dr aw i ngs, p le ase se e t he Mi c ro c hi p Pa ck ag ing Specifica t i on lo ca t ed
at http://www.microchip.co m/packaging
TC1173
DS21362C-page 10 2002-2012 Microchip Technology Inc.
REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
2002-2012 Microchip Technology Inc. DS21362C-page11
TC1173
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1173
DS21362C-page12 2002-2012 Microchip Technology Inc.
NOTES:
2002-2012 Microchip Technology Inc. DS21362C-page 13
Information contained in this publication regarding device
applications a nd the lik e is p ro vided on ly for your convenien ce
and may be supers eded by updates. It is y our res po ns i bil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip T echnology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Te chnology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKI T logo, CodeGuard, dsPICDEM ,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE , In - Circuit Serial
Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
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SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Tec hnology Germ any II Gm bH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767375
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
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QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21362C-page 14 2002-2012 Microchip Technology Inc.
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Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Worldwide Sales and Service
10/26/12