Approval sheet
Page 6 of 8 ASC_WKxxV_V04 DEC - 2016
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, “Recommended basic climatic and mechanical
robustness testing procedure for electronic components” and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
TEST PROCEDURE REQUIREMENT
Temperature Coefficient
of Resistance(T.C.R)
Clause 4.8
Natural resistance change per change in degree centigrade.
( )
6
121
12 10×
−
ttR RR
(ppm/°C)
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
t
1
: 20°C+5°C-1°C
Refer to
“QUICK REFERENCE DATA”
Short time overload
(S.T.O.L)
Clause 4.13
Permanent resistance change after a 2 second application of
a voltage 2.5 times RCWV or the maximum overload voltage
specified in the above list, whichever is less.
No visible damage
∆R/R max. ±(1%+0.05Ω)
Resistance to soldering
heat(R.S.H)
Clause 4.18
Un-mounted chips completely immersed for 10±1second in a
SAC solder bath at 260℃±5ºC no visible damage
∆R/R max. ±(1%+0.05Ω)
Solderability
Clause 4.17
Un-mounted chips completely immersed for 2±0.5second in
a SAC solder bath at 235℃±5℃ good tinning (>95% covered)
no visible damage
Temperature cycling
Clause 4.19 30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30
minutes at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total
5 continuous cycles
no visible damage
∆R/R max. ±(1%+0.05Ω)
Load life (endurance)
Clause 4.25 1000 +48/-0 hours, loaded with RCWV or Vmax
in chamber
controller 70±2ºC, 1.5 hours on and 0.5 hours off no visible damage
∆R/R max. ±(5%+0.1Ω)
Load life in Humidity
Clause 4.24 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity
chamber controller at 40°C±2°C and 95% relative humidity,
1.5hours on and 0.5 hours off
no visible damage
∆R/R max. ±(5%+0.1Ω)
Endurance at high
temperature
Clause 4.25.3
155
°C, no load, 1000hours
no visible damage
∆R/R max. ±(5%+0.1Ω)
Bending strength
Clause 4.33
Resistors mounted on a 90mm glass epoxy resin
PCB(FR4),
2512, 2010
bending : 1 mm
once for 10 seconds
1206, 0805, 0603 bending: 3mm
once for 10 seconds
∆R/R max. ±(1%+0.05Ω)
Adhesion
Clause 4.32 Pressurizing force: 5N, Test time: 10±1sec. No remarkable damage or
removal of the terminations