REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED Added Arrhenius equation for unbiased bake under margin test method A, back end margin test step C. Corrected military part numbers for device types 01 and 02. Technical changes made to 1.2.2, table I, figure 1, figure 2, figure 4, figure 5, 4.3.1, and table II. Added vendor CAGE 34649 for device type 05. Editorial changes throughout. 89-01-19 M. A. Frye Add device type 08 for vendor CAGE number 66579. Add vendor CAGE number 34335 to the drawing as a source of supply for the 08 device with changes to table I. Deleted programming cycle timing waveform and table III from drawing. Also deleted ESDS from drawing. Editorial changes throughout. 89-10-30 M. A. Frye Deleted vendor CAGE number 34335 as a source of supply for device type 08. Added vendor CAGE number 34335 as a source of supply for device types 01 through 07. Deleted figure 5. Editorial changes throughout. 90-02-26 M. A. Frye D Changes in accordance with NOR 5962-R079-95. 95-02-15 M. A. Frye E Added provisions for QD certification. Added CAGE 0C7V7 to drawing as a source of supply for device type 07. Updated boilerplate. - glg 99-12-03 Raymond Monnin F Boilerplate update, part of 5 year review. ksr 06-09-29 Raymond Monnin G Corrected footnote 1/ on section 1.2.2 package style heading to include all packages. Corrected test method number in 4.3.2 b (1). ksr 09-03-30 Robert M. Heber A B C The original first page of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE PREPARED BY Rick C. Officer CHECKED BY D. A. DiCenzo APPROVED BY Robert P. Evans DRAWING APPROVAL DATE 87-10-23 AMSC N/A REVISION LEVEL G DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16K X 8-BIT ULTRA VIOLET ERASABLE PROGRAMMABLE READ ONLY MEMORY (UVEPROM), MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 . 1 OF 5962-87661 11 5962-E233-09 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87661 01 X A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 04 05 06 07 08 Generic number 1/ 27C128 27C128 27C128 27C128 27C128 27C128 27C128 27C128 Circuit function 16K x 8-bit UVEPROM 16K x 8-bit UVEPROM 16K x 8-bit UVEPROM 16K x 8-bit UVEPROM 16K x 8-bit UVEPROM 16K x 8-bit UVEPROM 16K x 8-bit UVEPROM 16K x 8-bit UVEPROM Access time 90 ns 120 ns 150 ns 170 ns 200 ns 250 ns 300 ns 70 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Descriptive designator GDIP1-T28 or CDIP2-T28 CQCC1-N32 Terminals 28 32 Package style 1/ dual-in-line package rectangular leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 2/ Supply voltage range (VCC) 2/ ..................................................... Supply voltage range (VPP) 2/ ..................................................... All input voltage range except A9 2/ .......................................... Input voltage range (A9) 2/ .......................................................... Output voltage range 2/ .............................................................. Storage temperature range ........................................................ Power dissipation ........................................................................ Lead temperature (soldering, 10 seconds) .................................. Thermal resistance, junction-to-case (JC) ................................... Junction temperature (TJ) .......................................................... Data retention ............................................................................ -0.6 V dc to 6.25 V dc -0.6 V dc to 14.0 V dc -0.6 V dc to 6.25 V dc -0.6 V dc to 13.5 V dc -0.6 V dc to VCC + 1.0 V dc -65C to +150C 300 mW +300C See MIL-STD-1835 +150C 3/ 10 years minimum 1.4 Recommended operating conditions. Supply voltage range (VCC) 4/ .................................................... Supply voltage range (VPP) 5/ ..................................................... High level input voltage range (VIH).............................................. High level input voltage range (VIH).............................................. Low level input voltage range (VIL) ............................................. Low level input voltage range (VIL) ............................................. Case operating temperature range (TC) ...................................... 4.5 V dc to 5.5 V dc 4.5 V dc to 5.5 V dc 2.0 V dc to 6.5 V dc (TTL) VCC -0.2 V dc to VCC +0.2 V dc (CMOS) -0.1 V dc to 0.8 V dc (TTL) GND -0.2 to GND +0.2 V dc (CMOS) -55C to +125C Lid shall be transparent to permit ultraviolet light erasure. Under absolute maximum ratings, voltages are with respect to GND. Maximum junction temperature may be increased to +175C during burn-in and steady-state life. VCC must be applied before or at the same time as VPP and removed after or at the same time as VPP. The device must not be inserted into or removed from the board when VPP or VCC is applied. 5/ VPP can be connected to VCC directly (except in the program mode). VCC supply current in this case would be ICC + IPP. During programming, VPP must be maintained at 12.5 V (0.5 V). 1/ 2/ 3/ 4/ STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 2. 3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 3 TABLE I. Electrical performance characteristics. Test High level output voltage Low level output voltage Input current (leakage) Output current (leakage) VPP supply current VPP supply current (during program pulse) 1/ Operating supply current (active) Standby power supply current (TTL) Standby power supply current (CMOS) Input capactiance Output capacitance Functional tests Symbol VOH VOL II IO IPP1 IPP2 ICC1 ICC2 ICC3 CIN COUT Conditions -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified IOH = -400 A IOL = 2.1 mA VI = 0 V to 5.5 V VO = 0 V to VCC VPP = VCC = 5.5 V VPP = 13 V VCC = 5.5 V, CE = VIL, f = 1/tAVQV, 01-08 = 0 mA VCC = 5.5 V, CE = 2.0 V, f=0 VCC = 5.5 V, CE = VCC, f=0 VI = 0 V, f = 1 MHz, see 4.3.1c VO = 0 V, f = 1 MHz, see 4.3.1c see 4.3.1e Device types All All All All All 01-07 08 03.04, 05,06, 07 08 01 02 01-07 08 01-07 08 All All All Group A Limits subgroups Min Max 1,2,3 2.4 1,2,3 0.45 1,2,3 10 1,2,3 10 1,2,3 100 1 50 60 1,2,3 25 85 70 60 1,2,3 3.0 200 1,2,3 300 500 4 10 14 4 7,8A,8B Unit V V A A A mA mA mA A pF pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 4 TABLE I. Electrical performance characteristics - Continued. Test Address access time 2/ Chip enable access time 2/ Output enable access time 2/ CE or OE disable to output in high Z 1/ CE or OE enable to output valid 1/ 1/ 2/ Symbol tAVQV tELQV tOLQV tEHQZ, tOHQZ tEHQV, tOHQV Conditions -55C < TC < +125C 4.5 V < VCC < 5.5 V unless otherwise specified See figures 3 and 4 See figures 3 and 4 See figures 3 and 4 See figures 3 and 4 See figures 3 and 4 Device types 01 02 03 04 05 06 07 08 01 02 03 04 05 06 07 08 01,02 03,04 05 06 07 08 01,02 03,04 05,06 07 08 All Group A Limits subgroups Min Max 9,10,11 90 120 150 170 200 250 300 70 9,10,11 90 120 150 170 200 250 300 70 9,10,11 50 70 75 100 120 25 9,10,11 50 60 105 25 9,10,11 0 Unit ns ns ns ns ns May not be tested, but shall be guaranteed to the limits specified in table I. For all switching characteristics and timing measurements, inputs pulse levels are 0.40 V and 2.4 V and VPP = 12.5 V0.5 V during programming. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 5 Device types ALL Case Outlines X Y Terminal Number Terminal Symbol 1 VPP NC 2 A12 VPP 3 A7 A12 4 A6 A7 5 A5 A6 6 A4 A5 7 A3 A4 8 A2 A3 9 A1 A2 10 A0 A1 11 O1 12 O2 A0 NC 13 14 O3 GND O2 15 O4 16 O5 O3 GND 17 O6 NC 18 O7 O4 19 O1 O8 O5 20 CE O6 21 A10 O7 22 OE O8 23 A11 CE 24 A9 A10 25 A8 OE 26 A13 NC 27 PGM A11 28 29 VCC --- A8 30 --- A13 31 --- PGM 32 --- VCC A9 NC = no connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 6 Mode Read Output disable Standby Programming Verify Program inhibit Signature mode (see notes 2, 3, and 4) CE VIL VIL VIH VIL VIL VIH VIL Function pins (see note 1) OE PGM VPP VCC A9 VIL VIH VCC VCC X VIH VIH VCC VCC X X X VCC VCC X VIH VIL VPP VCC X VIL VIH VPP VCC X X X VPP VCC X VIL VIH VCC VCC VH VH A0 X X X X X X VIL VIH 01 - 08 DOUT HIGH-Z HIGH-Z DIN DOUT HIGH-Z MFG code Device code NOTES: 1. X can be VIL or VIH. 2. VH = 12 V0.5 V. 3. All other address must be held at VIL. 4. See 6.6. FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 7 FIGURE 3. Read cycle timing waveform. FIGURE 4. Output load circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 8 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator "C" shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator "C" shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be specified by the manufacturer prior to delivery. 3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.4. 3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the procedures and characteristics specified in 4.5. 3.6.3 Verification of erasure or programmability of EPROMS. When specified, devices shall be verified as either programmed to the specified program or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a failure, and shall be removed from the lot. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.10 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be done initially and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but will guarantee the number of years listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MILSTD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 9 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CIN and COUT measurement) shall be measured only for the initial test and after process or design changes which may affect capacitance. Sample size is fifteen devices with no failures and all input and output terminals tested. d. All devices selected for testing shall have a checkerboard pattern or equivalent. After completion of all testing, the devices shall be verified and erased (except devices submitted for groups C and D testing). e. Subgroups 7, 8A, and 8B shall include verification of the truth table. TABLE II. Electrical test requirements. 1/ 2/ 3/ MIL-STD-883 test requirements Subgroups (in accordance with method 5005, table I) Interim electrical parameters (method 5004) --- Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8A, 8B, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 2, 8A, 10 or 1, 2, 3 1/ * Indicates PDA applies to subgroups 1. 2/ Any or all subgroups may be combined when using high-speed testers. 3/ ** See 4.3.1c. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. c. All devices selected for testing shall be programmed with a checkerboard pattern, then verified and erased. 4.4 Erasing procedures. The recommended erasing procedure shall be as specified by the device manufacturer and shall be made available upon request. 4.5 Programming procedures. The programming procedures shall be as specified by the device manufacturer and shall be made available upon request. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 10 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87661 A REVISION LEVEL G SHEET 11 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 09-03-30 Approved sources of supply for SMD 5962-87661 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8766101XA 3/ 3/ 0C7V7 3/ 3/ 0C7V7 3/ 3/ 0C7V7 3/ 3/ 0C7V7 3/ 3/ 3/ 0C7V7 3/ 3/ 3/ 0C7V7 3/ 3/ 3/ 0C7V7 3/ 3/ 3/ 0C7V7 3/ 3/ 3/ 3/ 3/ 0C7V7 3/ 3/ 3/ 0C7V7 5962-8766101YA 5962-8766102XA 5962-8766102YA 5962-8766103XA 5962-8766103YA 5962-8766104XA 5962-8766104YA 5962-8766105XA 5962-8766105YA See footnotes at end of table. Vendor similar PIN 2/ AM27C128-90/BXA WS27C128F-90DMB 27C128-90 AM27C128-90/BUA WS27C128F-90CMB 27C128-90 AM27C128-120/BXA WS27C128L-12DMB 27C128-120 AM27C128-120/BUA WS27C128L-12CMB 27C128-120 AM27C128-150/BXA 27C128-15BXA WS27C128L-15DMB 27C128-150 AM27C128-150/BUA 27C128-15BUC WS27C128L-15CMB 27C128-150 AM27C128-170/BXA 27C128-17BXA WS27C128L-17DMB 27C128-170 AM27C128-170/BUA 27C128-17BUC WS27C128L-17CMB 27C128-170 SMJ27C128-20JM AM27C128-200/BXA MD27C128-20 27C128-20BXA WS27C128L-20DMB 27C128-200 AM27C128-200/BUA 27C128-20BUC WS27C128L-20CMB 27C128-200 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 5962-8766106XA 3/ 3/ 3/ 3/ 0C7V7 5962-8766106YA 3/ 3/ 3/ 0C7V7 3/ 3/ 3/ 3/ 0C7V7 3/ 3/ 3/ 0C7V7 0C7V7 0C7V7 0C7V7 0C7V7 SMJ27C128-25JM AM27C128-250/BXA WS27C128L-25DMB 27C128-25BXA 27C128-250 AM27C128-250/BUA WS27C128L-25CMB 27C128-25BUC 27C128-250 SMJ27C128-30JM AM27C128-300/BXA WS27C128L-30DMB 27C128-30BXA 27C128-300/BXA AM27C128-300/BUA WS27C128L-30CMB 27C128-30BUC 27C128-300 WS57C128FB-70DMB 27C128-70 WS57C128FB-70CMB 27C128-70 5962-8766107XA 5962-8766107YA 5962-8766108XA 5962-8766108YA 2/ 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed, contact the Vendor to determine its availability. 2/ Caution: Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source. Vendor CAGE number 0C7V7 Vendor name and address QP Semiconductor Manufacturing code 01H 2945 Oakmead Village Court Santa Clara, CA 95051 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Device code 16H