Mini-flat Half Pitch Package,
AC Input Photocoupler
■Features
1. 4-pin Mini-flat Half pitch package
(Lead pitch : 1.27mm)
2. Double transfer mold package
(Ideal for Fl ow Soldering)
3. AC input type
4. High collector-emitter voltage (VCE : 80V)
5. Isolation voltage between input and output
(Viso(rms): 2.5kV)
6. RoHS directive compliant
■Description
PC3H4J00001H Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin Mini-flat, half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter voltage is 80V and CTR is 20% to
400% (at IF=± 1mA,VCE=5V,Ta=25℃)
.
1
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC3H4J00001H
Series
PC3H4J00001H Series
1. Programmablecontrollers
■Applications
■Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC3H4)
2.Package resin : UL flammability grade (94V-0)
Sheet No.: OP18008EN
Date Jan. 15. 2018
© SHARPCorporation
Anode / Cathode
Cathode / Anode
Emitter
Collector
1
2
3
4
2
Internal Connection Diagram
1 4
3
Outline Dimensions (Unit : mm)
Product mass : approx. 0.05g
*( ) : Reference Dimensions
Sheet No.: OP18008EN
2
PC3H4J00001H Series
Sheet No.: OP18008EN
3
PC3H4J00001H Series
Date code MON TUE WED THU FRI SAT SUN
652 12/26 12/27 12/28 12/29 12/30 12/31 1/1
701 1/2 1/3 1/4 1/5 1/6 1/7 1/8
702 1/9 1/10 1/11 1/12 1/13 1/14 1/15
703 1/16 1/17 1/18 1/19 1/20 1/21 1/22
・ ・ ・ ・ ・ ・ ・ ・
・ ・ ・ ・ ・ ・ ・ ・
・ ・ ・ ・ ・ ・ ・ ・
752 12/11 12/12 12/13 12/14 12/15 12/16 12/17
751 12/18 12/19 12/20 12/21 12/22 12/23 12/24
752 12/25 12/26 12/27 12/28 12/29 12/30 12/31
801 1/1 1/2 1/3 1/4 1/5 1/6 1/7
Year Week
Date code indication (Ex.)
3-digit number shall be marked the age indication of 1-digit number, and week code of 2-digit number.
Week code “01” indicate the week including the first Thursday of January. And later, Monday is the starting
point.
Rank mark
Refer to the Model Line-uptable.
Country of origin and Plating material
Country of origin Plating material
Japan SnBi (Bi : 1～4%)
■Electro-optical Characteristics (Ta25˚C)
■Absolute Maximum Ratings (Ta25˚C)
*1 Pulse width100s, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
Sheet No.: OP18008EN
4
PC3H4J00001H Series
Parameter Symbol Rating Unit
Input
Forward current IF50 mA
*1 Peak forward current IFM 1 A
Power dissipation P 70 mW
Output
Collector-emittervoltage VCEO 80 V
Emitter-collectorvoltage VECO 6 V
Collector current IC50 mA
Collector power dissipation PC150 mW
Total power dissipation Ptot 170 mW
Operating temperature Topr 30 to 100 ˚C
Storage temperature Tstg 40 to 125 ˚C
*2 Isolation voltage Viso (rms) 2.5 kV
*3 Soldering temperature Tsol 260 ˚C
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Input Forward voltage VFIF20mA 1.2 1.4 V
Terminal capacitance CtV0, f1kHz 30 250 pF
Output
Dark current ICEO VCE50V, IF0 100 nA
Collector-emitter breakdown voltage BVCEO IC0.1mA, IF0 80 V
Emitter-collector breakdown voltage BVECO IE10A, IF0 6 V
Transfer
charac-
teristics
Collector current ICIF1mA, VCE5V 0.2 4.0 mA
Collector-emitter saturation voltage VCE (sat) IF20mA, IC1mA 0.1 0.2 V
Isolation resistance RISO DC500V, 40 to 60%RH 51010 11011
Floating capacitance CfV0, f1MHz 0.6 1.0 pF
Response time Risetime trVCE2V, IC2mA,
RL100
4 18 s
Falltime tf3 18 s
Package Taping
Rank mark IC[mA]
(IFmA, VCE5V,Ta25˚C)
3,500pcs/reel
Model No. PC3H4J00001H with or “_” 0.2 to 4.0
PC3H4AJ0001H A 0.5 to 1.5
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: OP18008EN
5
Model Line-up
PC3H4J00001H Series
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.6 Forward Current vs. Forward Voltage
Sheet No.: OP18008EN
6
Fig.5 Peak Forward Current vs. Duty Ratio
PC3H4J00001H Series
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
Fig.8 Collector Current vs. Collector-emitter
Voltage
Fig.7 Current Transfer Ratio vs. Forward
Current
Fig.11 Collector Dark Current vs. Ambient
Temperature
Sheet No.: OP18008EN
7
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
PC3H4J00001H Series
Fig.14 Test Circuit for Response Time
Sheet No.: OP18008EN
8
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Fig.13 Response Time vs.
Load Resistance
Fig.15 Frequency Response Fig.16 Test Circuit for Frequency Response
PC3H4J00001H Series
✩For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: OP18008EN
9
1.27
0.8
1.5
(Unit : mm)
●Recommended Foot Print (reference)
6.3
PC3H4J00001H Series
Design Considerations
●Design guide
While operating at IF<1mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
●Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the designconsideration.
Sheet No.: OP18008EN
10
PC3H4J00001H Series
Manufacturing Guidelines
●Soldering Method
Reflow Soldering :
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the be-
low listed guidelines.
Flow soldering should be completed below 260℃ and within 10s.
Preheating is within the bounds of 100 to 150℃ and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400℃.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
1 2 3 4
300
200
100
0
0
Terminal : 260˚C peak
(package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or m ore, 60s or less
(min)
Sheet No.: OP18008EN
11
PC3H4J00001H Series
●Cleaninginstructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packagingresin.
●Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
(1) The RoHS directive(2011/65/EU)
This product complies with the RoHS directive(2011/65/EU)
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls
（PBB）and polybrominated diphenyl ethers（PBDE）
(2) Content of six substances specified in Management Methods for Control of Pollution Caused
by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
This table is prepared in accordance with the provisions of SJ/T 11364.
○：Indicates that said hazardous substance contained in all of the homogeneous materials
for this part is below the limit requirement of GB/T 26572.
Category
Hazardous Substances
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
chromium
(Cr6+)
Polybrominated
biphenyls
(PBB)
Polybrominated
diphenyl ethers
(PBDE)
Photocoupler ○○○ ○ ○ ○
Marking Styles for the Names and Contents of the Hazardous Substances
Sheet No.: OP18008EN
12
PC3H4J00001H Series
A B C D E F G
16.00.3 7.50.1 1.750.1 4.00.1 2.00.1 4.00.1 1.50.1
0.0
H I J K L
7.550.1 0.3 2.30.1 2.850.1 1.550.1
(Unit : mm)
Dimensions List
Pull-out direction
Direction of product insertion
Reel structure and Dimensions
a b c d
3302.0 17.51.0 100.01.0 13.00.2
e f g
21.0 2.00.5 2.00.5
Dimensions List (Unit : mm)
[Packing : 3,500pcs/reel]
Package specification
●Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
Sheet No.: OP18008EN
13
PC3H4J00001H Series
■Important Notices
·The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
·Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
·Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i)The devices in this publication are designed for use in
general electronic equipment designs such as:
--- Personal computers
--- Office automationequipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visualequipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Trafficsignals
--- Gas leakage sensor breakers
--- Alarmequipment
--- Various safety devices,etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
·If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
·This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
·Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
