BALUN TRANSFORMERS OPERATING TEMP. 25105 Including self-generated heat Example circuits MB type MC type The above circuits are referetial examples. For details, Please contact us. FEATURES MC High stability due to pair wire windings MC type: pins are molded into the base to create a singular structure This item can be custom designed to meet customer requirements APPLICATIONS Impedance transformers Distribution transformers ORDERING CODE 1 3 5 6 BU 2 4 mm 05 06 5.05.3 6.0 B U 0 T 01 5 1 M 2 B 0 3 1 4 5 1 3 5 6 Type Shape Packaging Internal code BU Balun transformer 2 MB MC pin type Surface-mount type T Tape&Reel BulkOnly pin type Blank space 4 Length of component mm 05 06 388 MB MC 5.0, 5.3 6.0 Product classification code example 01 8 6 Standard product Blank space EXTERNAL DIMENSIONS Pin type Surface-mount type MB MC A A Type 5 B E C C FERRITE PRODUCTS B Fig D D Type A B C D BU05MB BU06MB 5.5 max 8 max BU05MC 5.30.5 0.217 max 0.315 max 0.2090.020 5.5 max 8 max 5.00.3 0.217 max 0.315 max 0.1970.012 6.0 max 8 max 2.70.2 0.236 max 0.315 max 0.1060.008 1.750.2 2.250.2 pitch 1.50.2 pitch 0.0690.008 0.0890.008 0.0590.008 E 3.5 3.55.0 0.138 0.1380.197 Unitmminch Recommended Land Patterns BU05MC 0.5 0.5 1.6 1.6 1 1 1 Unitmm Selection Guide P.12 etc Part Numbers Electrical Characteristics P.390 Packaging Reliability Data P.391 Please contact our Sales Department. 8 P.392 Precautions P.396 389 ELECTRICAL CHARACTERISTICS LOSS VSWR The following chart shows typical ranges for operating characteristics. Please specify the following when ordering. loss standing wave ratioVSWR operating frequency specified test circuit Loss-Frequency characteristics 0 BU05MCTYPE 2 E TYP B 6M 0 BU 75 300 75 Loss 4 6 8 1 390 10 100 Frequency 1000 2000 8 PACKAGING Minimum Quantitypcs. Type Box Taping 2500 BU05MC BU05MB 200 BU06MB 150 3.20.1 20.1 0.0790.004 0.1260.004 1.750.1 0.0690.0040.40.05 0.0160.002 5.20.1 0.2090.004 5 unit: mminch Embossed Tape Top tape Leader and Blank portion Blank portions Chip cavity Blank portions FERRITE PRODUCTS Tape material 80.1 1.5 +0.1 -0 0.3150.004 40.1 0.059+0.004 -0 0.1570.004 5.50.1 0.2170.004 120.3 0.4720.012 Taping dimensions 1 16mmEmbossed tape0.630 inches wide 5.60.1 0.2200.004 Minimum Quantity Leader Sprocket hole Base tape Chip cavity 3.15 inches or more 5.91 inches or more 3.15 inches or more Direction of tape feed Chip Reel size 3302 12.990.079 Label 801 3.150.039 Chip filled 13.51 0.530.039 unit: mminch 0.10.7N The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illutrated below. 8 391 1/2 RELIABILITY DATA Specifled Value Item CommonMode Choke Coils CM04RC Test Method and Remarks CommonMode Choke Coils BU05MC 25120 Including self-generated heat 4085 5 to 40 in taped packaging 3.Rated current Within the specified tolerance The maximum DC value having temperature increase within 4.Impedance Within the specified tolerance 5. Inductance Within the specified tolerance 6.DC Resisitance Within the specified tolerance SMD transformerCommom mode choke coil 7.Resisitance to flexure of Refer to individual specification. Accoding to JIS C0051 1.Operating Temperature Range 2. S t o r a g e Te m p e r a t u re Range specified temperature,as detailed in individual specification. Measuring equipmentHP 4291A or its equivalent Measuring equipmentDC ohmmeter CM04RCBU05MC substrare Warp 3mm Pressing speed Duration 0.5mm/sec. 51sec. FERRITE PRODUCTS Measuring frequencySpecified frequency 5 Pressig jig Board 8.Insulation resistance Applied voltageRated voltage 100M min. Duration60 sec. between wires 9.Rated current Within the specification 10.Withstanding voltage No abnormality Applied voltageRegulation voltage Duration60 sec. between wires 11.Resisitance to vibration Accoding to JIS C0040 Refer to individual specification. Directions2 hrs each in X, Y, and Z directions. Total6 hrs Frequency range10 to 55 to 10 Hz1 min. Amplitude1.5mmShall not exceed acceleration 196m/s2 Mounting methodsoldering onto printed board Recovery At least 2 hrs of recovery under the standard condition after the test,followed by the measurement within 24 hrs. A kind of vibrationA 12.Solderability At least 75 of terminal electrode is covered by CM04RCBU05MC new solder. 13.Resisitance to soldering Solder temperature 2355 Duration 20.5 sec. Immersion depth Up to 0.5mm from terminal root Reflow soldering Refer to individual specification. Preheating100 to 150 1 to 2min. heat Peak230 to 240 Within 5sec. More than 200 Within 40 sec. Number of reflowWithin 2 times. Manual soldering Solder temperature3505 Duration31sec. Recovery 1 to 2 hrs of recovery under the standard condition after the test. 8 393 2/2 RELIABILITY DATA Specifled Value Item 14.Thermal shock CommonMode Choke Coils CM04RC Test Method and Remarks CommonMode Choke Coils BU05MC Refer to individual specification. Accoding to JIS C0025 Conditions of 1 cycle Temperature CM04RCBU05MC Durationmin 253 2 Room temperature 3 3 853 303 4 Room temperature 3 303 Number of cycyle10 cycles Recovery12 hrs of recovery under the standard condition after removal from test chamber. 15.Loading under damp heat Refer to individual specification. CM04RCBU05MC Temperature 403 Humidity 9095 Applied current Rated current Duration 100024 5 FERRITE PRODUCTS 1 Recovery12 hrs of recovery under the standard condition after removal from test chamber. 16.High temperature life test Refer to individual specification. CM04RCBU05MC Temperature 853 Duration 100024 Recovery12 hrs of recovery under the standard condition after removal from test chamber. 17.Low Temperature life Test Refer to individual specification. CM04RCBU05MC Temperature 403 Duration 100024 Recovery12 hrs of recovery under the standard condition after removal from test chamber. Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure. When there are questions conceming measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." 8 395 PRECAUTIONS CM04RC BU05MC Stages 1.Circuit Design Precautions Technical considerations Operating environment, 1.The products described in this specification are intended for use in general equipment, electronic equipment,(office telecommunications systems, supply measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, 5 injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. Surface Mounting Land pattern design 1.Please contact any of our offices for a land pattern, and refer to a recommended land pattern of specifications. Mounting and soldering conditions should be checked beforehand. Applicable soldering process to this products is reflow soldering only. Recommended Land Patterns CM04RC BU05MC 0.5 0.5 1.6 1.4 6.7 3.2 1.4 1.6 3.Considerations for automatic placement 1 1 1.8 0.74 1.8 1 Unitmm FERRITE PRODUCTS 2.PCB Design Unitmm Adjustment of mounting machine 1.Excessive impact load should not be imposed on the products when mounting onto the PC boards. 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 2.Mounting and soldering conditions should be checked beforehand. 4.Soldering Reflow soldering 1.Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 1.If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. 2.This products is reflow soldering only. 3.SMD Inductors Please do not add any stress to a product until it returns in normal temperature after reflow soldering. Lead free soldering 1.When using products with lead free soldering, we request to use them after confirming of adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. Recommended conditions for using a soldering iron: Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350 Duration - 3 seconds or less The soldering iron should not directly touch the inductor. 5.Cleaning Cleaning conditions 1.SMD Inductors Please contact any of our offices for a cleaning, 6.Handling Handling 1.Keep the product away from all magnets and magnetic 1.There is a case that a characteristic varies with magnetic influence. objects. Breakaway PC boards (splitting along perforations) 1.When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or 1.Planning pattern configurations and the position of products should be carefully performed to minimize stress. twisting to the board. 2.Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1.Please do not give the product any excessive mechanical 1.There is a case to be damaged by a mechanical shock. shocks. 2.SMD Inductors 2.SMD Inductors Please do not add any shock and power to a product in There is a case to be broken by the handling in transportation. transportation. Pick-up pressure 1.SMD Inductors 1.SMD Inductors Please do not push to add any pressure to a winding part. Damage and a characteristic can vary with an excessive shock or stress. Please do not give any shock and push into a ferrite core exposure part. Packing 1.SMD Inductors Please avoid accumulation of a packing box as much as 1.There is a case that transformation and a product of tape are damaged by accumulation of a packing box. possible. 7.Storage conditions Storage 1.To maintain the solderability of terminal electrodes and to 1.Under a high temperature and humidity environment, problems suchas reduced caused by oxidation of terminal keep the packing material in good condition, temperature solderability and humidity in the storage area should be controlled.. oftaping/packaging materials may take place. electrodes and deterioration Recommended conditions Ambient temperature Humidity 040 Below 70% RH The ambient temperature must be kept below 30. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within one year from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. 8 397