用途 APPLICATIONS
形名表記法 ORDERING CODE
特長 FEATURES
388
8
例 01
example 01
B U 0 5 M B 0 1 △○
1
2
3
4
5
6
・多孔型（メガネ状）及びリング状フェライトコアにバイファラ巻線したバ
ルントランス
・MCタイプはベース一体構造により薄型を実現
バルントランス
BALUN TRANSFORMERS
OPERATING TEMP. ー25〜＋105℃（製品自己発熱含む）
（Including self-generated heat）
BU Balun transformer
1
Type 
・High stability due to pair wire windings
・MC type: pins are molded into the base to create a singular structure
・This item can be custom designed to meet customer requirements
BU バルントランス
1
形式
05 5.0、5.3
06 6.0
コアの長辺寸法〔mm〕
2
3
形状
MB ピンタイプ
MC 面実装タイプ
4
試作番号
・インピーダンス変換器
・分配器
5
包装記号
T テーピング
△ 単品（ピンタイプのみ）
△＝スペース
・Impedance transformers
・Distribution transformers
6
当社管理記号
△ 標準品
△＝スペース
2
05 5.0, 5.3
06 6.0
Length of component〔mm〕
3
Shape
MB pin type
MC Surface-mount type
4
5
Packaging
T Tape&Reel
△ Bulk（Only pin type）
△＝Blank space
6
Internal code
△ Standard product
△＝Blank space
回路例
Example circuits
Product classification code
MB type MC type
上記回路は参考例です。詳細につきましては弊社へご連絡下さい。
The above circuits are referetial examples. For details, Please contact us.
外形寸法 EXTERNAL DIMENSIONS
389
FERRITE PRODUCTS
5
8
P.390 P.391 P.392P.12
推奨ランドパターン Recommended Land Patterns
Type BU05MB BU06MB BU05MC
A 5.5 max 8 max 5.3±0.5
（0.217 max） （0.315 max） （0.209±0.020）
B 5.5 max 8 max 5.0±0.3
（0.217 max） （0.315 max） （0.197±0.012）
C 6.0 max 8 max 2.7±0.2
（0.236 max） （0.315 max） （0.106±0.008）
D 1.75±0.2 2.25±0.2 pitch 1.5±0.2 pitch
（0.069±0.008） （0.089±0.008） （0.059±0.008）
E 3.5 3.5〜5.0
（0.138） （0.138±0.197） 
Fig
ピンタイプ 面実装タイプ
Pin type Surface-mount type
MB MC
Type
Unit：mm（inch）
B
D
CA
A
B
CE
D
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
セレクションガイド
Selection Guide
etc
※P.396
※営業窓口に御相談ください。Please contact our Sales Department.
Unit：mm
1.6
1.6
【BU05MC】
1
0.5
1
0.5
1
390
8
特性図 ELECTRICAL CHARACTERISTICS
・特性は参考例を示します。
・ご用命の際は下記項目をご指定ください。
①挿入損失（LOSS）
②定在波比（VSWR）
③使用周波数
④指定測定回路
・The following chart shows typical ranges for op-
erating characteristics.
・Please specify the following when ordering.
①loss
②standing wave ratio（VSWR）
③operating frequency
④specified test circuit
75 75
300
0
2
4
6
8
1 10 100 1000 2000
Loss
Frequency
Loss-Frequency characteristics
BU05MCTYPE
BU06MBTYPE
391
FERRITE PRODUCTS
5
8
形  式 最小受注単位数 Minimum Quantity（pcs.）
Type 箱づめ Box テーピング Taping
BU05MC ー 2500
BU05MB 200 ー
BU06MB 150 ー
③テーピング寸法 Taping dimensions
（1）エンボステープ（16mm幅） Embossed tape（0.630 inches wide）
①最小受注単位数 Minimum Quantity
②テーピング材質 Tape material
④リーダー部・空部 Leader and Blank portion
80±1
（3.15±0.039）
330±2
（12.99±0.079）
13.5±1
（0.53±0.039）
Label
⑤リール寸法 Reel size
unit: mm（inch）
unit: mm（inch）
（3.15 inches or more）
Direction of tape feed
（5.91 inches or more）
Blank portions
Chip cavity Blank portions Leader
（3.15 inches or more）
⑥トップテープ強度
トップテープのはがし力は、下図矢印方向にて0.1〜0.7Nとなります。
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the
arrow as illutrated below.
Embossed Tape
Chip filled Chip
Top tape
Sprocket hole
Chip cavity
Base tape
梱包 PACKAGING
FERRITE PRODUCTS
5
393
8
Pressig jig
Board
RELIABILITY DATA 
Item
Specifled Value
Test Method and Remarks
1.Operating Temperature
Range
2.Storage Temperature
Range
3.Rated current
4.Impedance
5. Inductance
6.DC Resisitance
7.Resisitance to flexure of
substrare
8.Insulation resistance：
between wires
9.Rated current
10.Withstanding voltage：
between wires
11.Resisitance to vibration
12.Solderability
13.Resisitance to soldering
heat
Including self-generated heat
ー5 to ＋40℃ in taped packaging
The maximum DC value having temperature increase within
specified temperature,as detailed in individual specification.
Measuring equipment：HP 4291A or its equivalent
Measuring frequency：Specified frequency
SMD transformer・Commom mode choke coil：
Measuring equipment
：
DC ohmmeter
Accoding to JIS C0051
CM04RC・BU05MC
Warp 3mm
Pressing speed
0.5mm/sec.
Duration
5±1sec.
Applied voltage：Rated voltage
Duration：60 sec.
Applied voltage：Regulation voltage
Duration：60 sec.
Accoding to JIS C0040
Directions：2 hrs each in X
,
Y
,
and Z directions. Total：6 hrs
Frequency range
：
10 to 55 to 10 Hz
（
1 min.
）
Amplitude：1.5mm （Shall not exceed acceleration 196m/s2）
Mounting method
：
soldering onto printed board
Recovery ：At least 2 hrs of recovery under the stan-
dard condition after the test,followed by
the measurement within 24 hrs.
A kind of vibration：A
CM04RC・BU05MC
Solder temperature 235±5℃
Duration 2±0.5 sec.
Immersion depth
Up to 0.5mm from terminal root
① Reflow soldering
Preheating：100 to 150℃ 1 to 2min.
Peak：230 to 240℃ Within 5sec.
More than 200℃ Within 40 sec.
Number of reflow：Within 2 times.
② Manual soldering
Solder temperature：350±5℃
Duration：3±1sec.
Recovery ：1 to 2 hrs of recovery under the standard
condition after the test.
CommonMode Choke Coils
CM04RC
CommonMode Choke Coils
BU05MC
ー25℃〜＋120℃
ー40℃〜＋85℃
Within the specified tolerance
Within the specified tolerance
Within the specified tolerance
Within the specified tolerance
Refer to individual specification.
100MΩ min.
Within the specification
No abnormality
Refer to individual specification.
At least 75％ of terminal electrode is covered by
new solder.
Refer to individual specification.
1/2
FERRITE PRODUCTS
5
395
8
RELIABILITY DATA 
Item
Specifled Value
Test Method and Remarks
14.Thermal shock
15.Loading under damp heat
16.High temperature life test
17.
Low Temperature life Test
Accoding to JIS C0025
Conditions of 1 cycle
Temperature（℃）
Duration（min）
CM04RC・BU05MC
1 ー25±3℃ 30±3
2 Room temperature 3
3 85±3℃ 30±3
4 Room temperature 3
Number of cycyle：10 cycles
Recovery：1〜2 hrs of recovery under the standard con-
dition after removal from test chamber.
CM04RC・BU05MC
Temperature 40±3℃
Humidity
90〜95％
Applied current
Rated current
Duration
1000±24
Recovery：1〜2 hrs of recovery under the standard con-
dition after removal from test chamber.
CM04RC・BU05MC
Temperature 85±3℃
Duration
1000±24
Recovery：1〜2 hrs of recovery under the standard con-
dition after removal from test chamber.
CM04RC・BU05MC
Temperature ー40±3℃
Duration
1000±24
Recovery：1〜2 hrs of recovery under the standard con-
dition after removal from test chamber.
CommonMode Choke Coils
CM04RC
CommonMode Choke Coils
BU05MC
Refer to individual specification.
Refer to individual specification.
Refer to individual specification.
Refer to individual specification.
Note on standard condition: "standard condition"
referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions conceming measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of tem-
perature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
2/2
FERRITE PRODUCTS
5
397
8
Technical considerationsStages Precautions
CM04RC，BU05MC
1.Circuit Design
2.PCB Design
3.Considerations for
automatic placement
4.Soldering
5.Cleaning
6.Handling
7.Storage conditions
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
Land pattern design
1.Please contact any of our offices for a land pattern, and
refer to a recommended land pattern of specifications.
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
refer to the recommended condition specified.
2.This products is reflow soldering only.
3.SMD Inductors
Please do not add any stress to a product until it returns in
normal temperature after reflow soldering.
Lead free soldering
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, soldering etc sufficiently.
Recommended conditions for using a soldering iron:
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350 ℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
Cleaning conditions
1.SMD Inductors
Please contact any of our offices for a cleaning,
Handling
1.Keep the product away from all magnets and magnetic
objects.
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting product, care
should be taken not to give any stresses of deflection or
twisting to the board.
2.Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1.Please do not give the product any excessive mechanical
shocks.
2.SMD Inductors
Please do not add any shock and power to a product in
transportation.
Pick-up pressure
1.SMD Inductors
Please do not push to add any pressure to a winding part.
Please do not give any shock and push into a ferrite core
exposure part.
Packing
1.SMD Inductors
Please avoid accumulation of a packing box as much as
possible.
Storage
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled..
・Recommended conditions
 Ambient temperature      0〜40℃
 Humidity  Below 70% RH
The ambient temperature must be kept below 30℃. Even
under ideal storage conditions, solderability of products
electrodes may decrease as time passes. For this reason,
product should be used within one year from the time of
delivery.
In case of storage over 6 months, solderability shall be
checked before actual usage.
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
・ Recommended Land Patterns
1. When installing products, care should be taken not to apply distortion stress as it
may deform the products.
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
1.There is a case that a characteristic varies with magnetic influence.
1.Planning pattern configurations and the position of products should be carefully
performed to minimize stress.
1.There is a case to be damaged by a mechanical shock.
2.SMD Inductors
There is a case to be broken by the handling in transportation.
1.SMD Inductors
Damage and a characteristic can vary with an excessive shock or stress.
1.There is a case that transformation and a product of tape are damaged by
accumulation of a packing box.
1.Under a high temperature and humidity environment, problems suchas reduced
solderability caused by oxidation of terminal electrodes and deterioration
oftaping/packaging materials may take place.
1.6
Unit：mm Unit：mm
1.4
3.2
1.4
1.6
6.7
【CM04RC】 【BU05MC】
1.8 1.8 1
0.74
0.5
1
0.5
1
PRECAUTIONS