BAS19-TP - Micro Commercial Components

Features

 Ideally Suited for Automatic Insertion

 150oC Junction Temperature

 Fast Switching speed

 Epitaxial Planar Die Construction

Mechanical Data

 Weight: 0.008 grams ( approx.)

MCC Part

Number Marking

Continuous

Reverse

Voltage

V (V)

Repetitive

Peak

Reverse

Voltage

V (V)

RRM

BAS19 JP 100 120

BAS20 JR 150 200

BAS21 JS 200 250

Maximum Ratings @ 25oC Unless Otherwise Specified

Parameter Symbol Value Unit

Non-re

etitive Peak

t=1us

Forward Surge Current @ t=1s IFSM

2.5

0.5 A

Average Rectified Forward Current IF

(

)

200(1) mA

Forward DC Current at Tamb=25oCIF200(2) mA

Repetitive Peak Forward Current IFRM 625 mA

Power Dissipation up to Tamb=25oCPtot 250 mW

Thermal Resistance Junction to

Ambient 430 oC/W

Operating & Storage Temperature T

STG -65~150 oC

Notes: (1) Measured under pulse conditions;

Pulse time = tp<= 0.3ms

(2) Device on fiberglass substrate,

See layout on next page

BAS19

THRU

BAS21

Small

Signal Diodes

250mW

Suggested Solder

Pad Layout

DIMENSIONS

INCHES MM

DIM MIN MAX MIN MAX NOTE

A .110 .120 2.80 3.04

B .083 .098 2.10 2.64

C .047 .055 1.20 1.40

D .035 .041 .89 1.03

E .070 .081 1.78 2.05

F .018 .024 .45 .60

G .0005 .0039 .013 .100

H .035 .044 .89 1.12

J .003 .007 .085 .180

K .015 .020 .37 .51

.079

2.000

inches

.031

.800

.035

.900

.950

.037

.950

SOT-23

omponents

20736 Marilla Street Chatsworth

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MCC

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Revision: A 2011/01/01

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Micro Commercial Components

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 Epoxy meets UL 94 V-0 flammability rating

 Moisture Sensitivity Level 1

Electrical Characteristics (TJ= 25°C unless otherwise noted)

Parameter Symbol Test Condition Min Typ Max Unit

Forward Voltage VFIF= 100mA — — 1.0 V

IF= 200mA — — 1.25 V

Leakage Current IRVR= VRmax — — 100 nA

VR= VRmax; Tj= 150°C — — 100 µA

Dynamic Forward Resistance rfIF= 10mA — 5 — Ω

Capacitance Ctot VR= 0 —— 5pF

f = 1MHz

Reverse Recovery Time (see figures) trr IF= 30mA, IR = 30mA — — 50 ns

Irr = 3mA, RL= 100Ω

(1)Device on fiberglass substrate, see layout (SOT-23).

0.59 (15)

0.2 (5)

0.03 (0.8 )

0.30 (7.5 )

0.12 (3)

.04 (1)

0.06 (1.5)

0.20 (5.1)

.08 (2)

.04 (1)

0.47 (12)

Dimensions in inches (millimeters)

Layout for RΘJA test

Thickness: Fiberglass 0.059 in. (1.5 mm)

Copper leads 0.012 in. (0.3 mm)

Test Circuit and Waveforms(BAS19, BAS20, BAS21)

Test circuit

Input Signal - total pulse duration tp(tot) = 2µs

- duty factor δ = 0.0025

- rise time of reverse pulse tr= 0.6ns

- reverse pulse duration tp= 100ns

Oscilloscope - rise time tr= 0.35ns

- cicuit capitance* C < 1pF

*C = oscilloscope input capactitance + parasitic capacitance

Waveforms; IR = 3 mA

Input signal

Output signal

Ω

MCC

BAS19 thru BAS21

www.mccsemi.com

Revision: A 2011/01/01

Micro Commercial Components

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MCC

Revision: A 2011/01/01

Micro Commercial Components

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Device Packing

Part Number-TP Tape&Reel: 3Kpcs/Reel

Ordering Information :

***IMPORTANT NOTICE***

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make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components

Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it

convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all

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represented on our website, harmless against all damages.

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approval of Micro Commercial Components Corporation.

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