PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/07006BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 4-Jun-2007
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS20N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS20N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI
SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI
SN74S20N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S20N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 4-Jun-2007
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI
SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI
SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI
SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Jun-2007
Addendum-Page 3
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
www.ti.com 19-May-2007
Pack Materials-Page 1
Device Package Pins Site Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS20DR D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1
SN74LS20NSR NS 14 MLA 330 16 8.2 10.5 2.5 12 16 Q1
TAPE AND REEL BOX INFORMATION
Device Package Pins Site Length (mm) Width (mm) Height (mm)
SN74LS20DR D 14 MLA 342.9 336.6 28.58
SN74LS20NSR NS 14 MLA 342.9 336.6 28.58
PACKAGE MATERIALS INFORMATION
www.ti.com 19-May-2007
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/07006BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30007SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30007SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 14-Aug-2007
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS20N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS20N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI
SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI
SN74S20N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S20N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 14-Aug-2007
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI
SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI
SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI
SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 14-Aug-2007
Addendum-Page 3
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Jul-2007
Pack Materials-Page 1
Device Package Pins Site Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS20DR D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1
SN74LS20NSR NS 14 MLA 330 16 8.2 10.5 2.5 12 16 Q1
TAPE AND REEL BOX INFORMATION
Device Package Pins Site Length (mm) Width (mm) Height (mm)
SN74LS20DR D 14 MLA 346.0 346.0 33.0
SN74LS20NSR NS 14 MLA 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Jul-2007
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
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