Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
Document Number: MC33903_4_5
Rev. 9.0, 2/201 2
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2010 - 2012. All rights reserved.
SBC Gen2 with CAN High Speed
and LIN Interface
The 33903/4/5 is the second generation family of the System Basis
Chip (SBC). It combines several fe atures and enhances present
module designs. The device works as an advanced power
management unit for the MCU with additional integrate d circuits such
as sensors and CAN transceivers. It has a built-in enhanced high-speed
CAN interface (ISO11898-2 and -5) with local and bus failure
diagnostics, protection, and fail-sa fe operation modes. The SBC may
include zero, one or two LIN 2.1 interfaces with LIN output pin switches.
It includes up to four wake-up input pins that can also be configured as
output drivers for flexibility.
This device implements multiple Lo w-power (LP) modes, with very
low-current consumption. In addition, the device is part of a fami ly
concept where pin compatibility adds versatility to module design.
The 33903/4/5 also implements an innovative and advanced fail-safe
state machine and concept solution.
Features
• Voltage regulator for MCU, 5.0 or 3.3 V, part number selectable, with
possibility of usage external PN P to extend current capa bility and
share power dissipation
• Voltage, cu rre nt, and temperat ure protectio n
• Extremely low quiescent current in LP modes
• Fully-protected embedded 5.0 V regulator for the CAN driver
• Multiple under-voltage detections to address various MCU
specifications and system operation modes (i.e. cranking)
• Auxiliary 5. 0 or 3.3 V SPI configurable regulator, for additional ICs,
with over-current detection and under-voltage protecti on
• MUX output pin for device internal analog signal monitoring and
power supply monitoring
• Advanced SPI, MCU, ECU power supply, and critical pins
diagnostics and monitoring.
• Multiple wake-up sources in LP modes: CAN or LIN bus,
I/O transition, automatic timer, SPI message, and VDD over-current
detection.
• ISO11898-5 high-speed CAN interface compatibility for baud rates of
40 kb/s to 1.0 Mb/s
• Scalable product family of devices ranging from 0 to 2 LINs which are
compatible to J2602-2 and LIN 2.1
33903/
33903/4/5
EK Suffix (Pb-free)
98ASA10556D
32-PIN SOIC
EK Suffix (Pb-free)
98ASA10506D
54-PIN SOIC
SYSTEM BASIS CHIP
Analog Integrated Circuit Device Data
2Freescale Semiconductor
33903/4/5
TABLE OF CONTEN T S
TABLE OF CONTENTS
Simplified Application Diagrams ................................................................................................................. 3
Device Variations ....................................................................................................................................... 7
Internal Block Diagrams ............................................................................................................................. 9
Pin Connections ....................................................................................................................................... 11
Electrical Characteristics .......................................................................................................................... 17
Maximum Ratings .................................................................................................................................. 17
Static Electrical Characteristics ............................................................................................................. 19
Dynamic Electrical Characteristics ........................................................................................................ 27
Timing Diagrams ................................................................................................................................... 30
Functional Description ................................. .................................... ......................................................... 35
Introduction ............................................................................................................................................ 35
Functional Pin Description ..................... ... .... ... ................... ... .................... ... ................... .... .................. 35
Functional Device Operation .................... ... .... ................... ................................... ................................... 39
Mode and State Description .................................................................................................................. 39
LP Modes .............................................................................................................................................. 40
State Diagram ........................................................................................................................................ 41
Mode Change ................. .... ... ... ................ .... ... ... ... ... .... ... ... ... .... ................ ... ... ... .... ... ... ... ...................... 42
Watchdog Operation .............................................................................................................................. 42
Functional Block Operation Versus Mode ............................................................................................. 44
Illustration of Device Mode Transitions. ................................................................................................. 45
Cyclic Sense Operation During LP Modes ............................................................................................ 47
Behavior at Power Up and Power Down ............................................................................................... 49
Fail-safe Operation ... ... .................................... ................................... ...................................................... 51
CAN Interface ................. .... ... ... ................ .... ... ... ... ... .... ... ... ... .... ................ ... ... ... .... ... ... ......................... 55
CAN Interface Description ........... .... ... ... ... .................................... ................................... ...................... 55
CAN Bus Fault Diagnostic ........... ................. ... ... ... ... .... ... ... ... .... ... ................ ... ... .... ... ... ... .... .................. 58
LIN Block .................................................................................................................................................. 61
LIN Interface Description ....................................................................................................................... 61
LIN Operational Modes .......................................................................................................................... 61
Serial Peripheral Interface ........................................................................................................................ 63
High Level Overview . ................ ... .... ... ... ... .... ... ... ... ... ................. ... ... ... .... ... ... ... ... .... ... ............................ 63
Detail Operation ..................................................................................................................................... 64
Detail of Control Bits And Register Mapping ......................................................................................... 67
Flags and Device Status ........................................................................................................................ 84
Typical Applications ................. ... ... .... ... ................................ ... .... ... ... ... .... ... ... ... ... ................................... 91
Packaging ................................................................................................................................................ 99
Analog Integrated Circuit Device Data
Freescale Semiconductor 3
33903/4/5
SIMPLIFIED APPLICATION DIAGRAMS
SIMPLIFIED APPLICATION DIAGRAMS
Figure 1. 33905D Simplified Application Diagram
Figure 2. 33905S Simplified Application Diagram
CS
SCLK
MOSI
INT
5V-CAN
V
SUP1
I/O-0
I/O-1
MISO
RXD
TXD
CANL
CANH
GND
RST
DBG
V
DD
SPLIT
V
BAT
V
B
Q1*
D1
V
BAUX
SAFE
RXD-L1
TXD-L1
LIN-TERM 1
LIN-1
V
E
Q2
(5.0 V/3.3 V)
V
DD
V
SUP2
V
AUX
V
CAUX
LIN-TERM 2
LIN-2 RXD-L2
TXD-L2
MUX-OUT
33905D
MCU
SPI
A/D
CAN Bus
LIN Bus
LIN Bus
VSENSE
* = Optional
CS
SCLK
MOSI
INT
5V-CAN
V
SUP1
I/O-0
I/O-1
MISO
RXD
TXD
CANL
CANH
GND
RST
DBG
V
DD
SPLIT
V
BAT
V
B
Q1*
D1
V
BAUX
SAFE
RXD-L
TXD-L
LIN-T
LIN
V
E
Q2
(5.0 V/3.3 V)
V
DD
V
SUP2
V
AUX
V
CAUX
I/O-3
MUX-OUT
33905S
MCU
SPI
A/D
CAN Bus
LIN Bus
VSENSE
V
BAT
* = Optional
Analog Integrated Circuit Device Data
4Freescale Semiconductor
33903/4/5
SIMPLIFIED APPLICATION DIAGRAMS
Figure 3. 33904 Simplified Application Diagra m
Figure 4. 33903 Simplified Application Diagra m
33904
CS
SCLK
MOSI
INT
5V-CAN
V
SUP1
I/O-0
I/O-1
MISO
RXD
TXD
CANL
CANH
GND
RST
DBG
V
DD
SPLIT
V
BAT
V
B
Q1*
D1
V
BAUX
SAFE
I/O-3
V
E
Q2
(5.0 V/3.3 V)
V
DD
V
SUP2
V
AUX
V
CAUX
I/O-2
MUX-OUT
MCU
SPI
A/D
CAN Bus
VSENSE
V
BAT
* = Optional
CS
SCLK
MOSI
INT
5V-CAN
VSUP2
I/O-0
MISO
RXD
TXD
CANL
CANH
GND
RST
DBG
VDD
SPLIT
V
BAT
D1
V
DD
33903
MCU
SPI
CAN Bus
SAFE
VSUP1
Analog Integrated Circuit Device Data
Freescale Semiconductor 5
33903/4/5
SIMPLIFIED APPLICATION DIAGRAMS
Figure 5. 33903D Simplified Application Diagram
Figure 6. 33903S Simplified Application Diagram
CS
SCLK
MOSI
INT
5V-CAN
V
SUP
IO-0
MISO
RXD
TXD
CANL
CANH
GND
RST
DBG
V
DD
SPLIT
V
BAT
V
B
Q1*
D1
SAFE
RXD-L1
TXD-L1
LIN-T1/I/O-2
LIN-1
V
E
V
DD
LIN-T2/IO-3
LIN-2 RXD-L2
TXD-L2
MUX-OUT
33903D
MCU
SPI
A/D
CAN Bus
LIN Bus
LIN Bus
VSENSE
* = Optional
CS
SCLK
MOSI
INT
5V-CAN
V
SUP
IO-0
MISO
RXD
TXD
CANL
CANH
GND
RST
DBG
V
DD
SPLIT
V
BAT
V
B
Q1*
D1
SAFE
RXD-L1
TXD-L1
LIN-T1/I/O-2
LIN-1
V
E
V
DD
MUX-OUT
33903S
MCU
SPI
A/D
CAN Bus
LIN Bus
VSENSE
* = Optional
I/O-3
V
BAT
Analog Integrated Circuit Device Data
6Freescale Semiconductor
33903/4/5
SIMPLIFIED APPLICATION DIAGRAMS
Figure 7. 33903P Simplified Application Diagram
CS
SCLK
MOSI
INT
5V-CAN
V
SUP
IO-0
MISO
RXD
TXD
CANL
CANH
GND
RST
DBG
V
DD
SPLIT
V
BAT
V
B
Q1*
D1
SAFE
V
E
V
DD
MUX-OUT
33903P
MCU
SPI
A/D
CAN Bus
VSENSE
* = Optional
I/O-3
V
BAT
V
BAT
I/O-2
Analog Integrated Circuit Device Data
Freescale Semiconductor 7
33903/4/5
DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. MC33905 Device Variations - (All devices rated at TA = -40 TO 125 °C)
Freescale Part Number Version
(1), (2) VDD Output
Voltage LIN
Interface(s) Wake-up Input / LIN Master
Termination Package VAUX VSENSE MUX
MC33905D (Dual LIN)
MCZ33905BD3EK/R2 B3.3 V
2
2 Wake-up + 2 LIN terms
or
3 Wake-up + 1 LIN terms
or
4 Wake-up + no LIN terms
SOIC 54 pin
exposed pad Yes Yes Yes
MCZ33905CD3EK/R2 C
MCZ33905D5EK/R2
5.0 V
MCZ33905BD5EK/R2 B
MCZ33905CD5EK/R2 C
MC33905S (Single LIN)
MCZ33905BS3EK/R2 B3.3 V
13 Wake-up + 1 LIN terms
or
4 Wake-up + no LIN terms Yes Yes Yes
MCZ33905CS3EK/R2 C
MCZ33905S5EK/R2
5.0 V
MCZ33905BS5EK/R2 B
MCZ33905CS5EK/R2 C
Notes
1. Design changes in the “B” version resolved VSUP slow ramp up issues, enhanced device current consumption and improved oscillator
stability. “B” version has an errata linked to the SPI operation.
2. “C” versions are recommended for new designs. Design changes in the “C” version resolv e the SPI deviation of all prior versions, and
does not have the RxD short to ground detection feature.
Table 2. MC33904 Device Variations - (All devices rated at TA = -40 TO 125 °C)
Freescale Part Number Version
(3), (4) VDD Output
Voltage LIN
Interface(s) Wake-up Input / LIN Master
Termination Package VAUX VSENSE MUX
MC33904
MCZ33904B3EK/R2 B3.3 V
04 Wake-up SOIC 32 pin
exposed pad Yes Yes Yes
MCZ33904C3EK/R2 C
MCZ33904A5EK/R2 A
5.0 V
MCZ33904B5EK/R2 B
MCZ33904C5EK/R2 C
Notes
3. Design changes in the “B” version resolved VSUP slow ramp up issues, enhanced device current consumption and improved oscillator
stability. “B” version has an errata linked to the SPI operation.
4. “C” versions are recommended for new designs. Design changes in the “C” version resolv e the SPI deviation of all prior versions, and
does not have the RxD short to ground detection feature.
Analog Integrated Circuit Device Data
8Freescale Semiconductor
33903/4/5
DEVICE VARIATIONS
Table 3. MC33903 Device Variations - (All devices rated at TA = -40 TO 125 °C)
Freescale Part Number Version
(6), (7) VDD Output
Voltage LIN
Interface(s) Wake-up Input / LIN Master
Termination Package VAUX VSENSE MUX
MC33903
MCZ33903B3EK/R2 B3.3 V(5)
01 Wake-up SOIC 32 pin
exposed pad No No No
MCZ33903C3EK/R2 C
MCZ33903B5EK/R2 B5.0 V(5)
MCZ33903C5EK/R2 C
MC33903D (Dual LIN)
MCZ33903BD3EK/R2 B3.3 V
2
1 Wake-up + 2 LIN terms
or
2 Wake-up + 1 LIN terms
or
3 Wake-up + no LIN terms
SOIC 32 pin
exposed pad No Yes Yes
MCZ33903CD3EK/R2 C
MCZ33903BD5EK/R2 B5.0 V
MCZ33903CD5EK/R2 C
MC33903S (Single LIN)
MCZ33903BS3EK/R2 B3.3 V
12 Wake-up + 1 LIN terms
or
3 Wake-up + no LIN terms
SOIC 32 pin
exposed pad No Yes Yes
MCZ33903CS3EK/R2 C
MCZ33903BS5EK/R2 B5.0 V
MCZ33903CS5EK/R2 C
MC33903P
MCZ33903CP5EK/R2 C5.0 V 03 Wake-up SOIC 32 pin
exposed pad No Yes Yes
MCZ33903CP3EK/R2 3.3 V
Notes
5. VDD does not allow usage of an external PNP on the 33903. Output current limited to 100 mA.
6. Design changes in the “B” version resolved VSUP slow ramp up issues, enhanced device current consumption and improved oscillator
stability. “B” version has an errata linked to the SPI operation.
7. “C” versions are recommended for new designs. Design changes in the “C” version resolv e the SPI deviation of all prior versions, and
does not have the RxD short to ground detection feature.
Analog Integrated Circuit Device Data
Freescale Semiconductor 9
33903/4/5
INTERNAL BLOCK DIAGRAMS
INTERNAL BLOCK DIAGRAMS
Figure 8. 33905 Internal Block Diagram
Figure 9. 33904 Internal Block Diagram
CS
SCLK
MOSI
INT
5 V-CAN
VSUP1
I/O-1
MISO
GND
SPI
RST
V
DD
Regulator
DBG
5V-CAN
Configurable
VDD
VB
Analog Monitoring
VBAUX
5 V Auxiliary
SAFE
Signals Condition & Analog MUX
Input-Output
VSENSE
VE
Regulator
V
S2-INT
Oscillator
Regulator
State M a chine
Fail-safe
Power Managem e nt
VSUP2
V
S2-INT
VAUX
VCAUX
MUX-OUT
I/O-0
RXD
TXD
Enhanced High Speed CAN
Physical Interface
CANL
CANH
SPLIT
LIN Term #1
LIN-T1
LIN1 RXD-L1
TXD-L1
LIN 2.1 Interface - #1
V
S2-INT
LIN Te rm #2
LIN-T2
LIN2 RXD-L2
TXD-L2
LIN 2.1 Interface - #2
V
S2-INT
I/O-3
LIN Term #1
CS
SCLK
MOSI
INT
5 V-CAN
VSUP1
I/O-1
MISO
GND
SPI
RST
V
DD
Regulator
DBG
5V-CAN
Configurable
VDD
VB
Analog Monitoring
VBAUX
5V Auxiliary
SAFE
Signals Condition & Analog MUX
Input-Output
VSENSE
VE
Regulator
V
S2-INT
Oscillator
Regulator
State Machine
Fail-safe
Power Managem e nt
VSUP2
V
S2-INT
VAUX
VCAUX
MUX-OUT
I/O-0
LIN-T
LIN RXD-L
TXD-L
LIN 2.1 Interface - #1
RXD
TXD
Enhanced High Speed CAN
Physical Interface
CANL
CANH
SPLIT
V
S2-INT
33905D
33905S
CS
SCLK
MOSI
INT
5V-CAN
VSUP1
MISO
GND
SPI
RST
V
DD
Regulator
DBG
5V-CAN
Configurable
VDD
VB
Analog Monitoring
VBAUX
5V Auxiliary
SAFE
Signals Condition & Analog MUX
Input-Output
VSENSE
VE
Regulator
V
S2-INT
Oscillator
Regulator
State Machine
Fail-safe
Power Management
VSUP2
V
S2-INT
VAUX
VCAUX
MUX-OUT
RXD
TXD
Enhanced High Speed CAN
Physical Interface
CANL
CANH
SPLIT
I/O-1
I/O-2
I/O-3
I/O-0
Analog Integrated Circuit Device Data
10 Freescale Semiconductor
33903/4/5
INTERNAL BLOCK DIAGRAMS
Figure 10. 33903 Internal Block Diagram
CS
SCLK
MOSI
INT
5 V-CAN
VSUP2
MISO
GND
SPI
RST
V
DD
Regulator
DBG
5V-CAN
Configurable
VDD
Input-Output Regulator
V
S2-INT
Oscillator
State Machine
Power Management
V
S2-INT
I/O-0
RXD
TXD
Enhanced High Speed CAN
Physical Interface
CANL
CANH
SPLIT
SAFE
VSUP1
CS
SCLK
MOSI
INT
5 V-CAN
VSUP
MISO
GND
SPI
RST
V
DD
Regulator
DBG
5V-CAN
Configurable
VDD
VB
Analog Monitoring
SAFE
Signals Condition & Analog MUX
Input-Output
VSENSE
VE
Regulator
V
S-INT
Oscillator
State Machine
Fail-safe
Power Management
V
S-INT
MUX-OUT
IO-0
RXD
TXD
Enhanced High-sp eed C AN
Physical Inter f a c e
CANL
CANH
SPLIT
LIN Term #1
LIN-T1
LIN1 RXD-L1
TXD-L1
LIN 2.1 Interface - #1
V
S-INT
LIN Term #2
LIN-T2
LIN2 RXD-L2
TXD-L2
LIN 2.1 Interface - #2
V
S-INT
33903
33903D
I/O-3
LIN Term #1
CS
SCLK
MOSI
INT
5 V-CAN
VSUP
MISO
GND
SPI
RST
V
DD
Regulator
DBG
5V-CAN
Configurable
VDD
VB
Analog Monitoring
SAFE
Signals Condition & Analog MUX
Input-Output
VSENSE
VE
Regulator
V
S-INT
Oscillator
State Machine
Fail-safe
Power Management
MUX-OUT
I/O-0
LIN-T
LIN RXD-L
TXD-L
LIN 2.1 Interface - #1
RXD
TXD
Enhanced High Speed CAN
Physical Interface
CANL
CANH
SPLIT
V
S-INT
V
S-INT
I/O-3
CS
SCLK
MOSI
INT
5 V-CAN
VSUP
MISO
GND
SPI
RST
V
DD
Regulator
DBG
5V-CAN
Configurable
VDD
VB
Analog Monitoring
SAFE
Signals Condition & Analog MUX
Input-Output
VSENSE
VE
Regulator
V
S-INT
Oscillator
State Machine
Fail-safe
Power Management
MUX-OUT
I/O-0
RXD
TXD
Enhanced High Speed CAN
Phy s ic al Interfac e
CANL
CANH
SPLIT
V
S-INT
I/O-2
33903S
33903P
Analog Integrated Circuit Device Data
Freescale Semiconductor 11
33903/4/5
PIN CONNECTIONS
PIN CONNECTIONS
Figure 11. 33905D, MC33905S, MC33904 and MC33903 Pin Connections
4
5
6
7
8
9
10
11
12
2
3
54
51
50
49
48
47
46
45
44
43
53
52
1
13
14
15
16
42
41
40
39
MC33905D
17
18
19
20
21
22
23
24
25
26
27
38
37
36
35
34
33
32
31
30
29
28
TXD-L2
GND
RXD-L2
LIN-2
MISO
SCLK
MOSI
VSENSE
CS
VDD
TXD
VE
VB
I/O-1
RXD-L1
TXD-L1
LIN-1
INT
RST
RXD
SAFE
5V-CAN
CANL
SPLIT
DBG
CANH
VSUP2
MUX-OUT
V-AUX
V-CAUX
V-BAUX
VSUP1
LIN-T1/I/O-2
GND CAN
LIN-T2/I/O-3
I/O-0
GND
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
4
5
6
7
8
9
10
11
12
2
3
32
29
28
27
26
25
24
23
22
21
31
30
1
13
14
15
16
20
19
18
17
MC33904
MISO
SCLK
MOSI
VSENSE
CS
VDD
TXD
SAFE
5V-CAN
CANL
SPLIT
DBG
CANH
VSUP2 VE
VB
I/O-1
NC
NC
NC
MUX-OUT
V-AUX
V-CAUX
V-BAUX
VSUP1
I/O-2
GND CAN INT
RST
I/O-3 RXD
I/O-0
4
5
6
7
8
9
10
11
12
2
3
32
29
28
27
26
25
24
23
22
21
31
30
1
13
14
15
16
20
19
18
17
MC33905S
MISO
SCLK
MOSI
VSENSE
CS
VDD
TXD
SAFE
5V-CAN
CANL
SPLIT
DBG
CANH
VSUP2 VE
VB
I/O-1
RXD-L
TXD-L
LIN
MUX-OUT
V-AUX
V-CAUX
V-BAUX
VSUP1
LIN-T/I/O-2
GND CAN INT
RST
I/O-3 RXD
I/O-0
GROUND
GROUND
4
5
6
7
8
9
10
11
12
2
3
32
29
28
27
26
25
24
23
22
21
31
30
1
13
14
15
16
20
19
18
17
MC33903
MISO
SCLK
MOSI
CS
VDD
TXD
SAFE
5V-CAN
CANL
SPLIT
DBG
CANH
NC
NC
NC
NC
VSUP1
GND CAN INT
RST
RXD
I/O-0
GROUND
NC
NC
NC
NC
VSUP2
NC
NC
NC
NC
NC
Note: MC33905D, MC33905S, MC33904 and MC33903 are footprint compatible,
GROUND
32 pin exposed package
GND - LEAD FRAME
32 pin exposed package
GND - LEAD FRAME
32 pin exposed package
GND - LEAD FRAME
54 pin exposed package
GND - LEAD FRAME
Analog Integrated Circuit Device Data
12 Freescale Semiconductor
33903/4/5
PIN CONNECTIONS
Figure 12. 33905D, MC33905S, MC33904 and MC33903 Pin Connections
4
5
6
7
8
9
10
11
12
2
3
32
29
28
27
26
25
24
23
22
21
31
30
1
13
14
15
16
20
19
18
17
MC33903D
MISO
SCLK
MOSI
VSENSE
CS
VDD
TXD
SAFE
5V-CAN
CANL
SPLIT
DBG
CANH
VE
LIN1
GND
LIN2
MUX-OUT
VSUP
GND CAN INT
RST
RXD
IO-0
32 pin exposed package
GROUND
RXD-L1
TXD-L1
VB
LIN-T2 / I/O-3
LIN-T1 / I/O-2
TXD-L2
GND
RXD-L2
4
5
6
7
8
9
10
11
12
2
3
32
29
28
27
26
25
24
23
22
21
31
30
1
13
14
15
16
20
19
18
17
MC33903S
MISO
SCLK
MOSI
VSENSE
CS
VDD
TXD
SAFE
5V-CAN
CANL
SPLIT
DBG
CANH
VE
LIN
GND
NC
MUX-OUT
VSUP
GND CAN INT
RST
RXD
I/O-0
32 pin exposed packa ge
GROUND
RXD-L
TXD-L
VB
I/O-3
LIN-T / I/O-2
NC
GND
NC
Note: MC33903D, MC33903S, and MC33903P are footprint compatible.
GND - LEAD FRAMEGND - LEAD FRAME
4
5
6
7
8
9
10
11
12
2
3
32
29
28
27
26
25
24
23
22
21
31
30
1
13
14
15
16
20
19
18
17
MC33903P
MISO
SCLK
MOSI
VSENSE
CS
VDD
TXD
SAFE
5V-CAN
CANL
SPLIT
DBG
CANH
VE
N/C
GND
NC
MUX-OUT
VSUP
GND CAN INT
RST
RXD
I/O-0
32 pin exposed package
GROUND
N/C
N/C
VB
I/O-3
I/O-2
NC
GND
NC
GND - LEAD FRAME
Analog Integrated Circuit Device Data
Freescale Semiconductor 13
33903/4/5
PIN DEFINITIONS
PIN DEFINITIONS
Table 4. 33903/4/5 Pin Definitions
A functional description of each pin can be found in the Function al Pin Description section beginning on page 35.
54 Pin
33905D 32 Pin
33905S 32 Pin
33904 32 Pin
33903 32 Pin
33903D 32 Pin
33903S 32 Pin
33903P Pin Name Pin
Function Formal
Name Definition
1-3, 20-
22, 27-
30, 32-
35, 52-
54
N/A 17, 18,
19 3-4,11-
14, 17-
21, 31,
32
N/A N/A N/A N/C No
Connect -Connect to GND.
N/A N/A N/A N/A N/A 14, 16,
17 14, 16,
17, 19-
21
N/C No
Connect Do NOT connect the N/C pins to
GND. Leave these pins Open.
4111222VSUP/1 Power Battery
Voltage
Supply 1
Supply input for the device internal
supplies, power on reset circuitry and
the VDD regulator. VSUP and VSUP1
supplies are internally connected on
part number MC33903BDEK and
MC33903BSEK
5 2 2 2 N/A N/A N/A VSUP2 Power Battery
Voltage
Supply 2
Supply input for 5 V-CAN regulator,
VAUX regulator, I/O and LIN pins.
VSUP1 and VSUP2 supplies are
internally connected on part number
MC33903BDEK and MC33903BSEK
6 3 3 N/A 3 3 3 LIN-T2
or
I/O-3
Output
or
Input/
Output
LIN
Termination 2
or
Input/Output
3
33903D and 33905D - Output pin for
the LIN2 master node termination
resistor.
or
33903P, 33903S, 33903D, 33904,
33905S and 33905D - Configurable
pin as an input or HS output, for
connection to external circuitry
(switched or small load). The input
can be used as a programmable
Wake-up input in (LP) mode. When
used as a HS, no over-temperature
protection is implemented. A basic
short to GND protection function,
based on switch drain-source over-
voltage detection, is available.
7 4 4 N/A 4 4 4 LIN-T1
or
LIN-T
or
I/O-2
Output
or
Input/
Output
LIN
Termination
1
or
Input/Output
2
33905D - Output pin for the LIN1
master node termination resistor.
or
33903P, 33903S, 33903D, 33904,
33905S and 33905D - Configurable
pin as an input or HS output, for
connection to external circuitry
(switched or small load). The input
can be used as a programmable
Wake-up input in (LP) mode. When
used as a HS, no over-temperature
protection is implemented. A basic
short to GND protection function,
based on switch drain-source over-
voltage detection, is available.
Analog Integrated Circuit Device Data
14 Freescale Semiconductor
33903/4/5
PIN DEFINITIONS
8555555SAFE Output Safe Output
(Active LOW) Output of the safe circuitry. The pin is
asserted LOW if a fault event occurs
(e.g.: software watchdog is not
triggered, VDD low, issue on the RST
pin, etc.). Open drain structure.
96666665 V-CAN Output 5V-CAN Output voltage for the embedded
CAN interface. A capacitor must be
connected to this pin.
10 777777CANH Output CAN High CAN high output.
11 888888CANL Output CAN Low CAN low output.
12 999999GND-CAN Ground GND-CAN Power GND of the embedded CAN
interface
13 10 10 10 10 10 10 SPLIT Output SPLIT Output Output pin for connection to the
middle point of the split CAN
termination
14 11 11 N/A N/A N/A N/A VBAUX Output VB Auxiliary Output pin for external path PNP
transistor base
15 12 12 N/A N/A N/A N/A VCAUX Output VCOLLECT
OR Auxiliary Output pin for external path PNP
transistor collector
16 13 13 N/A N/A N/A N/A VAUX Output VOUT
Auxiliary Output pin for the auxiliary voltage.
17 14 14 N/A 11 11 11 MUX-OUT Output Multiplex
Output Multiplexed output to be connected to
an MCU A/D input. Selection of the
analog parameter available at MUX-
OUT is done via the SPI. A
switchable internal pull-down resistor
is integrated for VDD current sense
measurements.
18 15 15 15 12 12 12 I/O-0 Input/
Output Input/Output
0Configurable pin as an input or
output, for connection to external
circuitry (switched or small load). The
voltage level can be read by the SPI
and via the MUX output pin. The
input can be used as a
programmable Wake-up input in LP
mode. In LP, when used as an
output, the High Side (HS) or Low
Side (LS) can be activated for a cyclic
sense function.
19 16 16 16 13 13 13 DBG Input Debug Input to activate the Debug mode. In
Debug mode, no watchdog refresh is
necessary. Outside of Debug mode,
connection of a resistor between
DBG and GND allows the selection of
Safe mode functionality.
23 N/A N/A N/A 14 N/A N/A TXD-L2 Input LIN T ransmit
Data 2 LIN bus transmit data input. Includes
an internal pull-up resistor to VDD.
24,31 N/A N/A N/A 15, 18 15, 18 15, 18 GND Ground Ground Ground of the IC.
25 N/A N/A N/A 16 N/A N/A RXD-L2 Output LIN Receive
Data LIN bus receive data output.
Table 4. 33903/4/5 Pin Definitions (continued)
A functional description of each pin can be found in the Function al Pin Description section beginning on page 35.
54 Pin
33905D 32 Pin
33905S 32 Pin
33904 32 Pin
33903 32 Pin
33903D 32 Pin
33903S 32 Pin
33903P Pin Name Pin
Function Formal
Name Definition
Analog Integrated Circuit Device Data
Freescale Semiconductor 15
33903/4/5
PIN DEFINITIONS
26 N/A N/A N/A 17 N/A N/A LIN2 Input/
Output LIN bus LIN bus input output connected to the
LIN bus.
36 17 N/A N/A 19 19 N/A
33903D/5D
LIN-1
33903S/5S
LIN
Input/
Output LIN bus LIN bus input output connected to the
LIN bus.
37 18 N/A N/A 20 20 N/A
33903D/5D
TXD-L11
33903S/5S
TXD-L
Input LIN T ransmit
Data LIN bus transmit data input. Includes
an internal pull-up resistor to VDD.
38 19 N/A N/A 21 21 N/A
33903D/5D
RXD-L1
33903S/5S
RXD-L
Output LIN Receive
Data LIN bus receive data output.
39 20 20 N/A 22 22 22 VSENSE Input Sense input Direct battery voltage input sense. A
serial resistor is required to limit the
input current during high voltage
transients.
40 21 21 N/A N/A N/A N/A I/O-1 Input/
Output Input Output
1Configurable pin as an input or
output, for connection to external
circuitry (switched or small load). The
voltage level can be read by the SPI
and the MUX output pin. The input
can be used as a programmable
Wake-up input in (LP) mode. It can
be used in association with
I/O-0 for a cyclic sense function in
(LP) mode.
41 22 22 22 23 23 23 RST Output Reset Output
(Active LOW) This is the device reset output whose
main function is to reset the MCU.
This pin has an internal pull-up to
VDD. The reset input voltage is also
monitored in order to detect external
reset and safe conditions.
42 23 23 23 24 24 24 INT Output Interrupt
Output
(Active LOW)
This output is asserted low when an
enabled interrupt condition occurs.
This pin is an open drain structure
with an internal pull up resistor to
VDD.
43 24 24 24 25 25 25 CS Input Chip Select
(Active LOW) Chip select pin for the SPI. When the
CS is low, the device is selected. In
(LP) mode with VDD ON, a transition
on CS is a Wake-up condition
44 25 25 25 26 26 26 SCLK Input Serial Data
Clock Clock input for the Serial Peripheral
Interface (SPI) of the device
45 26 26 26 27 27 27 MOSI Input Master Out /
Slave In SPI data received by the device
46 27 27 27 28 28 28 MISO Output Master In /
Slave Out SPI data sent to the MCU. When the
CS is high, MISO is high-impedance
Table 4. 33903/4/5 Pin Definitions (continued)
A functional description of each pin can be found in the Function al Pin Description section beginning on page 35.
54 Pin
33905D 32 Pin
33905S 32 Pin
33904 32 Pin
33903 32 Pin
33903D 32 Pin
33903S 32 Pin
33903P Pin Name Pin
Function Formal
Name Definition
Analog Integrated Circuit Device Data
16 Freescale Semiconductor
33903/4/5
PIN DEFINITIONS
47 28 28 28 29 29 29 VDD Output Voltage
Digital Drain 5.0 or 3.3 V output pin of the main
regulator for the Microcontroller
supply.
48 29 29 29 30 30 30 TXD Input Transmit
Data CAN bus transmit data input. Internal
pull-up to VDD
49 30 30 30 31 31 31 RXD Output Receive Data CAN bus receive data output
50 31 31 N/A 32 32 32 VE Voltage
Emitter Connection to the external PNP path
transistor. This is an intermediate
current supply source for the VDD
regulator
51 32 32 N/A 1 1 1 VB Output Voltage Base Base output pin for connection to the
external PNP pass transistor
EX P AD EX P AD EX P AD EX P AD EX P AD EX P AD EX P AD GND Ground Ground Ground
Table 4. 33903/4/5 Pin Definitions (continued)
A functional description of each pin can be found in the Function al Pin Description section beginning on page 35.
54 Pin
33905D 32 Pin
33905S 32 Pin
33904 32 Pin
33903 32 Pin
33903D 32 Pin
33903S 32 Pin
33903P Pin Name Pin
Function Formal
Name Definition
Analog Integrated Circuit Device Data
Freescale Semiconductor 17
33903/4/5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 5. Maximum Ratings
All voltages are referenced to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings Symbol Value Unit
ELECTRICAL RATINGS(8)
Supply Voltage at VSUP/1 and VSUP2
Normal Operation (DC)
Transient Conditions (Load Dump) VSUP1/2
VSUP1/2TR
-0.3 to 28
-0.3 to 40
V
DC voltage on LIN/1 and LIN2
Normal Operation (DC)
Transient Conditions (Load Dump) VBUSLIN
VBUSLINTR
-28 to 28
-28 to 40
V
DC voltage on CANL, CANH, SPLIT
Normal Operation (DC)
Transient Conditions (Load Dump) VBUS
VBUSTR
-28 to 28
-32 to 40
V
DC Voltage at SAFE
Normal Operation (DC)
Transient Conditions (Load Dump) VSAFE
VSAFETR
-0.3 to 28
-0.3 to 40
V
DC Voltage at I/O-0, I/O-1, I/O-2, I/O-3 (LIN-T Pins)
Normal Operation (DC)
Transient Conditions (Load Dump) VI/O
VI/OTR
-0.3 to 28
-0.3 to 40
V
DC voltage on TXD-L, TXD-L1 TXD-L2, RXD-L, RXD-L1, RXD-L2 VDIGLIN -0.3 to VDD +0.3 V
DC voltage on TXD, RXD(10) VDIG -0.3 to VDD +0.3 V
DC Voltage at INT VINT -0.3 to 10 V
DC Voltage at RST VRST -0.3 to VDD +0.3 V
DC Voltage at MOSI, MSIO, SCLK and CS VRST -0.3 to VDD +0.3 V
DC Voltage at MUX-OUT VMUX -0.3 to VDD +0.3 V
DC Voltage at DBG VDBG -0.3 to 10 V
Continuous current on CANH and CANL ILH 200 mA
DC voltage at VDD, 5V-CAN, VAUX, VCAUX VREG -0.3 to 5.5 V
DC voltage at VBASE(9) and VBAUX VREG -0.3 to 40 V
DC voltage at VE(10) VE -0.3 to 40 V
DC voltage at VSENSE VSENSE -28 to 40 V
Notes
8. The voltage on non-VSUP pins should never exceed the VSUP voltage at any time or permanent damage to the device may occur.
9. If the voltage delta between VSUP/1/2 and VBASE is greater than 6.0 V, the external VDD ballast current sharing functionality may be
damaged.
10. Potential Electrical Over Stress (EOS) damage may occur if RXD is in contact with VE while the device is ON.
Analog Integrated Circuit Device Data
18 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Figure 13. PCB with Top and Bottom Lay er Dissipation Area (Dual Layer)
ESD Capability
AECQ100(11)
Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 )
CANH and CANL. LIN1 and LIN2, Pins versus all GND pins
all other Pins including CANH and CANL
Charge Device Model - JESD22/C101 (CZAP = 4.0 pF
Corner Pins (Pins 1, 16, 17, and 32)
All other Pins (Pins 2-15, 18-31)
Tested per IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 )
Device unpowered, CANH and CANL pin without capacitor, versus GND
Device unpowered, LIN, LIN1 and LIN2 pin, versus GND
Device unpowered, VS1/VS2 (100 nF to GND), versus GND
Tested per specific OEM EMC requirements for CAN and LIN with
additional capacitor on VSUP/1/2 pins (See Typical Applications on page
91)
CANH, CANL without bus filter
LIN, LIN1 and LIN2 with and without bus filter
I/O with external components (22 k - 10 nF)
VESD1-1
VESD1-2
VESD2-1
VESD2-2
VESD3-1
VESD3-2
VESD3-3
VESD4-1
VESD4-2
VESD4-3
8000
2000
750
500
15000
15000
15000
9000
12000
7000
V
THERMAL RATINGS
Junction temperature TJ150 °C
Ambient temperature TA-40 to 125 °C
Storage temperature TST -50 to 150 °C
THERMAL RESISTANCE
Thermal resistance junction to ambient(14) RJA 50(14) °C/W
Peak package reflow temperature during reflow(12), (13) TPPRT Note 13 °C
Notes
11. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500 ), the Charge Device Model
(CDM), and Robotic (CZAP = 4.0 pF).
12. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
13. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
14. This parameter was measured according to Figure 13:
Table 5. Maximum Ratings (continued)
All voltages are referenced to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings Symbol Value Unit
P C B 10 0mm x 100mm
B ot tom side
20 mm x 40 m m
To p side , 300 sq . mm
(20mmx15mm)
Bottom view
Analog Integrated Circuit Device Data
Freescale Semiconductor 19
33903/4/5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 6. Static Electrical Characteristics
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25 °C under nominal conditio ns, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
POWER INPUT
Nominal DC Voltage Range(15) VSUP1/VSUP2 5.5 -28 V
Extended DC Low Voltage Range(16) VSUP1/VSUP2 4.0 -5.5 V
Under-voltage Detector Thresholds, at the VSUP/1 pin,
Low threshold (VSUP/1 ramp down)
High threshold (VSUP/1 ramp up)
Hysteresis
Note: function not active in LP mode
VS1_LOW 5.5
-
0.22
6.0
-
0.35
6.5
6.6
0.5
V
Under-voltage Detector Thresholds, at the VSUP2 pin:
Low threshold (VSUP2 ramp down)
High threshold (VSUP2 ramp up)
Hysteresis
Note: function not active in LP modes
VS2_LOW 5.5
-
0.22
6.0
-
0.35
6.5
6.6
0.5
V
VSUP Over-voltage Detector Thresholds, at the VSUP/1 pin:
Not active in LP modes VS_HIGH 16.5 17 18.5 V
Battery loss detection threshold, at the VSUP/1 pin. BATFAIL 2.0 2.8 4.0 V
VSUP/1 to turn VDD ON, VSUP/1 rising VSUP-TH1 -4.1 4.5 V
VSUP/1 to turn VDD ON, hysteresis (Guaranteed by design) VSUP-TH1HYST 150 180 mV
Supply current(17), (18)
- from VSUP/1
- from VSUP2, (5V-CAN VAUX, I/O OFF)
ISUP1 -
-2.0
0.05 4.0
0.85
mA
Supply current, ISUP1 + ISUP2, Normal mode, VDD ON
- 5 V-CAN OFF, VAUX OFF
- 5 V-CAN ON, CAN interface in Sleep mode, V AUX OFF
- 5 V-CAN OFF, Vaux ON
- 5 V-CAN ON, CAN interface in TXD/RXD mode, VAUX OFF, I/O-x disabled
ISUP1+2 -
-
-
-
2.8
-
-
-
4.5
5.0
5.5
8.0
mA
LP mode VDD OFF. Wake-up from CAN, I/O-x inputs
VSUP 18 V, -40 to 25 °C
VSUP 18 V, 125 °C
ILPM_OFF -
-15
-35
50
A
LP mode VDD ON (5.0 V) with VDD under-voltage and VDD
over-current monitoring, Wake-up from CAN, I/O-x inputs
VSUP 18 V, -40 to 25 °C, IDD = 1.0 A
VSUP 18 V, -40 to 25 °C, IDD = 100 A
VSUP 18 V, 125 °C, IDD = 100 A
ILPM_ON -
-20
40
-
-
65
85
A
LP mode, additional current for oscillator (used for: cyclic sense, forced Wake-
up, and in LP VDD ON mode cyclic interruption and watchdog)
VSUP 18 V, -40 to 125 °C
IOSC
-5.0 9.0
A
Debug mode DBG voltage range VDBG 8.0 -10 V
Notes
15. All parameters in spec (ex: VDD regulator tolerance).
16. Device functional, some parameters could be out of spec. VDD is active, device is not in Reset mode if the lowest VDD under-voltage
reset threshold is selected (approx. 3.4 V). CAN and I/Os are not operational.
17. In Run mode, CAN interface in Sleep mode, 5 V -CAN and V AUX turned OFF. IOUT at VDD < 50 mA. Ballast: turned OFF or not connected.
18. VSUP1 and VSUP2 supplies are internally connected on part number MC33903BDEK and MC33903BSEK. Therefore, ISUP1 and ISUP2
cannot be measured individually.
Analog Integrated Circuit Device Data
20 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
VDD VOLTAGE REGULATOR, VDD PIN
Output Voltage
VDD 5.0 V, VSUP 5.5 to 28 V, IOUT 0 to 150 mA
VDD 3.3 V, VSUP 5.5 to 28 V, IOUT 0 to 150 mA VOUT-5.0
VOUT-3.3
4.9
3.234 5.0
3.3 5.1
3.4
V
Drop voltage without external PNP pass transistor(19)
VDD 5.0 V, IOUT 100 mA
VDD 5.0 V, IOUT 150 mA
VDROP -
-330
-450
500
mV
Drop voltage with external transistor(19)
IOUT 200 mA (I_BALLAST + I_INTERNAL)VDROP-B -350 500 mV
VSUP/1 to maintain VDD within VOUT-3.3 specified voltage range
VDD 3.3 V, IOUT 150 mA
VDD 3.3 V, IOUT 200 mA, external transistor implemented
VSUP1-3.3 4.0
4.0 -
--
-
V
External ballast versus internal current ratio (I_BALLAST = K x Internal current) K1.5 2.0 2.5
Output Current limitation, without external transistor ILIM 150 350 550 mA
Temperature pre-warning (Guaranteed by design) TPW -140 -°C
Thermal shutdown (Guaranteed by design) TSD 160 - - °C
Range of decoupling capacitor (Guaranteed by design)(20) CEXT 4.7 -100 F
LP mode VDD ON, IOUT 50 mA (time limited)
VDD 5.0 V, 5.6 V VSUP 28 V
VDD 3.3 V, 5.6 V VSUP 28 V
VDDLP 4.75
3.135 5.0
3.3 5.25
3.465
V
LP mode VDD ON, dynamic output current capability (Limited duration. Ref. to
device description). LP-IOUTDC - - 50 mA
LP VDD ON mode:
Over-current Wake-up threshold.
Hysteresis
LP-ITH 1.0
0.1 3.0
1.0 -
-
mA
LP mode VDD ON, drop voltage, at IOUT 30 mA (Limited duration. Ref. to
device description) (19) LP-VDROP -200 400 mV
LP mode VDD ON, min VSUP operation (Below this value, a VDD, under-voltage
reset may occur) LP-MINVS 5.5 - - V
VDD when VSUP < VSUP-TH1, at I_VDD 10 A (Guaranteed by design) VDD_OFF - - 0.3 V
VDD when VSUP VSUP-TH1, at I_VDD 40 mA (Guaranteed with parameter
VSUP-TH1 VDD_START UP 3.0 - - V
Notes
19. For 3.3 V VDD devices, the drop-out voltage test condition leads to a VSUP below the min VSUP threshold (4.0 V). As a result, the dropout
voltage parameter cannot be specified.
20. The regulator is stable without an external capacitor. Usage of an external capacitor is recommended for AC performance.
Table 6. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
Freescale Semiconductor 21
33903/4/5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
VOLTAGE REGULATOR FOR CAN INTERFACE SUPPLY, 5.0 V-CAN PIN
Output voltage, VSUP/2 = 5.5 to 40 V
IOUT 0 to 160 mA 5V-C OUT 4.75 5.0 5.25 V
Output Current limitation (21) 5V-C ILIM 160 280 -mA
Under-voltage threshold 5V-C U V 4.1 4.5 4.7 V
Thermal shutdown (Guaranteed by design) 5V-CTS 160 - - °C
External capacitance (Guaranteed by design) CEXT-CAN 1.0 -100 F
V AUXILIARY OUTPUT, 5.0 AND 3.3 V SELECTABLE PIN VB-AUX, VC-AUX, VAUX
VAUX output voltage
VAUX = 5.0 V, VSUP = VSUP2 5.5 to 40 V, IOUT 0 to 150 mA
VAUX = 3.3 V, VSUP = VSUP2 5.5 to 40 V, IOUT 0 to 150 mA
VAUX 4.75
3.135 5.0
3.3 5.25
3.465
V
VAUX under-voltage detector (VAUX configured to 5.0 V)
Low Threshold
Hysteresis
VAUX under-voltage detector (VAUX configured to 3.3 V, default value)
VAUX-UVTH 4.2
0.06
2.75
4.5
-
3.0
4.70
0.12
3.135
V
VAUX over-current threshold detector
VAUX set to 3.3 V
VAUX set to 5.0 V
VAUX-ILIM 250
230 360
330 450
430
mA
External capacitance (Guaranteed by design) VAUX CAP 2.2 -100 F
UNDER-VOLTAGE RESET AND RESET FUNCTION, RST PIN
VDD under-voltage threshold down - 90% VDD (VDD 5.0 V)(22), (24)
VDD under-voltage threshold up - 90% VDD (VDD 5.0 V)
VDD under-voltage threshold down - 90% VDD (VDD 3.3 V)(22), (24)
VDD under-voltage threshold up - 90% VDD (VDD 3.3 V)
VRST-TH1 4.5
-
2.75
-
4.65
-
3.0
-
4.85
4.90
3.135
3.135
V
VDD under-voltage reset threshold down - 70% VDD (VDD 5.0 V)(23), (24) VRST-TH2-5 2.95 3.2 3.45 V
Hysteresis
for threshold 90% VDD, 5.0 V device
for threshold 70% VDD, 5.0 V device
Hysteresis 3.3 V VDD
for threshold 90% VDD, 3.3 V device
VRST-HYST 20
10
10
-
-
-
150
150
150
mV
VDD under-voltage reset threshold down - LP VDD ON mode
(Note: device change to Normal Request mode). VDD 5.0 V
(Note: device change to Normal Request mode). VDD 3.3 V
VRST-LP 4.0
2.75 4.5
3.0 4.85
3.135
V
Notes
21. Current limitation will be reported by setting a flag.
22. Generate a Reset or an INT. SPI programmable
23. Generate a Reset
24. In Non-LP modes
Table 6. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
22 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
UNDER-VOLTAGE RESET AND RESET FUNCTION, RST PIN (CONTINUED)
Reset VOL @ 1.5 mA, VSUP 5.5 to 28 V VOL -300 500 mV
Current limitation, Reset activated, VRESET = 0.9 x VDD IRESET LOW 2.5 7.0 10 mA
Pull-up resistor (to VDD pin) RPULL-UP 8.0 11 15 k
VSUP to guaranteed reset low level(25) VSUP-RSTL 2.5 - - V
Reset input threshold
Low threshold, VDD = 5.0 V
High threshold, VDD = 5.0 V
Low threshold, VDD = 3.3 V
High threshold, VDD = 3.3 V
VRST-VTH 1.5
2.5
0.99
1.65
1.9
3.0
1.17
2.0
2.2
3.5
1.32
2.31
V
Reset input hysteresis VHYST 0.5 1.0 1.5 V
I/O PINS WHEN FUNCTION SELECTED IS OUTPUT
I/O-0 HS switch drop @ I = -12 mA, VSUP = 10.5 V VI/O-0 HSDRP -0.5 1.4 V
I/O-2 and I/O-3 HS switch drop @ I = -20 mA, VSUP = 10.5 V VI/O-2-3 HSDRP -0.5 1.4 V
I/O-1, HS switch drop @ I = -400 A, VSUP = 10.5 V VI/O-1 HSDRP -0.4 1.4 V
I/O-0, I/O-1 LS switch drop @ I = 400 A, VSUP = 10.5 V VI/O-01 LSDRP -0.4 1.4 V
Leakage current, I/O-x VSUP II/O_LEAK -0.1 3.0 A
I/O PINS WHEN FUNCTION SELECTED IS INPUT
Negative threshold VI/O_NTH 1.4 2.0 2.9 V
Positive threshold VI/O_PTH 2.1 3.0 3.8 V
Hysteresis VI/O_HYST 0.2 1.0 1.4 V
Input current, I/O VSUP/2 II/O_IN -5.0 1.0 5.0 A
I/O-0 and I/O-1 input resistor. I/O-0 (or I/O-1) selected in
register, 2.0 V < VI/O-X <16 V (Guaranteed by design). RI/O-X -100 - k
VSENSE INPUT
VSENSE under-voltage threshold (Not active in LP modes)
Low Threshold
High threshold
Hysteresis
VSENSE_TH 8.1
-
0.1
8.6
-
0.25
9.0
9.1
0.5
V
Input resistor to GND. In all mod es except in LP modes. (Guaranteed by
design). RVSENSE -125 - k
Notes
25. Reset must be kept low
Table 6. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
Freescale Semiconductor 23
33903/4/5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
ANALOG MUX OUTPUT
Output Voltage Range, with external resistor to GND >2.0 kVOUT_MAX 0.0 - VDD - 0.5 V
Internal pull-down resistor for regulator output current sense RMI 0.8 1.9 2.8 k
External capacitor at MUX OUTPUT(26) (Guaranteed by design) CMUX - - 1.0 nF
Chip temperature sensor coefficient (Guaranteed by design and device
characterization)
VDD = 5.0 V
VDD = 3.3 V
TEMP-COEFF
20
13.2 21
13.9 22
14.6
mv/°C
Chip temperature: MUX-OUT voltage
VDD = 5.0 V, TA = 125 °C
VDD = 3.3 V, TA = 125 °C
VTEMP 3.6
2.45 3.75
2.58 3.9
2.65
V
Chip temperature: MUX-OUT voltage (guaranteed by design and
characterization)
TA = -40 °C, VDD = 5.0 V
TA = 25 °C, VDD = 5.0 V
TA = -40 °C, VDD = 3.3 V
TA = 25 °C, VDD = 3.3 V
VTEMP(GD)
0.12
1.5
0.07
1.08
0.30
1.65
0.19
1.14
0.48
1.8
0.3
1.2
V
Gain for VSENSE, with external 1.0 k 1% resistor
VDD = 5.0 V
VDD = 3.3 V
VSENSE GAIN 5.42
8.1 5.48
8.2 5.54
8.3
Offset for VSENSE, with external 1.0 k 1% resistor VSENSE
OFFSET -20 -20 mV
Divider ratio for VSUP/1
VDD = 5.0 V
VDD = 3.3 V
VSUP/1 RATIO 5.335
7.95 5.5
8.18 5.665
8.45
Attenuation/Gain ratio for I/O-0 and I/O-1 actual voltage:
VDD = 5.0 V, I/O = 16 V (Attenuation, MUX-OUT register bit 3 set to 1)
VDD = 5.0 V, (Gain, MUX-OUT register bit 3 set to 0)
VDD = 3.3 V, I/O = 16 V (Attenuation, MUX-OUT register bit 3 set to 1)
VDD = 3.3 V, (Gain, MUX-OUT register bit 3 set to 0)
VI/O RATIO 3.8
-
5.6
-
4.0
2.0
5.8
1.3
4.2
-
6.2
-
Internal reference voltage
VDD = 5.0 V
VDD = 3.3 V
VREF 2.45
1.64 2.5
1.67 2.55
1.7
V
Current ratio between VDD output & IOUT at MUX-OUT
(IOUT at MUX-OUT = IDD out / IDD_RATIO)
At IOUT = 50 mA
I_OUT from 25 to 150 mA
IDD_RATIO
80
62.5 97
97 115
117
SAFE OUTPUT
SAFE low level, at I = 500 AVOL 0.0 0.2 1.0 V
Safe leakage current (VDD low, or device unpowered). VSAFE 0 to 28 V. ISAFE-IN -0.0 1.0 A
Notes
26. When C is higher than CMUX, a serial resistor must be inserted
Table 6. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
24 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
INTERRUPT
Output low voltage, IOUT = 1.5 mA VOL -0.2 1.0 V
Pull-up resistor RPU 6.5 10 14 k
Output high level in LP VDD ON mode (Guaranteed by design) VOH-LPVDDON 3.9 4.3 V
Leakage current INT voltage = 10 V (to allow high-voltage on MCU INT pin) VMAX -35 100 A
Sink current, VINT > 5.0 V, INT low state I SINK 2.5 6.0 10 mA
MISO, MOSI, SCLK, CS PINS
Output low voltage, IOUT = 1.5 mA (MISO) VOL - - 1.0 V
Output high voltage, IOUT = -0.25 mA (MISO) VOH VDD -0.9 - V
Input low voltage (MOSI, SCLK,CS)VIL - - 0.3 x VDD V
Input high voltage (MOSI, SCLK,CS)VIH 0.7 x VDD - - V
Tri-state leakage current (MISO) IHZ -2.0 -2.0 A
Pull-up current (CS)IPU 200 370 500 A
CAN LOGIC INPUT PINS (TXD)
High Level Input Voltage VIH 0.7 x VDD - VDD + 0.3 V
Low Level Input Voltage VIL -0.3 -0.3 x VDD V
Pull-up Current, TXD, VIN = 0 V
VDD =5.0 V
VDD =3.3 V
IPDWN -850
-500 -650
-250 -200
-175
µA
CAN DATA OUTPUT PINS (RXD)
Low Level Output Voltage
IRXD = 5.0 mA VOUTLOW 0.0 -0.3 x VDD
V
High Level Output Voltage
IRX = -3.0 mA VOUTHIGH 0.7 x VDD - VDD
V
High Level Output Current
VRXD = VDD - 0.4 V IOUTHIGH 2.5 5.0 9.0 mA
Low Level Input Current
VRXD = 0.4 V IOUTLOW 2.5 5.0 9.0 mA
Table 6. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
Freescale Semiconductor 25
33903/4/5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
CAN OUTPUT PINS (CANH, CANL)
Bus pins common mode voltage for full functionality VCOM -12 -12 V
Differential input voltage threshold VCANH-VCANL 500 -900 mV
Differential input hysteresis VDIFF-HYST 50 - - mV
Input resistance RIN 5.0 -50 k
Differential input resistance RIN-DIFF 10 -100 k
Input resistance matching RIN-MATCH -3.0 0.0 3.0 %
CANH output voltage (45 < RBUS < 65)
TXD dominant state
TXD recessive state
VCANH 2.75
2.0 3.5
2.5 4.5
3.0
V
CANL output voltage (45 < RBUS < 65)
TXD dominant state
TXD recessive state
VCANL 0.5
2.0 1.5
2.5 2.25
3.0
V
Differential output voltage (45 < RBUS < 65)
TXD dominant state
TXD recessive state
VOH-VOL 1.5
-0.5 2.0
0.0 3.0
0.05
V
CAN H output current capability - Dominant state ICANH - - -30 mA
CAN L output current capability - Dominant state ICANL 30 - - mA
CANL over-current detection - Error reported in register ICANL-OC 75 120 195 mA
CANH over-current detection - Error r eported in register ICANH-OC -195 -120 -75 mA
CANH, CANL input resistance to GND, device supplied, CAN in Sleep mode,
V_CANH, V_CANL from 0 to 5.0 V RINSLEEP 5.0 -50 k
CANL, CANH output voltage in LP VDD OFF and LP VDD ON modes VCANLP -0.1 0.0 0.1 V
CANH, CANL input current, VCANH, VCANL = 0 to 5.0 V, device unpowered
(VSUP, VDD, 5V-CAN: open).(27) ICAN-UN_SUP1 -3.0 10 µA
CANH, CANL input current, VCANH, VCANL = -2.0 to 7.0 V, device
unpowered (VSUP, VDD, 5V-CAN: open).(27) ICAN-UN_SUP2 - - 250 µA
Differential voltage for rece ssive bit detection in LP mode(28) VDIFF-R-LP - - 0.4 V
Differential voltage for dominant bit detection in LP mode(28) VDIFF-D-LP 1.15 - - V
CANH AND CANL DIAGNOSTIC INFORMAT ION
CANL to GND detection threshold VLG 1.6 1.75 2.0 V
CANH to GND detection threshold VHG 1.6 1.75 2.0 V
CANL to VBAT detection threshold, VSUP/1 and VSUP2 > 8.0 V VLVB - VSUP -2.0 - V
CANH to VBAT detection threshold, VSUP/1 and VSUP2 > 8.0 V VHVB - VSUP -2.0 - V
CANL to VDD detection threshold VL5 4.0 VDD -0.43 - V
CANH to VDD detection threshold VH5 4.0 VDD -0.43 - V
Notes
27. VSUP, VDD, 5V-CAN: shorted to GND, or connected to GND via a 47 k resistor instances are guaranteed by design and device
characterization.
28. Guaranteed by design and device characterization.
Table 6. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
26 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
SPLIT
Output voltage
Loaded condition ISPLIT = ±500 µA
Unloaded condition Rmeasure > 1.0 M
VSPLIT 0.3 x VDD
0.45 x
VDD
0.5 x VDD
0.5 x VDD
0.7 x VDD
0.55 x VDD
V
Leakage current
-12 V < VSPLIT < +12 V
-22 to -12 V < VSPLIT < +12 to +35 V
ILSPLIT -
-0.0
-5.0
200
µA
LIN TERMINALS (LIN-T/1, LIN-T2)
LIN-T1, LIN-T2, HS switch drop @ I = -20 mA, VSUP > 10 .5 V VLT_HSDRP -1.0 1.4 V
LIN1 & LIN2 33903D/5D PIN - LIN 33903S/5S PIN (Parameters guaranteed for VSUP/1, VSUP2 7.0 V VSUP 18 V)
Operating Voltage Range VBAT 8.0 -18 V
Supply Voltage Range VSUP 7.0 -18 V
Current Limitation for Driver Dominant State
Driver ON, VBUS = 18 V IBUS_LIM 40 90 200 mA
Input Leakage Current at the receiver
Driver off; VBUS = 0 V; VBAT = 12 V IBUS_PAS_DOM -1.0 - - mA
Leakage Output Current to GND
Driver Off; 8.0 V VBAT 18 V; 8.0 V VBUS 18 V; VBUS VBAT IBUS_PAS_REC - - 20 µA
Control unit disconnected from ground (Loss of local ground must not affect
communication in the residual network)
GNDDEVICE = VSUP; VBAT = 12 V; 0 < VBUS < 18 V (Guaranteed by design)
IBUS_NO_GND -1.0 -1.0 mA
VBAT Disconnected; VSUP_DEVICE = GND; 0 < VBUS < 18 V (Node has to
sustain the current that can flow under this condition. Bus must remain
operational under this condition). (Guaranteed by design)
IBUSNO_BAT - - 100 µA
Receiver Dominant State VBUSDOM - - 0.4 VSUP
Receiver Recessive State VBUSREC 0.6 - - VSUP
Receiver Threshold Center
(VTH_DOM + VTH_REC)/2 VBUS_CNT 0.475 0.5 0.525 VSUP
Receiver Threshold Hysteresis
(VTH_REC - VTH_DOM) VHYS - - 0.175 VSUP
LIN Wake-up threshold from LP VDD ON or LP VDD OFF mode VBUSWU -5.3 5.8 V
LIN Pull-up Resistor to VSUP RSLAVE 20 30 60 k
Over-temperature Shutdown (G uaranteed by design) TLINSD 140 160 180 °C
Over-temperature Shutdown Hysteresis (Guaranteed by design) TLINSD_HYS -10 -°C
Table 6. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
Freescale Semiconductor 27
33903/4/5
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 7. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, GND = 0 V, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal cond itions, unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
SPI TIMING
SPI Operation Frequency (MISO cap = 50 pF) FREQ 0.25 -4.0 MHz
SCLK Clock Period tPCLK 250 - N/A ns
SCLK Clock High Time tWSCLKH 125 - N/A ns
SCLK Clock Low Time tWSCLKL 125 - N/A ns
Falling Edge of CS to Rising Edge of SCLK
“C” version
All others
tLEAD 30
550 -
-N/A
N/A
ns
Falling Edge of SCLK to Rising Edge of CS tLAG 30 - N/A ns
MOSI to Falling Edge of SCLK tSISU 30 - N/A ns
Falling Edge of SCLK to MOSI tSIH 30 - N/A ns
MISO Rise Time (CL = 50 pF) tRSO - - 30 ns
MISO Fall Time (CL = 50 pF) tFSO - - 30 ns
Time from Falling to MISO Low-impedance
Time from Rising to MISO High-impedance tSOEN
tSODIS
-
--
-30
30 ns
Time from Rising Edge of SCLK to MISO Data Valid tVALID - - 30 ns
Delay between falling and rising edge on CS
“C” version
All others
tCSLOW 1.0
5.5 -
-N/A
N/A
s
CS Chip Select Low Timeout Detection tCS-TO 2.5 - - ms
SUPPLY, VOLTAGE REGULATOR, RESET
VSUP under-voltage detector threshold deglitcher tVS_LOW1/
2_DGLT 30 50 100 s
Rise time at turn ON. VDD from 1.0 to 4.5V. 2 .2 F at the VDD pin. tRISE-ON 50 250 800 s
Deglitcher time to set RST pin low tRST-DGLT 20 30 40 s
RESET PULSE DURATION
VDD under-voltage (SPI selectable)
short, default at power on when BATFAIL bit set
medium
medium long
long
tRST-PULSE 0.9
4.0
8.5
17
1.0
5.0
10
20
1.4
6.0
12
24
ms
Watchdog reset tRST-WD 0.9 1.0 1.4 ms
I/O INPUT
Deglitcher time (Guaranteed by design) tIODT 19 30 41 s
VSENSE INPUT
Under-voltage deglitcher time tBFT 30 -100 s
Analog Integrated Circuit Device Data
28 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
INTERRUPT
INT pulse duration (refer to SPI for selection. Guaranteed by design)
short (25 to 125 °C)
short (-40 °C)
long (25 to 125 °C)
long (-40 °C)
tINT-PULSE 20
20
90
90
25
25
100
100
35
40
130
140
s
STATE DIGRAM TIMINGS
Delay for SPI Timer A, Timer B or Timer C write command after entering Normal
mode
(No command should occur within t D_NM.
tD_NM delay definition: from CS rising edge of “Go to Normal mode (i.e. 0x5A00)”
command to CS falling edge of “Timer write” command)
tD_NM 60 - - s
Tolerance for: watchdog period in all modes, FWU delay, Cyclic sense period
and active time, Cyclic Interrupt period, LP mode over-current (unless otherwise
noted)(32)
tTIMING-ACC -10 -10 %
CAN DYNAMIC CHARACTERISTICS
TXD Dominant State Timeout tDOUT 300 600 1000 µs
Bus dominant clamping detection tDOM 300 600 1000 µs
Propagation loop delay TXD to RXD, recessive to dominant (Fast slew rate) tLRD 60 120 210 ns
Propagation delay TXD to CAN, recessive to dominant tTRD -70 110 ns
Propagation delay CAN to RXD, recessive to dominant tRRD -45 140 ns
Propagation loop delay TXD to RXD, dominant to recessive (Fast slew rate) tLDR 100 120 200 ns
Propagation delay TXD to CAN, dominant to recessive tTDR -75 150 ns
Propagation delay CAN to RXD, dominant to recessive tRDR -50 140 ns
Loop time TXD to RXD, Medium Slew Rate (Selected by SPI)
Recessive to Dominant
Dominant to Recessive
tLOOP-MSL -
-200
200 -
-
ns
Loop time TXD to RXD, Slow Slew Rate (Selected by SPI)
Recessive to Dominant
Dominant to Recessive
tLOOP-SSL -
-300
300 -
-
ns
CAN Wake-up filter time, single dominant pulse detection(29) (See Figure 35)tCAN-WU1-F 0.5 2.0 5.0 s
CAN Wake-up filter time, 3 dominant pulses detection(30) tCAN-WU3-F 300 - - ns
CAN Wake-up filter time, 3 dominant pulses detection timeout(31) (See
Figure 36)tCAN-WU3-TO - - 120 s
Notes
29. No Wake-up for single pulse shorter than tCAN-WU1 min. Wake-up for single pulse longer than tCAN-WU1 max.
30. Each pulse should be greater than tCAN-WU3-F min. Guaranteed by design, and device characterization.
31. The 3 pulses should occur within tCAN-WU3-TO. Guaranteed by design, and device characterization.
32. Guaranteed by design.
Table 7. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, GND = 0 V, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unle ss otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
Freescale Semiconductor 29
33903/4/5
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0 KBIT/SEC ACCORDING TO LIN PHYSICAL
LAYER SPECIFICATION
BUS LOAD RBUS AND CBUS 1.0 NF / 1.0 K, 6.8 NF / 660 , 10 NF / 500 . SEE Figure 18, PAGE 32.
Duty Cycle 1:
THREC(MAX) = 0.744 * VSUP
THDOM(MAX) = 0.581 * VSUP
D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 µs, 7.0 V VSUP18 V
D1
0.396 - -
Duty Cycle 2:
THREC(MIN) = 0.422 * VSUP
THDOM(MIN) = 0.284 * VSUP
D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 µs, 7.6 V VSUP18 V
D2
- - 0.581
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4 KBIT/SEC ACCORDING TO LIN PHYSICAL LAYER
SPECIFICATION
BUS LOAD RBUS AND CBUS 1.0 NF / 1.0 K, 6.8 NF / 660 , 10 NF / 500 . MEASUREMENT THRESHOLDS. SEE Figure 19, PAGE 33.
Duty Cycle 3:
THREC(MAX) = 0.778 * VSUP
THDOM(MAX) = 0.616 * VSUP
D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 µs, 7.0 V VSUP18 V
D3
0.417 - -
Duty Cycle 4:
THREC(MIN) = 0.389 * VSUP
THDOM(MIN) = 0.251 * VSUP
D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96 µs, 7.6 V VSUP18 V
D4
- - 0.590
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR FAST SLEW RATE
LIN Fast Slew Rate (Programming Mode) SRFAST -20 - V / s
LIN PHYSICAL LAYER: CHARACTERISTICS AND WAKE-UP TIMINGS
VSUP FROM 7.0 TO 18 V, BUS LOAD RBUS AND CBUS 1.0 NF / 1.0 K, 6.8 NF / 660 , 10 NF / 500 . SEE Figure 18, PAGE 32.
Propagation Delay and Symmetry (See Figure 18, page 31 and Figure 19,
page 33)
Propagation Delay of Receiver, tREC_PD = MAX (tREC_PDR, tREC_PDF)
Symmetry of Receiver Propagation Delay, tREC_PDF - tREC_PDR
t REC_PD
t REC_SYM
-
- 2.0 4.2
-6.0
2.0
s
Bus Wake-up Deglitcher (LP VDD OFF and LP VDD ON modes) (See Figure 20,
page 32 for LP VDD OFF mode and Figure 21, page 33 for LP mode) t PROPWL 42 70 95 s
Bus Wake-up Event Reported
From LP VDD OFF mode
From LP VDD ON mode
t WAKE_LPVDD
OFF
t WAKE_LPVDD
ON
-
1.0
-
-
1500
12
s
TXD Permanent Dominant State Delay (Guaranteed by design) t TXDDOM 0.65 1.0 1.35 s
Table 7. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V VSUP 28 V, - 40 C TA 125 C, GND = 0 V, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unle ss otherwise noted.
Characteristic Symbol Min Typ Max Unit
Analog Integrated Circuit Device Data
30 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
Figure 14. SPI Timings
Figure 15. CAN Signal Propagation Loo p Delay T X D to RXD
Di 0
Do 0
Undefined Don’t Care Di n Don’t Care
tLEAD
tSIH
tSISU
tLAG
tPCLK
tWCLKH
tWCLKL
tVALID
Do n
tSODIS
CS
SCLK
MOSI
MISO
tSOEN
tCSLOW
TXD
RXD
0.3 x V
DD
t
LRD
0.7 x V
DD
t
LDR
0.3 x V
DD
0.7 x V
DD
Analog Integrated Circuit Device Data
Freescale Semiconductor 31
33903/4/5
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
Figure 16. CAN Signal Propagation Delays TXD to CAN and CAN to RXD
.
Figure 17. Test Circuit for CAN Timing Characteristics
TXD
VDIFF
0.9 V
t
TRD
0.5 V
t
TDR
RXD
t
RRD
t
RDR
0.3 x VDD 0.7 x V
DD
0.3 x V
DD
0.7 x V
DD
VSUP
12 V
CANL
22 F
10 F
SPLIT
GND
TXD
RXD
Signal generato r
All pins are not shown
RBUS
15 pF
CBus
100 pF
60
100 nF
5 V_CAN
CANH
Analog Integrated Circuit Device Data
32 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
Figure 18. LIN Timing Measurements for Normal Slew Rate
TXD
LIN
RXD
tBIT tBIT
tBUS_DOM(MAX) tBUS_REC(MIN)
tREC_PDF(1)
74.4% V
SUP
42.2% VSUP
58.1% VSUP
28.4% VSUP
tBUS_REC(MAX)
VLIN_REC
tBUS_DOM(MIN)
RXD
Output of receiving Node 1
Output of receiving Node 2
THREC(MAX)
THDOM(MAX)
THREC(MIN)
THDOM(MIN)
Thresholds of
receiving node 1
Thresholds of
receiving node 2
tREC_PDR(1)
tREC_PDF(2)
tREC_PDR(2)
Analog Integrated Circuit Device Data
Freescale Semiconductor 33
33903/4/5
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
Figure 19. LIN Timing Measurements for Slow Slew Rate
Figure 20. LIN Wak e-up LP V DD OFF Mode Timing
TXD
LIN
RXD
tBIT tBIT
tBUS_DOM(MAX) tBUS_REC(MIN)
tREC_PDF(1)
77.8% V
SUP
38.9% VSUP
61.6% VSUP
25.1% VSUP
tBUS_REC(MAX)
VLIN_REC
tBUS_DOM(MIN)
RXD
Output of receiving Node 1
Output of receiving Node 2
THREC(MAX)
THDOM(MAX)
THREC(MIN)
THDOM(MIN)
Thresholds of
receiving node 1
Thresholds of
receiving node 2
tREC_PDR(1)
tREC_PDF(2)
tREC_PDR(2)
VDD
LIN
V
TT
D om i nant l evel
0.4 V
V
3V
SUP
PROPWL WAKE
BUSWU
REC
Analog Integrated Circuit Device Data
34 Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
Figure 21. LIN Wake-up LP VDD ON Mode Timing
IRQ
LIN
V
LIN_REC
TT
D om i nant l ev el
0.4 V V
IRQ st ays low until SPI reading com m and
PROPWL
WAKE
BUSWU
SUP
Analog Integrated Circuit Device Data
Freescale Semiconductor 35
33903/4/5
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The MC33903_4_5 is the seco nd generation of System
Basis Chip, combining:
- Advanced power management unit fo r the MCU, the
integrated CAN interface and for the additional ICs such as
sensors, CAN transceiver.
- Built in enhanced high speed CAN interface (ISO11898-
2 and -5), with local and bus failure diagnostic, protection,
and fail-safe operation mode.
- Built in LIN interface, compliant to LIN 2.1 and J2602-2
specification, with local and bus failure diagnostic and
protection.
- Innovative hardware configurable fail-safe state machine
solution.
- Multiple LP modes, with low current consumption.
- Family concept with pin compatibility; with and without
LIN interface devices.
FUNCTIONAL PIN DESCRIPTION
POWER SUPPLY (VSUP/1 AND VSUP2)
Note: VSUP1 and VSUP2 supplies are externally available
on all devices except the 33903D, 33903S, and 33903P,
where these are connected intern a l ly.
VSUP1 is the input pin for the internal supply and the VDD
regulator. VSUP2 is the input pin for the 5 V-CAN regulator,
LIN’s interfaces and I/O functions. The VSUP block includes
over and under-voltage detections which can generate
interrupt. The device includes a loss of battery detector
connected to VSUP/1.
Loss of battery is reported through a bit (called BATFAIL).
This generates a POR (Power On Reset).
VDD VOLTAGE REGULATOR (VDD)
The regulator has two main modes of op eration (Normal
mode and LP mode). It can operate with or without an
external PNP transistor.
In Normal mode, without external PNP, the max DC
capability is 150 mA. Current li mitation, temperature pre-
warning flag and over-temperature shutdown features are
included. When VDD is turned ON, rise time from 0 to 5.0 V is
controlled. Output voltage is 5.0 V. A 3.3 V option is available
via dedicated part number.
If current higher than 150 mA is required, an external PNP
transistor must be connected to VE (PNP emitter) and VB
(PNP base) pins, in order to increase total current capability
and share the power dissi pation between intern al VDD
transistor and the external transistor. See External Transistor
Q1 (VE and VB). The PNP can be used even if current is less
than 150 mA, depending upon ambient temperature,
maximum supply and thermal resista nce. Typically, above
100-200 mA, an external ballast transistor is recommended.
VDD REGULATOR IN LP MODE
When the device is set in LP VDD ON mode, the VDD
regulator is able to supply the MCU with a DC current below
typically 1.5 mA (LP-ITH). Transient current can also be
supplied up to a tenth of a mA. Current in excess of 1.5 mA
is detected, and this event is managed by the device logic
(Wake-up detection, timer start for over-current duration
monitoring or watchdog refresh).
EXTERNAL TRANSISTOR Q1 (VE AND VB)
The device has a dedicated circuit to allow usage of an
external “P” type transistor, with the objecti ve to share the
power dissipation between the internal transistor of the VDD
regulator and the external transistor. The recommended
bipolar PNP transistor is MJD42C or BCP52-16.
When the external PNP is connected, the current is shared
between the internal path transistor and the external PNP,
with the following typical ratio: 1/3 in the internal transistor
and 2/3 in the external PNP. The PNP activation and control
is done by SPI.
The device is able to operate without an external
transistor. In this case, the VE and VB pins must remain
open.
5 V-CAN VOLTAGE REGULATOR FOR CAN AND
ANALOG MUX
This regulator is supplied from the VSUP/2 pin. A capacitor
is required at 5 V-CAN pin. Analog MUX and part of the LIN
interfaces are supplied from 5 V-CAN. Consequently, the
5 V-CAN must be ON in order to have Analog MUX operating
and to have the LIN interface operating in TXD/RXD mode.
The 5 V-CAN regulator is OFF by default and must be
turned ON by SPI. In Debug mode, the 5 V-CAN is ON by
default.
V AUXILIARY OUTPUT, 5.0 AND 3.3 V
SELECTABLE (VB-AUX, VC-AUX, AND VCAU X) -
Q2
The VAUX block is used to provide an auxiliary voltage
output, 5.0 or 3.3 V, selectable by the SPI. It uses an external
PNP pass transistor for flexibility and power dissipatio n
constraints. The external recommended bipolar transistors
are MJD42C or BCP52-16.
An over-current and under-voltage detectors are provided.
Analog Integrated Circuit Device Data
36 Freescale Semiconductor
33903/4/5
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
VAUX is controlled via the SPI, and can be turned ON or
OFF. VAUX low threshold detection and over-current
information will disable VAUX, and are reported in the SPI and
can generate INT.
VAUX is OFF by default and must be turned ON by the SPI.
UNDER-VOLTAGE RESET AND RESET FUNCTION
(RST)
The RST pin is an open drain structure with an internal
pull-up resistor. The LS driver has limited current capability
when asserted low, in order to tolerate a short to 5.0 V. The
RST pin voltage is monitored in order to detect failure (e.g.
RST pin shorted to 5.0 V or GND).
The RST pin reports an under-voltage condition to the
MCU at the VDD pin, as a RST failure in the watchdog refresh
operation. VDD under-voltage reset also operates in LP VDD
ON mode.
Two VDD under-voltage thresholds are included. The
upper (typically 4.65 V, RST-TH1-5) can lead to a Reset or an
Interrupt. This is selected by the SPI. When “RST-TH2-5“is
selected, in Normal mode, an INT is asserted when VDD falls
below “RST-TH1-5“, then, when VDD falls below “RST-TH2-5” a
Reset will occur. This will allow the MCU to operate in a
degraded mode (i.e., with 4.0 V VDD).
I/O PINS (I/O-0: I/O-3)
I/Os are configurable input/output pins. They can be used
for small loads or to drive external transistors. When used as
output drivers, the I/Os are either a HS or LS type. They can
also be set to high-impedance. I/Os are controlled by the SPI
and at power on, the I/Os are set as inputs. They include
over-load protection by temperature or excess of a voltage
drop.
When I/O-0/-1/-2/-3 voltage is greater than VSUP/2
voltage, the leakage current (II/O_LEAK) parameter is not
applicable
• I/O-0 and I/O-1 will have current flowing into the device
through three diodes limited by an 80 kOhm resistor (in
series).
• I/O-2 and I/O-3 will have unlimited current flowing into the
device through one diode.
In LP mode, the state of the I/O can be turned ON or OFF,
with extremely low power consumption (except when there is
a load). Protection is disabled in LP mode.
When cyclic sense is used, I/O-0 is the HS/LS switch, I/O-
1, -2 and -3 are the wake inputs.
I/O-2 and I/O-3 pins share the LIN Master pin function.
VSENSE INPUT (VSENSE)
This pin can be connected to the battery line (before the
reverse battery protection diode), via a serial resistor and a
capacitor to GND. It incorporates a threshold detector to
sense the battery voltage and provide a battery ea rly
warning. It also includes a resistor divider to measure the
VSENSE voltage via the MUX-OUT pin.
MUX-OUTPUT (MUXOUT)
The MUX-OUT pin (Figure 22) delivers an analog voltage
to the MCU A/D input. The voltage to be delivered to MUX-
OUT is selected via the SPI, from one of the following
functions: VSUP/1, VSENSE, I/O-0, I/O-1, Internal 2.5 V
reference, die temperature sensor, VDD current copy.
Voltage divider or amplifier is inserted in the chain, as
shown in Figure 22.
For the VDD current copy, a resistor must be added to the
MUX-OUT pin, to convert current into voltage. Device
includes an internal 2.0 k resistor selectable by the SPI.
Voltage range at MUX-OUT is from GND to VDD. It is
automatically limited to VDD (max 3.3 V for 3.3 V part
numbers).
The MUX-OUT buffer is supplied from 5 V-CAN regulator,
so the 5 V-CAN regulator must be ON in order to have:
1) MUX-OUT functionality and
2) SPI selection of the analog function.
If the 5 V-CAN is OFF, the MUX-OUT voltage is near GND
and the SPI command that selects one of the analog inputs
is ignored.
Delay must be respected between SPI commands for 5 V-
CAN turned ON and SPI to select MUX-OUT function. The
delay depends mainly upon the 5 V-CAN capacitor and load
on 5 V-CAN.
The delay can be estimated using the following formula:
delay = C(5 V-CAN) x U (5.0 V) / I_lim 5 V-CAN.
C = cap at 5 V-CAN regulator, U = 5.0 V,
I_LIM 5 V-CAN = min current limit of 5 V-CAN regulator
(parameter 5 V-C ILIM).
Analog Integrated Circuit Device Data
Freescale Semiconductor 37
33903/4/5
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
Figure 22. Analog Multiplexer Block Diagram
DGB (DGB) AND DEBUG MODE
Primary Function
It is an input used to set the device in Debug mode. This is
achieved by applying a voltage between 8.0 and 10 V at the
DEBUG pin and then, powering up the device (See State
Diagram). When the device leaves the INIT Reset mode and
enters into INIT mode, it detects the voltage at the DEBUG
pin to be between a range of 8.0 to 10 V, and activates the
Debug mode.
When Debug mode is detected, no Watchdog SPI refresh
commands are necessary. This allows an easy debug of the
hardware and software routines (i.e. SPI commands).
When the device is in Debug mode it is reported by the SPI
flag. While in Debug mode, and the voltage at DBG pin falls
below the 8.0 to 10 V range, the Debug mode is left, and the
device starts the watchdog operation, and expects the proper
watchdog refresh. The Debug mode can be left by SPI. This
is recommended to avoid staying in Debug mode when an
unwanted Debug mode selection (FMEA pin) is present. The
SPI command has a higher priority than providing 8.0 to 10 V
at the DEBUG pin.
Secondary Function
The resistor connected between the DBG pin and the GND
selects the Fail-Safe mode operation. DBG pin can also be
connected directly to GND (this prevents the usage of Debug
mode).
Flexibility is provided to select SAFE outpu t operation via
a resistor at the DBG pin or via a SPI command. The SPI
command has higher priority than the hardware selection via
Debug resistor.
When the Debug mode is selected, the SAFE modes
cannot be configured via the resistor connected at DBG pin.
SAFE
Safe Output Pin
This pin is an output and is asserted low when a fault event
occurs. The objective is to drive electrical safe circuitry and
set the ECU in a known state, independent of the MCU and
SBC, once a failure has been detected.
The SAFE output structure is an open drain, without a pull-
up.
INTERRUPT (INT)
The INT output pin is asserted low or genera te s a low
pulse when an interrupt condition occurs. The INT condition
is enabled in the INT register. The selection of low level or
pulse and pulse duration are selected by SPI.
No current will flow inside the INT structure when VDD is
low, and the device is in LP VDD OFF mode. This allows the
connection of an external pull-up resistor and connection of
an INT pin from other ICs without extra consumpti on in
unpowered mode.
D1
V
BAT
VSUP/1
S_in
I/O-1
I/O-0
M
ultiplexer
V
DD-I_COPY
R
M(*)
(*)Optional
A/D in
MCU
S_iddc
MUX-OUT
S_g3.3
Temp
VSENSE
S_g5
R
SENSE
1.0 k
R
MI
S_ir
S_in
S_in
S_in
V
REF
: 2.5 V
5V-CAN
S_I/O_att
S_I/O_att
All swicthes and resistor are co nfigured and controlled via t he SPI
RM: internal resistor connected when VREG current monitor is used
S_g3.3 and S_g5 for 5.0 V or 3.3 V VDD versions
S_iddc to select VDD regulato r current copy
S_in1 for LP mode resistor bridge disconnection
S_ir to switch on/of f of the internal R MI resistor
S_I/O_att for I/O-0 and I/O-1 atte nuation selection
buffer
5V-CAN
Analog Integrated Circuit Device Data
38 Freescale Semiconductor
33903/4/5
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
INT has an internal pull-up structure to VDD. In LP VDD ON
mode, a diode is inserted in series with the pull-up, so th e
high level is slightly lower than in other modes.
CANH, CANL, SPLIT, RXD, TXD
These are the pins of the high speed CAN physica l
interface, between the CAN bus and the micro controller. A
detail description is provided in the document.
LIN, LIN-T, TXDL AND RXDL
These are the pins of the LIN physical interface. Device
contains zero, one or two LIN interfaces.
The MC33903, MC33903P, and MC33904 do not have a
LIN interface. However, the MC33903S/5 S (S = Single) and
MC33903D/5D (D=Dual) contain 1 and 2 LIN interfaces,
respectively.
LIN, LIN1 and LIN2 pins are the connection to the LIN sub
buses.
LIN interfaces are connected to the MCU via the TXD,
TXD-L1 and TXD-L2 and RXD, RXD-L1 and RXD-L2 pi ns.
The device also includes one or two HS switches to VSUP/
2 pin which can be used as a LIN master termination switch.
Pins LINT, LINT-1 and LINT-2 pins are the same as
I/O-2 and I/O-3.
Analog Integrated Circuit Device Data
Freescale Semiconductor 39
33903/4/5
FUNCTIONAL DEVICE OPERATION
MODE AND STATE DESCRIPTION
FUNCTIONAL DEVICE OPERATION
MODE AND STATE DESCRIPTION
The device has several opera tion modes. The transitions
and conditions to enter or leave each mode are illustrated in
the state diagram.
INIT RESET
This mode is automatically entered after the device is
“powered on”. In this mode, the RST pin is asserted low, for
a duration of typically 1.0 ms. Control bits and flags are “set”
to their default reset condition. The BATFAIL is set to indicate
the device is coming from an unpowered condition, and all
previous device configurations are lost and “reset” the default
value. The duration of the INIT reset is typically 1.0 ms.
INIT reset mode is also entered from INIT mode if the
expected SPI command does not occur in due time (Ref. INIT
mode), and if the device is not in the debug mode.
INIT
This mode is automatically entered from the INIT Reset
mode. In this mode, the device must be configured via SPI
within a time of 25 6 ms max.
Four registers called INIT Wdog, INIT REG, INIT LIN I/O
and INIT MISC must be, and can only be configured during
INIT mode.
Other registers can be written in this and other modes.
Once the INIT register configuration is done, a SPI
Watchdog Refresh command must be sent in order to set the
device into Normal mode. If the SPI watchdog refresh does
not occur within the 256 ms period, the device will return into
INIT Reset mode for typically 1.0 ms, and then re enter into
INIT mode.
Register read operation is allowed in INIT mode to collect
device status or to read back the INIT register configuration.
When INIT mode is left by a SPI watchdog refresh
command, it is only possible to re-enter the INIT mode using
a secured SPI command. In INIT mode, the CAN, LIN1, LIN2,
VAUX, I/O_x and Analog MUX functions are not opera ting.
The 5 V-CAN is also not operating, except if the Debug mode
is detected.
RESET
In this mode, the RST pin is asserted low. Reset mode is
entered from Normal mode, Normal Request mode, LP VDD
on mode and from the Flash mode when the watchdog is not
triggered, or if a VDD low cond i ti on is detected.
The duration of reset is typically 1.0 ms by default. You
can define a longer Reset pulse activation only when the
Reset mode is entered following a VDD low condition. Reset
pulse is always 1.0 ms, when reset mode is entered due to
wrong watchdog refresh command.
Reset mode can be entered via the secured SPI
command.
NORMAL REQUEST
This mode is automatically entered after RESET mode, or
after a Wake-up from LP VDD ON mode.
A watchdog refresh SPI command is necessary to
transition to NORMAL mode. The duration of the Normal
request mode is 256 ms wh en Normal Request mode is
entered after RESET mode. Different durations can be
selected by SPI when normal request is entered from LP VDD
ON mode.
If the watchdog refresh SPI command does not occur
within the 256 ms (or the shorter user defined time out), then
the device will enter into RESET mode for a duration of
typically 1.0 ms.
Note: in init reset, init, reset and normal request modes as
well as in LP modes, the VDD external PNP is disabled.
NORMAL
In this mode, all device functions are available. This mode
is entered by a SPI watchdog refresh command from Normal
Request mode, or from INIT mode.
During Normal mode, the device watchdog function is
operating, and a periodic watchdog refresh must occur.
When an incorrect or missing watchdog refresh command is
initiated, the device will enter into Reset mode.
While in Normal mode, the device can be set to LP modes
(LP VDD ON or LP VDD OFF) using the SPI command.
Dedicated, secured SPI commands must be used to enter
from Normal mode to Reset mode, INIT mode or Flash mode.
FLASH
In this mode, the software watchdog period is extended up
to typically 32 seconds. This allow programming of the MCU
flash memory while minimizing the software over head to
refresh the watchdog. The flash mode is entered by Secured
SPI command and is left by SPI command. Device will enter
into Reset mode. When an incorrect or missing watchdog
refresh command device will enter into Reset mode. An
interrupt can be generated at 50% of the watchdog period.
CAN interface operates in Flash mode to allow flash via
CAN bus, inside the vehicle.
DEBUG
Debug is a special operation mode of the device which
allows for easy software and hardware debugging. The
debug operation is detected after power up if the DBG pin is
set to 8.0 to 10 V range.
When debug is detected, all the software watchdog
operations are disabled: 256 ms of INIT mode, watchdog
refresh of Normal mode and Flash mode, Normal Request
time out (256 ms or user defined value) are not operating and
will not lead to transition into INIT reset or Reset mode.
When the device is in Debug mode, the SPI command can
be sent without any time constraints with respect to the
watchdog operation and the MCU program can be “halted” or
“paused” to verify proper operation.
Analog Integrated Circuit Device Data
40 Freescale Semiconductor
33903/4/5
FUNCTIONAL DEVICE OPERATION
LP MODES
Debug can be left by removing 8 to 10 V from the DEBUG
pin, or by the SPI command (Ref. to MODE register). The 5 V-CAN regulator is ON by default in Debug mode.
LP MODES
The device has two main LP modes: LP mode with VDD
OFF, and LP mode with VDD ON.
Prior to entering into LP mode, I/O and CAN Wa ke-up
flags must be cleared (Ref. to mode register). If the Wake-up
flags are not cleared, the device will not enter into LP mode.
In addition, the CAN failure flags (i.e. CAN_F and CAN_ UF)
must be cleared, in order to meet the LP current consumption
specification.
LP - VDD OFF
In this mode, VDD is turned OFF and the MCU connected
to VDD is unsupplied. This mode is entered using SPI. It can
also be entered by an automatic transition due to fail-safe
management. 5 V-CAN and VAUX regulators are al so turn ed
OFF.
When the device is in LP VDD OFF mode, it monitors
external events to Wake-up and leave the LP mode. The
Wake-up events can occur from:
•CAN
• LIN interface, depending upon device part number
• Expiration of an internal timer
• I/O-0, and I/O-1 inputs, and depending upon device part
number and configuration, I/O-2 and/or -3 input
• Cyclic sense of I/O-1 input, associated by I/O-0
activation, and depending upon device part number and
configuration, cyclic sense of I/O-2 and -3 input,
associated by I/O-0 activation
When a Wake-up event is detected, the device enters into
Reset mode and then into Normal Request mode. The Wake-
up sources are reported to the device SPI registers. In
summary, a Wake-up event from LP VDD OFF leads to the
VDD regulator turned ON, and the MCU operation restart.
LP - VDD ON
In this mode, the voltage at the VDD pin remains at 5.0 V
(or 3.3 V, depending upon device part numbe r). The
objective is to maintain the MCU powered, with redu ced
consumption. In such mode, the DC output current is
expected to be limited to 100 A or a few mA, as the ECU is
in reduced power operation mode.
During this mode, the 5 V-CAN and VAUX regulators are
OFF. The optional external PNP at VDD will also be
automatically disabled when entering this mode.
The same Wake-up events as in LP VDD OFF mode (CAN,
LIN, I/O, timer, cyclic sense) are available in LP VDD on
mode.
In addition, two additional Wake-up conditions are
available.
• Dedicated SPI command. When device is in LP VDD ON
mode, the Wake-up by SPI command uses a write to
“Normal Request mode”, 0x5C10.
• Output current from VDD exceeding LP-ITH threshold.
In LP VDD ON mode, the device is able to source several
tenths of mA DC. The current source capability can be time
limited, by a selectable internal timer. Timer duration is up to
32 ms, and is triggered when the output current exceed the
output current threshold typi cally 1.5 mA.
This allows for instance, a periodic activation of the MCU,
while the device remains in LP VDD on mode. If the duration
exceed the selected time (ex 32 ms), the device will detect a
Wake-up.
Wake-up events are reported to the MCU via a low leve l
pulse at INT pulse. The MCU will detect the INT pulse and
resume operation.
Watchdog Function in LP VDD ON Mode
It is possible to enable the watchdog function in LP VDD
ON mode. In this case, the principle is timeout.
Refresh of the watchdog is done either by:
• a dedicated SPI command (different from any other SPI
command or simple CS activation which would Wake-
up - Ref. to the previous paragraph)
• or by a temporary (less than 32 ms max) VDD over
current Wake-up (IDD > 1.5 mA typically).
As long as the watchdog refresh occurs, the device
remains in LP VDD on mode.
Mode Transitions
Mode transitions are either done automatically (i.e. after a
timeout expired or voltage conditions), or via a SPI command,
or by an external event such as a Wake-up. Some mode
changes are performed using the Secured SPI commands.
Analog Integrated Circuit Device Data
Freescale Semiconductor 41
33903/4/5
FUNCTIONAL DEVICE OPERATION
STATE DIAGRAM
STATE DIAGRAM
Figure 23. State Diagram
INIT Reset
start T_IR
INIT
start T_INIT
T_IR expired
T_INIT expired
or VDD<VDD_UVTH
NORMAL (4)
start T_ WDN
SPI write (0x5A00)
SPI secured (3)
watchdog refresh
FLASH
start T_WDF
SPI secured (3)
watchdog refresh
RESET
(config)
start T_R
(1.0 ms or config) VDD<VDD_UVTH or T_WD expired
POWER DOWN
SPI secured
VSUP fall
VSUP/1 rise > VSUP-TH1
NORMAL
start T_NR
REQUEST
(256 ms or co nfig)
(1) watchdog refresh in closed window or enhanced watchdog refresh failure
T_R expired
SPI write (0x5A00)
T_NR expired
LP
start T_WDL (2 )
VDD ON
LPVDD OFF
Wake-up
if enable
Wake-up (5)
(2) If enable by SPI, prior to enter LP VDD ON mode
LP VDDON
start T_OC time
IDD > 1.5 mA I-DD>IOC
I-DD<IOC
T_OC expired
SPI
& VDD>VDD_UVTH
watchdog refresh
SPI
or T_WDF expired
or VDD<VDD_UVTH
VSUP fall Debug
FAIL-SAFE DETECTED
detection
(watchdog refresh)
(1.5 mA)
(1.5 mA)
by SPI
by SPI
mode
(T_IR =1.0ms)
(T_INIT =256ms)
(T_WDN = config)
T_WDL expired or VDD<VDD_UVTHLP
or Wake-up
or watchdog failure (1) or SPI secured
(watchdog refresh)
VDD<VDD_UVTHLP
by SPI
& VDD > VDD_UVTH
Ext reset
(3) Ref. to “SPI secure” description (4) VDD external PNP is disable in all mode except Normal and Flash modes.
(5) Wake-up from LP VDD ON mode by SPI command is done by a SPI mode change: 0X5C10
or VDD TSD
Analog Integrated Circuit Device Data
42 Freescale Semiconductor
33903/4/5
FUNCTIONAL DEVICE OPERATION
MODE CHANGE
MODE CHANGE
“SECURED SPI” DESCRIPTION:
A request is done by a SPI command, the device provide
on MISO an unpredictable “random code”. Software must
perform a logical change on the code and return it to the
device with the new SPI command to perform the desired
action.
The “random code” is different at every exercise of the
secured procedure and can be read back at any time.
The secured SPI uses the Special MODE register for the
following transitions:
- from Normal mode to INT mode
- from Normal mode to Flash mode
- from Normal mode to Reset mode (reset request).
“Random code” is also used when the “advance
watchdog” is selected.
CHANGING OF DEVICE CRITICAL PARAMETERS
Some critical parameters are configured one time at
device power on only, while the batfail flag is set in the INIT
mode. If a change is required while device is no longer in INIT
mode, device must be set back in INIT mode using the “SPI
secure” procedure.
WATCHDOG OPERATION
IN NORMAL REQUEST MODE
In Normal Request mode, the device expects to receive a
watchdog configuration before the end of the normal request
time out period. This period is reset to a long (256 ms) after
power on and when BATFAIL is set.
The device can be configured to a different (shorter) time
out period w hich can be used after Wake-up f rom LP VDD on
mode.
After a software watchdog reset, the value is restored to
256 ms, in order to allow for a complete software initialization,
similar to a device power up.
In Normal Request mode the watchdog operation is
“timeout” only and can be triggered/observed any time within
the period.
WATCHDOG TYPE SELECTION
Three types of watchdog operation can be used:
- Window watchdog (default)
- Timeout operation
- Advanced
The selection of watchdog is performed in INIT mode. This
is done after device power up and when the BATFAIL flag is
set. The Watchdog configuration is done via the SPI, then the
Watchdog mode selection content is locked and can be
changed only via a secured SPI procedure.
Window Watchdog Operation
The window watchdog is available in No rmal mode only.
The watchdog period selection can be kept (SPI is selectable
in INIT mode), while the device enters into LP VDD ON mode.
The watchdog period is reset to the default long period after
BATFAIL.
The period and the refresh of watchd og are done by the
SPI. A refresh must be done in the open window of the
period, which starts at 50% of the selected perio d and ends
at the end of the period.
If the watchdog is triggered before 50%, or not triggered
before end of period, a reset has occurred. The device enters
into Reset mode.
Watchdog in De bug Mode
When the device is in Debug mode (entered via the DBG
pin), the watchdog continues to operate but does not affect
the device operation by asserting a reset. Fo r the user,
operation appears without the watchdog.
When Debug mode is set by software (SPI mode reg), the
watchdog period starts at the end of the SPI command.
When Debug mode is set by hardware (DBG pin below 8-
10 V), the device enters into Reset mode.
Watchdog in Flash Mode
During Flash mode, watchdog can be set to a long timeout
period. Watchdog is timeout only and an INT pulse can be
generated at 50% of the time window.
Advance Watchdog Operation
When the Advance watchdog is selected (at INIT mode),
the refresh of the watchdog must be done using a rando m
number and with 1, 2, or 4 SPI commands. The number for
the SPI command is selected in INIT mode.
The software must read a random byte from the device,
and then must return the random byte inverted to clear the
watchdog. The random byte write can be performed in 1, 2,
or 4 different SPI commands.
If one command is selected, all eight bits are written at
once.
If two commands are selected, the first write command
must include four of the eight bits of the inverted random byte.
The second command must include the next four bits. This
completes the watchdog refresh.
If four commands are selected, the first write command
must include two of the eight bits of the inverted random byte.
The second command must include the next two bits, the 3rd
command must include the next two, and the last command,
Analog Integrated Circuit Device Data
Freescale Semiconductor 43
33903/4/5
FUNCTIONAL DEVICE OPERATION
WATCHDOG OPERATION
must include the last two. This comple tes the watchdog
refresh.
When multiple writes are used, the most significant bits are
sent first. The latest SPI command needs to be done inside
the open window time frame, if window watchdog is selected.
DETAIL SPI OPERATION AND SPI COMMANDS
FOR ALL WATCHDOG TYPES.
All SPI commands and examples do not use parity
functions.
In INIT mode, the watchdog type (window, timeout,
advance and number of SPI commands) is selected using the
register Init watchdog, bits 1, 2 and 3. The watchdog period
is selected using the TIM_A register. The watchdo g period
selection can also be done in Normal mode or in Normal
Request mode.
Transition from INIT mode to Normal mode or from Normal
Request mode to Normal mode is done using a single
watchdog refresh command (SPI 0x 5A00).
While in Normal mode, the Watchdog Refresh Command
depends upon the watchdog type selected in INIT mode.
They are detailed in the paragraph below:
Simple Watchdog
The Refresh command is 0x5A00. It can be send any time
within the watchdog period, if the timeout watchdog operation
is selected (INIT-watchdog register, bit 1 WD N/Win = 0). It
must be send in the open window (second half of the period)
if the Window Watchdog operation was selected (INIT-
watchdog register, bit 1 WD N/Win = 1).
Advance Watchdog
The first time the device enters into Normal mode (entry on
Normal mode using the 0x5A00 command), Random
(RNDM) code must be read using the SPI command,
0x1B00. The device returns on MISO second byte the RNDM
code. The full 16 bits MISO is called 0x XXRD. RD is the
complement of the RD byte.
Advance Watchdog, Refresh by 1 SPI Command
The refresh comman d is 0x5ARD. During each refresh
command, the device will return on MISO, a new Random
Code. This new Random Code must be inverted and send
along with the next refresh command. It must be done in an
open window, if the Window operation was selected.
Advance Watchdog, Refresh by two SPI Commands:
The refresh command is split in two SPI commands.
The first partial refresh command is 0x5Aw1, and the
second is 0x5Aw2. Byte w1 contains the first four inverted
bits of the RD byte plus the last four bits equal to zero. Byte
w2 contains four bits equal to zero plus the last four inverted
bits of the RD byte.
During this second refresh command the device returns on
MISO a new Random Code. This new random code must be
inverted and send along with the next two refresh commands
and so on.
The second command must be done in an open window if
the Window operation was selected.
Advance Watchdog, Refresh by four SPI Commands
The refresh command is split into four SPI commands.
The first partial refresh command is 0x5Aw1, the second is
0x5Aw2, the third is 0x5Aw3, and the last is 0x5Aw4.
Byte w1 contains the first two inverted bits of the RD byte,
plus the last six bits equal to zero.
Byte w2 contains two bits equal to zero, plus the next two
inverted bit s of the RD byte, plus fou r bits equal to zero.
Byte w3 contains four bits equal to zero, plus the next two
inverted bit s of the RD byte, plus two bits equal to zero.
Byte w4 contains six bits equal to zero, plus the next two
inverted bits of the RD byte.
During this fourth refresh command, the device will return,
on MISO, a new Random Code. This new Random Code
must be inverted and send along with the next four refresh
commands.
The fourth command must be done in an open window if
the Window operation was selected.
PROPER RESPONSE TO INT
During a device detect upon an INT, the software handles
the INT in a timely manner: Access of the INT register is done
within two watchdog periods. This feature must be enabled
by SPI using the INIT watchdog register bit 7.
Analog Integrated Circuit Device Data
44 Freescale Semiconductor
33903/4/5
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL BLOCK OPERATION VERSUS MODE
FUNCTIONAL BLOCK OPERATION VERSUS MODE
The 5 V-CAN default is ON when the device is powered-up and set in Debug mode. It is fully controllable via the SPI command.
Table 8. Device Block Operation for Each State
State VDD 5 V-CAN I/O-X VAUX CAN LIN1/2
Power down OFF OFF OFF OFF High-impedance High-impedance
Init Reset ON OFF HS/LS off
Wake-up disable OFF OFF:
CAN termination 25 k to GND
Transmitter / receiver /Wake-up
OFF
OFF:
internal 30 k pull-up active.
Transmitter: receiver /
Wake-up OFF.
LIN term OFF
INIT ON OFF (34)
WU disable
(35)(36)(37)
OFF OFF OFF
Reset ON Keep SPI config WU disable
(35)(36)(37)
OFF OFF OFF
Normal Request ON Keep SPI config WU disable
(35)(36)(37)
OFF OFF OFF
Normal ON SPI config SPI config
WU SPI config SPI config SPI config SPI config
LP VDD OFF OFF OFF user defined
WU SPI config OFF OFF + Wake-up en/dis OFF + Wake-up en/dis
LP VDD ON ON(33) OFF user defined
WU SPI config OFF OFF + Wake-up en/dis OFF + Wake-up en/dis
SAFE output low:
Safe case A safe case
A:ON
safe case B:
OFF
A: Keep SPI
config, B: OFF HS/LS off
Wake-up by change
state
OFF OFF + Wake-up enable OFF + Wake-up enable
FLASH ON SPI config SPI config OFF SPI config OFF
Notes
33. With limited current capability
34. 5 V-CAN is ON in Debug mode.
35. I/O-0 and I/O-1, configured as an output high-side switch and ON in Normal mode will remain ON in RESET, INIT or Normal
Request.
36. I/O-0, configured as an output low-side switch and ON in Nor mal mode will turn OFF when entering Reset mode, resume
operation in Normal mode.
37. I/O-1, configured as an output low-side switch and ON in Normal mode will remain ON in RESET, INIT or Normal Request.
Analog Integrated Circuit Device Data
Freescale Semiconductor 45
33903/4/5
FUNCTIONAL DEVICE OPERATION
ILLUSTRATION OF DEVICE MODE TRANSITIONS.
ILLUSTRATION OF DEVICE MODE TRANSITIONS.
Figure 24. Power Up Normal and LP Modes
V
SUP
V
DD
RST
INT
SPI
MODE
V
DD-UV
(4.5 V typically)
RESET INIT
Series of SPI
Single SPI
NORMAL
BATFAIL
5V-CAN
>4.0 V
VAUX
APower up to Nor mal Mode B
s_11
s_1
s_11: write IN T registers
s_1: go to Normal mode
s_12
s_2
V
DD-UV
NORMAL LP V
DD
OFF
C
s_2: go to
LP VDD OFF mode
s_12: LP Mode configuration
BNormal to LP
V
SUP
V
DD
RST
INT
SPI
5V-CAN
VAUX
legend:
s_13
s_3
NORMAL LP V
DD
On
D
BNormal to LP
V
SUP
V
DD
RST
INT
SPI
5V-CAN
VAUX
s_13: LP Mode configuration
s_3: go to LP mode
V
DD
OFF Mode V
DD
ON Mode
Analog Integrated Circuit Device Data
46 Freescale Semiconductor
33903/4/5
FUNCTIONAL DEVICE OPERATION
ILLUSTRATION OF DEVICE MODE TRANSITIONS.
Figure 25. Wake-up from LP Modes
CWake-up from LP V
DD
OFF Mode
V
DD
-UV
(4.5 V typically)
RESET NORMAL
s_14
s_4
REQUEST NORMAL
CAN bus
Based on reg configuration
Based on reg configuration
CAN Wake-up
I/O-x toggle
pattern
Available Wake-up event s (exclusive)
Wake-up detected
Start FWU timer
duration (50-8192 ms)
.
SPI selectable
FWU timer
LP V
DD
_OFF
V
SUP
V
DD
RST
INT
SPI
MODE
5V-CAN
VAUX
D
s_14
s_4
NORMAL
REQUEST NORMAL
LP V
DD
ON
Based on reg configuration
Based on reg configuration
CAN bus
CAN Wake-up
I/O-x toggle
pattern
I
DD
current I
DD-OC
(3.0 mA typically)
I
DD OC
deglitcher or timer (100 us typically, 3 -32 ms)
Wake-up detected
Start FWU timer
duration (50-8192 ms)
Stop
SPI selectable
FWU timer
SPI
Wake-up from LP V
DD
ON Mode
V
SUP
V
DD
RST
INT
SPI
MODE
5V-CAN
VAUX
LIN Bus
LIN Wake-up filter
LIN Bus
LIN Wake-up filter
Analog Integrated Circuit Device Data
Freescale Semiconductor 47
33903/4/5
FUNCTIONAL DEVICE OPERATION
CYCLIC SENSE OPERATION DURING LP MODES
CYCLIC SENSE OPERATION DURING LP MODES
This function can be used in both LP modes: VDD OFF and
VDD ON.
Cyclic sense is the periodic activation of I/O-0 to allow
biasing of external contact switches. The contact switch state
can be detected via I/O-1, -2, and -3, and the device can
Wake-up from either LP mode.
Cyclic sense is optimized and designed primarily for
closed contact switch in order to minimize consumption via
the contact pull-up resistor.
Principle
A dedicated timer provides an opportunity to select a cyclic
sense period from 3.0 to 512 ms (selection in timer B).
At the end of the period, the I/O-0 will be activated for a
duration of T_CSON (SPI selectable in INIT register, to 200 s,
400 s, 800 s, or 1.6 ms). The I/O-0 HS transistor or LS
transistor can be activated. The selection is done by the state
of I/O-0 prior to entering in LP mode.
During the T-CSON duration, the I/O-x’s are monitored. If
one of them is high, the device will detect a Wake-up.
(Figure 26).
Cyclic sense period is selected by the SPI configuration
prior to entering LP mode. Upon entering LP mode, the I/O-0
should be activated.
The level of I/O-1 is sense during the I/O-0 active time, and
is deglitched for a duration of typically 30 s. This means that
I/O-1 should be in the expected state for a duration longer
than the deglitch time.
The diagram below (Figure 26) illustrates the cyclic sense
operation, with I/O-0 HS active and I/O-1 Wake-up at high
level.
Figure 26. Cyclic Sense Operation - Switch to GND, Wake-up by Open Switch
I/O-0
I/O-1
NORMAL MODE LP MODE
I/O-0 HS active in No rm al mo de I/O-0 HS active during cyclic sense active time
Cyclic sense period
Cyclic sense active time
RESET or NORMAL REQUEST MODE
Wake-up detected.
state o f I/O-1 low => no Wake-up
Cyclic sense active
I/O-1 deglitcher time
I/O-1 high => Wake-up I/O-0
I/O-1
Zoom
time (ex 200 us)
Wake-up event detected
I/O-0
I/O-1
S1 closed S1 openS1
(typically 30 us)
S1
R
I/O-2
R
S2
R
S3
I/O-3
I/O-0
I/O-1
S1
R
I/O-2
R
S2
R
S3
I/O-3
Upon entering in LP mode, all 3
contact switches are closed. In LP mode, 1 contact switch is open .
High level is detected on I/O-x, an d device wakes up.
Analog Integrated Circuit Device Data
48 Freescale Semiconductor
33903/4/5
FUNCTIONAL DEVICE OPERATION
CYCLIC INT OPERATION DURING LP VDD ON MODE
CYCLIC INT OPERATION DURING LP VDD ON MODE
Principle
This function can be used only in LP VDD ON mode (LP
VDD ON).
When Cyclic INT is selected and device is in LP VDD ON
mode, the device will generate a periodic INT pulse.
Upon reception of the INT pulse, the MCU must
acknowledge the INT by sendin g SPI commands before the
end of the next INT period in order to keep the process going.
When Cyclic INT is selected and operating, the device
remains in LP VDD ON mode, assuming the SPI commands
are issued properly. When no/improper SPI comma nds are
sent, the device will cease Cyclic INT operation and leave LP
VDD ON mode by issuing a reset. The device will then enter
into Normal Request mode.
VDD current capability and VDD regulator behavior is
similar as in LP VDD ON mode.
Operation
Cyclic INT period selection: register timer B
SPI command in hex 0x56xx [example; 0x560E for 512ms
cyclic Interrupt period (SPI command without parity bit)].
This command must be send while the device is in Normal
mode.
SPI commands to acknowledge INT: (2 commands)
- read the Random code via the watchdog register address
using the following command: MOSI 0x1B00 device report on
MISO second byte the RNDM code (MISO bit 0-7).
- write watchdog refresh command using the random code
inverted: 0x5A RND b.
These commands can occur at any time within the period.
Initial entry in LP mode with Cyclic INT: after the device is
set in LP VDD ON mode, with cyclic INT enable, no SPI
command is necessary until the first INT pulse occurs. The
acknowledge process must start only after the 1st INT pulse.
Leave LP mode with Cyclic INT:
This is done by a SPI Wake-up command, similar to SPI
Wake-up from LP VDD ON mode: 0x5C10. The device will
enter into Normal Request mode.
Improper SPI command while Cyclic INT operates:
When no/improper SPI commands are sent, while the
device is in LP VDD ON mode with Cyclic INT enable, the
device will cease Cyclic INT operation and leave LP VDD ON
mode by issuing a reset. The device will then enter into
Normal Request mode.
The figure below (Figure 27) describes the complete
Cyclic Interrupt operation.
Figure 27. Cyclic Interrupt Operation
NORMAL MODE
INT
SPI
Timer B
LP V
DD
Cyclic INT period Cyclic INT period
LP V
DD
ON MODE
ON mode
Read RNDM cod e
Write RNDM code inv.
1st period 2nd period
NORMAL
MODE
Cyclic INT period
Cyclic INT period
3rd period
SPI Wake-up: 0x5C10
Write Timer B, selec t Cyclic INT period (ex: 512 ms, 0x560E)
Write Device mode: LP V
DD
ON with Cyclic INT enable (example: 0x5C90)
Cyclic INT period
Legend for SPI commands
INT
SPI
RST
RESET and
REQUEST
Prepare LP V
DD
ON In LP V
DD
ON with Cyclic INT Leave LP
Improper or no
with Cyclic INT V
DD
ON Mode
LP V
DD
ON MODE
Leave LP V
DD
ON and Cyclic INT due to improper operation
REQUEST
acknowledg e SP I com m an d
NORMAL
MODE
Analog Integrated Circuit Device Data
Freescale Semiconductor 49
33903/4/5
FUNCTIONAL DEVICE OPERATION
BEHAVIOR AT POWER UP AND POWER DOWN
BEHAVIOR AT POWER UP AND POWER DOWN
DEVICE POWER UP
This section describe the device behavior during ramp up,
and ramp down of VSUP/1, and the flexibility offered mainly by
the Crank bit and the two VDD under-voltage reset thresholds.
The figures below illustrate the device behavior during
VSUP/1 ramp up. As the Crank bit is by default set to 0, VDD is
enabled when VSUP/1 is above VSUP TH 1 parameters.
Figure 28. VDD Start-up Versus VSUP/1 Tramp
DEVICE POWER DOWN
The figures below illustrate the device behavior during
VSUP/1 ramp down, based on Crank bit configuration, and
VDD under-voltage reset selection.
Crank Bit Reset (INIT Watchdog Register, Bit 0 =0)
Bit 0 = 0 is the default state for this bit.
During VSUP/1 ramp down, VDD remain ON until device
enters in Reset mode due to a VDD under-voltage condition
(VDD < 4.6 V or VDD < 3.2 V typically, threshold selected by
the SPI). When device is in Reset, if VSUP/1 is below
“VSUP_TH1”, VDD is turned OFF.
Crank Bit Set (INIT Watchdog Register, Bit 0 =1)
The bit 0 is set by SPI write. During VSUP/1 ramp down,
VDD remains ON until device detects a POR and set
BATFAIL. This occurs for a VSUP/1 approx 3.0 V.
D1
V
BAT
VSUP/1
V
SUP_TH1
V
SUP_NOMINAL
(ex 12 V)
V
DD NOMINAL
(ex 5.0 V)
VDD
Gnd
V
DD_START UP
V
DD_OFF
90% V
DD_START UP
10% V
DD_START UP
VDD
VSUP/1
I_VDD
V
SUP
slew rate
3390X
V
DD_UV TH
(typically 4.65 V)
RST
1.0 ms
Analog Integrated Circuit Device Data
50 Freescale Semiconductor
33903/4/5
FUNCTIONAL DEVICE OPERATION
BEHAVIOR AT POWER UP AND POWER DOWN
Figure 29. VDD Behavior During VSUP/1 Ramp Down
V
SUP_NOMINAL
V
DD
(5.0 V)
VDD
VSUP/1
RST
(ex 12 V)
V
BAT
V
DD_UV TH
(typically 4.65 V)
V
SUP_TH1
(4.1 V)
V
SUP_NOMINAL
V
DD
(5.0 V)
VDD
VSUP/1
RST
(ex 12 V)
V
BAT
V
DD_UV TH
(typically 4.65 V)
V
SUP_TH1
(4.1 V)
INT
V
DD_UV TH2
(typically 3.2 V)
V
SUP_NOMINAL
V
DD
(5.0 V)
VDD
VSUP/1
RST
(ex 12 V)
V
BAT
V
DD_UV TH
(typically 4.65 V)
INT
V
DD_UV TH2
(typically 3.2 V)
BATFAIL (3.0 V)
(1)
(2)
(1) reset then (2) V
DD
turn OFF
V
SUP_NOMINAL
V
DD
(5.0 V)
VDD
VSUP/1
RST
(ex 12 V)
V
BAT
V
DD_UV TH
(typically 4.65 V)
BATFAIL (3.0 V)
Case 2: “VDD UV 4.6V”, with bit Crank = 1
Case 1: “VDD UV TH 3.2V”, with bit Crank = 0 (default value) Case 2: “VDD UV 3.2V”, with bit Crank = 1
Case 1: “VDD UV TH 4.6V”, with bit Crank = 0 (default value)
Analog Integrated Circuit Device Data
Freescale Semiconductor 51
33903/4/5
FAIL-SAFE OPERATION
BEHAVIOR AT POWER UP AND POWER DOWN
FAIL-SAFE OPERATION
OVERVIEW
Fail-safe mode is entered when specific fail conditions
occur. The “Safe state” condition is defined by the resistor
connected at the DGB pin. Safe mode is entered after
additional event or conditions are met: time out for CAN
communication and state at I/O-1 pin.
Exiting the safe state is always possible by a Wake-up
event: in the safe state, the device can automatica lly be
awakened by CAN and I/O (if configured as inputs). Upon
Wake-up, the device operation is resumed: enter in Reset
mode.
FAIL-SAFE FUNCTIONALITY
Upon dedicated event or issue detected at a device pin
(i.e. RST short to VDD), the Safe mode can be entered. In
this mode, the SAFE pin is active low.
Description
Upon activation of the SAFE pin, and if the failure
condition that make the SAFE pin activated have not
recovered, the device can help to reduce ECU consumption,
assuming that the MCU is not able to set the whole ECU in LP
mode. T wo main cases are available:
Mode A
Upon SAFE activation, the MCU remains powered (VDD
stays ON), until the failure condition recovers (i.e. S/W is able
to properly control the device and properly refresh the
watchdog).
Modes B1, B2 and B3
Upon SAFE activation, the system continues to monitor
external event, and disable the MCU supply (turn VDD OFF).
The external events monitored are: CAN traffic, I/O-1 low
level or both of them. 3 sub cases exist, B1, B2 and B3.
Note: no CAN traffic indicates that the ECU of the vehicle
are no longer active, thus that the car is being parked and
stopped. The I/O low level detection can also indicate that the
vehicle is being shutdown, if the I/O-1 pin is connected for
instance to a switched battery signal (ignition key on/off
signal).
The selection of the monitored events is done by
hardware, via the resistor connected at DBG pin, but can be
over written by software, via a specific SPI command.
By default, after power up the device detect the resistor
value at DBG pin (upon transition from INIT to Normal mode),
and, if no specific SPI command related to Debug resistor
change is send, operates according to the detected resistor .
The INIT MISC register allow you to verify and change the
device behavior, to either confirm or change the hardware
selected behavior. Device wil l then operate according to the
SAFE mode configured by the SPI.
Table 9 illustrates the complete options available:
Exit of Safe Mode
Exit of the safe state with VDD OFF is always possible by
a Wake-up event: in this safe state the device can
automatically awakened by CAN and I/O (if I/O Wake-up was
enable by the SPI prior to enter into SAFE mode). Upon
Wake-up, the device operation is resumed, and device enters
in Reset mode. The SAFE pin remains active, until there is a
proper read and clear of the SPI flags reporting the SAFE
conditions.
Table 9. Fail-safe Options
Resistor at
DBG pin SPI coding - register INIT MISC bits [2,1,0]
(higher priority that Resistor coding) Safe mode
code VDD status
<6.0 k bits [2,1,0) = [111]: verification enable: resistor at DBG pin is typically
0 kohm (RA) - Selection of SAFE mode A Aremains ON
typically 15 k bits [2,1,0) = [110]: verification enable: resistor at DBG pin is typically
15 kohm (RB1) - Selection of SAFE mode B1 B1 Turn OFF 8.0 s after CAN traffic bus idle detection.
typically 33 k bits [2,1,0) = [101]: verification enable: resistor at DBG pin is typically
33 kohm (RB2 - Selection of SAFE mode B2 B2 Turn OFF when I/O-1 low level detected.
typically 68 k bits [2,1,0) = [100]: verification enable: resistor at DBG pin is typically
68 kohm (RB3) - Selection of SAFE mode B3 B3 Turn OFF 8.0 s after CAN traffic bus idle detection
AND when I/O-1 low level detected.
Analog Integrated Circuit Device Data
52 Freescale Semiconductor
33903/4/5
FAIL-SAFE OPERATION
BEHAVIOR AT POWER UP AND POWER DOWN
.
Figure 30. Safe Operation Flow Chart
Conditions to Set SAFE Pin Active Low
Watchdog refresh issue: SAFE activated at 1st reset pulse
or at the second consecutive reset pulse (selected by bit 4,
INIT watchdog register).
VDD low: VDD < RST-TH. SAFE pin is set low at the same
time as the RST pin is set low.
The RST pin is monitored to verify that reset is not
clamped to a low level preventing the MCU to operate. If this
is the case, the Safe mode is entered.
watchdog failure
VDD low:
Rst s/c GND:
- SAFE low
8 consecutive watchdog failure (5)
State A : RDBG <6.0 k AND
- SAFE low
- Reset: 1.0 ms
- VDD ON
- Reset low
INIT, b ) ECU external signal
State B1: RDBG =15k AND
State B3:
State B2: - SAFE low
- Reset low
- VDD OFF
a) Evaluation of
Bus idle timeout expired
Normal, FLASH
VDD <VDD_UVTH
Rst <2.5 V, t >100 ms
Device state:
RESET NR
bit 4, INIT watchdog = 1 (1) detection of 2nd
consecutive watchdog failure
SAFE low
SAFE high
SAFE low
Reset: 1.0 ms pulse
bit 4, INIT watchdog = 0 (1) Reset: 1.0 ms pulse
Normal Request
power up, or SPI
at DBG pin during
RESET
SAFE pin release
failure recovery, SAFE pin remains low
SPI (3)
AND Bus idle time out expired
RESET Wake-up (2), VDD ON, SAFE pin remains low
register content
(SAFE high)
Failure events
1) bit 4 of INIT Watchdog register
2) Wake-up event: CAN, LIN or I/O-1 high level (if I/O-1 Wake-up previously enabled)
3) SPI commands: 0xDD00 or 0xDD80 to release SAFE pin
4) Recovery: reset low condition released, VDD low condition released, correct SPI watchdog refresh
5) detection of 8 consecutive watchdog fai l ures: no correct SPI watchdog refresh command occurred for duration of 8 x 256 ms.
6) Dynamic behavior: 1.0 ms reset pulse every 256 ms, due to no watchdog refresh SPI command, and device state transition
Legend:
RDBG = 33 k AND I/O-1 low
RDBG =47 k AND I/O-1 low
- VDD ON
(6)
- SAFE low
- VDD ON
- Reset low
periodic pulse
State A: RDBG <6.0 k AND
watchdog failure
(VDD low or RST s/c GND) failure
safe state A
safe state B
Resistor detected
between RESET and NORMAL REQUEST mode, or INIT RESET and INIT modes.
- bus idle time out
- I/O-1 monitoring
monitoring (7):
7) 8 second timer for bus idle timeout. I/O-1 high to low transition.
SAFE Operation Flow Chart
Analog Integrated Circuit Device Data
Freescale Semiconductor 53
33903/4/5
FAIL-SAFE OPERATION
BEHAVIOR AT POWER UP AND POWER DOWN
SAFE Mode A Illustration
Figure 31 illustrates the event and consequences when SAFE mode A is selected via the appropriate debug resistor or SPI
configuration.
Figure 31. SAFE Mode A Behavior Illustration
RST
V
DD
failure event, i.e. watchdog
SAFE OFF state ON stat e
8 x 256 ms delay time to enter in SAFE mode
V
DD
RST
SAFE
to evaluate resistor at DBG pin
and monitor ECU external events
1st 8th
2nd
Behavior Illustration for Safe State A (RDG < 6.0 kohm), or Selection by the SPI
step 1: Failure illustration
RST
V
DD
failure event, V
DD
low
SAFE OFF st ate ON state
100 ms delay time to enter in SAFE mode
to evaluat e resistor at DBG pin
and monitor ECU external events
V
DD_UV TH
100ms
V
DD
RST
SAFE
V
DD
< V
DD_UV TH
GND GND
RST
V
DD
failure event, Reset s/c GND
SAFE OFF state ON state
100 ms deglitcher time to activate SAFE and
enter in SAFE mode to evaluate resistor at the DBG pin
and monitor ECU external events
2.5 V
100ms
V
DD
RST
SAFE
step 2: Consequence on
VDD, RST and SAFE
Analog Integrated Circuit Device Data
54 Freescale Semiconductor
33903/4/5
FAIL-SAFE OPERATION
BEHAVIOR AT POWER UP AND POWER DOWN
SAFE Mode B1, B2 and B3 Illustration
Figure 32 illustrates the event, and consequences whe n SAF E mode B1, B2, or B3 is selected via the appropriate debug
resistor or SPI configuration.
Figure 32. SAFE Modes B1, B2, or B3 Behavior Illustration
DBG resistor => safe state B1
V
DD
RST
SAFE
CAN bus
CAN bus idle time
I/O-1 I/O-1 high to low tra n sition
DBG resistor => safe state B2
DBG resistor => safe state B3
CAN bus
CAN bus idle time
I/O-1 I/O-1 h igh to lo w tra nsition
step 2:
RST
V
DD
failure event, i.e. watchdog
SAFE OFF state ON state
8 x 256 ms delay time to enter in SAFE mode
to evaluate resistor at the DBG pin
and monitor ECU external events
1st 8th
2nd
step 1: Failure illustration
RST
V
DD
failure event, V
DD
low
SAFE OFF state ON state
100 ms delay time to enter in SAFE mode
to evaluate resistor at DBG pin
and monitor ECU external events
V
DD_UV TH
100 ms
GND
RST
V
DD
failure event, Reset s/c GND
SAFE OFF state ON state
100 ms deglitcher time to activate SAFE and
enter in SAFE mode to evaluate resistor at DBG pin
and monitor ECU external events
2.5 V
100 ms
V
DD
RST
SAFE
V
DD
OFF
RST
SAFE
V
DD
If V
DD
failure recovered
V
DD
< V
DD_UV TH
V
DD
OFF
GND
step 3: Consequences for VDD
If Reset s/c GND recovered
Behavior illustration for the safe state B (RDG > 10 kohm)
Wake-up
ECU external condition
met => VDD disable
ECU external event to
RDBG resistor or
disable VDD based on
SPI configuration
Exclusive detection of
Analog Integrated Circuit Device Data
Freescale Semiconductor 55
33903/4/5
CAN INTERFACE
CAN INTERFACE DESCRIPTION
CAN INTERFACE
CAN INTERFACE DESCRIPTION
The figure below is a high level schematic of the CAN
interface. It exist in a LS driver between CANL and GND, and
a HS driver from CANH to 5 V-CAN. Two differential
receivers are connected between CANH and CANL to detect
a bus state and to Wake-up from CAN Sleep mode. An
internal 2.5 V reference provides the 2.5 V recessive levels
via the matched RIN resistors. The resistors can be switched
to GND in CAN Sleep mode. A dedicated split buffer provides
a low-impedance 2.5 V to the SPLIT pin, for recessive level
stabilization.
Figure 33. CAN Interface Block Diagra m
Can Interface Supply
The supply voltage for the CAN driver is the 5 V-CAN pin.
The CAN interface also has a supply pass from the battery
line through the VSUP/2 pin. This pass is used in CAN Sleep
mode to allow Wake-up detection.
During CAN communication (transmission and reception),
the CAN interface current is sourced from the 5 V-CAN pin.
During CAN LP mode, the current is sou rced from the VSUP/
2 pin.
TXD/RXD Mode
In TXD/RXD mode, both the CAN driver and the receiver
are ON. In this mode, the CAN lines are controlled by the TXD
pin level and the CAN bus state is reported on the RXD pin.
The 5 V-CAN regulator must be ON . It sup plies the CAN
driver and receiver.The SPLIT pin is active and a 2.5 V
biasing is provided on the SPLIT output pin.
Receive Only Mode
This mode is used to disable the CAN driver, but leave the
CAN receiver active. In this mode, the device is only able to
report the CAN state on the RXD pin. The TXD pin has no
effect on CAN bus lines. The 5 V-CAN regulator must be ON.
The SPLIT pin is active and a 2.5 V biasing is provided on the
SPLIT output pin.
Operation in TXD/RXD Mode
The CAN driver will be enabled as soon as the device is in
Normal mode and the TXD pin is recessive.
Differential
Receiver
Driver
Driver
2.5 V
Receiver
Pattern
Detection
CANH
CANL
QH
QL
R
IN
R
IN
VSUP/2
5V-CAN
Failure Detection Buffer
5V-CAN
SPLIT
Wake-up
& Management
TXD
RXD
5V-CAN
Thermal
SPI & State machine
SPI & State machine
SPI & St ate machine
Analog Integrated Circuit Device Data
56 Freescale Semiconductor
33903/4/5
CAN INTERFACE
CAN INTERFACE DESCRIPTION
When the CAN interface is in Normal mode, the driver has
two states: recessive or dominant. The driver state is
controlled by the TXD pin. The bus state is reported through
the RXD pin.
When TXD is high, the driver is set in the recessive state,
and CANH and CANL lines are biased to the voltage set with
5 V-CAN divided by 2, or approx. 2.5 V.
When TXD is low, the bus is set into the dominant state,
and CANL and CANH drivers are active. CANL is pulled low
and CANH is pulled high.
The RXD pin reports the bus state: CANH minus the CANL
voltage is compared versus an internal threshold (a few
hundred mV).
If “CANH minus CANL” is below the threshold, the bus is
recessive and RXD is set high.
If “CANH minus CANL” is above the threshold, the bus is
dominant and RXD is set low.
The SPLIT pin is active and provides a 2.5 V biasing to the
SPLIT output.
TXD/RXD Mode and Slew Rate Selection
The CAN signal slew rate selection is done via the SPI. By
default and if no SPI is used, the device is in the fastest slew
rate. Three slew rates are available. The slew rate controls
the recessive to dominant, and dominant to recessive
transitions. This also affects the delay time from the TXD pin
to the bus and from the bus to the RXD. The loop time is thus
affected by the slew rate selection.
Minimum Baud Rate
The minimum baud rate is determined by the shortest TXD
permanent dominant timing detection. The maximum number
of consecutive dominant bits in a frame is 12 (6 bits of active
error flag and its echo error flag).
The shortest TXD dominant detection time of 300 s lead
to a single bit time of: 300 s / 12 = 25 s.
So the minimum Baud rate is 1 / 25 s = 40 kBaud.
Sleep Mode
Sleep mode is a reduced curre nt consumption mode.
CANH and CANL drivers are disabled and CANH and CANL
lines are terminated to GND via the RIN resistor, the SPLIT
pin is high-impedance. In order to monitor bus activities, the
CAN Wake-up receiver can be enabled. It is supplied
internally from VSUP/2.
Wake-up events occurring on the CAN bus pin are
reporting by dedicated flags in SPI and by INT pulse, and
results in a device Wake-up if the device was in LP mode.
When the device is set back into Normal mode, CANH and
CANL are set back into the recessive level. This is illustrated
in Figure 34.
.
Figure 34. Bus Signal in TXD/RXD and LP Mode
Wake-up
When the CA N interface is in Sleep mode with Wake-up
enabled, the CAN bus traffic is detected. The CAN bus W ake-
up is a pattern W ake-up. The Wake-up by the CAN is enabled
or disabled via the SPI.
CANL
CANH
TXD
RXD
2.5 V
CANL-DOM
CANH-DOM CANL/CANH-REC
2.5 V
High ohmic termination (50 kohm) to GND
SPLIT
Dominant state Recessive state
Bus Driver Receiver
(bus dominant set by other IC) High-impedance
Normal or Listen Only mode Normal or Listen Only mode
Go to sleep,
CANH-CANL
Sleep or Stand-by mode
Analog Integrated Circuit Device Data
Freescale Semiconductor 57
33903/4/5
CAN INTERFACE
CAN INTERFACE DESCRIPTION
Figure 35. Single Dominant Pulse Wake-up
Pattern Wake-up
In order to Wake-up the CAN interface, the Wake-up
receiver must receive a series of three consecutive valid
dominant pulses, by default when the CANWU bit is low.
CANWU bit can be set high by SPI and the Wake-up will occur
after a single pulse duration of 2.0 s (typically).
A valid dominant pulse should be longer than 500 ns. The
three pulses should occur in a time frame of 120 s, to be
considered valid. When three pulses meet these conditions,
the wake signal is detected. This is illustrated by the following
figure.
.
Figure 36. Pattern Wake-up - Multiple Dominant Detection
BUS TERMINATION
The device supports the two main types of bus
terminations:
• Differential termination resistors between CANH and
CANL lines.
• SPLIT termination concept, with the mid point of the
differential termin ation connected to GND through a
capacitor and to the SPLIT pin.
• In application, the device can also be used without
termination.
•Figure 37 illustrates some of the most common
terminations.
CANL
CANH
Internal Wake-up signal
Dominant
CAN
Pulse # 1 Dominant
Pulse # 2
t
CAN WU1-F
Can Wake-up detected
bus
Internal differential Wake-up receiver signal
CANL
CANH
Internal Wake-up signal
Dominant
Internal differential Wake-up receiver signal
CAN
Pulse # 1 Dominant
Pulse # 2 Dominant
Pulse # 3 Dominant
Pulse # 4
tCAN WU3-F tCAN WU3-F tCAN WU3-F
tCAN WU3-TO
Dominant Pulse # n: duration 1 or multiple dominant bits
Can Wake-up detecte d
bus
Analog Integrated Circuit Device Data
58 Freescale Semiconductor
33903/4/5
CAN INTERFACE
CAN BUS FAULT DIAGNOSTIC
Figure 37. Bus Terminatio n Op tio ns
CAN BUS FAULT DIAGNOSTIC
The device includes diagnostic of bus short-circuit to GND,
VBAT, and internal ECU 5.0 V. Several comparators are
implemented on CANH and CANL lines. These comparators
monitor the bus level in the recessive and dominant states.
The information is then managed by a logic circuitry to
properly determine the failure and report it.
Figure 38. CAN Bus Simplified Structure Truth Table for Failure Detection
The following table indicates the state of the comparators when there is a bus failure, and depending upon the driver state.
CANH
CANL
SPLIT CAN bus
60
60
Standard termination
CANH
CANL
SPLIT CAN bus
120
No
connect
CANH
CANL
SPLIT
No termination
No
connect
ECU connector
ECU connector
CAN bus
ECU connector
Table 10. Failure Detection Truth Table
Failure Description Driver Recessive State Driver Dominant State
Lg (threshold 1.75 V) Hg (threshold 1.75 V) Lg (threshold 1.75 V) Hg (threshold 1.75 V)
No failure 1 1 0 1
CANL to GND 0 0 0 1
CANH to GND 0 0 0 0
Lb (threshold VSUP -2.0 V) Hb (threshold VSUP -2.0 V) Lb (threshold VSUP -2.0 V) Hb (threshold VSUP -2.0 V)
No failure 0 0 0 0
CANL to VBAT 1 1 1 1
CANH to VBAT 1 1 0 1
Hg CANH
CANLLg
VDD
Vrg
Vrg
Hb Vrvb
Lb Vrvb
Logic
TXD
Diag VDD (5.0 V)
GND (0.0 V)
Recessive level (2.5 V)
VBAT (12-14 V)
VRVB (VSUP-2.0 V)
VRG (1.75 V)
CANL dominant level (1.4 V)
CANH dominant level (3.6 V)
L5 Vr5
H5 Vr5
VR5 (VDD-.43 V)
Analog Integrated Circuit Device Data
Freescale Semiconductor 59
33903/4/5
CAN INTERFACE
CAN BUS FAULT DIAGNOSTIC
DETECTION PRINCIPLE
In the recessive state, if one of the two bus lines are
shorted to GND, VDD (5.0 V), or VBAT, the voltage at the
other line follows the shorted line, due to the bus termination
resistance. For example: if CANL is shorted to GND, the
CANL voltage is zero, the CANH voltage measured by the Hg
comparator is also close to zero.
In the recessive state, the failure detection to GND or
VBAT is possible. However, it is not possible with the above
implementation to distinguish which of the CANL or CANH
lines are shorted to GND or VBAT. A complete diagnostic is
possible once the driver is turned on, and in the dominant
state.
Number of Samples for Proper Failure Detection
The failure detector requires at least one cycle of the
recessive and dominant states to properly recognize the bus
failure. The error will be fully detected after five cycles of the
recessive-dominant states. As long as the failure detection
circuitry has not dete cted the same error for five recessive-
dominant cycles, the error is not reported.
BUS CLAMPING DETECTION
If the bus is detected to be in dominant for a time longer
than (TDOM), the bus failure flag is set and the error is
reported in the SPI.
This condition could occur when the CANH line is shorted
to a high-voltage. In this case, current will flow from the high-
voltage short-circuit, through the bus termination resistors
(60 ), into the SPLIT pin (if used), and into the device CANH
and CANL input resistors, which are terminated to internal
2.5 V biasing or to GND (Sleep mode).
Depending upon the high-voltage short-circuit, the number
of nodes, usage of the SPLIT pin, RIN actual resistor and
mode state (Sleep or Active) the voltage across the bus
termination can be sufficient to create a positive dominant
voltage between CANH and CANL, and the RXD pin will be
low. This would prevent start of any CAN communication and
thus, proper failure identification requires five pulses on TXD.
The bus dominant clamp circuit will help to determine such
failure situation.
RXD Permanent Recessive Failure (does not apply
to “C version”)
The aim of this detection is to diagnose an external
hardware failure at the RXD output pin and ensure that a
permanent failure at RXD does not disturb the netwo rk
communication. If RXD is shorted to a logic high signal, the
CAN protocol module within the MCU will not recognize any
incoming message. In addition, it will not be able to easily
distinguish the bus idle state and can start communication at
any time. In order to prevent this, RXD failure detection is
necessary. When a failure is detected, the RXD high flag is
set and CAN switches to receive only mode.
Figure 39. RXD Path Simplified Schematic, RXD Short to VDD Detection
Implementation for Detection
The implementation senses the RXD output voltage at
each low to high transition of the differ ential receiver.
Excluding the internal propagation delay, the RXD output
should be low when the differential receiver is low. When an
external short to VDD at the RXD output, RXD will be tied to
a high level and can be detected at the next low to high
transition of the differential receiver.
As soon as the RXD permanent recessive is detected, the
RXD driver is deactivated.
L5 (threshold VDD -0.43 V) H5 (threshold VDD -0.43 V) L5 (threshold VDD -0.43 V) H5 (threshold VDD -0.43 V)
No failure 0 0 0 0
CANL to 5.0 V 1 1 1 1
CANH to 5.0 V 1 1 0 1
Table 10. Failure Detection Truth Table
Failure Description Driver Recessive State Driver Dominant State
Lg (threshold 1.75 V) Hg (threshold 1.75 V) Lg (threshold 1.75 V) Hg (threshold 1.75 V)
CANH
CANL
Diff
VDD
Rxsense
RXD driver
RXD
TXD
TXD driver
60
VDD
Logic
Diag
CANL&H
Diff output
RXD output
RXD short to VDD
Prop delay
RXD flag
RXD flag latched
VDD/2 Sampling Sampling
The RXD flag is not the RXPR bit in the LPC regi ster, an d neither is the CANF in the INTR register.
Analog Integrated Circuit Device Data
60 Freescale Semiconductor
33903/4/5
CAN INTERFACE
CAN BUS FAULT DIAGNOSTIC
Once the error is detected the driver is disabled and the
error is reported via SPI in CAN register. Recovery Condition
The internal recovery is done by sampling a correct low
level at TXD as shown in the following illustration.
Figure 40. RXD Path Simplified Schematic, RXD Short to VDD Detection
TXD PERMANENT DOMINANT
Principle
If the TXD is set to a permanent low level, the CAN bus is
set into dominant level, and no communication is possible.
The device has a TXD permanent timeout detector. After the
timeout (TDOUT), the bus driver is disabled and the bus is
released into a recessive state. The TXD permanent flag is
set.
Recovery
The TXD permanent dominant is used and activated when
there is a TXD short to RXD. The recovery condition for a
TXD permanent dominant (recovery means the re-activation
of the CAN drivers) is done by entering into a Normal mode
controlled by the MCU or when TXD is recessive while RXD
change from recessive to dominant.
TXD TO RXD SHORT-CIRCUIT
Principle
When TXD is shorted to RXD during incomi ng dominant
information, RXD is set to low. Consequently, the TXD pin is
low and drives CANH and CANL into a dominant state. Thus
the bus is stuck in dominant. No further communication is
possible.
Detection and Recov ery
The TXD permanent dominant timeout will be activated and
release the CANL and CANH drivers. However, at the next
incoming dominant bit, the bus will then be stuck in dominant
again. The recovery condition is same as the TXD dominant
failure
IMPORTANT INFORMATION FOR BUS DRIVER
REACTIVATION
The driver stays disabled until the failure is/are removed
(TXD and/or RXD is no longer permanent dominant or
recessive state or shorted) and the failure flags cleared
(read). The CAN driver must be set by SPI in TXD/RXD mode
in order to re enable the CAN bus driver.
CANL&H
Diff output
RXD output RXD short to VDD
RXD flag
RXD flag latched
Sampling
Sampling
The RXD flag is not the RXPR bit in the LPC register, and neither is the CANF in the INTR register.
RXD no longer shorted to VDD
Analog Integrated Circuit Device Data
Freescale Semiconductor 61
33903/4/5
LIN BLOCK
LIN INTERFACE DESCRIPTION
LIN BLOCK
LIN INTERFACE DESCRIPTION
The physical interface is dedicated to automotive LIN sub-
bus applications.
The interface has 20 kbps and 10 kbps baud rate s, and
includes as well as a fast baud rate for test and programming
modes. It has excellent ESD robustness and immunity
against disturbance, and radiated emission performance. It
has safe behavior when a LIN bus short-to-ground, or a LIN
bus leakage during LP mode.
Digital inputs are relate d to the device VDD pin.
POWER SUPPLY PIN (VSUP/2)
The VSUP/2 pin is the supply pin for the LIN interface. To
avoid a false bus message, an under-voltage on VSUP/2
disables the transmission path (from TXD to LIN) when
VSUP/2 falls below 6.1 V.
GROUND PIN (GND)
When there is a ground disconnection at the module level,
the LIN interface do not have significant current consumption
on the LIN bus pin when in the recessive state.
LIN BUS PIN (LIN, LIN1, LIN2)
The LIN pin represents the single-wire bus transmitter and
receiver. It is suited for auto motive bus systems, and is
compliant to the LIN bus specification 2.1 and SAEJ2602-2.
The LIN interface is only active during Normal mode.
Driver Characteristics
The LIN driver is a LS MOSFET with internal over-current
thermal shutdown. An internal pull-up resistor with a serial
diode structure is integrated so no external pull-up
components are required for the application in a slave node.
An additional pull-up resistor of 1.0 k must be added when
the device is used in the master node. The 1.0 kpull-up
resistor can be connected to the LIN pin or to the ECU battery
supply.
The LIN pin exhibits no reverse current from the LIN bus
line to VSUP/2, even in th e event of a GND shift or VSUP/2
disconnection.
The transmitter has a 20 kbps, 10 kbps and fast baud rate,
which are selected by SPI.
Receiver Characteristics
The receiver thresholds are ratiometric with the device
VSUP/2 voltage.
If the VSUP/2 voltage goes below typically 6.1 V, the LIN
bus enters into a recessive state even if communication is
sent on TXD.
If LIN driver temperature reaches the over-te mpe ra tu re
threshold, the transceiver and receiver are disabled. When
the temperature falls below the over-temperature threshold,
LIN driver and receiver will be automatically en abled.
DATA INPUT PIN (TXD-L, TXD-L1, TXD-L2)
The TXD-L,TXD-L1 and TXD-L2 input pin is the MCU
interface to control the state of the LIN output. When TXD-L
is LOW (dominant), LIN output is LOW. When TXD-L is HIGH
(recessive), the LIN output transistor is turned OFF.
This pin has an internal pull-up current source to VDD to
force the recessive state if the input pin is left floating.
If the pin stays low (dominant sate) more than t TXDDOM,
the LIN transmitter goes automatically in recessive state. This
is reported by flag i n LI N regi st er.
DATA OUTPUT PIN (RXD-L, RXD-L1, RXD-L2)
This output pin is the MCU interface, which reports the
state of the LIN bus voltage.
LIN HIGH (recessive) is reported by a high voltage on
RXD, LIN LOW (dominant) is reported by a low voltage on
RXD.
LIN OPERATIONAL MODES
The LIN interface have two operational modes, Transmit
receiver and LIN disable modes.
TRANSMIT RECEIVE
In the TXD/RXD mode, the LIN bus can transmit and
receive information.
When the 2 0 kbps baud rate is selected, the slew rate and
timing are compatible with LIN protocol specification 2.1.
When the 1 0 kbps baud rate is selected, the slew rate and
timing are compatible with J260 2-2.
When the fast baud rate is selected, the slew rate and
timing are much faster than the above specification and allow
fast data transition. The LIN interface can be set by the SPI
command in TXD/RXD mode, only when TXD-L is at a high
level. When the SPI command is send while TXD-L is low, the
command is ignored.
SLEEP MODE
This mode is selected by SPI, and the transmission path is
disabled. Supply current for LIN block from VSUP/2 is very low
(typically 3.0 A). LIN bus is monitor to detect Wake-up
Analog Integrated Circuit Device Data
62 Freescale Semiconductor
33903/4/5
LIN BLOCK
LIN OPERATIONAL MODES
event. In the Sleep mode, the internal 725 kOhm pull-up
resistor is connected and the 30 kOhm disconnected.
The LIN block can be awake ned from Sleep mode by
detection of LIN bus activity.
LIN Bus Activity Detection
The LIN bus Wake-up is recognized by a recessive to
dominant transition, followe d by a dominant level with a
duration greater than 70 s, follow ed by a dominant to
recessive transition. This is illustrated in Figures 20 and 21.
Once the Wake-up is detected, the event is reported to the
device state machine. An INT is generated if the device is in
LP VDD ON mode, or VDD will restart if the device was in LP
VDDOFF mode.
The Wake-up can be enable or disable by the SPI.
Fail-safe Features
Table 11 describes the LIN block behavior when there is a
failure.
Table 11. LIN Block Failure
FAULT FUNCTIONNAL
MODE CONDITION CONSEQUENCE RECOVERY
LIN supply under-voltage TXD RXD LIN supply voltage < 6.0 V (typically) LIN transmitter in recessive St ate Condition gon e
TXD Pin Permanent
Dominant TXD pin low for more than t TXDDOM LIN transmitter in recessive State Condition gone
LIN Thermal Shutdown TXD RXD LIN driver temperature > 160 °C
(typically) LIN transmitter and receiver disable d
HS turned off Condition gone
Analog Integrated Circuit Device Data
Freescale Semiconductor 63
33903/4/5
SERIAL PERIPHERAL INTERFACE
HIGH LEVEL OVERVIEW
SERIAL PERIPHERAL INTERFACE
HIGH LEVEL OVERVIEW
The device uses a 16 bits SPI, with the following
arrangements:
MOSI, Master Out Slave In bits:
• bits 15 and 14 (called C1 and C0) are control bits to
select the SPI operati on mode (write control bit to
device register, read back of the control bits, read of
device fl ag ).
• bit 13 to 9 (A4 to A0) to select the register address.
• bit 8 (P/N) has two functions: parity bit in write mode
(optional, = 0 if not used), Next bit ( = 1) in read mode.
• bit 7 to 0 (D7 to D0): control bits
MISO, Master In Slave Out bits:
• bits 15 to 8 (S15 to S8) are device status bits
• bits 7 to 0 (Do7 to Do0) are either extended device
status bits, de vi c e i nt ernal control register content or
device flags.
The SPI implementation does not support daisy chain
capability.
Figure 41 is an overview of the SPI implementation.
Figure 41. SPI Overview
Bit 15 Bit 13 Bit 11Bit 12 Bit 10Bit 14 Bit 9 Bit 8
C1 A4 A2C0
Bit 7 Bit 5 Bit 3Bit 4 Bit 2Bit 6 Bit 1 Bit 0
D7 D5 D3D4 D2D6 D1 D0
control bits
A3
register address Parity (optional) or
A0
A1 P/N
data
MOSI
S15 S13 S11S14 Do7 Do5 Do3Do4 Do2Do6 Do1 Do0
S12 S9
S10 S8
MISO
Device Status Extended Device Status, Register Control bits or Device Flags
Next bit = 1
CS
SCLK
MOSI
MISO Tri-state Tri-state
SPI Wave Form, and Signals Polarity
S15 S14 Do0
C1 C0 D0
SCLK sign a l is lo w ou tside of CS active
CS active low. Must rise at end of 16 clocks,
MOSI and MISO data changed at SCLK rising edge
and sampled at falling edge. Msb first.
MISO tri-state outside of CS active
Don’t CareDon’t Care
for write commands, MOSI bits [15, 14] = [0, 1]
Analog Integrated Circuit Device Data
64 Freescale Semiconductor
33903/4/5
SERIAL PERIPHERAL INTERFACE
DETAIL OPERATION
DETAIL OPERATION
SPI Operation Deviation (does not apply to “C” version)
In some cases, the SPI write command is not properly
interpreted by the device. This results in either a “non
received SPI command” or a “corrupted SPI command”.
Important: Due to this, the tLEAD and tCSLOW parameters
must be carefully acknowledged.
Only SPI write commands (starting with bits 15,14 = 01)
are affected. The SPI read commands (starting with bits
15,14 = 00 or 11) are not affected.
The occurrence of this issu e is extremely low and is
caused by the synchronization between internal and external
signals. In order to guarantee proper operation, the following
steps must be taken.
1. Ensure the duration of the Chip Select Low (tCSLOW)
state is >5.5 s.
Note: In data sheet revisions prior to 7.0, this parameter is
not specified and is indirectly defined by the sum of 3
parameters, tLEAD + 16 x tPCLK + tLAG (sum = 4.06 s).
2. Ensure SPI timing parameter tLEAD is a min. of
550 ns.
Note: In data sheet revisions prior to 7.0, the tLEAD
parameter is a min of 30 ns.
3. Make sure to include a SPI read command after a
SPI write command.
In case a series of SPI write commands is used, only one
additional SPI read is necessary. The recommended SPI
read command is “device ID read: 0x2580” so device
operation is not affected (ex: clear flag). Other SPI read
commands may also be used.
When the previous steps are implemented, the device will
operate as follows:
For a given SPI write command (named SPI write ‘n’):
• In case the SPI write command ‘n’ is not accepted, the
following SPI command (named SPI ‘n+1’) will finish the
write process of the SPI write ‘n’, thanks to step 2
(tLAG > 550 ns) and step 3 (which is the additional SPI
command ‘n+1’).
• By applying steps 1, 2, and 3, no SPI command is ignored.
Worst case, the SPI write ‘n’ is executed at the time the
SPI ‘n+1’ is sent. This will lead to a delay in device
operation (delay between SPI command ‘n’ and ‘n+ 1’).
Note: Occurrence of an incorrect command is reduced,
thanks to step 1 (extension of tCSLOW duration to >5.5 s).
Sequence examples:
Example 1:
• 0x60C0 (CAN in terface control) – in case this com mand is
missed, next write command will complete it
• 0x66C0 (LIN interface control) – in case this command is
missed, next read command will complete it
• 0x2580 (read device ID) – Additional command to
complete previous LIN command, in case it was missed
Example 2:
• 0x60C0 (CAN interface control) - in case this command is
missed, next write command will complete it
• 0x66C0 (LIN interface control) - in case this command is
missed, next read command will complete it
• 0x2100 (read CAN register content) – this command wil l
complete previous one, in case it was missed
• 0x2700 (read LIN register content)
BITS 15, 14, AND 8 FUNCTIONS
Table 12 summarizes the various SPI operation, depending upon bit 15, 14, and 8.
Table 12. SPI Operations (bits 8, 14, & 15)
Control Bits MOSI[15-14], C1-C0 Type of Command Parity/Next
MOSI[8] P/N Note for Bit 8 P/N
00 Read back of register
content and block (CAN,
I/O, INT, LINs) real time
state. See Table 39.
1Bit 8 must be set to 1, independently of the parity function
selected or not selected.
01 Write to register
address, to control the
device operation
0If bit 8 is set to “0”: means parity not selected OR
parity is selected AND parity = 0
1if bit 8 is set to “1”: means parity is selected AND parity = 1
10 Reserved
11 Read of device flags
form a register address 1Bit 8 must be set to 1, independently of the parity function
selected or not selected.
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DETAIL OPERATION
BITS 13-9 FUNCTIONS
The device contains several registers coded on five bits
(bits 13 to 9).
Each register controls or reports part of the device’s
function. Data can be written to the register to control the
device operation or to set the default value or behavior.
Every register can also be read back in order to ensure
that it’s content (default setting or value previously written) is
correct.
In addition, some of the registers are used to report device
flags.
Device Status on MISO
When a write operation is performed to store data or
control bits into the device, the MISO pin reports a 16 bit fixed
device status composed of 2 bytes: Device Fixed S t atus (bits
15 to 8) + extended Device Status (bits 7 to 0). In a read
operation, MISO will report the Fixed device status (bits 15 to
8) and the next eight bits will be the content of the selected
register.
REGISTER ADRESS TABLE
Table 13 is a list of device registers and addresses, coded
with bits 13 to 9.
Table 13. Device Registers with Corresponding Address
Address
MOSI[13-9]
A4...A0 Description Quick Ref.
Name Functionality
0_0000 Analog Multiplexer MUX 1) Write “device control bits” to register address.
2) Read back register “control bits”
0_0001 Memory byte A RAM_A 1) Write “data byte” to register address.
2) Read back “data byte” from register address
0_0010 Memory byte B RAM_B
0_0011 Memory byte C RAM_C
0_0100 Memory byte D RAM_D
0_0101 Initialization Regulators Init REG 1) Write “device initialization control bits ” to register address.
2) Read back “initialization control bits” from register address
0_0110 Initialization Watchdog Init watchdog
0_0111 Initialization LIN and I/O Init LIN I/O
0_1000 Initialization Miscellaneous functions Init MISC
0_1001 Specific modes SPE_MODE 1) Write to register to select device Specific mode, using “Inverted
Random Code”.
2) Read “Random Code”
0_1010 Timer_A: watchdog & LP MCU consumption TIM_A 1) Write “timing values” to regist er address.
2) Read back register “timing values”
0_1011 Timer_B: Cyclic Sense & Cyclic Interrupt TIM_B
0_1100 Timer_C: watchdog LP & Forced Wake-up TIM_C
0_1101 Watchdog Refresh watchdog Watchdog Refresh Commands
0_1110 Mode register MODE 1) Write to register to select LP mode, with optional “Inverted Random
code” and select Wake-up functionality
2) Read operations:
Read back device “Current mode”
Read “Random Code”,
Leave “Debug mode”
0_1111 Regulator Control REG
1) Write “device control bits” to register address, to select device
operation.
2) Read back register “control bits”.
3) Read device flags from each of the register addresses.
1_0000 CAN inter face contr ol CAN
1_0001 Input Output control I/O
1_0010 Interrupt Control Interrupt
1_0011 LIN1 interface control LIN1
1_0100 LIN2 interfac e control LIN2
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COMPLETE SPI OPERATION
Table 14 is a compiled view of all the SPI capabilities and
options. Both MOSI and MISO information are described.
Note: P = 0 if parity bit is not selected or parity = 0. P = 1 if p arity
is selected and parity = 1.
PARITY BIT 8
Calculation
The parity is used for the write-to-register command (bit
15,14 = 01). It is calculated based on the number of logic one
contained in bits 15-9,7-0 sequence (this is the entire 16 bits
of the write command except bit 8).
Bit 8 must be set to 0 if the number of 1 is odd.
Bit 8 must be set to 1if the number of 1 is even.
Examples 1:
MOSI [bit 15-0] = 01 00 011 P 01101001, P sh ould be 0,
because the command contains 7 bits with logic 1.
Thus the Exact command will then be:
MOSI [bit 15-0] = 01 00 01 1 0 01 101001
Examples 2:
MOSI [bit 15-0] = 01 00 011 P 0100 0000, P should be 1,
because the command contains 4 bits with logic 1.
Thus the Exact command will then be:
MOSI [bit 15-0] = 01 00 01 1 1 0100 0000
Parity Function Selection
All SPI commands and examples do not use parity
functions.
The parity function is optional. It is selected by bit 6 in INIT
MISC register .
If parity function is not selected (bit 6 o f INIT MISC = 0),
then Parity bits in all SPI commands (bit 8) must be “0”.
Table 14. SPI Capabilities with Options
Type of Command MOSI/
MISO Control bits
[15-14] Address
[13-9] Parity/Next
bits [8] Bit 7 Bits [6-0]
Read back of “device control bit s” (MOSI bit 7 = 0)
OR
Read specific device inform ation (MOSI bit 7 = 1)
MOSI 00 address 1 0 000 0000
MISO Device Fixed Status (8 bits) Register control bits content
MOSI 00 address 1 1 000 0000
MISO Device Fixed Status (8 bits) Device ID and I/Os state
Write device control bit to address selected by bits
(13-9).
MISO return 16 bits device stat us
MOSI 01 address (note) Control bits
MISO Device Fixed Status (8 bits) Device Extended Status (8 bit s)
Reserved MOSI 10 Reserved
MISO Reserved
Read device flags and Wake-up flags, from
register address (bit 13 -9), and sub address (bit 7).
MISO return fixed device status (b it 15-8) + flags
from the selected address and sub-address.
MISO 11 address Reserved 0Read of device flags form a register address,
and sub address LOW (bit 7)
MOSI Device Fixed Status (8 bits) Flags
MISO 11 address 1 1 Read of device flags form a register address,
and sub address HIGH (bit 7)
MOSI Device Fixed Status (8 bits) Flags
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DETAIL OF CONTROL BITS AND REGISTER MAPPING
The following tables contain register bit meaning arranged by register address, from address 0_000 to address 1_0100
MUX AND RAM REGISTERS
Table 15. MUX Register(38)
MOSI First Byte [15-8]
[b_15 b_14] 0_0000 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 00 _ 000 P MUX_2 MUX_1 MUX_0 Int 2K I/O-att 0 0 0
Default state 0 0 0 0 0 0 0 0
Condition for default POR, 5 V-CAN off, any mode different fr om Normal
Bits Description
b7 b6 b5 MUX_2, MUX_1, MUX_0 - Selection of external i nput signal or internal signal to be measured at MUX-OUT pin
000 All functions disable. No output voltage at MUX-OUT pin
001 VDD regulator current recopy. Ratio is approx 1/97. Requires an external resistor or selection of Internal 2.0 K (bit 3)
010 Device internal voltage reference (approx 2.5 V)
011 Device internal temperature sensor voltage
100 Voltage at I/O-0. Atte nuation or gain is selected by bit 3.
101 Voltage at I/O-1. Atte nuation or gain is selected by bit 3.
110 Voltage at VSUP/1 pin. Refer to electrical tab l e for attenuation ratio (approx 5)
111 Voltage at VSENSE pin. Refer to electrical table for attenuation ratio (approx 5)
b4 INT 2k - Select device internal 2.0 kohm resist or betwee n AMUX and GND. This re sistor allows the measurement of a voltage proportional
to the VDD output current.
0Internal 2.0 kohm resistor disable. An external resistor must be connected between AMUX and GND.
1Internal 2.0 kohm resistor enable.
b3 I/O-att - When I/O-0 (or I/O-1) is selected with b7,b6,b5 = 100 (or 101), b3 selects attenuation or gain
between I/O-0 (or I/O-1) and MUX-OUT pin
0Gain is approx 2 for device with VDD = 5.0 V (Ref. to electrical table for exact gain value)
Gain is approx 1.3 for device with VDD = 3.3 V (Ref. to electrical table for exact gain value)
1Attenuation is approx 4 for device with VDD = 5.0 V (Ref. to electrical table for exact attenuation value)
Attenuation is approx 6 for device with VDD = 3.3 V (Ref. to electrical table for exact attenuation value)
Notes
38. The MUX register can be written and read only when the 5V-CAN regulator is ON. If the MUX register is written or read while
5V-CAN is OFF, the command is ignored, and the MXU register content is reset to default st ate (all control bits = 0).
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Table 16. Internal Memory Registers A, B, C, and D, RAM_A, RAM_B, RAM_C, and RAM_D
MOSI First Byte [15-8]
[b_15 b_14] 0_0xxx [P/N]
MOSI Second Byte, bits 7-0
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
01 00 _ 001 P Ram a7 Ram a6 Ram a5 Ram a4 Ram a3 Ram a2 Ram a1 Ram a0
Default state 0 0 0 0 0 0 0 0
Condition for default POR
01 00 _ 010 P Ram b7 Ram b6 Ram b5 Ram b4 Ram b3 Ram b2 Ram b1 Ram b0
Default state 0 0 0 0 0 0 0 0
Condition for default POR
01 00 _ 011 P Ram c7 Ram c6 Ram c5 Ram c4 Ram c3 Ram c2 Ram c1 Ram c0
Default state 0 0 0 0 0 0 0 0
Condition for default POR
01 00 _ 100 P Ram d7 Ram d6 Ram d5 Ram d4 Ram d3 Ram d2 Ram d1 Ram d0
Default state 0 0 0 0 0 0 0 0
Condition for default POR
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INIT REGISTERS
Note: these registers can be written only in INIT mode
Table 17. Initialization Regulator Registers, INIT REG (note: register can be written only in INIT mode)
MOSI First Byte [15-8]
[b_15 b_14] 0_0101 [P/N ]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 00 _ 101 P I/O-x sync VDDL rst[1] VDDL rst[0] VDD rstD[1] VDD rstD[0] VAUX5/3 Cyclic on[1] Cyclic on[0]
Default state 1 0 0 0 0 0 0 0
Condition for default POR
Bit Description
b7 I/O-x sync - Determine if I/O-1 is sensed during I/O-0 act i vation, when cyclic sense function is selected
0I/O-1 sense anytime
1I/O-1 sense during I/O-0 activation
b6, b5 VDDL RST[1] VDDL RST[0] - Select the VDD under-voltage threshold, to activate RST pin and/or INT
00 Reset at approx 0. 9 VDD.
01 INT at approx 0.9 VDD, Reset at approx 0.7 VDD
10 Reset at approx 0.7 VDD
11 Reset at approx 0. 9 VDD.
b4, b3 VDD RSTD[1] VDD RSTD[0] - Select the RST pin low lev duration, after VDD rises above the VDD under-voltage threshold
00 1.0 ms
01 5.0 ms
10 10 ms
11 20 ms
b2 [VAUX 5/3] - Select Vauxilary output voltage
0 VAUX = 3.3 V
1 VAUX = 5.0 V
b1, b0 Cyclic on[1] Cyclic on[0] - Determine I/O-0 activation time, when cyclic sense functi on is selected
00 200 s (typical value. Ref. to dynamic parameters for exact value)
01 400 s (typical value. Ref. to dynamic parameters for exact value)
10 800 s (typical value. Ref. to dynamic parameters for exact value)
11 1600 s (typical value. Ref. to dynamic parameters for exact value)
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Table 18. Initialization Watchdog Registers, INIT watchdog (note: register can be writte n only in INIT mode)
MOSI First Byte [15-8]
[b_15 b_14] 0_0110 [P/N ]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 00 _ 110 P WD2INT MCU_OC OC-TIM WD Safe WD_spi[1] WD_spi[0] WD N/Win Crank
Default state 0 1 0 0 0 1 0
Condition for default POR
Bit Description
b7 WD2INT - Select the maximum time delay between INT occurrence and INT source read SPI command
0Function disable. No constraint between I NT occurre nce and INT source read.
1INT source read must occur before the remaining of the current watchdog period plus 2 complete watchdog periods.
b6, b5 MCU_OC, OC-TIM - In LP VDD ON, select watchdog refresh and VDD cu rrent moni tor ing f uncti onal ity. VDD_OC_LP thresh old is defined in device
electrical parameters (approx 1.5 mA)
In LP mode, when watchdog is not selected
no watchdog
+ 00 In LP VDD ON mode, VDD over-current has no effect
no watchdog
+ 01 In LP VDD ON mode, VDD over-current has no effect
no watchdog
+ 10 In LP VDD ON mode, VDD current > VDD_OC_LP threshold for a time > 100 s (typically) is a wake-up event
no watchdog
+ 11 In LP VDD ON mode, VDD current > VDD_OC_LP threshold for a time > I_mcu_OC is a wake-up event. I_mcu_OC time is selected in Timer register
(selection range from 3.0 to 32 ms)
In LP mode when watchdog is selected
watchdog +
00 In LP VDD ON mode, VDD current > VDD_OC_LP threshold has no effect. watchdog refresh must occur by SPI command.
watchdog +
01 In LP VDD ON mode, VDD current > VDD_OC_LP threshold has no effect. watchdog refresh must occur by SPI command.
watchdog +
10 In LP VDD ON mode, VDD over-current for a time > 100 s (typically) is a wake-up event.
watchdog +
11 In LP VDD ON mode, VDD current > VDD_OC_LP threshold for a time < I_mcu_OC is a watchdog refresh condition. VDD current > VDD_OC_LP
threshold for a time > I_mcu_OC is a wake-up event. I_mcu_OC time is selected in Timer register (selection range from 3.0 to 32 ms)
b4 WD Safe - Select the activation of the SAFE pin low, at first or second consecutive RESET pulse
0SAFE pin is set low at the time of the RST pin low activation
1SAFE pin is set low at the second consecutive time RST pulse
b3, b2 WD_spi[1] WD_spi[0] - Select the Watchd og (watchdog) Operation
00 Simple Watchdog selection: watchdog refresh done by a 8 bits or 16 bits SPI
01 Enhanced 1: Refresh is done using the Random Code, and by a single 16 bits.
10 Enhanced 2: Refresh is done using the Random Code, and by two 16 bits command.
11 Enhanced 4: Refresh is done using the Random Code, and by four 16 bits command.
b1 WD N/Win - Select the Watchdog (watchdog) Windo w or Timeo ut operation
0Watchdog operation is TIMEOUT, watchdog refresh can occur anytime in the period
1Watchdog operation is WINDOW, watchdog refresh must occur in the open window (second half of period)
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b0 Crank - Select the VSUP/1 threshold to disable VDD, while VSUP1 is falling toward GND
0 VDD disable when VSUP/1 is below typically 4.0 V (parameter VSUP-TH1), and device in Reset mode
1 VDD kept ON when VSUP/1 is below typically 4.0 V (parameter VSUP_TH1)
Table 19. Initialization LIN and I/O Registers, INIT LIN I/O (note: register can be written only in INIT mode)
MOSI First Byte [15-8]
[b_15 b_14] 0_0111 [P/N ]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 00 _ 111 P I/O-1 ovof f LIN_T2[1] LIN_T2[0] LIN_T/1[1] LIN_T/1[0] I/O-1 out-en I/O-0 out-en Cyc_Inv
Default state 0 0 0 0 0 0 0
Condition for default POR
Bit Description
b7 I/O-1 ovoff - Select the deactivation of I/ O-1 when VDD or VAUX over-voltage condition is detected
0Disable I/O-1 turn off.
1Enable I/O-1 turn off, when VDD or VAUX over-voltage condition is detected.
b6, b5 LI N_T2[1], LIN_T2[0] - Select pin operation as LIN Master pin switch or I/O
00 pin is OFF
01 pin operation as LIN Master pin switch
10 pin operation as I/O: HS switch and Wake-up input
11 N/A
b4, b3 LIN_T/1[1], LIN_T/1[0] - Select pin ope ration as LIN Master pin switch or I/O
00 pin is OFF
01 pin operation as LIN Master pin switch
10 pin operation as I/O: HS switch and Wake-up input
11 N/A
b2 I/O-1 out-en- Select the operation of the I/O-1 as output driver (HS, LS)
0Disable HS and LS drivers of pin I/O-1. I/O-1 can only be used as input.
1Enable HS and LS drivers of pin I/O-1. Pin can be used as input and output driver.
b1 I/O-0 out-en - Select t he operation of the I/O-0 as output driver (HS, LS)
0Disable HS and LS drivers of I/O-0 can only be used as input.
1Enable HS and LS drivers of the I/O-0 pin. Pin can be used as input and output drivers.
b0 Cyc_Inv - Select I/O-0 operation in device LP m o de , w h en cycl ic se nse is selected
0During cyclic sense active time, I/ O is set t o the same stat e prior to entering in to LP mode. During cyclic sense off time, I/ O-0 is disable (HS a nd
LS drivers OFF).
1During cyclic sense active time, I/O is set to the same state prior to entering in to LP mode. During cyclic sense off time, the opposite driver of I/
O_0 is actively set. Example: If I/0_0 HS is ON during active time, then I/O_O LS is turned ON at expiration of the active time, for the duration of
the cyclic sense period.
Bit Description
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Table 20. Initialization Miscellaneous Functions, INIT MISC (Note: Register can be written only in INIT mode)
MOSI First Byte [15-8]
[b_15 b_14] 0_1000 [P/N ]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 01_ 000 P LPM w RNDM SPI parity INT pulse INT width INT flash Dbg Res[2] Dbg Res[1] Dbg Res[0]
Default state 0 0 0 0 0 0 0
Condition for default POR
Bit Description
b7 LPM w RNDM - This enables the usage of random bits 2, 1 and 0 of the MODE register to enter into LP VDD OFF or LP VDD ON.
0Function disable: the LP mode can be entered without usage of Random Code
1Function enabled: the LP mode is entered using the Random Code
b6 SPI parity - Select usage of the parity bit in SPI write operation
0Function disable: the parity is not used. The parity bit must always set to logic 0.
1Function enable: the parity is used, and parity must be calculated.
b5 INT pulse -Select INT pin operation: low level pulse or low level
0INT pin will assert a low level pulse, duration sel ected by bit [b4]
1INT pin assert a permanent low level (no pulse)
b4 INT width - Select the INT pulse duration
0INT pulse duration is typically 100 s. Ref. to dynamic parameter table for exact value.
1INT pulse duration is typical l y 25 s. Ref. to dynamic parameter table for exact value.
b3 INT flash - Select INT pulse generation at 50% of the Watchdog Period in Flash mode
Function disable
Function enable: an INT pulse will occur at 50% of the Watchdog Period when device in Flash mode.
b2, b1, b0 Dbg Res[2], Dbg Res[1], Dbg Res[0 ] - Allow verification of the external resistor connecte d at DBG pin. Ref. to parametric t able for resistor range
value.(39)
0xx Function disable
100 100 verification enable: resistor at DBG pin is typically 68 kohm (RB3) - Selection of SAFE mode B3
101 101 verification enable: resistor at DBG pin is typically 33 kohm (RB2 - Selection of SAFE mode B2
110 110 verification enable: resistor at DBG pin is typically 15 kohm (RB1) - Selection of SAFE mode B1
111 111 verification enable: resisto r at DBG pin is typically 0 kohm (RA) - Selection of SAFE mode A
Notes
39. Bits b2,1 and 0 allow the following operation:
First, check the resistor device has detected at the DEBUG pin. If the resistor is different, bit 5 (Debug resistor) is set in INTerrupt
register (Ref. to device flag table).
Second, over write the resistor decoded by device, to set the SAFE mode operation by SPI. Once this function is selected by bit 2 = 1,
this selection has higher priority than “hardware”, and device will behave according to b2,b1 and b0 setting
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SPECIFIC MODE REGISTER
The SPE MODE Register is used for the Following
Operation
- Set the device in RESET mode, to exercise or test the
RESET functions.
- Go to INIT mode, using the Secure SPi command.
- Go to FLASH mode (in this mode the watchdog timer can
be extended up to 32 s).
- Activate the SAFE pin by S/W.
This mode (called Special mode) is accessible from the
secured SPI command, which consist of 2 commands:
1) reading a random code and
2) then write the inverted random code plus mode
selection or SAFE pin activation:
Return to INIT mode is done as follow (this is done from
Normal mode only):
1) Read random code:
MOSI : 0001 0011 0000 0000 [Hex:0x 13 00]
MISO report 16 bits, random code are bits (5-0)
miso = xxxx xxxx xxR5 R4 R3 R2 R1 R0 (RXD = 6 bits
random code)
2) Write INIT mode + random code inverted
MOSI : 0101 0010 01 Ri5 Ri4 Ri3 Ri2 Ri1 Ri0 [Hex 0x 52
HH] (RIX = random code inverted)
MISO : xxxx xxxx xxxx xxxx (don’t care)
SAFE pin activation: SAFE pin can be set low, only in INIT
mode, with following commands:
1) Read random code:
MOSI : 0001 0011 0000 0000 [Hex:0x 13 00]
MISO report 16 bits, random code are bits (5-0)
miso = xxxx xxxx xxR5 R4 R3 R2 R1 R0 (RXD = 6 bits
random code)
2) Write INIT mode + random code bits 5:4 not inverted
and random code bits 3:0 inverted
MOSI : 0101 0010 01 R5 R4 Ri3 Ri2 Ri1 Ri0 [Hex 0x 52
HH] (RIX = random code inverted)
MISO : xxxx xxxx xxxx xxxx (don’t care)
Return to Reset or Flash mode is done similarly to the go
to INIT mode, except that the b7 and b6 are set according to
the table above (b7, b6 = 00 - go to reset, b7, b6 = 10 - go to
Flash).
Table 21. Specific Mode Register, SPE_MODE
MOSI First Byte [15-8]
[b_15 b_14] 01_001 [P/N ]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 01_ 001 P Sel_Mod[1] Sel_Mod[0] Rnd_C5b Rnd_C4b Rnd_C3b Rnd_C2b Rnd_C1b Rnd_C0b
Default state 0 0 0 0 0 0 0
Condition for default POR
Bit Description
b7, b6 Sel_Mod[1], Sel_Mod[0] - Mode selection: these 2 bits are used to select which mode the device will enter upon a SPI command.
00 RESET mode
01 INIT mode
10 FLASH mode
11 N/A
b5....b0 [Rnd_C4b... Rnd_C0b] - Random Code inverted, these six bits are the inverted bits obtained from the SPE MODE Register read command.
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TIMER REGISTERS
Table 22. Timer Register A, LP VDD Over-current & Watchdog Period Normal mode, TIM_A
MOSI First Byte [15-8]
[b_15 b_14] 01_010 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 01_ 010 P I_mcu[2] I_mcu[1] I_mcu[1] watchdog
Nor[4] W/D_N[4] W/D_Nor[3] W/D_N[2] W/D_Nor[0]
Default state 0 0 0 1 1 1 1 0
Condition for default POR
LP VDD Over-current (ms)
b7 b6, b5
00 01 10 11
03 (def) 612 24
1 4 8 16 32
Watchdog Period in Device Normal Mode (ms)
b4, b3 b2, b1, b0
000 001 010 011 100 101 110 111
00 2.5 510 20 40 80 160 320
01 3 6 12 24 48 96 192 384
10 3.5 714 28 56 112 224 448
11 4 8 16 32 64 128 256 (def) 512
Table 23. Timer Register B, Cyclic Sense and Cyclic INT, in Device LP Mode, TIM_B
MOSI First Byte [15-8]
[b_15 b_14] 01_011 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 01_ 011 P Cyc-sen[3] Cyc-sen[2] Cyc-sen[1] Cyc-sen[0] Cyc-int[3] Cyc-int[2] Cyc-int[1] Cyc-int[0]
Default state 0 0 0 0 0 0 0 0
Condition for defa ult POR
Cyclic Sense (ms)
b7 b6, b5, b4
000 001 010 011 100 101 110 111
0 3 6 12 24 48 96 192 384
1 4 8 16 32 64 128 256 512
Cyclic Interrupt (ms)
b3 b2, b1, b0
000 001 010 011 100 101 110 111
06 (def) 12 24 48 96 192 384 768
1 8 16 32 64 128 258 512 1024
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DETAIL OF CONTROL BITS AND REGISTER MAPPING
WATCHDOG AND MODE REGISTERS
.
Table 24. Timer Register C, Watchdog LP Mode or Flash Mode and Forced Wake-up Timer, TIM_C
MOSI First Byte [15-8]
[b_15 b_14] 01_100 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 01_ 100 P WD-LP-F[3] WD-LP-F[2] WD-LP-F[1] WD-LP-F[0] FWU[3] FWU[2] FWU[1] FWU[0]
Default state 0 0 0 0 0 0 0 0
Condition for default POR
Table 25. Typical Timing Values
Watchdog in LP VDD ON Mode (ms)
b7 b6, b5, b4
000 001 010 011 100 101 110 111
012 24 48 96 192 384 768 1536
116 32 64 128 256 512 1024 2048
Watchdog in Flash Mode (ms)
b7 b6, b5, b4
000 001 010 011 100 101 110 111
048 (def) 96 192 384 768 1536 3072 6144
1256 512 1024 2048 4096 8192 16384 32768
Forced Wake-up (ms)
b3 b2, b1, b0
000 001 010 011 100 101 110 111
048 (def) 96 192 384 768 1536 3072 6144
164 128 258 512 1024 2048 4096 8192
Table 26. Watchdog Refresh Register, watchdo g(40)
MOSI First Byte [15-8]
[b_15 b_14] 01_101 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 01_ 101 P 0 0 0 0 0 0 0 0
Default state 0 0 0 0 0 0 0 0
Condition for default POR
Notes
40. The Simple Watchdog Refresh command is in hexadecimal: 5A00. This command is used to refresh the watchdog and also to
transition from INIT mode to Normal mode, and from Normal Request mode to Normal mode (after a wake-up of a reset)
Table 27. MODE Register, MODE
MOSI First Byte [15-8]
[b_15 b_14] 01_110 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 01_ 110 P mode[4] mode[3] mode[2] mode[1] mode[0] Rnd_b[2] Rnd_b[1] Rnd_b[0]
Default state N/A N/A N/A N/A N/A N/A N/A N/A
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Prior to enter in LP VDD ON or LP VDD OFF, the Wake-up
flags must be cleared or read.
This is done by the following SPI commands (See Table
39, Device Flag, I/O Real Time and Device Identification):
0xE100 for CAN Wake-up clear
0xE380 for I/O Wake-up clear
0xE700 for LIN1 Wake-up clear
0xE900 for LIN2 Wake-up clear
If Wake-up flags are not cleared, the device will enter into
the selected LP mode and immediately Wake-up. In addition,
the CAN failure flags (i.e. CAN_F and CAN_UF) must be
cleared in order to meet the low power current consump tion
specification. This is done by the following SPI command:
0xE180 (read CAN failure flags)
When the device is in LP VDD ON mode, the Wake-up by
a SPI command uses a write to “Normal Request mode”,
0x5C10.
Mode Register Features
The mode register includes specific functions and a “global
SPI command” that allow the following:
- read device current mode
- read device Debug status
- read state of SAFE pin
- leave Debug state
- release or turn off SAFE pin
- read a 3 bit Random Code to enter in LP mode
These global commands are built using the MODE register
address bit [13-9], along with several combinations of bit [15-
14] and bit [7]. Note, bit [8] is always set to 1.
Table 28. LP VDD OFF Selection and FWU / Cyclic Sense Selection
b7, b6, b5, b4, b3 FWU Cyclic Sense
0 1100 OFF OFF
0 1101 OFF ON
0 1110 ON OFF
0 1111 ON ON
Table 29. LP VDD ON Selection and Op eration Mode
b7, b6, b5, b4, b3 FWU Cyclic Sense Cyc lic INT Watchdog
1 0000 OFF OFF OFF OFF
1 0001 OFF OFF OFF ON
1 0010 OFF OFF ON OFF
1 0011 OFF OFF ON ON
1 0100 OFF ON OFF OFF
1 0101 OFF ON OFF ON
1 0110 OFF ON ON OFF
1 0111 OFF ON ON ON
1 1000 ON OFF OFF OFF
1 1001 ON OFF OFF ON
1 1010 ON OFF ON OFF
1 1011 ON OFF ON ON
1 1100 ON ON OFF OFF
1 1101 ON ON OFF ON
1 1110 ON ON ON OFF
1 1111 ON ON ON ON
b2, b1, b0 Random Code inverted, these 3bits are the inverted bits obtained from the previous SPI command.
The usage of these bits are optional and must be previously selected in the INIT MISC register [See
bit 7 (LPM w RNDM) in Table 20]
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Entering into LP Mode Using Random Code
- LP mode using Random Code must be selected in INIT
mode via bit 7 of the INIT MISC register.
- In Normal mode, read the Random Code using 0x1D00 or
0x1D80 command. The 3 Random Code bits are available on
MISO bits 2,1 and 0.
- Write LP mode by inverting the 3 random bits.
Example - Select LP VDD OFF without cyclic sense and
FWU:
1. in hex: 0x5C60 to enter in LP VDD OFF mode without
using the 3 random code bits.
2. if Random Code is selected, the commands are:
- Read Random Code: 0x1D00 or 0x1D80,
MISO report in binary: bits 15-8, bits 7-3, Rnd_[2], Rnd_[1],
Rnd_[0].
- Write LP VDD OFF mode, using Random Code inverted:
in binary: 0101 1100 0110 0 Rnd_b[2], Rnd_b[1], Rnd_b[0].
Table 30 summarizes th ese commands
Table 31 describes MISO bits 7-0, used to decode the
device’s current mode.
Table 32 describes the SAFE and DEBUG bit decoding.
Table 30. Devi ce Modes
Global commands and effects
Read device current mode, Leave debug mode.
Keep SAFE pin as is.
MOSI in hexadecimal: 1D 00
MOSI bits 15-14 bits 13-9 bit 8 bit 7 bits 6-0
00 01 110 1 0 0 00 0000
MISO bit 15-8 bit 7-3 bit 2-0
Fix Status device current mode Random code
Read device current mode
Release SAFE pin (turn OFF).
MOSI in hexadecimal: 1D 80
MOSI bits 15-14 bits 13-9 bit 8 bit 7 bits 6-0
00 01 110 1 1 0 00 0000
MISO bit 15-8 bit 7-3 bit 2-0
Fix Status device current mode Random code
Read device current mode, Leave debug mode.
Keep SAFE pin as is.
MOSI in hexadecimal: DD 00
MISO reports Debug and SAFE state (bits 1,0 )
MOSI bits 15-14 bits 13-9 bit 8 bit 7 bits 6-0
11 01 110 1 0 0 00 0000
MISO bit 15-8 bit 7-3 bit 2 bit 1 bit 0
Fix Status device current mode XSAFE DEBUG
Read device current mode, Keep DEBUG mode
Release SAFE pin (turn OFF).
MOSI in hexadecimal: DD 80
MISO reports Debug and SAFE state (bits 1,0 )
MOSI bits 15-14 bits 13-9 bit 8 bit 7 bits 6-0
11 01 110 1 1 0 00 0000
MISO bit 15-8 bit 7-3 bit 2 bit 1 bit 0
Fix Status device current mode XSAFE DEBUG
Table 31. MISO bits 7-3
Device current mode, any of the above commands
b7, b6, b5, b4, b3 MODE
0 0000 INIT
0 0001 FLASH
0 0010 Normal Request
0 0011 Normal mode
1 XXXX Low Power mode (Table 29)
Table 32. SAFE and DEBUG status
SAFE and DEBUG bits
b1 description
0SAFE pin OFF, not activated
1SAFE pin ON, driver activated.
b0 description
0Debug mode OFF
1Debug mode Active
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DETAIL OF CONTROL BITS AND REGISTER MAPPING
REGULATOR, CAN, I/O, INT AND LIN REGISTERS
Table 33. Regulator Register
MOSI First Byte [15-8]
[b_15 b_14] 01_111 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 01_ 111 P VAUX[1] VAUX[0] -5V-can[1] 5V-can[0] VDD bal en VDD bal auto VDD OFF en
Default state 0 0 N/A 0 0 N/A N/A N/A
Condition for default POR POR
Bits Description
b7 b6 VAUX[1], VAUX[0] - Vauxilary regulator control
00 Regulator OFF
01 Regulator ON. Under-voltage (UV) and Over-current (OC) monitoring flags not reported. VAUX is disabled when UV or OC
detected after 1.0 ms blanking time.
10 Regulator ON. Under-voltage (UV) and over-current (OC) monitoring flags active. VAUX is disabled when UV or OC detected
after 1.0 ms blanking time.
11 Regulator ON. Under-voltage (UV) and over-current (OC) monitoring flags active. VAUX is disabled when UV or OC detected
after 25 s blanking time.
b4 b3 5 V-can[1], 5 V-can[0] - 5V-CAN regulator control
00 Regulator OFF
01 Regulator ON. Thermal protection active. Under-voltage (UV) and over-current (OC) monitoring flags not reported. 1.0 ms
blanking time for UV and OC detection. Note: by default when in Debug mode
10 Regulator ON. Thermal protection active. Under-voltage (UV) and over-current (OC) monitoring flags active. 1.0 ms blanking
time for UV and OC detection.
11 Regulator ON. Thermal protection active. Under-voltage (UV) and over-current (OC) monitoring flags active after 25 s blanking
time.
b2 VDD bal en - Control bit to Enable the VDD external ballast transistor
0External VDD ballast disable
1External VDD ballast Enable
b1 VDD bal auto - Control bit to automatically Enable the VDD external ballast transistor, if VDD is > typically 60 mA
0Disable the automatic activation of the external ballast
1Enable the automatic activation of the external ballast, if VDD > typically 60 mA
b0 VDD OFF en - Control bit to allow transition into LP V DD OFF mode (to prevent VDD turn OFF )
0Disable Usage of LP VDD OFF mode
1Enable Usage of LP VDD OFF mode
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Table 34. CAN Register(41)
MOSI First byte [15-8]
[b_15 b_14] 10_000 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 10_ 000P CAN mod[1] CAN mod[0] Slew[1] Slew[0] Wake-up 1/3 - - CAN int
Default state 1 0 0 0 0 - - 0
Condition for default note POR POR POR
Bits Description
b7 b6 CAN mod[1], CAN mod[0] - CAN interface mode control, Wake-up enable / disable
00 CAN interface in Sleep mode, CAN Wake-up disable.
01 CAN interface in receive only mode, CAN driver disable.
10 CAN interface is in Sleep mode, CAN Wake-up enable. In device LP mode,
CAN Wake-up is reported by device Wake-up. In device Normal mode, CAN Wake-up reported by INT.
11 CAN interface in transmit and receive mode.
b5 b4 Slew[1] Slew[0] - CAN driver slew rate selection
00/11 FAST
01 MEDIUM
10 SLOW
b3 Wake-up 1/3 - Selection of CAN Wake-up mechanism
03 dominant pulses Wake-up mechanism
1Single dominant pulse Wake-up mechanism
b0 CAN INT - Select the CAN failure detection reporting
0Select INT generation when a bus failure is fully identified and decoded (i.e. after 5 dominant pulses on TxCAN)
1Select INT generation as soon as a bus failure is detected, event if not fully identified
Notes
41. The first time the device is set to Normal mode, the CAN is in Sleep Wake-up enabled (bit7 = 1, bit 6 =0). The next time the device is
set in Normal mode, the CAN state is controlled by bits 7 and 6.
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Table 35. I/O Register
MOSI First byte [15-8]
[b_15 b_14] 10_001 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 10_ 001P I/O-3 [1] I/O-3 [0] I/O-2 [1] I/O-2 [0] I/O-1 [1] I/O-1 [0] I/O-0 [1] I/O-0 [0]
Default state 0 0 0 0 0 0 0 0
Condition for default POR
Bits Description
b7 b6 I/O-3 [1], I/O-3 [0] - I/O-3 pin operation
00 I/O-3 driver disable, Wake-up capability disable
01 I/O-3 driver disable, Wake-up capability enable.
10 I/O-3 HS driver enable.
11 I/O-3 HS driver enable.
b5 b4 I/O-2 [1], I/O-2 [0] - I/O-2 pin operation
00 I/O-2 driver disable, Wake-up capability disable
01 I/O-2 driver disable, Wake-up capability enable.
10 I/O-2 HS driver enable.
11 I/O-2 HS driver enable.
b3 b2 I/O-1 [1], I/O-1 [0] - I/O-1 pin operation
00 I/O-1 driver disable, Wake-up capability disable
01 I/O-1 driver disable, Wake-up capability enable.
10 I/O-1 LS driver enable.
11 I/O-1 HS driver enable.
b1 b0 I/O-0 [1], I/O-0 [0] - I/O-0 pin operation
00 I/O-0 driver disable, Wake-up capability disable
01 I/O-0 driver disable, Wake-up capability enable.
10 I/O-0 LS driver enable.
11 I/O-0 HS driver enable.
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DETAIL OF CONTROL BITS AND REGISTER MAPPING
Table 36. INT Register
MOSI First byte [15-8]
[b_15 b_14] 10_010 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 10_ 010P CAN failure MCU req LIN2 fail LIN1fail I/O SAFE -Vmon
Default state 0 0 0 0 0 0 0 0
Condition for default POR
Bits Description
b7 CAN failure - control bit for CAN failure INT (CANH/L to GND, VDD or VSUP, CAN over-current, Driver Over-temp, TXD-PD,
RXD-PR, RX2HIGH, and CANBUS Dominate clamp)
0INT disable
1INT enable.
b6 MCU req - Control bit to request an INT. INT will occur once when the bit is enable
0INT disable
1INT enable.
b5 LIN2 fail - Control bit to enable INT when of failure on LIN2 interface
0INT disable
1INT enable.
b4 LIN/1 fail - Control bit to enable INT when of failure on LIN1 interface
0INT disable
1INT enable.
b3 I/O - Bit to control I/O interruption: I/O failure
0INT disable
1INT enable.
b2 SAFE - Bit to enable INT when of: Vaux over-voltage, VDD over-voltage, VDD Temp pre-warning, VDD under-voltage(42),
SAFE resistor mismatch, RST terminal short to VDD, MCU request INT.(43)
0INT disable
1INT enable.
b0 VMON - enable interruption by voltage monitoring of one of the voltage regulator: VAUX, 5 V-CAN, VDD (IDD Over-current, VSUV,
VSOV, VSENSELOW, 5V-CAN low or thermal shutdown, VAUX low or VAUX over-current
0INT disable
1INT enable.
Notes
42. If VDD under-voltage is set to 70% of VDD, see bits b6 and b5 in Table 15 on page 69.
43. Bit 2 is used in conjunction with bit 6. Both bit 6 and bit 2 must be set to 1 to activate the MCU INT request.
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Table 37. LIN/1 Register(45)
MOSI First byte [15-8]
[b_15 b_14] 10_010 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 10_ 011P LIN mode[1] LIN mode[0] Slew rate[1] Slew rate[0] -LIN T/1 on - VSUP ext
Default state 0 0 0 0 0 0 0 0
Condition for default POR
Bits Description
b7 b6 LIN mode [1], LIN mode [0] - LIN/1 interface mode control, Wake-up enable / disable
00 LIN/1 disable, Wake-up capability disable
01 not used
10 LIN/1 disable, Wake-up capability enable
11 LIN/1 Transmit Receive mode(44)
b5 b4 Slew rate[1], Slew rate[0] LIN/1 slew rate selection
00 Slew rate for 20 kbit/s baud rate
01 Slew rate for 10 kbit/s baud rate
10 Slew rate for fast baud rate
11 Slew rate for fast baud rate
b2 LIN T/1 on
0LIN/1 termination OFF
1LIN/1 termination ON
b0 VSUP ext
0LIN goes recessive when device VSUP/2 is below typically 6.0 V. This is to meet J2602 specification
1LIN continues operation below VSUP/2 6.0 V, until 5 V-CAN is disabled.
Notes
44. The LIN interface can be set in TXD/RXD mode only when the TXD-L input signal is in recessive state. An attempt to set TXD/RXD
mode, while TXD-L is low, will be ignored and the LIN interface remains disabled.
45. In order to use the LIN interface, the 5V-CAN regulator must be set to ON.
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Table 38. LIN2 Register(47)
MOSI First byte [15-8]
[b_15 b_14] 10_010 [P/N]
MOSI Second Byte, bits 7-0
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
01 10_ 100P LIN mode[1] LIN mode[0] Slew rate[1] Slew rate[0] -LIN T2 on - VSUP ext
Default state 0 0 0 0 0 0 0 0
Condition for default POR
Bits Description
b7 b6 LIN mode [1], LIN mode [0] - LIN 2 interface mode control, Wake-up enable / disable
00 LIN2 disable, Wake-up capability disable
01 not used
10 LIN2 disable, Wake-up capability enable
11 LIN2 Transmit Receive mode(46)
b5 b4 Slew rate[1], Slew rate[0] LIN 2slew rate selection
00 Slew rate for 20 kbit/s baud rate
01 Slew rate for 10 kbit/s baud rate
10 Slew rate for fast baud rate
11 Slew rate for fast baud rate
b2 LIN T2 on
0LIN 2 termination OFF
1LIN 2 termination ON
b0 VSUP ext
0LIN goes recessive when device VSUP/2 is below typically 6.0 V. This is to meet J2602 specification
1LIN continues operation below VSUP/2 6.0 V, until 5 V-CAN is disabled.
Notes
46. The LIN interface can be set in TXD/RXD mode only when the TXD-L input signal is in a recessive state. An attempt to set TXD/RXD
mode while TXD-L is low, will be ignored and the LIN interface will remain disabled.
47. In order to use the LIN interface, the 5V-CAN regulator must be set to ON.
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FLAGS AND DEVICE STATUS
FLAGS AND DEVICE STATUS
DESCRIPTION
The table below is a summary of the device flags, I/O real
time level, device Identification, and includes exa mp l es of
SPI commands (SPI commands do not use parity functions).
They are obtained using the following commands.
This command is composed of the following:
bits 15 and 14:
• [1 1] for failure flags
• - [0 0] for I/O re al time status, device identification and
CAN LIN driver receiver real time state.
• bit 13 to 9 are the register address from which the flags is
to be read.
•bit 8 = 1 (this is not parity bit function, as this is a read
command).
When a failure event occurs, the respective flag is set and
remains latched until it is cleared by a read command
(provided the failure event has recovered).
Table 39. Device Flag, I/O Real Time and Device Identification
Bits 15-14 13-9 8 7 6 5 4 3 2 1 0
MOSI
MOSI bits 15-7
Next 7 MOSI bits (bits 6.0) should be “000_0000”
bits [15,
14] Address
[13-9] bit 8 bit
7
MISO 8 Bits Device Fixed Status
(bits 15...8)
MISO bits [7-0], device response on MISO pin
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
REG 11 0_1111
REG 1 0 VAUX_LOW VAUX_OVER-
CURRENT 5V-CAN_
THERMAL
SHUTDOWN
5V-CAN_
UV
5V-CAN_
OVER-
CURRENT
VSENSE_
LOW
VSUP_
UNDER-
VOLTAGE
IDD-OC-
NORMAL
MODE
11 1 - - - VDD_
THERMAL
SHUTDOWN
RST_LOW
(<100 ms) VSUP_
BATFAIL
IDD-OC-LP
VDDON
MODE
Hexa SPI commands to get Vreg Flags: MOSI 0x DF 00, and MOSI Ox DF 80
CAN 11 1_0000
CAN 1 0 CAN
Wake-up -CAN Over-
temp RXD low(48) Rxd high TXD dom Bus Dom
clamp CAN Over-
current
1CAN_UF CAN_F CANL
to VBAT
CANL to VDD CANL to
GND CANH to
VBAT CANH to VDD CANH to
GND
Hexa SPI commands to get CAN Flags: MOSI 0x E1 00, and MOSI 0x E1 80
00 1_0000
CAN 1 1 CAN Driver
State CAN Receiver
State CAN WU
en/dis - - - - -
Hexa SPI commands to get CAN real time status: MOSI 0x 21 80
I/O 11 1_0001
I/O 1 0 HS3 short to
GND HS2 short to
GND SPI parity
error CSB low
>2.0 ms VSUP/2-UV VSUP/1-OV I/O_O ther mal watchdog
flash mode
50%
1I/O_1-3
Wake-up I/O_0-2
Wake-up SPI Wake-up FWU INT service
Timeout LP VDD OFF Reset request Hardware
Leave Debug
Hexa SPI commands to get I/O Flags and I/O Wake-up: MOSI 0x E3 00, and MOSI 0x E3 80
00 1_0001
I/O 1 1 I/O_3
state I/O_2
state I/O_1 state I/O_0 state
Hexa SPI commands to get I/O real time level: MOSI 0x 23 80
SAFE 11 1_0010
SAFE 1 0 INT request RST high DBG resistor VDD temp
Pre-warning VDD UV VDD Over-
voltage VAUX_OVER-
VOLTAGE -
1 - - - VDD low
>100 ms VDD low RST RST low
>100 ms multiple
Resets watchdog
refresh
failure
Hexa SPI commands to get INT and RST Flags: MOSI 0x E5 00, and MOSI 0x E5 80
00 1_0010
SAFE 1 1 VDD (5.0 V or
3.3 V) device
p/n 1 device
p/n 0 id4 id3 id2 id1 id0
Hexa SPI commands to get device Identification: MOSI 0x 2580
example: MISO bit [7-0] = 1011 0100: MC33904, 5.0 V vers ion, silicon Rev. C (Pass 3.3)
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FLAGS AND DEVICE STATUS
LIN/1 11 1_0011
LIN 1 1 0 - LIN1
Wake-up LIN1 Term
short to GND LIN 1
Over-temp RXD1 low RXD1 high TXD1 dom LIN1 bus
dom clamp
Hexa SPI commands to get LIN 2 Flags: MOSI 0x E7 00
00 1_0011
LIN 1 1 1 LIN1 State LIN1 WU
en/dis - - - - - -
Hexa SPI commands to get LIN1 real time status: MOSI 0x 27 80
LIN2 11 1_0100
LIN 2 1 0 - LIN2
Wake-up LIN2 Term
short to GND LIN 2
Over-temp RXD2 low RXD2 high TXD2 dom LIN2 bus
dom clamp
Hexa SPI commands to get LIN 2 Flags: MOSI 0x E9 00
00 1_0100
LIN 2 1 1 LIN2 State LIN2 WU
en/dis - - - - - -
Hexa SPI commands to get LIN2 real time status: MOSI 0x 29 80
Notes
48. Not available on “C” versions
Table 40. Flag Descriptions
Flag Description
REG
VAUX_LOW Description Reports that VAUX regulator output voltage is lower than the VAUX_UV threshold.
Set / Reset condition Set: VAUX below threshold for t >100 s typically. Reset: VAUX above threshold and flag read (SPI)
VAUX_OVER-
CURRENT
Description Report that current out of VAUX regulator is above VAUX_OC threshold.
Set / Reset condition Set: Current above threshold for t >100 s. Reset: Current below threshold and flag read by SPI.
5 V-CAN_
THERMAL
SHUTDOWN
Description Report that the 5 V-CAN regulator has reached over-temperature threshold.
Set / Reset condition Set: 5 V-CAN thermal sensor above threshold. Reset: thermal sensor below threshold and flag read
(SPI)
5V-CAN_UV Description Reports that 5 V-CAN regulator output voltage is lower than the 5 V-CAN UV threshold.
Set / Reset condition Set: 5V-CAN below 5V-CAN UV for t >100 s typically. Reset: 5V-CAN > threshold and flag read (SPI)
5V-can_
over-current Description Report that the CAN driver output current is above threshold.
Set / Reset condition Set: 5V-CAN current above threshold for t>100 s. Reset: 5V-CAN current below threshold and flag
read (SPI)
VSENSE_
LOW
Description Reports that VSENSE pin is lower than the VSENSE LOW threshold.
Set / Reset condition Set: VSENSE below threshold for t >100 s typically. Reset: VSENSE above threshold and flag read
(SPI)
VSUP_
UNDER-
VOLTAGE
Description Reports that VSUP/1 pin is lower than the VS1_LOW threshold.
Set / Reset condition Set: VSUP/1 below threshold for t >100 s typically. Reset: VSUP/1 above threshold and flag read (SPI)
IDD-OC-
NORMAL MODE
Description Report that current out of VDD pin is higher that IDD-OC threshold, while device is in Normal mode.
Set / Reset condition Set: current above threshold for t>100 s typically. Reset; current below threshold and flag read (SPI)
VDD_
THERMAL
SHUTDOWN
Description Report that the VDD has reached over-temperature threshold, and was turned off.
Set / Reset condition Set: VDD OFF due to thermal condition. Reset: VDD recover and flag read (SPI)
RST_LOW
(<100 ms) Description Report that the RST pin has detected a low level, shorter than 100 ms
Set / Reset condition Set: after detection of reset low pulse. Reset: Reset pulse terminated and flag read (SPI)
VSUP_
BATFAIL
Description Report that the device voltage at VSUP/1 pin was below BATFAIL threshold.
Set / Reset condition Set: VSUP/1 below BATFAIL. Reset: VSUP/1 above threshold, and flag read (SPI)
IDD-OC-LP
VDDON mode Description Report that current out of VDD pin is higher that IDD-OC threshold LP, while device is in LP VDD ON
mode.
Set / Reset condition Set: current above threshold for t>100 s typically. Reset; current below threshold and flag read (SPI)
Table 39. Device Flag, I/O Real Time and Device Identification
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SERIAL PERIPHERAL INTERFACE
FLAGS AND DEVICE STATUS
CAN
CAN driver
state Description Report real time CAN bus driver state: 1 if Driver is enable, 0 if driver disable
Set / Reset condition Set: CAN driver is enable. Reset: CAN driver is disable. Driver can be disable by SPI command (ex
CAN set in RXD only mode) or following a failure event (ex: TXD Dominant). Flag read SPI command
(0x2180) do not clear the flag, as it is “real time” information.
CAN receiver
state Description Report real time CAN bus receiver state: 1 if Enable, 0 if disable
Set / Reset condition Set: CAN bus receiver is enable. Reset: CAN bus receiver is disable. Receiver disable by SPI
command (ex: CAN set in sleep mode). Flag read SPI command (0x2180) do not clear the flag, as it
is “real time” information.
CAN WU
enable Description Report real time CAN bus Wake-up receiver state: 1 if WU receiver is enable, 0 if disable
Set / Reset condition Set: CAN Wake-up receiver is enable. Reset: CAN Wake-up receiver is disable. Wake-up receiver is
controlled by SPI, and is active by default after device Power ON. SPI command (0x2180) do not
change flag state.
CAN
Wake-up Description Report that Wake-up source is CAN
Set / Reset condition Set: after CAN wake detected. Reset: Flag read (SPI)
CAN Over-
temp Description Report that the CAN interface has reach over-temperature threshold.
Set / Reset condition Set: CAN thermal sensor above threshold. Reset: thermal sensor below threshold and flag read (SPI)
RXD low(49) Description Report that RXD pin is shorted to GND.
Set / Reset condition Set: RXD low failure detected. Reset: failure recovered and flag read (SPI)
Rxd high Description Report that RXD pin is shorted to recessive voltage.
Set / Reset condition Set: RXD high failure detected. Reset: failure recovered and flag read (SPI)
TXD dom Description Report that TXD pin is shorted to GND.
Set / Reset condition Set: TXD low failure detected. Reset: failure recovered and flag read (SPI)
Bus Dom
clamp Description Report that the CAN bus is dominant for a time longer than tDOM
Set / Reset condition Set: Bus dominant clamp failure detected. Reset: failure recovered and flag read (SPI)
CAN Over-
current Description Report that the CAN current is above CAN over-current threshold.
Set / Reset condition Set: CAN current above threshold. Reset: current below threshold and flag read (SPI)
CAN_UF Description Report that the CAN failure detection has not yet identified the bus failure
Set / Reset condition Set: bus failure pre detection. Reset: CAN bus failure recovered and flag read
CAN_F Description Report that the CAN failure detection has identified the bus failure
Set / Reset condition Set: bus failure complete detetction.Reset: CAN bus failure recovered and flag read
CANL
to VBAT
Description Report CAN L short to VBAT failure
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
CANL to VDD Description Report CANL short to VDD
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
CANL to GND Description Report CAN L short to GND failure
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
CANH
to VBAT
Description Report CAN H short to VBAT failure
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
CANH to VDD Description Report CANH short to VDD
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
CANH to
GND Description Report CAN H short to GND failure
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
Notes
49. Not available on “C” versions
Table 40. Flag Descriptions
Flag Description
Analog Integrated Circuit Device Data
Freescale Semiconductor 87
33903/4/5
SERIAL PERIPHERAL INTERFACE
FLAGS AND DEVICE STATUS
I/O
HS3 short to
GND Description Report I/O-3 HS switch short to GND failure
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
HS2 short to
GND Description Report I/O-2 HS switch short to GND failure
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
SPI parity
error Description Report SPI parity error was detected.
Set / Reset condition Set: failure detected. Reset: flag read (SPI)
CSB low
>2.0 ms Description Report SPI CSB was low for a time longer than typically 2.0 ms
Set / Reset condition Set: failure detected. Reset: flag read (SPI)
VSUP/2-UV Description Report that VSUP/2 is below VS2_LOW threshold.
Set / Reset condition Set VSUP/2 below VS2_LOW thresh. Reset VSUP/2 > VS2_LOW thresh and flag read (SPI)
VSUP/1-OV Description Report that VSUP/1 is above VS_HIGH threshold.
Set / Reset condition Set VSUP/1 above VS_HIGH threshold. Reset VSUP/1 < VS_HIGH thresh and flag read (SPI)
I/O-0 thermal Description Report that the I/O-0 HS switch has reach over-temperature threshold.
Set / Reset condition Set: I/O-0 HS switch thermal sensor above threshold. Reset: thermal sensor below threshold and flag
read (SPI)
watchdog
flash mode
50%
Description Report that the watchdog period has reach 50% of its value, while device is in Flash mode.
Set / Reset condition Set: watchdog period > 50%. Reset: flag read
I/O-1-3 Wake-
up Description Report that Wake-up source is I/O-1 or I/O-3
Set / Reset condition Set: after I/O-1 or I/O-3 wake detected. Reset: Flag read (SPI)
I/O-0-2 Wake-
up Description Report that Wake-up source is I/O-0 or I/O-2
Set / Reset condition Set: after I/O-0 or I/O-2 wake detected. Reset: Flag read (SPI)
SPI Wake-up Description Report that Wake-up source is SPI command, in LP VDD ON mode.
Set / Reset condition Set: after SPI Wake-up detected. Reset: Flag read (SPI)
FWU Description Report that Wake-up source is forced Wake-up
Set / Reset condition Set: after Forced Wake-up detected. Reset: Flag read (SPI)
INT service
Timeout Description Report that INT timeout error detected.
Set / Reset condition Set: INT service timeout expired. Reset: flag read.
LP VDD OFF Description Report that LP VDD OFF mode was selected, prior Wake-up occurred.
Set / Reset condition Set: LP VDD OFF selected. Reset: Flag read (SPI)
Reset request Description Report that RST source is an request from a SPI command (go to RST mode).
Set / Reset condition Set: After reset occurred due to SPI request. Reset: flag read (SPI)
Hardware
Leave Debug Description Report that the device left the Debug mode due to hardware cause (voltage at DBG pin lower than
typically 8.0 V).
Set / Reset condition Set: device leave debug mode due to hardware cause. Reset: flag read.
Table 40. Flag Descriptions
Flag Description
Analog Integrated Circuit Device Data
88 Freescale Semiconductor
33903/4/5
SERIAL PERIPHERAL INTERFACE
FLAGS AND DEVICE STATUS
INT
INT request Description Report that INT source is an INT request from a SPI command.
Set / Reset condition Set: INT occurred. Reset: flag read (SPI)
RST high Description Report that RST pin is shorted to high voltage.
Set / Reset condition Set: RST failure detection. Reset: flag read.
DBG resistor Description Report that the resistor at DBG pin is different from expected (different from SPI register content).
Set / Reset condition Set: failure detected. Reset: correct resistor and flag read (SPI).
VDD TEMP PRE-
WARNING
Description Report that the VDD has reached over-temperature pre-warning threshold.
Set / Reset condition Set: VDD thermal sensor above threshold. Reset: VDD thermal sensor below threshold and flag read
(SPI)
VDD UV Description Reports that VDD pin is lower than the VDDUV threshold.
Set / Reset condition Set: VDD below threshold for t >100 s typically. Re set: VDD above threshold and flag read (SPI)
VDD OVER-
VOLTAGE
Description Reports that VDD pin is higher than the typically VDD + 0.6 V threshold. I/O-1 can be turned OFF if
this function is selected in INIT register.
Set / Reset condition Set: VDD above threshold for t >100 s typically. Reset: VDD below threshold and flag read (SPI)
VAUX_OVER-
VOLTAGE
Description Reports that VAUX pin is higher than the typically VAUX + 0.6 V threshold. I/O-1 can be turned OFF if
this function is selected in INIT register.
Set / Reset condition Set: VAUX above threshold for t >100 s typically. Reset: VAUX below threshold and flag read (SPI)
VDD LOW
>100 ms Description Reports that VDD pin is lower than the VDDUV threshold for a time longer than 100 ms
Set / Reset condition Set: VDD below threshold for t >100 ms typically. Reset: VDD above threshold and flag read (SPI)
VDD LOW Description Report that VDD is below VDD under-voltage threshold.
Set / Reset condition Set: VDD below threshold. Reset: fag read (SPI)
VDD (5.0 V or
3.3 V) Description 0: mean 3.3 V VDD version
1: mean 5.0 V VDD version
Set / Reset condition N/A
Device P/N1
and 0 Description Describe the device part number:
00: MC33903
01: MC33904
10: MC33905S
11: MC333905D
Set / Reset condition N/A
Device id 4 to
0Description Describe the silicon revision number
10010: silicon revision A (Pass 3.1)
10011: silicon revision B (Pass 3.2)
10100: silicon revision C (Pass 3.3)
Set / Reset condition N/A
RST low
>100 ms Description Report that the RST pin has detected a low level, longer than 100 ms (Reset permanent low)
Set / Reset condition Set: after detection of reset low pulse. Reset: Reset pulse terminated and flag read (SPI)
Multiple
Resets Description Report that the more than 8 consecutive reset pulses occurred, due to missing or wrong watchdog
refresh.
Set / Reset condition Set: after detection of multiple reset pulses. Reset: flag read (SPI)
watchdog
refresh failure Description Report that a wrong or missing watchdog failure occurred.
Set / Reset condition Set: failure detected. reset: flag read (SPI)
Table 40. Flag Descriptions
Flag Description
Analog Integrated Circuit Device Data
Freescale Semiconductor 89
33903/4/5
SERIAL PERIPHERAL INTERFACE
FLAGS AND DEVICE STATUS
LIN/1/2
LIN/1/2 bus
dom clamp Description Report that the LIN/1/2 bus is domin ant for a time longer than tDOM
Set / Reset condition Set: Bus dominant clamp failure detected. Reset: failure recovered and flag read (SPI)
LIN/1/2 State Description Report real time LIN interface TXD/RXD mode. 1 if LIN is in TX D/RXD mode. 0 is LIN is not in TXD/
RXD mode.
Set / Reset condition Set: LIN in TXD RXD mode. Reset: LIN not in TXD/RXD mode. LIN not in TXD/RXD mode by SPI
command (ex LIN set in Sleep mode) or following a failure event (ex: TxL Dominant). Flag read SPI
command (0x2780 or 0x2980) do not clear it, as it is “real time” flag.
LIN/1/2 WU Description Report real time LIN Wake-up receiver state. 1 if LIN Wake-up is enable, 0 if LIN Wake-up is disable
(means LIN signal will not be detected and will not Wake-up the device).
Set / Reset condition Set: LIN WU enable (LIN interface set in Sleep mode Wake-up enable). Reset: LIN Wake-up disable
(LIN interface set in Sleep mode Wake-up disable). Flag read SPI command (0x2780 or 0x2980) do
not clear the flag, as it is “real time” information.
LIN/1/2
Wake-up Description Report that Wake-up source is LIN/1/2
Set / Reset condition Set: after LIN/1/2 wake detected. Reset: Flag read (SPI)
LIN/1/2 Term
short to GND Description Report LIN/1/2 short to GND failure
Set / Reset condition Set: failure detected. Reset failure recovered and flag read (SPI)
LIN/1/2
Over-temp Description Report that the LIN/1/2 interface has reach over-temperature threshold.
Set / Reset condition Set: LIN/1/2 thermal sensor above threshold. Reset: sensor below threshold and flag read (SPI)
RXD-L/1/2
low Description Report that RXD/1/2 pin is shorted to GND.
Set / Reset condition Set: RXD low failure detected. Reset: failure recovered and flag read (SPI)
RXD-L/1/2
high Description Report that RXD/1/2pin is shorted to recessive voltage.
Set / Reset condition Set: RXD high failure detected. Reset: failure recovered and flag read (SPI)
TXD-L/1/2
dom Description Report that TXD/1/2 pin is shorted to GND.
Set / Reset condition Set: TXD low failure detected. Reset: failure recovered and flag read (SPI)
Table 40. Flag Descriptions
Flag Description
Analog Integrated Circuit Device Data
90 Freescale Semiconductor
33903/4/5
SERIAL PERIPHERAL INTERFACE
FLAGS AND DEVICE STATUS
FIX AND EXTENDED DEVICE STATUS
For every SPI command, the device response on MISO is
fixed status information. This information is either:
Two Bytes
Fix Status + Extended Status: when a device write
command is used (MOSI bits 15-14, bits C1 C0 = 01)
One Byte
Fix Status: when a device read operation is performed
(MOSI bits 15-14, bits C1 C0 = 00 or 11).
Table 41. Status Bits Description
Bits 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
MISO INT WU RST CAN-G LIN-G I/O-G SAFE-G VREG-G CAN-BUS CAN-LOC LIN2 LIN1 I/O-1 I/O-0 VREG-1 VREG-0
Bits Description
INT Indicates that an INT has occurred and that INT flags are pending to be read.
WU Indicates that a Wake-up has occurred and that Wake-up flags are pending to be read.
RST Indicates that a reset has occurred and that the flags that report the reset source are pending to be read.
CAN-G The INT, WU, or RST source is CAN interface. CAN local or CAN bus source.
LIN-G The INT, WU, or RST source is LIN2 or LIN1 interface
I/O-G The INT, WU, or RST source is I/O interfaces.
SAFE-G The INT, WU, or RST source is from a SAFE condition
VREG-G The INT, WU, or RST source is from a Regulator event, or voltage monitoring event
CAN-LOC The INT, WU, or RST source is CAN interface. CAN local source.
CAN-BUS The INT, WU, or RST source is CAN interface. CAN bus source.
LIN2 The INT, WU, or RST source is LIN2 interface
LIN/LIN1 The INT, WU, or RST source is LIN1 interface
I/O-0 The INT, WU, or RST source is I/O interface, flag from I/O sub adress Low (bit 7 = 0)
I/O-1 The INT, WU, or RST source is I/O interface, flag from I/O sub adress High (bit 7 = 1)
VREG-1 The INT, WU, or RST source is from a Regulator event, flag from REG register sub adress high (bit 7 = 1)
VREG-0 The INT, WU, or RST source is from a Regulator event, flag from REG register sub adress low (bit 7 = 0)
Analog Integrated Circuit Device Data
Freescale Semiconductor 91
33903/4/5
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
Figure 42. 33905D Typical Application Schematic
CS
SCLK
MOSI
INT
5V-CAN
MISO
RXD
TXD
GND
RST
V
DD
V
SUP2
I/O-1
CANL
CANH
SPLIT
I/O-0
VE
MCU
V
BAT
Q1
D1
Safe Circuitry
V
BAT
CAN BUS
V
BAUX
V
AUX
SAFE
MUX A/D
SPI
CAN
V
SENSE
V
SUP1
Q2
V
CAUX
V
SUP
V
SUP
V
SUP
V
SUP
V
DD
INT
RST
RF module
Switch Detection Interface
CAN xcvr
Safing Micro Controller
5.0 V (3.3 V)
DBG
V
B
eSwitch
RXD-L1
TXD-L1
LIN1
RXD-L2
TXD-L2
LIN2
1.0 k
22 k
100 nF
100 nF
100 nF
22
F
>4.7
F
>2.2
F
4.7 nF
<10 k
4.7 k *
60
60
* Optional
*
Notes
50.
Tested per specific OEM EMC requirements for CAN and LIN with additional
capacitor > 10
F
on VSUP1/VSUP2 pins
(50)
LIN1
LIN TERM1
LIN BUS 1
1.0 k
1.0 k
VSUP1/2
option 1 option 2
LIN2
LIN TERM2
LIN BUS 1
1.0 k
1.0 k
VSUP1/2
option 1 option 2
>1.0
F
N/C
Analog Integrated Circuit Device Data
92 Freescale Semiconductor
33903/4/5
TYPICAL APPLICATIONS
Figure 43. 33905S Typical Application Schematic
CS
SCLK
MOSI
INT
5V-CAN
MISO
RXD
TXD
GND
RST
VDD
VSUP2
I/O-1
CANL
CANH
SPLIT
I/O-0
VE
MCU
V
BAT
Q1*
D1
Safe Circuitry
V
BAT
CAN BUS
VBAUX VAUX
SAFE
MUX A/D
SPI
CAN
VSENSE
VSUP1
Q2
VCAUX
V
SUP
V
SUP
V
SUP
V
SUP
VDD
INT
RST
RF module
Switch Detection Interface
CAN xcvr
Safing Micro Controller
5.0 V (3.3 V)
DBG
VB
eSwitch
RXD-L1
TXD-L1
LIN1
I/O-3
V
SUP
1.0 k
22 k
100 nF
100 nF
100 nF
22 F
>1.0 F>4.7 F
>2.2 F
4.7 nF
<10 k
4.7 k *
60
60
(51)
Notes
51.
Tested per specific OEM EMC requirements for CAN and LIN with additional
capacitor > 10
F
on VSUP1/VSUP2 pins
LIN1
LIN TERM1
LIN BUS 1
1.0 k
1.0 k
VSUP1/2
option 1 option 2
Analog Integrated Circuit Device Data
Freescale Semiconductor 93
33903/4/5
TYPICAL APPLICATIONS
Figure 44. 33904 Typical Application Schematic
CS
SCLK
MOSI
INT
5V-CAN
MISO
RXD
TXD
GND
RST
VDD
VSUP2
I/O-1
CANL
CANH
DBG
SPLIT
I/O-0
VE
VB
MCU
V
BAT
Q1*
D1
Safe Circuitry
V
BAT
CAN BUS
VBAUX VAUX
SAFE
MUX A/D
SPI
CAN
VSENSE
VSUP1
Q2
VCAUX
V
SUP
V
SUP
OR
V
SUP
V
SUP
VDD
INT
RST
RF module
Switch Detection Interface
CAN xcvr
function
eSwitch
Safing Micro Controller
5V (3.3 V)
I/O-3
I/O-2
V
SUP
V
BAT
1.0 k
22 k
100 nF
100nF
100 nF
22 F
>4.7 F
>2.2 F
4.7 nF
<10 k
4.7 k *
60
60
100 nF
* Optional
22 k
(52)
Notes
52.
Tested per specific OEM EMC requirements for CAN and LIN with additional
capacitor > 10
F
on VSUP1/VSUP2 pins
>1.0 F
N/C
Analog Integrated Circuit Device Data
94 Freescale Semiconductor
33903/4/5
TYPICAL APPLICATIONS
Figure 45. 33903 Typical Application Schematic
CS
SCLK
MOSI
INT
5V-CAN
MISO
RXD
TXD
GND
RST
VDD
CANL
CANH
DBG
SPLIT
I/O-0
MCU
Safe Circuitry
V
BAT
CAN BUS
SAFE
SPI
CAN
OR
V
SUP
V
SUP
VDD
INT
RST
function
22 k 100 nF
>1.0 F>4.7 F
4.7 nF
60
60
(53)
Notes
53.
Tested per specific OEM EMC requirements for CAN and LIN with additional
capacitor > 10
F
on VSUP1/VSUP2 pins
VSUP1
V
BAT
D1
V
SUP
100 nF
22 FVSUP2
N/C
Analog Integrated Circuit Device Data
Freescale Semiconductor 95
33903/4/5
TYPICAL APPLICATIONS
Figure 46. 33903D Typical Application Schematic
CS
SCLK
MOSI
INT
5V-CAN
MISO
RXD
TXD
GND
RST
VDD
VSUP
CANL
CANH
SPLIT
IO-0
VE
MCU
V
BAT
Q1
D1
Safe Circuitry
V
BAT
CAN BUS
SAFE
MUX A/D
SPI
CAN
VSENSE
V
SUP
V
SUP
V
SUP
VDD
INT
RST
DBG
VB
RXD-L1
TXD-L1
LIN1
RXD-L2
TXD-L2
LIN2
LIN BUS 1 LIN1
LIN-T1
1.0 k
1.0 k
22 k
100 nF
100 nF
100 nF
22 F
>1.0 F>4.7 F
4.7 nF
4.7 k (optional)
60
60
* = Optional
*
1.0 k
option1 option2
LIN BUS 2 LIN2
LIN-T2
1.0 k
1.0 k
option1 option2
VSUP
VSUP
Notes
54.
Tested per specific OEM EMC requirements for CAN and LIN with additional
capacitor > 10
F
on VSUP pin
Analog Integrated Circuit Device Data
96 Freescale Semiconductor
33903/4/5
TYPICAL APPLICATIONS
Figure 47. 33903S Typical Application Schematic
CS
SCLK
MOSI
INT
5V-CAN
MISO
RXD
TXD
GND
RST
VDD
VSUP
CANL
CANH
SPLIT
VE
MCU
V
BAT
Q1
D1
Safe Circuitry
V
BAT
CAN BUS
SAFE
MUX A/D
SPI
CAN
VSENSE
V
SUP
V
SUP
V
SUP
VDD
INT
RST
DBG
VB
RXD-L
TXD-L
LIN
LIN BUS LIN
LIN-T
1.0 k
1.0 k
22 k
100 nF
100 nF
100 nF
22 F
>1.0 F>4.7 F
4.7 nF
4.7 k (optional)
60
60
* = Optional
*
1.0 k
option1 option2
VSUP
Notes
55.
Tested per specific OEM EMC requirements for CAN and LIN with additional
capacitor > 10
F
on VSUP pin
56. Leave N/C pins open.
IO-3
V
SUP
IO-0
N/C
Analog Integrated Circuit Device Data
Freescale Semiconductor 97
33903/4/5
TYPICAL APPLICATIONS
Figure 48. 33903P Typical Application Schematic
CS
SCLK
MOSI
INT
5V-CAN
MISO
RXD
TXD
GND
RST
VDD
VSUP
CANL
CANH
SPLIT
VE
MCU
V
BAT
Q1
D1
Safe Circuitry
V
BAT
CAN BUS
SAFE
MUX A/D
SPI
CAN
VSENSE
V
SUP
V
SUP
V
SUP
VDD
INT
RST
DBG
VB
1.0 k
22 k
100 nF
100 nF
100 nF
22 F
>1.0 F>4.7 F
4.7 nF
4.7 k (optional)
60
60
* = Optional
*
Notes
57.
Tested per specific OEM EMC requirements for CAN and LIN with additional
capacitor > 10
F
on VSUP pin
58. Leave N/C pins open.
IO-3
V
SUP
IO-0
N/C
I/O-2
V
BAT
100 nF
22 k
Analog Integrated Circuit Device Data
98 Freescale Semiconductor
33903/4/5
TYPICAL APPLICATIONS
The following figure illustrates the application case
where two reverse battery diodes can be used for
optimization of the filtering and buffering capacitor at the
VDD pin. This allows using a minimum value capacitor at
the VDD pin to guarantee rese t-free operation of the MCU
during the cra nking pulse and temporary (5 0 ms) loss of the
VBAT supply .
Applications without an external ballast on VDD and
without using th e VAUX regulator are illustrated as we ll.
Figure 49. Appl ication Options
ex2: Split V
SUP
Supply
ex 4: No External Transistor - No VAUX
ex 3: No External T ransistor, V
DD
~100 mA Capability
ex1: Single V
SUP
Supply
Optimized solution for cranking pulses.
C1 is sized for MCU power supply buffer only.
VDD
VSUP2 VE
VB
V
BAT
Q1
D1
VBAUX VAUX
5.0 V/3.3 V
VSUP1
Q2
Partial View
VDD
VE
VB
V
BAT
D1
VBAUX
VDD
VE
VB
V
BAT
D1
VDD
VE
VB
V
BAT
Q1
D2
VSUP2
VSUP1
VSUP2
VSUP1
VSUP2
VSUP1
D1
C1
C2
VCAUX
Q2
VAUX
VCAUX
Q2
VBAUX VAUX
VCAUX
VBAUX VAUX
VCAUX
Partial View
Partial View
Partial View
5.0 V/3.3 V
5.0 V/3.3 V
delivered by internal path transistor.
Analog Integrated Circuit Device Data
Freescale Semiconductor 99
33903/4/5
PACKAGING
SOIC 32 PACKAGE DIMENSIONS
PACKAGING
SOIC 32 PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.
EK SUFFIX (PB-FREE)
32-PIN SOIC WIDE BODY
EXPOSED PAD
98ASA10556D
REVISION D
Analog Integrated Circuit Device Data
100 Freescale Semiconductor
33903/4/5
PACKAGING
SOIC 32 PACKAGE DIMENSIONS
EK SUFFIX (PB-FREE)
32-PIN SOIC WIDE BODY
EXPOSED PAD
98ASA10556D
REVISION D
Analog Integrated Circuit Device Data
Freescale Semiconductor 101
33903/4/5
PACKAGING
SOIC 32 PACKAGE DIMENSIONS
EK SUFFIX (PB-FREE)
32-PIN SOIC WIDE BODY
EXPOSED PAD
98ASA10556D
REVISION D
Analog Integrated Circuit Device Data
102 Freescale Semiconductor
33903/4/5
PACKAGING
SOIC 54 PACKAGE DIMENSIONS
SOIC 54 PACKAGE DIMENSIONS
EK SUFFIX (PB-FREE)
54-PIN SOIC WIDE BODY
EXPOSED PAD
98ASA10506D
REVISION D
Analog Integrated Circuit Device Data
Freescale Semiconductor 103
33903/4/5
PACKAGING
SOIC 54 PACKAGE DIMENSIONS
EK SUFFIX (PB-FREE)
54-PIN SOIC WIDE BODY
EXPOSED PAD
98ASA10506D
REVISION D
Analog Integrated Circuit Device Data
104 Freescale Semiconductor
33903/4/5
PACKAGING
SOIC 54 PACKAGE DIMENSIONS
EK SUFFIX (PB-FREE)
54-PIN SOIC WIDE BODY
EXPOSED PAD
98ASA10506D
REVISION D
Analog Integrated Circuit Device Data
Freescale Semiconductor 105
33903/4/5
REVISION HISTORY
REVISION HISTORY
REVISION DATE DESCRIPTION OF CHANGES
4.0 9/2010 • Initial Release - This document supersedes document MC33904_5.
• Initial release of document includes the MC33903 part number , the VDD 3.3 V version description,
and the silicon revision rev. 3.2. Change details available upon request.
5.0 12/2010 • Added Cyclic INT Operation During LP VDD ON Mode 48
• Changed VSUP pin to VSUP1 and pin 2 (NC) to VSUP2 for the 33903 device
• Removed Drop voltage without external PNP pass transistor(19) 20 for VDD=3.3 V devices
• Added VSUP1-3.3 to VDD Voltage regulator, VDD pin 20.
• Added Pull-up Current, TXD, VIN = 0 V 24 for VDD=3.3 V devices
•Revised MUX and RAM registers 67
•Revised Status Bits Description 90
• Added Entering into LP Mode Using Random Code 77.
6.0 4/2011 • Removed part numbers MCZ33905S3EK/R2, MCZ33904A3EK/R2 and MCZ33905D3EK/R2, and
added part numbers MCZ33903BD3EK/R2, MCZ33903BD5EK/R2, MCZ33903BS3EK/R2 and
MCZ33903BS5EK/R2.
• Voltage Supply was improved from 27V to 28V.
• Changed Classification from Advance Information to Technical Data.
• Updated Notes in Tables 8.
•Revised Tables 8; Attenuation/Gain ratio for I/O-0 and I/O-1 actual voltage: to reflect a Typical
value.
• Corrected typographical errors throughout.
• Added Chip temperature: MUX-OUT voltage (guaranteed by design and characterization)
parameter to Tables 8.
• Updated I/O pins (I/O-0: I/O-3) on page 36.
7.0 9/2011 • Updated VOUT-3.3 maximum
• Updated tLEAD parameter
• Added tCSLOW parameter
• Updated the Detail Operation section to reflect the importance of acknowledging tLEAD and tCSLOW.
• Corrected typographical error in Tables 34 CAN REGISTER for Slew Rate bits b5,b4
8.0 1/2011 • Added 12 PCZ devices to the ordering information
• Bit label change on Table 39 from INT to SAFE
• Revised notes on Table 1 to include “C” version
•Split Falling Edge of CS to Rising Edge of SCLK to differentiate the “C” version
• Added “C” version note to Table 39 and Table 40
• Added device ID 10100 Rev C, Pass 3.3 to Device id 4 to 0
• Added Debug mode DBG voltage range parameter. Already detailed in text.
• Added the MC33903P device, making additions throughout the document, where applicable.
9.0 2/2012 • Changed all PC devices to MC devices.
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