[ /Title (CD74 HC431 6, CD74 HCT43 16) /Subject (HighSpeed CMOS CD54HC4316, CD74HC4316, CD74HCT4316 Data sheet acquired from Harris Semiconductor SCHS212D High-Speed CMOS Logic Quad Analog Switch with Level Translation February 1998 - Revised October 2003 Features In addition these devices contain logic-level translation circuits that provide for analog signal switching of voltages between 5V via 5V logic. Each switch is turned on by a high-level voltage on its select input (S) when the common Enable (E) is Low. A High E disables all switches. The digital inputs can swing between VCC and GND; the analog inputs/outputs can swing between VCC as a positive limit and VEE as a negative limit. Voltage ranges are shown in Figures 2 and 3. * Wide Analog-Input-Voltage Range VCC - VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 10V * Low "ON" Resistance - 45 (Typ) . . . . . . . . . . . . . . . . . . . . . . . . . . .VCC = 4.5V - 35 (Typ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC = 6V - 30 (Typ) . . . . . . . . . . . . . . . . . . . . . . . VCC - VEE = 9V * Fast Switching and Propagation Delay Times Ordering Information * Low "OFF" Leakage Current * Built-In "Break-Before-Make" Switching PART NUMBER * Logic-Level Translation to Enable 5V Logic to Accommodate 5V Analog Signals TEMP. RANGE (oC) PACKAGE CD54HC4316F3A -55 to 125 16 Ld CERDIP CD74HC4316E -55 to 125 16 Ld PDIP CD74HC4316M -55 to 125 16 Ld SOIC * HC Types - 2V to 10V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V CD74HC4316MT -55 to 125 16 Ld SOIC CD74HC4316M96 -55 to 125 16 Ld SOIC CD74HC4316NSR -55 to 125 16 Ld SOP * HCT Types - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH CD74HC4316PW -55 to 125 16 Ld TSSOP CD74HC4316PWR -55 to 125 16 Ld TSSOP CD74HC4316PWT -55 to 125 16 Ld TSSOP CD74HCT4316E -55 to 125 16 Ld PDIP Description CD74HCT4316M -55 to 125 16 Ld SOIC CD74HCT4316MT -55 to 125 16 Ld SOIC CD74HCT4316M96 -55 to 125 16 Ld SOIC * Wide Operating Temperature Range . . . -55oC to 125oC The 'HC4316 and CD74HCT4316 contain four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits. Pinout NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. CD54HC4316 (CERDIP) CD74HC4316 (PDIP, SOIC, SOP, TSSOP) CD74HCT4316 (PDIP, SOIC) TOP VIEW 1Z 1 16 VCC 1Y 2 15 1S 2Y 3 14 4S 2Z 4 13 4Z 2S 5 12 4Y 3S 6 11 3Y E 7 10 3Z 9 VEE GND 8 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) 2003, Texas Instruments Incorporated 1 CD54HC4316, CD74HC4316, CD74HCT4316 Functional Diagram VCC 16 2 15 1Y 1S 1 5 1Z 3 2S LOGIC LEVEL CONV. AND CONTROL 6 3S 2Y 4 2Z 11 3Y 14 4S 10 12 E 7 3Z 4Y 13 4Z 8 9 GND VEE TRUTH TABLE INPUTS E S SWITCH L L OFF L H ON H X OFF H= High Level Voltage L= Low Level Voltage X= Don't Care Logic Diagram nY TO 3 OTHER SWITCHES E nS VCC VCC LOGIC LEVEL CONV. nZ VEE VEE FIGURE 1. ONE SWITCH 2 CD54HC4316, CD74HC4316, CD74HCT4316 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Supply Voltage, VCC - VEE . . . . . . . . . . . . . . . . . . -0.5V to 10.5V DC Supply Voltage, VEE . . . . . . . . . . . . . . . . . . . . . . . . 0.5V to -7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC 0.5V. . . . . . . . . . . . . . . . . . . . . . . .20mA DC Switch Diode Current, IOK For VI < VEE -0.5V or VI < VCC + 0.5V . . . . . . . . . . . . . . . . .25mA DC Switch Diode Current For VI > VEE -0.5V or VI < VCC + 0.5V . . . . . . . . . . . . . . . . .25mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .50mA Package Thermal Impedance, JA (see Note 1): E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W Maximum Junction Temperature (Plastic Package) . . . . . . . . . 150o Maximum Storage Temperature Range . . . . . . . . . . . -65oC to 150o Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . 300o SOIC - Lead Tips Only Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V Supply Voltage Range, VCC - VEE HC, HCT Types (Figure 2) . . . . . . . . . . . . . . . . . . . . . . .2V to 10V Supply Voltage Range, VEE HC, HCT Types (Figure 3) . . . . . . . . . . . . . . . . . . . . . . . 0V to -6V DC Input or Output Voltage, VI . . . . . . . . . . . . . . . . . . . GND to VCC Analog Switch I/O Voltage, VIS . . . . . . . . . . . . . . . . . . . . . VEE (Min) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC (Max) Input Rise and Fall Time, tr, tf 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Area as a Function of Supply Voltage 8 8 6 VCC - GND (V) 4 6 VCC - GND (V) 4 HCT HC 2 0 HCT HC 2 0 2 0 4 6 8 10 12 VCC - VEE (V) FIGURE 2. 0 -2 -4 -6 -8 VEE - GND (V) FIGURE 3. 3 CD54HC4316, CD74HC4316, CD74HCT4316 DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIS (V) VIH - - -40oC TO 85oC 25oC VEE (V) VCC (V) -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V 0 4.5 - 45 180 - 225 - 270 0 6 - 35 160 - 200 - 240 -4.5 4.5 - 30 135 - 170 - 205 0 4.5 - 85 320 - 400 - 480 0 6 - 55 240 - 300 - 360 -4.5 4.5 - 35 170 - 215 - 255 0 4.5 - 10 - - - - - 0 6 - 8.5 - - - - - -4.5 4.5 - 5 - - - - - 0 6 - - 0.1 - 1 - 1 A -5 5 - - 0.1 - 1 - 1 A HC TYPES High Level Input Voltage Low Level Input Voltage "ON" Resistance IO = 1mA (Figures 4, 5) VIL RON - VIH or VIL - VCC or VEE VCC to VEE Maximum "ON" Resistance Between Any Two Channels RON Switch Off Leakage Current IIZ Control Input Leakage Current Quiescent Device Current IO = 0 - - - - VIH or VIL VCC VEE IIL VCC or GND - 0 6 - - 0.1 - 1 - 1 A ICC VCC or When 0 GND VIS = VEE, VOS=VCC -5 6 - - 8 - 80 - 160 A 5 - - 16 - 160 - 320 A When VIS = VCC, VOS =VEE HCT TYPES High Level Input Voltage VIH - - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V "ON" Resistance IO = 1mA (Figures 4, 5) RON VIH or VIL VCC or VEE 0 4.5 - 45 180 - 225 - 270 -4.5 4.5 - 30 135 - 170 - 205 0 4.5 - 85 320 - 400 - 480 -4.5 4.5 - 35 170 - 215 - 255 0 4.5 - 10 - - - - - -4.5 4.5 - 5 - - - - - 0 6 - - 0.1 - 1 - 1 A -5 5 - - 0.1 - 1 - 1 A VCC to VEE Maximum "ON" Resistance Between Any Two Channels RON Switch Off Leakage Current IIZ - VIH or VIL - VCC VEE 4 CD54HC4316, CD74HC4316, CD74HCT4316 DC Electrical Specifications (Continued) PARAMETER SYMBOL VI (V) VIS (V) Control Input Leakage Current II VCC or GND - Quiescent Device Current IO = 0 Additional Quiescent Device Current Per Input Pin: 1 Unit Load ICC ICC (Note 2) Any When Voltage VIS = VEE, BeVOS = tween VCC, VCC and When GND VIS = VCC, VOS = VEE VCC -2.1 -40oC TO 85oC 25oC TEST CONDITIONS VEE (V) VCC (V) -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 0 5.5 - - 0.1 - 1 - 1 A 0 5.5 - - 8 - 80 - 160 A -4.5 5.5 - - 16 - 160 - 320 A - 4.5 to 5.5 - 100 360 - 450 - 490 A - NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS All 0.5 NOTE: Unit Load is ICC limit specified in DC Electrical Table, e.g., 360A max at 25oC. Switching Specifications Input tr, tf = 6ns PARAMETER -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL TEST CONDITIONS VEE (V) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 0 2 - - 60 - 75 - 90 ns 0 4.5 - - 12 - 15 - 18 ns 0 6 - - 10 - 13 - 15 ns -4.5 4.5 - - 8 - 10 - 12 ns 0 2 - - 205 - 255 - 310 ns 0 4.5 - - 41 - 51 - 62 ns 0 6 - - 35 - 43 - 53 ns HC TYPES Propagation Delay, Switch In to Out Turn "ON" Time E to Out Turn "ON" Time nS to Out Turn "OFF" Time E to Out tPZH, tPZL tPZH, tPZL tPLZ, tPHZ CL = 50pF -4.5 4.5 - - 37 - 47 - 56 ns CL = 15pF - 5 - 17 - - - - - ns CL = 50pF 0 2 - - 175 - 220 - 265 ns 0 4.5 - - 35 - 44 - 53 ns 0 6 - - 30 - 37 - 45 ns -4.5 4.5 - - 34 - 43 - 51 ns CL = 15pF - 5 - 14 - - - - - ns CL = 50pF 0 2 - - 205 - 255 - 310 ns 0 4.5 - - 41 - 51 - 62 ns 0 6 - - 35 - 43 - 53 ns -4.5 4.5 - - 37 - 47 - 56 ns - 5 - 17 - - - - - ns CL = 15pF 5 CD54HC4316, CD74HC4316, CD74HCT4316 Switching Specifications Input tr, tf = 6ns PARAMETER Turn "OFF" Time nS to Out Input (Control) Capacitance Power Dissipation Capacitance (Notes 3, 4) (Continued) -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 0 2 - - 175 - 220 - 265 ns 0 4.5 - - 35 - 44 - 53 ns SYMBOL TEST CONDITIONS VEE (V) tPLZ, tPHZ CL = 50pF 0 6 - - 30 - 37 - 45 ns -4.5 4.5 - - 34 - 43 - 51 ns CL = 15pF - 5 - 14 - - - - - ns CI - - - - - 10 - 10 - 10 pF CPD - - 5 - 42 - - - - - pF tPLH, tPHL CL = 50pF 0 4.5 - - 12 - 15 - 18 ns -4.5 4.5 - - 8 - 10 - 12 ns tPZH CL = 50pF 0 4.5 - - 44 - 55 - 66 ns -4.5 4.5 - - 42 - 53 - 63 ns - 5 - 18 - - - - - ns HCT TYPES Propagation Delay, Switch In to Switch Out Turn "ON" Time E to Out CL = 15pF tPZL Turn "ON" Time nS to Out tPZH CL = 50pF Turn "OFF" Time E to Out Turn "OFF" Time nS to Out Input (Control) Capacitance Power Dissipation Capacitance (Notes 3, 4) 4.5 - - 56 - 70 - 85 ns 4.5 - - 42 - 53 - 63 ns CL = 15pF - 5 - 24 - - - - - ns CL = 50pF 0 4.5 - - 40 - 53 - 60 ns -4.5 4.5 - - 34 - 43 - 51 ns - 5 - 17 - - - - - ns CL = 15pF tPZL 0 -4.5 CL = 50pF 0 4.5 - - 50 - 63 - 75 ns -4.5 4.5 - - 34 - 43 - 51 ns CL = 15pF - 5 - 18 - - - - - ns tPLZ CL = 50pF 0 4.5 - - 50 - 63 - 75 ns -4.5 4.5 - - 46 - 58 - 69 ns tPLZ, tPHZ CL = 15pF - 5 - 21 - - - - - ns tPHZ CL = 50pF 0 4.5 - - 44 - 55 - 66 ns -4.5 4.5 - - 40 - 50 - 60 ns tPLZ, tPHZ CL = 15pF - 5 - 18 - - - - - ns CI - - - - - 10 - 10 - 10 pF CPD - - 5 - 47 - - - - - pF NOTES: 3. CPD is used to determine the dynamic power consumption, per package. 4. PD = CPD VCC2 fi + (CL + CS) VCC2 fo where fi = input frequency, fo = output frequency, CL = output load capacitance, CS = switch capacitance, VCC = supply voltage. Analog Channel Specifications TA = 25oC TEST CONDITIONS VCC (V) HC4316 CD74HCT4316 UNITS Figure 9 (Notes 5, 6) 4.5 >200 >200 MHz Crosstalk Between Any Two Switches (Figure 7) Figure 8 (Notes 6, 7) 4.5 TBE TBE dB PARAMETER Switch Frequency Response Bandwidth at -3dB (Figure 6) 6 CD54HC4316, CD74HC4316, CD74HCT4316 Analog Channel Specifications TA = 25oC (Continued) TEST CONDITIONS VCC (V) HC4316 CD74HCT4316 UNITS 1kHz, VIS = 4VP-P (Figure 10) 4.5 0.078 0.078 % 1kHz, VIS = 8VP-P (Figure 10) 9 0.018 0.018 % 4.5 TBE TBE mV 9 TBE TBE mV Figure 12 (Notes 6, 7) 4.5 -62 -62 dB - - 5 5 pF PARAMETER Total Harmonic Distortion Control to Switch Feedthrough Noise Switch "OFF" Signal Feedthrough (Figure 7) Figure 11 Switch Input Capacitance, CS NOTES: 5. Adjust input level for 0dBm at output, f = 1MHz. 6. VIS is centered at VCC/2. 7. Adjust input for 0dBm at VIS. Typical Performance Curves 110 60 "ON" RESISTANCE, RON () "ON" RESISTANCE, RON () 100 90 VCC = 4.5V, VEE = 0V 80 70 60 50 40 VCC = 6V, VEE = 0V 30 20 50 45 40 30 25 20 15 10 5 10 0 1 2 3 4 4.5 INPUT SIGNAL VOLTAGE, VIS (V) 5 0 -4.5 6 CROSSTALK, dB SWITCH OFF SIGNAL FEEDTHROUGH, dB CL = 10pF -2 VCC = 4.5V RL = 50 TA = 25oC PIN 4 TO 3 -3 CL = 10pF VCC = 9V RL = 50 TA = 25oC PIN 4 TO 3 -4 10K 100K 1M 10M FREQUENCY (f), Hz -2.5 -1.5 -0.5 0.5 1.5 2.5 3.5 4.5 FIGURE 5. TYPICAL "ON" RESISTANCE vs INPUT SIGNAL VOLTAGE 0 -1 -3.5 INPUT SIGNAL VOLTAGE, VIS (V) FIGURE 4. TYPICAL "ON" RESISTANCE vs INPUT SIGNAL VOLTAGE CHANNEL ON BANDWIDTH, dB VCC = 4.5V, VEE = 4.5V 35 0 -40 FIGURE 6. SWITCH FREQUENCY RESPONSE CL = 10pF VCC = 9V RL = 50 TA = 25oC PIN 4 TO 3 -60 -80 -100 10K 100M CL = 10pF VCC = 4.5V RL = 50 TA = 25oC PIN 4 TO 3 -20 100K 1M 10M FREQUENCY (f), Hz 100M FIGURE 7. SWITCH-OFF SIGNAL FEEDTHROUGH AND CROSSTALK vs FREQUENCY 7 CD54HC4316, CD74HC4316, CD74HCT4316 Analog Test Circuits VIS VCC VCC 0.1F SWITCH ON VIS VOS1 R R VOS2 SWITCH ON R C R VCC/2 C dB METER VCC/2 fIS = 1MHz SINEWAVE R = 50 C = 10pF VCC/2 FIGURE 8. CROSSTALK BETWEEN TWO SWITCHES TEST CIRCUIT VCC VCC 0.1F VIS SINE WAVE 10F VIS VOS SWITCH ON 50 VIS VI = VIH SWITCH ON VOS 10k 10pF dB METER VCC/2 50pF DISTORTION METER VCC/2 fIS = 1kHz TO 10kHz FIGURE 9. FREQUENCY RESPONSE TEST CIRCUIT E VCC 600 VCC/2 SWITCH ALTERNATING ON AND OFF tr, tf 6ns fCONT = 1MHz 50% DUTY CYCLE FIGURE 10. TOTAL HARMONIC DISTORTION TEST CIRCUIT VCC VP-P VOS 0.1F 600 50pF VCC/2 SCOPE FIGURE 11. CONTROL-TO-SWITCH FEEDTHROUGH NOISE TEST CIRCUIT fIS 1MHz SINEWAVE R = 50 C = 10pF VOS SWITCH ON VIS VOS VC = VIL R R VCC/2 VCC/2 C dB METER FIGURE 12. SWITCH OFF SIGNAL FEEDTHROUGH 8 CD54HC4316, CD74HC4316, CD74HCT4316 Test Circuits and Waveforms 6ns 6ns 3V (HCT) 90% 50% tf = 6ns tPLH OUTPUT LOW TO OFF 90% 50% 10% 50% 50% SWITCH ON FIGURE 13. SWITCH PROPAGATION DELAY TIMES tPZH 90% OUTPUT HIGH TO OFF VEE SWITCH OUTPUT 50% 10% tPHZ tPHL GND tPZL tPLZ tr = 6ns SWITCH INPUT 10% E VCC VCC (HC) OUTPUTS DISABLED SWITCH OFF OUTPUTS ENABLED SWITCH ON FIGURE 14. SWITCH TURN-ON AND TURN-OFF PROPAGATION DELAY TIMES WAVEFORMS 9 10 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type CD54HC4316F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD74HC4316E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4316EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4316M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4316PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HCT4316EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4316M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4316MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74HC4316M96 Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HC4316NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD74HC4316PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD74HC4316PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD74HCT4316M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC4316M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HC4316NSR SO NS 16 2000 367.0 367.0 38.0 CD74HC4316PWR TSSOP PW 16 2000 367.0 367.0 35.0 CD74HC4316PWT TSSOP PW 16 250 367.0 367.0 35.0 CD74HCT4316M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated