Subm Feedba Send Print Twitte Faceb Linke Type Here to Search Products ARK Menu Intel(R) NUC Kit NUC5i3RYK Specifications Essentials Memory Specifications Graphics Specifications Expansion Options I/O Specifications Package Specifications Advanced Technologies Intel(R) Data Protection Technology Ordering / sSpecs / Steppings Download Drivers Compare Specifications Related Products - Essentials Status Launched Launch Date Q1'15 Expected Discontinuance See Roadmap Board Form Factor UCFF (4" x 4") Socket Soldered-down BGA Internal Drive Form Factor M.2 SSD # of Internal Drives Supported 1 Embedded Options Available No Lithography 14 nm TDP 15 W DC Input Voltage Supported 12-19 VDC Recommended Customer Price $279.00 Datasheet Link Processor Included Intel(R) CoreTM i3-5010U Processor (3M Cache, 2.10 GHz) Product Brief Link Additional Information URL Link Warranty Period 3 yrs - Memory Specifications Max Memory Size (dependent on memory type) 16 GB Memory Types DDR3L-1333/1600 1.35V SODIMM Max # of Memory Channels 2 Max Memory Bandwidth 25.6 GB/s Max # of DIMMs 2 ECC Memory Supported No - Graphics Specifications Integrated Graphics Yes Graphics Output Mini-DP 1.2; Mini-HDMI 1.4a Intel(R) Clear Video Technology Yes # of Displays Supported 3 - Expansion Options PCI Express Revision Gen2 PCI Express Configurations M.2 slot with PCIe x4 lanes M.2 Card Slot (storage) 22x42/60/80 - I/O Specifications USB Revision 2.0, 3.0 # of USB Ports 6 USB 2.0 Configuration (External + Internal) 0+2 USB 3.0 Configuration (External + Internal) 2B 2F + 0 Total # of SATA Ports 2 Max # of SATA 6.0 Gb/s Ports 2 Audio (back channel + front channel) 7.1 digital (mHDMI mDP); L+R+mic (F) Integrated LAN 10/100/1000 Integrated Wifi Intel(R) Wireless-AC 7265 + BT 4.2 Integrated Bluetooth Yes Consumer Infrared Rx Sensor Yes Additional Headers 2x USB2.0, AUX_PWR - Package Specifications Low Halogen Options Available + See MDDS - Advanced Technologies Intel(R) Virtualization Technology for Directed I/O (VT-d) Yes Intel(R) vPro Technology No TPM No Intel(R) NUC Boards and Kits Intel(R) NUC Kits Products formerly Rock Canyon Quick Links Export Full Specifications Additional Information Support Overview Search Distributors PCN/MDDS Information 936893: PCN | MDDS Intel(R) HD Audio Technology Yes Intel(R) Rapid Storage Technology Yes Intel(R) Virtualization Technology (VT-x) Yes - Intel(R) Data Protection Technology Intel(R) AES New Instructions Yes All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. "Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export. Refer to Datasheet for formal definitions of product properties and features. "Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update. This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration. "Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers. The Recommended Customer Price ("RCP") is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. 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