1. Product profile
1.1 General description
NPN medium power tran sistor series in Surface-Mo unted Device (SMD) plastic p ackages.
[1] Valid for all available selection groups.
1.2 Features and benefits
High current
Two curren t gai n sele ct ion s
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plas tic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
1.4 Quick reference data
BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
Rev. 8 — 18 October 2011 Product data sheet
Table 1. Product overview
Type number[1] Package PNP complement
NXP JEITA JEDEC
BCP68 SOT223 SC-73 - BCP69
BC868 SOT89 SC-62 TO-243 BC869
BC68PA SOT1061 - - BC69PA
Linear voltage regulators Power management
Low-side switches MOSFET drivers
Battery-driven devices Amplifiers
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 20 V
ICcollector current - - 2 A
ICM peak collector current single pulse; tp1ms - - 3 A
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 2 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
[1] Pulse test: tp300 s; = 0.02.
2. Pinning information
hFE DC current gain VCE =1V; I
C=500mA [1] 85 - 375
hFE selection -25 VCE =1V; I
C=500mA [1] 160 - 375
Table 2. Quick reference data …continued
Symbol Parameter Conditions Min Typ Max Unit
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
SOT223
1base
2 collector
3emitter
4 collector
SOT89
1emitter
2 collector
3base
SOT1061
1base
2emitter
3 collector
132
4
sym016
2, 4
3
1
321
sym042
1
2
3
Transparent top view
12
3
sym021
3
2
1
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 3 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
3. Ordering information
[1] Valid for all available selection groups.
4. Marking
Tabl e 4. Ordering information
Type number[1] Package
Name Description Version
BCP68 SC-73 plastic surface-mounted package with increased
heatsink; 4 leads SOT223
BC868 SC-62 plastic surface-mounted package; exposed die pad for
good heat transfer; 3 leads SOT89
BC68PA HUSON3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2 20.65 mm SOT1061
Table 5. Marking codes
Type number Marking code
BCP68 BCP68
BCP68-25 BCP68/25
BC868 CAC
BC868-25 CDC
BC68PA AR
BC68-25PA AS
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 4 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 32 V
VCEO collector-emitter voltage open base - 20 V
VEBO emitter-base voltage open collector - 5 V
ICcollector current - 2 A
ICM peak collector current single pulse;
tp1ms -3A
IBbase current - 0.4 A
IBM peak base current single pulse;
tp1ms -0.4A
Ptot total power dissipation Tamb 25 C
BCP68 [1] -0.65W
[2] -1.00W
[3] -1.35W
BC868 [1] -0.50W
[2] -0.95W
[3] -1.35W
BC68PA [1] -0.42W
[2] -0.83W
[3] -1.10W
[4] -0.81W
[5] -1.65W
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 5 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT223 Fig 2. Power derating curves SOT89
(1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2
(2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm2
(3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm2
(4) FR4 PCB, 4-layer copper, standard footprint
(5) FR4 PCB, single-sided copper, standard footprint
Fig 3. Power derating curves S OT 10 6 1
Tamb (°C)
–75 17512525 75–25
006aac674
0.5
1.0
1.5
Ptot
(W)
0.0
(1)
(2)
(3)
Tamb (°C)
–75 17512525 75–25
006aac675
0.5
1.0
1.5
Ptot
(W)
0.0
(1)
(2)
(3)
Tamb (°C)
–75 17512525 75–25
006aac676
1.0
0.5
1.5
2.0
Ptot
(W)
0.0
(1)
(2)
(3)
(4)
(5)
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 6 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air
BCP68 [1] --192K/W
[2] --125K/W
[3] --93K/W
BC868 [1] --250K/W
[2] --132K/W
[3] --93K/W
BC68PA [1] --298K/W
[2] --151K/W
[3] --114K/W
[4] --154K/W
[5] --76K/W
Rth(j-sp) thermal resistance from
junction to solder poi nt
BCP68 - - 16 K/W
BC868 - - 16 K/W
BC68PA - - 20 K/W
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 7 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junc tio n to ambient as a function of pul se duration for SOT223;
typical values
FR4 PCB, mounting pad for collector 1 cm2
Fig 5. Transient thermal impedance from junc tio n to ambient as a function of pul se duration for SOT223;
typical values
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 8 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
FR4 PCB, mounting pad for collector 6 cm2
Fig 6. Transient thermal impedance from junc tio n to ambient as a function of pul se duration for SOT223;
typical values
FR4 PCB, standard footprint
Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;
typical values
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 9 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
FR4 PCB, mounting pad for collector 1 cm2
Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;
typical values
FR4 PCB, mounting pad for collector 6 cm2
Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;
typical values
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 10 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
FR4 PCB, single-sided copper, standard footprint
Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
FR4 PCB, single-sided copper, mounting pad for collector 1 cm2
Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 11 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
FR4 PCB, single-sided copper, mounting pad for collector 6 cm2
Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
FR4 PCB, 4-layer copper, standard footprint
Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 12 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2
Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 13 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
7. Characteristics
[1] Pulse test: tp300 s; = 0.02.
Table 8. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base cut-off
current VCB =25V; I
E= 0 A - - 100 nA
VCB =25V; I
E=0A;
Tj= 150 C--10A
IEBO emitter-base cut-of f
current VEB =5V; I
C= 0 A - - 100 nA
hFE DC current gain VCE =10V
IC=5mA 50 - -
DC curren t ga in VCE =1V
IC=500mA [1] 85 - 375
IC=1 A [1] 60 - -
IC=2 A [1] 40 - -
DC curren t ga in VCE =1V
hFE selection -25 IC=500mA [1] 160 - 375
VCEsat collector-emitter
saturation voltage IC=1A; I
B= 100 mA [1] --0.5V
IC=2A; I
B= 200 mA [1] --0.6V
VBE base-emitter vo ltage VCE =10V; I
C=5mA [1] --0.7V
VCE =1V; I
C=1A [1] --1V
Cccollector capacitance VCB =10V; I
E=i
e=0A;
f=1MHz -22-pF
fTtransition frequency VCE =5V; I
C=50mA;
f=100MHz 40 170 - MHz
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 14 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
VCE =1V
(1) Tamb = 100 C
(2) Tamb =25C
(3) Tamb =55 C
Tamb =25C
Fig 15. DC current gain as a function of collector
current; typical values Fig 16. Collector current as a function of
collector-emitter voltage; typical values
VCE =1V
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 100 C
IC/IB=10
(1) Tamb = 100 C
(2) Tamb =25C
(3) Tamb =55 C
Fig 17. Ba se-emitter voltage as a function of collector
current; typical values Fig 18. Collector- em itter saturatio n voltage as a
function of collector current; typical values
006aac694
200
100
300
400
hFE
0
IC (A)
10–4 10110–3 10–1
10–2
(1)
(2)
(3)
VCE (V)
054231
006aac710
0.8
1.6
2.4
IC
(A)
0.0
IB (mA) = 10
9
87
65
4
3
2
1
006aac695
0.4
0.8
1.2
VBE
(V)
0
IC (A)
10–1 104
103
110
2
10
(1)
(2)
(3)
006aac696
10–1
10–2
1
VCEsat
(V)
10–3
IC (mA)
10–1 104
103
110
2
10
(1)
(2)
(3)
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 15 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
Fig 19. Package outline SOT223 (SC-73)
Fig 20. Package outline SOT89 (SC-62/TO-243)
04-11-10Dimensions in mm
6.7
6.3
3.1
2.9
1.8
1.5
7.3
6.7 3.7
3.3
1.1
0.7
132
4
4.6
2.3 0.8
0.6 0.32
0.22
06-08-29Dimensions in mm
4.6
4.4
1.8
1.4
1.6
1.4
1.2
0.8
3
1.5 0.48
0.35 0.44
0.23
0.53
0.40
2.6
2.4 4.25
3.75
123
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 16 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] Valid for all available selection groups.
[3] T1: normal taping
[4] T3: 90 rotated taping
Fig 21. Package outline SOT1061 (HUSON3)
09-11-12Dimensions in mm
0.65
max
2.1
1.9
1.6
1.4
0.35
0.25 0.45
0.35
2.1
1.9
1.1
0.9
0.3
0.2
1.05
0.95
1.3
2
3
1
Table 9. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type
number[2] Package Description Packing quantity
1000 3000 4000
BCP68 SOT223 8 mm pitch, 12 mm tape and reel -115 - -135
BC868 SOT89 8 mm pitch, 12 mm tape and reel; T1 [3] -115 - -135
8 mm pitch, 12 mm tape and reel; T3 [4] -146 - -
BC68PA SOT1061 4 mm pitch, 8 mm tape and reel - -115 -
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 17 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
11. Soldering
Fig 22. Reflow soldering footprint SOT223 (SC-73)
Fig 23. Wave soldering footprint SOT223 (SC-73)
sot223_fr
1.2
(4×)
1.2
(3×)
1.3
(4×)
1.3
(3×)
6.15
7
3.85
3.6
3.5
0.3
3.9 7.65
2.3 2.3
6.1
4
231
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
sot223_fw
1.9
6.7
8.9
8.7
1.9
(3×)
1.9
(2×)
1.1
6.2
2.7 2.7
2
4
31
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 18 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243)
Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243)
solder lands
solder resist
occupied area
solder paste
sot089_fr
1.2
1.9
2
2.25
4.75
1
(3×)
0.7
(3×)
0.6
(3×)
1.1
(2×)
1.2
0.85 0.2
0.5
1.7
4.85
3.95
4.6
1.51.5
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot089_fw
0.7
5.3
6.6
2.4
3.5
0.5
1.8
(2×)
1.5
(2×)
7.6
1.9 1.9
Dimensions in mm
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 19 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
Reflow soldering is the only recommended soldering method.
Fig 26. Reflow soldering footprint SOT1061 (HUSON3)
occupied area
solder paste = solder lands Dimensions in mm
sot1061_fr
solder resist
0.4
2.1
1.3
0.25
0.25 0.25
1.1 1.2
0.55
0.6
2.3
0.5 (2×)
0.5 (2×) 0.6 (2×)
0.4 (2×)
0.5
1.6
1.7
1.05
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 20 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BCP68_BC868_BC68PA v.8 20111018 Product data sheet - BC868 v.7
BCP68 v.4
Modifications: •The format of this document has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Type number BC68PA added
•Section 1 “Product profile”: updated
•Section 2 “Pinning informa tion”: updated
•Section 3 “Ordering information”: updated
•Section 4 “Marking”: updated
•Section 8 “Test information”: added
•Section 9 “Package outline”: updated
•Section 10 “Packing information”: added
•Section 11 “Soldering”: added
•Table 6, 7 and 8: updated according to latest measurements
•Figure 1, 2, 6, 8, 15 to 18: updated
•Figure 3, 4, 5, 7, 9, 10 to 13: added
BC868 v.7 200 41108 Product specification - BC868 v.6
BC868 v.6 200 31202 Product specification - BC868 v.5
BC868 v.5 199 90408 Product specification - BC868 v.4
BC868 v.4 19980716 Product specification - BC868_CNV v.3
BC868_CNV v.3 19970319 Product specification - BC868_CNV v.2
BC868_CNV v. 2 199703 07 Product specification - -
BCP68 v. 4 20031125 Product specification - BCP68 v.3
BCP68 v. 3 19990408 Product specification - BCP68_CNV v.2
BCP68_CNV v.2 19970409 Product specification - -
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Product data sheet Rev. 8 — 18 October 2011 21 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
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Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
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Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
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customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
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Limited warr a nty and liability — Information in this document is believed to
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Notwithstanding any damages that customer might incur for any reason
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changes to information published in this document, including without
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Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyri ghts, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objecti ve specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011 22 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristi cs sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 October 2011
Document identifier: BCP68_BC868_BC68PA
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 6
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . 15
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 15
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
10 Packing information . . . . . . . . . . . . . . . . . . . . 16
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
14 Contact information. . . . . . . . . . . . . . . . . . . . . 22
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23