DAC8718
DAC8718
ControlLogic
An ogal Monit ro
ToDAC-0,DAC-1,
DAC-2,DAC-3
ToDAC-0,DAC-1,
DAC-2,DAC-3
ToDAC-4,DAC-5,DAC-6,DAC-7
DAC8718
OFFSET-B
AGND-B
V -7
OUT
VMON
OFFSET-A
AGND-A
REF-B
Reference
BufferB
InternalTrimming
Zero/Gain;INL
Reference
BufferA
OFFSET
DACA
OFFSET
DACB
DAC-0
Latch-0
Power-Up/
Power-Down
Control
(SameFunctionBlocks
forAllChannels)
REF-A
LDAC
RST
RSTSEL
LDAC
CLR
USB/BTC
AIN-0
AIN-1
GPIO-0
GPIO-1
GPIO-2
SDO
SDI
CS
SCLK
WAKEUP
SPIShiftRegister
IOVDD DGND DVDD AVDD AVSS
DGND DVDD AVDD AVSS
V -0
OUT
V -7
OUT
AIN-0
AIN-1
RefBufferA
RefBufferB
OFFSET-B
Mux
Command
Registers
InputData
Register0
Correction
Engine
(WhenCorrectionEngineDisabled)
DAC-0
Data
UserCalibration:
ZeroRegister0
GainRegsiter0
V -0
OUT
DAC8718
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
Octal, 16-Bit, Low-Power, High-Voltage Output, Serial Input
DIGITAL-TO-ANALOG CONVERTER
Check for Samples: DAC8718
1FEATURES DESCRIPTION
2345• Bipolar Output: ±2V to ±16.5V The DAC8718 is a low-power, octal, 16-bit
digital-to-analog converter (DAC). With a 5V
• Unipolar Output: 0V to +33V reference, the output can either be a bipolar ±15V
• 16-Bit Resolution voltage when operating from dual ±15.5V (or higher)
• Low Power: 14.4mW/Ch (Bipolar Supply) power supplies, or a unipolar 0V to +30V voltage
• Relative Accuracy: 4 LSB Max when operating from a +30.5V (or higher) power
supply. With a 5.5V reference, the output can either
• Low Zero/Full-Scale Error be a bipolar ±16.5V voltage when operating from dual
– Before User Calibration: ±10 LSB Max ±17V (or higher) power supplies, or a unipolar 0V to
– After User Calibration: ±1 LSB +33V voltage when operating from a +33.5V (or
higher) power supply. This DAC provides low-power
• Flexible System Calibration operation, good linearity, and low glitch over the
• Low Glitch: 4nV-s specified temperature range of –40°C to +105°C. This
• Settling Time: 15μsdevice is trimmed in manufacturing and has very low
zero-code and gain error. In addition, system level
• Channel Monitor Output calibration can be performed to achieve ±1 LSB
• Programmable Gain: x4/x6 bipolar zero/full-scale error with bipolar supplies, or
• Programmable Offset ±1 LSB zero code/full-scale error with a unipolar
supply, over the entire signal chain. The output range
• SPI™: Up to 50MHz, 1.8V/3V/5V Logic can be offset by using the DAC offset register.
• Schmitt Trigger Inputs The DAC8718 features a standard, high-speed serial
• Daisy-Chain with Sleep Mode Enhancement peripheral interface (SPI) that operates at up to
• Packages: QFN-48 (7x7mm), TQFP-64 50MHz and is 1.8V, 3V, and 5V logic compatible, to
(10x10mm) communicate with a DSP or microprocessor. The
input data of the device are double-buffered. An
APPLICATIONS asynchronous load input (LDAC) transfers data from
• Automatic Test Equipment the DAC data register to the DAC latch. The
asynchronous CLR input sets the output of all eight
• PLC and Industrial Process Control DACs to AGND. The VMON pin is a monitor output
• Communications that connects to the individual analog outputs, the
offset DAC, the reference buffer outputs, and two
external inputs through a multiplexer (mux).
The DAC8718 is pin-to-pin and function-compatible
with the DAC8218 (14-bit) and the DAC7718 (12-bit).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2DSP is a trademark of Texas Instruments.
3SPI, QSPI are trademarks of Motorola Inc.
4Microwire is a trademark of National Semiconductor.
5All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
RELATIVE DIFFERENTIAL SPECIFIED
ACCURACY LINEARITY PACKAGE- PACKAGE TEMPERATURE PACKAGE
PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING
±4 ±1 QFN-48 RGZ –40°C to +105°C DAC8718
DAC8718 ±4 ±1 TQFP-64 PAG –40°C to +105°C DAC8718
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted). DAC8718 UNIT
AVDD to AVSS –0.3 to 38 V
AVDD to AGND –0.3 to 38 V
AVSS to AGND, DGND –19 to 0.3 V
DVDD to DGND –0.3 to 6 V
IOVDD to DGND –0.3 to min of (6 or DVDD + 0.3) V
AGND-x to DGND –0.3 to 0.3 V
Digital input voltage to DGND –0.3 to IOVDD + 0.3 V
SDO to DGND –0.3 to IOVDD + 0.3 V
VOUT-x, VMON, AIN-x to AVSS –0.3 to AVDD + 0.3 V
REF-A, REF-B to AGND –0.3 to DVDD V
GPIO-n to DGND –0.3 to IOVDD + 0.3 V
GPIO-n input current 5 mA
Maximum current from VMON 3 mA
Operating temperature range –40 to +105 °C
Storage temperature range –65 to +150 °C
Maximum junction temperature (TJmax) +150 °C
Human body model (HBM) 2.5 kV
ESD ratings Charged device model (CDM) 1000 V
Machine model (MM) 200 V
TQFP 55 °C/W
Junction-to-ambient, θJA QFN 27.5 °C/W
Thermal impedance TQFP 21 °C/W
Junction-to-case, θJC QFN 10.8 °C/W
Power dissipation (TJmax – TA) / θJA W
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
ELECTRICAL CHARACTERISTICS: Dual-Supply
All specifications at TA= TMIN to TMAX, AVDD = +16.5V, AVSS = –16.5V, IOVDD = DVDD = +5V, REF-A and REF-B = +5V,
gain = 6, AGND-x = DGND = 0V, data format = straight binary, and Offset DAC A and Offset DAC B are at default values(1),
unless otherwise noted. DAC8718
PARAMETER CONDITIONS MIN TYP MAX UNIT
STATIC PERFORMANCE(2)
Resolution 16 Bits
Linearity error Measured by line passing through codes 0000h and FFFFh ±4 LSB
Differential linearity error Measured by line passing through codes 0000h and FFFFh ±1 LSB
TA= +25°C, before user calibration, gain = 6, code = 8000h ±10 LSB
Bipolar zero error TA= +25°C, before user calibration, gain = 4, code = 8000h ±15 LSB
TA= +25°C, after user calib., gain = 4 or 6, code = 8000h ±1 LSB
Bipolar zero error TC Gain = 4 or 6, code = 8000h ±0.5 ±2 ppm FSR/°C
TA= +25°C, gain = 6, code = 0000h ±10 LSB
Zero-code error TA= +25°C, gain = 4, code = 0000h ±15 LSB
Zero-code error TC Gain = 4 or 6, code = 0000h ±0.5 ±3 ppm FSR/°C
TA= +25°C, gain = 6 ±10 LSB
Gain error TA= +25°C, gain = 4 ±15 LSB
Gain error TC Gain = 4 or 6 ±1 ±3 ppm FSR/°C
TA= +25°C, before user calibration, gain = 6, code = FFFFh ±10 LSB
Full-scale error TA= +25°C, before user calibration, gain = 4, code = FFFFh ±15 LSB
TA= +25°C, after user calib., gain = 4 or 6, code = FFFFh ±1 LSB
Full-scale error TC Gain = 4 or 6, code = FFFFh ±0.5 ±3 ppm FSR/°C
Measured channel at code = 8000h, full-scale change on any
DC crosstalk(3) 0.2 LSB
other channel
(1) Offset DAC A and Offset DAC B are trimmed in manufacturing to minimize the error for symmetrical output. The default value may vary
no more than ±10 LSB from the nominal number listed in Table 7. The Offset DAC pins are not intended to drive an external load, and
must not be connected during dual-supply operation.
(2) Gain = 4 and TC specified by design and characterization.
(3) The DAC outputs are buffered by op amps that share common AVDD and AVSS power supplies. DC crosstalk indicates how much dc
change in one or more channel outputs may occur when the dc load current changes in one channel (because of an update). With
high-impedance loads, the effect is virtually immeasurable. Multiple AVDD and AVSS terminals are provided to minimize dc crosstalk.
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ELECTRICAL CHARACTERISTICS: Dual-Supply (continued)
All specifications at TA= TMIN to TMAX, AVDD = +16.5V, AVSS = –16.5V, IOVDD = DVDD = +5V, REF-A and REF-B = +5V,
gain = 6, AGND-x = DGND = 0V, data format = straight binary, and Offset DAC A and Offset DAC B are at default values (1),
unless otherwise noted. DAC8718
PARAMETER CONDITIONS MIN TYP MAX UNIT
ANALOG OUTPUT (VOUT-0 to VOUT-7)(4)
VREF = +5V –15 +15 V
Voltage output(5) VREF = +1.5V –4.5 +4.5 V
Output impedance Code = 8000h 0.5 Ω
Short-circuit current(6) ±8 mA
Load current See Figure 37 ±3 mA
TA= +25°C, device operating for 500 hours, full-scale output 3.4 ppm of FSR
Output drift vs time TA= +25°C, device operating for 1000 hours, full-scale output 4.3 ppm of FSR
Capacitive load stability 500 pF
To 0.03% of FSR, CL= 200pF, RL= 10kΩ, code from 0000h 10 μs
to FFFFh and FFFFh to 0000h
To 1 LSB, CL= 200pF, RL= 10kΩ, code from 0000h to
Settling time 15 μs
FFFFh and FFFFh to 0000h
To 1 LSB, CL= 200pF, RL= 10kΩ, code from 7F00h to 6μs
8100h and 8100h to 7F00h
Slew rate (7) 6 V/μs
Power-on delay(8) From IOVDD ≥+1.8V and DVDD ≥+2.7V to CS low 200 μs
Power-down recovery time 60 μs
Digital-to-analog glitch(9) Code from 7FFFh to 8000h and 8000h to 7FFFh 4 nV-s
Glitch impulse peak amplitude Code from 7FFFh to 8000h and 8000h to 7FFFh 5 mV
Channel-to-channel isolation(10) VREF = 4VPP, f = 1kHz 88 dB
DACs in the same group 7.5 nV-s
DAC-to-DAC crosstalk(11) DACs among different groups 1 nV-s
Digital crosstalk(12) 1 nV-s
Digital feedthrough(13) 1 nV-s
TA= +25°C at 10kHz, gain = 6 200 nV/√Hz
Output noise TA= +25°C at 10kHz, gain = 4 130 nV/√Hz
0.1Hz to 10Hz, gain = 6 20 μVPP
Power-supply rejection(14) AVDD = ±15.5V to ±16.5V 0.05 LSB
(4) Specified by design.
(5) The analog output range of VOUT-0 to VOUT-7 is equal to (6 × VREF – 5 × OUTPUT_OFFSET_DAC) for gain = 6. The maximum value of
the analog output must not be greater than (AVDD – 0.5V), and the minimum value must not be less than (AVSS + 0.5V). All
specifications are for a ±16.5V power supply and a ±15V output, unless otherwise noted.
(6) When the output current is greater than the specification, the current is clamped at the specified maximum value.
(7) Slew rate is measured from 10% to 90% of the transition when the output changes from 0 to full-scale.
(8) Power-on delay is defined as the time from when the supply voltages reach the specified conditions to when CS goes low, for valid
digital communication.
(9) Digital-to-analog glitch is defined as the amount of energy injected into the analog output at the major code transition. It is specified as
the area of the glitch in nV-s. It is measured by toggling the DAC register data between 7FFFh and 8000h in straight binary format.
(10) Channel-to-channel isolation refers to the ratio of the signal amplitude at the output of one DAC channel to the amplitude of the
sinusoidal signal on the reference input of another DAC channel. It is expressed in dB and measured at midscale.
(11) DAC-to-DAC crosstalk is the glitch impulse that appears at the output of one DAC as a result of both the full-scale digital code and
subsequent analog output change at another DAC. It is measured with LDAC tied low and expressed in nV-s.
(12) Digital crosstalk is the glitch impulse transferred to the output of one converter as a result of a full-scale code change in the DAC input
register of another converter. It is measured when the DAC output is not updated, and is expressed in nV-s.
(13) Digital feedthrough is the glitch impulse injected to the output of a DAC as a result of a digital code change in the DAC input register of
the same DAC. It is measured with the full-scale digital code change without updating the DAC output, and is expressed in nV-s.
(14) The output must not be greater than (AVDD – 0.5V) and not less than (AVSS + 0.5V).
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
ELECTRICAL CHARACTERISTICS: Dual-Supply (continued)
All specifications at TA= TMIN to TMAX, AVDD = +16.5V, AVSS = –16.5V, IOVDD = DVDD = +5V, REF-A and REF-B = +5V,
gain = 6, AGND-x = DGND = 0V, data format = straight binary, and Offset DAC A and Offset DAC B are at default values (1),
unless otherwise noted. DAC8718
PARAMETER CONDITIONS MIN TYP MAX UNIT
OFFSET DAC OUTPUT(15) (16)
Voltage output VREF = +5V 0 5 V
Full-scale error TA= +25°C ±4 LSB
Zero-code error TA= +25°C ±2 LSB
Linearity error ±6 LSB
Differential linearity error ±1 LSB
ANALOG MONITOR PIN (VMON)
Output impedance(17) TA= +25°C 2 kΩ
Three-state leakage current 100 nA
AUXILIARY ANALOG INPUT
Input range AVSS AVDD V
Input impedance TA= +25°C 2 kΩ
(AIN-x to VMON)
Input capacitance(15) 4 pF
Input leakage current 30 nA
REFERENCE INPUT
Reference input voltage range(18) 1.0 5.5 V
Reference input dc impedance 10 MΩ
Reference input capacitance(15) 10 pF
DIGITAL INPUT(15)
IOVDD = +4.5V to +5.5V 3.8 0.3 + IOVDD V
High-level input voltage, VIH IOVDD = +2.7V to +3.3V 2.3 0.3 + IOVDD V
IOVDD = +1.7V to 2.0V 1.5 0.3 + IOVDD V
IOVDD = +4.5V to +5.5V –0.3 0.8 V
Low-level input voltage, VIL IOVDD = +2.7V to +3.3V –0.3 0.6 V
IOVDD = +1.7V to 2.0V –0.3 0.3 V
CLR, LDAC, RST, CS, and SDI ±1 μA
Input current USB/BTC, RSTSEL, and GPIO-n ±5 μA
CLR, LDAC, RST, CS, and SDI 5 pF
Input capacitance USB/BTC and RSTSEL 12 pF
GPIO-n 14 pF
DIGITAL OUTPUT(15)
IOVDD = +2.7V to +5.5V, sourcing 1mA IOVDD – 0.4 IOVDD V
High-level output voltage, VOH
(SDO) IOVDD = +1.8V, sourcing 200μA 1.6 IOVDD V
IOVDD = +2.7V to +5.5V, sinking 1mA 0 0.4 V
Low-level output voltage, VOL
(SDO) IOVDD = +1.8V, sinking 200μA 0 0.2 V
GPIO-n output voltage low, VOL 1mA sink from IOVDD 0.15 V
GPIO-n output voltage high, VOH 10kΩpull-up resistor to IOVDD 0.99 × IOVDD V
High-impedance leakage current SDO and GPIO-n ±5 μA
SDO 5 pF
High-impedance output
capacitance GPIO-n 14 pF
(15) Specified by design.
(16) Offset DAC A and Offset DAC B are trimmed in manufacturing to minimize the error for symmetrical output. The default value may vary
no more than ±10 LSB from the nominal number listed in Table 7. The Offset DAC pins are not intended to drive an external load, and
must not be connected during dual-supply operation.
(17) 8kΩwhen VMON is connected to Reference Buffer A or B, and 4kΩwhen VMON is connected to Offset DAC-A or -B.
(18) Reference input voltage ≤DVDD.
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
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ELECTRICAL CHARACTERISTICS: Dual-Supply (continued)
All specifications at TA= TMIN to TMAX, AVDD = +16.5V, AVSS = –16.5V, IOVDD = DVDD = +5V, REF-A and REF-B = +5V,
gain = 6, AGND-x = DGND = 0V, data format = straight binary, and Offset DAC A and Offset DAC B are at default values (1),
unless otherwise noted. DAC8718
PARAMETER CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
AVDD +4.5 +18 V
AVSS –18 –4.5 V
DVDD +2.7 +5.5 V
IOVDD(19) +1.8 +5.5 V
Normal operation, midscale code, output unloaded 4.3 6 mA
AIDD Power down, output unloaded 35 μA
Normal operation, midscale code, output unloaded –4 –2.7 mA
AISS Power down, output unloaded 35 μA
Normal operation 78 μA
DIDD Power down 36 μA
Normal operation, VIH = IOVDD, VIL = DGND 5 μA
IOIDD Power down, VIH = IOVDD, VIL = DGND 5 μA
Power dissipation Normal operation, ±16.5V supplies, midscale code 115 165 mW
TEMPERATURE RANGE
Specified performance –40 +105 °C
(19) IOVDD ≤DVDD.
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
ELECTRICAL CHARACTERISTICS: Single-Supply
All specifications at TA= TMIN to TMAX, AVDD = +32V, AVSS = 0V, IOVDD = DVDD = +5V, REF-A and REF-B = +5V, gain = 6,
AGND-x = DGND = 0V, data format = straight binary, and OFFSET-A = OFFSET-B = AGND, unless otherwise noted.
DAC8718
PARAMETER CONDITIONS MIN TYP MAX UNIT
STATIC PERFORMANCE(1)
Resolution 16 Bits
Linearity error Measured by line passing through codes 0100h and FFFFh ±4 LSB
Differential linearity error Measured by line passing through codes 0100h and FFFFh ±1 LSB
TA= +25°C, before user calibration, gain = 6, code = 0100h ±10 LSB
Unipolar zero error TA= +25°C, before user calibration, gain = 4, code = 0100h ±15 LSB
TA= +25°C, after user calib., gain = 4 or 6, code = 0100h ±1 LSB
Unipolar zero error TC Gain = 4 or 6, code = 0100h ±0.5 ±3 ppm FSR/°C
TA= +25°C, gain = 6 ±10 LSB
Gain error TA= +25°C, gain = 4 ±15 LSB
Gain error TC Gain = 4 or 6 ±1 ±3 ppm FSR/°C
TA= +25°C, before user calibration, gain = 6, code = FFFFh ±10 LSB
Full-scale error TA= +25°C, before user calibration, gain = 4, code = FFFFh ±15 LSB
TA= +25°C, after user calib., gain = 4 or 6, code = FFFFh ±1 LSB
Full-scale error TC Gain = 4 or 6, code = FFFFh ±0.5 ±3 ppm FSR/°C
Measured channel at code = 8000h, full-scale change on any
DC crosstalk(2) 0.2 LSB
other channel
ANALOG OUTPUT (VOUT-0 to VOUT-7)(3)
VREF = +5V 0 +30 V
Voltage output(4) VREF = +1.5V 0 +9 V
Output impedance Code = 8000h 0.5 Ω
Short-circuit current(5) ±8 mA
Load current See Figure 84 and Figure 85 ±3 mA
TA= +25°C, device operating for 500 hours, full-scale output 3.4 ppm of FSR
Output drift vs time TA= +25°C, device operating for 1000 hours, full-scale output 4.3 ppm of FSR
Capacitive load stability 500 pF
To 0.03% of FSR, CL= 200pF, RL= 10kΩ, code from 0100h to 10 μs
FFFFh and FFFFh to 0100h
To 1 LSB, CL= 200pF, RL= 10kΩ, code from 0100h to FFFFh
Settling time 15 μs
and FFFFh to 0100h
To 1 LSB, CL= 200pF, RL= 10kΩ, code from 7F00h to 8100h 6μs
and 8100h to 7F00h
Slew rate(6) 6 V/μs
Power-on delay(7) From IOVDD ≥+1.8V and DVDD ≥+2.7V to CS low 200 μs
Power-down recovery time 90 μs
Digital-to-analog glitch(8) Code from 7FFFh to 8000h and 8000h to 7FFFh 4 nV-s
Glitch impulse peak amplitude Code from 7FFFh to 8000h and 8000h to 7FFFh 5 mV
Channel-to-channel isolation(9) VREF = 4VPP, f = 1kHz 88 dB
(1) Gain = 4 and TC specified by design and characterization.
(2) The DAC outputs are buffered by op amps that share common AVDD and AVSS power supplies. DC crosstalk indicates how much dc
change in one or more channel outputs may occur when the dc load current changes in one channel (because of an update). With
high-impedance loads, the effect is virtually immeasurable. Multiple AVDD and AVSS terminals are provided to minimize dc crosstalk.
(3) Specified by design.
(4) The analog output range of VOUT-0 to VOUT-7 is equal to (6 × VREF) for gain = 6. The maximum value of the analog output must not be
greater than (AVDD – 0.5V). All specifications are for a +32V power supply and a 0V to +30V output, unless otherwise noted.
(5) When the output current is greater than the specification, the current is clamped at the specified maximum value.
(6) Slew rate is measured from 10% to 90% of the transition when the output changes from 0 to full-scale.
(7) Power-on delay is defined as the time from when the supply voltages reach the specified conditions to when CS goes low, for valid
digital communication.
(8) Digital-to-analog glitch is defined as the amount of energy injected into the analog output at the major code transition. It is specified as
the area of the glitch in nV-s. It is measured by toggling the DAC register data between 7FFFh and 8000h in straight binary format.
(9) Channel-to-channel isolation refers to the ratio of the signal amplitude at the output of one DAC channel to the amplitude of the
sinusoidal signal on the reference input of another DAC channel. It is expressed in dB and measured at midscale.
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ELECTRICAL CHARACTERISTICS: Single-Supply (continued)
All specifications at TA= TMIN to TMAX, AVDD = +32V, AVSS = 0V, IOVDD = DVDD = +5V, REF-A and REF-B = +5V, gain = 6,
AGND-x = DGND = 0V, data format = straight binary, and OFFSET-A = OFFSET-B = AGND, unless otherwise noted.
DAC8718
PARAMETER CONDITIONS MIN TYP MAX UNIT
DACs in the same group 10 nV-s
DAC-to-DAC crosstalk(10) DACs among different groups 1 nV-s
Digital crosstalk(11) 1 nV-s
Digital feedthrough(12) 1 nV-s
TA= +25°C at 10kHz, gain = 6 200 nV/√Hz
Output noise TA= +25°C at 10kHz, gain = 4 130 nV/√Hz
0.1Hz to 10Hz, gain = 6 20 μVPP
Power-supply rejection(13) AVDD = +33V to +36V 0.05 LSB
ANALOG MONITOR PIN (VMON)
Output impedance(14) TA= +25°C 2 kΩ
Three-state leakage current 100 nA
AUXILIARY ANALOG INPUT
Input range AVSS AVDD V
Input impedance TA= +25°C 2 kΩ
(AIN-x to VMON)
Input capacitance(15) 4 pF
Input leakage current 30 nA
REFERENCE INPUT
Reference input voltage 1.0 5.5 V
range(16)
Reference input dc impedance 10 MΩ
Reference input capacitance(15) 10 pF
DIGITAL INPUT(15)
IOVDD = +4.5V to +5.5V 3.8 0.3 + IOVDD V
High-level input voltage, VIH IOVDD = +2.7V to +3.3V 2.3 0.3 + IOVDD V
IOVDD = +1.7V to 2.0V 1.5 0.3 + IOVDD V
IOVDD = +4.5V to +5.5V –0.3 0.8 V
Low-level input voltage, VIL IOVDD = +2.7V to +3.3V –0.3 0.6 V
IOVDD = +1.7V to 2.0V –0.3 0.3 V
CLR, LDAC, RST, CS, and SDI ±1 μA
Input current USB/BTC, RSTSEL, and GPIO-n ±5 μA
CLR, LDAC, RST, CS, and SDI 5 pF
Input capacitance USB/BTC and RSTSEL 12 pF
GPIO-n 14 pF
(10) DAC-to-DAC crosstalk is the glitch impulse that appears at the output of one DAC as a result of both the full-scale digital code and
subsequent analog output change at another DAC. It is measured with LDAC tied low and expressed in nV-s.
(11) Digital crosstalk is the glitch impulse transferred to the output of one converter as a result of a full-scale code change in the DAC input
register of another converter. It is measured when the DAC output is not updated, and is expressed in nV-s.
(12) Digital feedthrough is the glitch impulse injected to the output of a DAC as a result of a digital code change in the DAC input register of
the same DAC. It is measured with the full-scale digital code change without updating the DAC output, and is expressed in nV-s.
(13) The analog output must not be greater than (AVDD – 0.5V).
(14) 8kΩwhen VMON is connected to Reference Buffer A or B, and 4kΩwhen VMON is connected to Offset DAC-A or -B.
(15) Specified by design.
(16) Reference input voltage ≤DVDD.
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
ELECTRICAL CHARACTERISTICS: Single-Supply (continued)
All specifications at TA= TMIN to TMAX, AVDD = +32V, AVSS = 0V, IOVDD = DVDD = +5V, REF-A and REF-B = +5V, gain = 6,
AGND-x = DGND = 0V, data format = straight binary, and OFFSET-A = OFFSET-B = AGND, unless otherwise noted.
DAC8718
PARAMETER CONDITIONS MIN TYP MAX UNIT
DIGITAL OUTPUT(17)
IOVDD = +2.7V to +5.5V, sourcing 1mA IOVDD – 0.4 IOVDD V
High-level output voltage, VOH
(SDO) IOVDD = +1.8V, sourcing 200μA 1.6 IOVDD V
IOVDD = +2.7V to +5.5V, sinking 1mA 0 0.4 V
Low-level output voltage, VOL
(SDO) IOVDD = +1.8V, sinking 200μA 0 0.2 V
GPIO-n output voltage low, VOL 1mA sink from IOVDD 0.15 V
GPIO-n output voltage high, VOH 10kΩpull-up resistor to IOVDD 0.99 × IOVDD V
High-impedance leakage current SDO and GPIO-n ±5 μA
SDO 5 pF
High-impedance output
capacitance GPIO-n 14 pF
POWER SUPPLY
AVDD +9 +36 V
DVDD +2.7 +5.5 V
IOVDD(18) +1.8 +5.5 V
Normal operation, midscale code, output unloaded 4.5 7 mA
AIDD Power down, output unloaded 35 µA
Normal operation 70 μA
DIDD Power down 36 μA
Normal operation, VIH = IOVDD, VIL = DGND 5 μA
IOIDD Power down, VIH = IOVDD, VIL = DGND 5 μA
Power dissipation Normal operation 140 225 mW
TEMPERATURE RANGE
Specified performance –40 +105 °C
(17) Specified by design.
(18) IOVDD ≤DVDD.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 9
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ControlLogic
An ogal Monit ro
ToDAC-0,DAC-1,
DAC-2,DAC-3
ToDAC-0,DAC-1,
DAC-2,DAC-3
ToDAC-4,DAC-5,DAC-6,DAC-7
DAC8718
OFFSET-B
AGND-B
V -7
OUT
VMON
OFFSET-A
AGND-A
REF-B
Reference
BufferB
InternalTrimming
Zero/Gain;INL
Reference
BufferA
OFFSET
DACA
OFFSET
DACB
DAC-0
Latch-0
Power-Up/
Power-Down
Control
(SameFunctionBlocks
forAllChannels)
REF-A
LDAC
RST
RSTSEL
LDAC
CLR
USB/BTC
AIN-0
AIN-1
GPIO-0
GPIO-1
GPIO-2
SDO
SDI
CS
SCLK
WAKEUP
SPIShiftRegister
IOVDD DGND DVDD AVDD AVSS
DGND DVDD AVDD AVSS
V -0
OUT
V -7
OUT
AIN-0
AIN-1
RefBufferA
RefBufferB
OFFSET-B
Mux
Command
Registers
InputData
Register0
Correction
Engine
(WhenCorrectionEngineDisabled)
DAC-0
Data
UserCalibration:
ZeroRegister0
GainRegsiter0
V -0
OUT
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
Figure 1. Functional Block Diagram
10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
AVDD
NC
AIN-1
V -4
OUT
REF-B
V -5
OUT
V -6
OUT
AGND-B
AGND-B
OFFSET-B
V -7
OUT
AVSS
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
AVDD
NC
AIN-0
V -3
OUT
REF-A
V -2
OUT
V -1
OUT
AGND-A
AGND-A
OFFSET-A
V -0
OUT
AVSS
NC
VMON
NC
NC
NC
WAKEUP
LDAC
SDO
NC
SDI
CS
SCLK
DVDD
IOVDD
DGND
NC
NC
RSTSEL
USB/BTC
NC
NC
NC
GPIO-2
CLR
RST
NC
NC
DVDD
DGND
NC
NC
DGND
GPIO-1
GPIO-0
NC
NC
64 63 62 61 60 59 58 57 56 55 54
17 18 19 20 21 22 23 24 25 26 27
53 52 51 50 49
28 29 30 31 32
DAC8718
AVDD
AIN-0
V -3
OUT
REF-A
V -2
OUT
V -1
OUT
AGND-A
AGND-A
OFFSET-A
V -0
OUT
AVSS
VMON
AVDD
AIN-1
V -4
OUT
REF-B
V -5
OUT
V -6
OUT
AGND-B
AGND-B
OFFSET-B
V -7
OUT
AVSS
NC
1
2
3
4
5
6
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
DAC8718
WAKEUP
LDAC
SDO
SDI
CS
SCLK
DVDD
IOVDD
DGND
NC
RSTSEL
USB/BTC
48
47
46
45
44
43
42
41
40
39
38
37
GPIO-2
CLR
RST
NC
DVDD
NC
NC
DGND
NC
DGND
GPIO-1
GPIO-0
13
14
15
16
17
18
19
20
21
22
23
24
DAC8718
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
PIN CONFIGURATIONS
PAG PACKAGE RGZ PACKAGE
TQFP-64 QFN-48
(TOP VIEW) (TOP VIEW)
(1) The thermal pad is internally connected to
the substrate. This pad can be connected
to AVSS or left floating. Keep the thermal
pad separate from the digital ground, if
possible.
PIN DESCRIPTIONS
PIN NO.
PIN
NAME QFN-48 TQFP-64 I/O DESCRIPTION
AVDD 1 1 I Positive analog power supply
AIN-0 2 3 I Auxiliary analog input 0, directly routed to the analog mux
VOUT-3 3 4 O DAC-3 output
REF-A 4 5 I Group A(1) reference input
VOUT-2 5 6 O DAC-2 output
VOUT-1 6 7 O DAC-1 output
AGND-A 7 8 I Group A analog ground and the ground of REF-A. This pin must be tied to AGND-B and DGND.
AGND-A 8 9 I Group A analog ground and the ground of REF-A. This pin must be tied to AGND-B and DGND.
OFFSET DAC-A analog output. Must be connected to AGND-A during single power-supply
OFFSET-A 9 10 O operation (AVSS = 0V). This pin is not intended to drive an external load.
VOUT-0 10 11 O DAC-0 output
AVSS 11 12 I Negative analog power supply
Analog monitor output. This pin is either in Hi-Z status, connected to one of the eight DAC outputs,
VMON 12 14 O reference buffer outputs, offset DAC outputs, or one of the auxiliary analog inputs, depending on
the content of the Monitor Register. See the Monitor Register, Table 12, for details.
General-purpose digital input/output 2. This pin is a bidirectional digital input/output, open-drain and
GPIO-2 13 19 I/O requires an external pull-up resistor. See the GPIO Pins section for details.
Clear input, level triggered. When the CLR pin is logic '0', all VOUT-X pins connect to AGND-x
CLR 14 20 I through switches and internal low-impedance. When the CLR pin is logic '1', all VOUT-X pins
connect to the amplifier outputs.
Reset input (active low). Logic low on this pin resets the DAC registers and DACs to the values
RST 15 21 I defined by the RSTSEL pin. CS must be logic high when RST is active.
(1) Group A consists of DAC-0, DAC-1, DAC-2, and DAC-3. Group B consists of DAC-4, DAC-5, DAC-6, and DAC-7.
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
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PIN DESCRIPTIONS (continued)
PIN NO.
PIN
NAME QFN-48 TQFP-64 I/O DESCRIPTION
DVDD 17 24 I Digital power supply
DGND 20 25 I Digital ground
DGND 22 28 I Digital ground
General-purpose digital input/output 1. This pin is a bidirectional digital input/output, open-drain and
GPIO-1 23 29 I/O requires an external resistor. See the GPIO Pins section for details.
General-purpose digital input/output 0. This pin is a bidirectional digital input/output, open-drain and
GPIO-0 24 30 I/O requires an external resistor. See the GPIO Pins section for details.
AVSS 26 37 I Negative analog power supply
VOUT-7 27 38 O DAC-7 output
OFFSET DAC-B analog output. Must be connected to AGND-B during single-supply operation
OFFSET-B 28 39 O (AVSS = 0V).
AGND-B 29 40 I Group B(1) analog ground and the ground of REF-B. This pin must be tied to AGND-A and DGND.
AGND-B 30 41 I Group B analog ground and the ground of REF-B. This pin must be tied to AGND-A and DGND.
VOUT-6 31 42 O DAC-6 output
VOUT-5 32 43 O DAC-5 output
REF-B 33 44 I Group B reference input
VOUT-4 34 45 O DAC-4 output
AIN-1 35 46 I Auxiliary analog input 1, directly routed to the analog mux
AVDD 36 48 I Positive analog power supply
Data format selection of Input DAC data and Offset DAC data. Data are in straight binary format
USB/BTC 37 50 I when connected to DGND or in twos complement format when connected to IOVDD. The command
data are always in straight binary format. Refer to Input Data Format section for details.
Output reset selection. Selects the output voltage on the VOUT pin after power-on or hardware reset.
RSTSEL 38 51 I Refer to the Power-On Reset section for details.
DGND 40 54 I Digital ground
IOVDD 41 55 I Interface power
DVDD 42 56 I Digital power supply
SCLK 43 57 I SPI bus serial clock input
SPI bus chip select input (active low). Data are not clocked into SDI unless CS is low. When CS is
CS 44 58 I high, SDO is in a high-impedance state and the SCLK and SDI signals are blocked from the device.
SDI 45 59 I SPI bus serial data input
SPI bus serial data output.
When the DSDO bit = '0', the SDO pin works as an output in normal operation.
SDO 46 61 O When the DSDO bit = '1', SDO is always in a Hi-Z state, regardless of the CS pin status. Refer to
the Timing Diagrams section for details.
Load DAC latch control input (active low). When LDAC is low, the DAC latch is transparent and the
contents of the DAC Data Register are transferred to it. The DAC output changes to the
corresponding level simultaneously when the DAC latch is updated. See the Updating the DAC
LDAC 47 62 I Outputs section for details. If asynchronous mode is desired, LDAC must be permanently tied low
before power is applied to the device. If synchronous mode is desired, LDAC must be logic high
during power-on.
Wake-up input (active low). Restores the SPI from sleep to normal operation. See the Daisy-Chain
WAKEUP 48 63 I Operation section for details.
2, 13,
15-18, 22,
16, 18, 19, 23, 26, 27,
NC — Not connected
21, 25, 39 31-36, 47,
49, 52, 53,
60, 64
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t8
CS
SCLK
InputDataRegisterand
DACLatchUpdated
WhenCorrectionCompletes(1)
DACLatchUpdated(2)
SDI
BIT23(MSB)
BIT23(MSB) BIT22 BIT1
Low
BIT0
LDAC
Ifthecorrectionengineisoff,theDAClatchisreloadedimmediatelyaftertheDACDataRegisterisupdated.NOTE:(1)
TheDAClatchisupdatedwhen goeslow,aslongasthetimingrequirementoft issatisfied.
9
LDAC
NOTE:(2)
t4
t1
t2t5t6
t7
Case1:Standalonemode:Updatewithout pin; tiedtologiclowLDAC LDAC pin .
t8
CS
SCLK
InputDataRegisterUpdated,
butDACLatchisNot Updated
SDI BIT22 BIT1
High
BIT0
LDAC
t4
t1
t2
t5t6
t7
t9
Case2:Standalonemode:Updatewith pin.LDAC
t10
=Don’tCare Bit23=MSB
Bit0=LSB
t3
t3
DAC8718
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
TIMING DIAGRAMS
Figure 2. SPI Timing for Standalone Mode
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t8
CS
SCLK
SDI BIT23(N) BIT22(N) BIT0(N) BIT23(N+1)
BIT23(N) BIT0(N)
Low
BIT0(N+1)
SDO
LDAC
Ifthecorrectionengineisoff,theDAClatchisreloadedimmediatelyaftertheDACDataRegisterisupdated.NOTE:(1)
TheDAClatchisupdatedwhen goeslow.Theproperdataareloadedifthet timingrequirementissatisfied.
Otherwise,invaliddataareloaded.
9
LDAC
NOTE:(2)
t4
t1
t2t5t6
t7
Case3:Daisy-ChainMode:Updatewithout pin; pintiedtologiclow.LDAC LDAC
High
LDAC
t9t10
=Don’tCare Bit23=MSB
Bit0=LSB
t11
t8
CS
SCLK
InputDataRegisterUpdated,
butDACLatchisNotUpdated
SDI BIT23(N) BIT22(N) BIT0(N) BIT23(N+1)
BIT23(N) BIT0(N)
BIT0(N+1)
SDO
t4
t1
t2
t5t6
t7
Case4:Daisy-ChainMode:Updatewith pin.LDAC
t11
t14
DACLatchUpdated(2)
InputDataRegisterand
DACLatchUpdated
WhenCorrectionCompletes(1)
DB23 DB0
Case5:Daisy-ChainMode:Sleeping.
CS
SCLK
SDI
FirstWord LastWord
DB23 DB0
DB23 DB0
SDO DB23 DB0
t12
t12
Hi-Z
Hi-Z Hi-Z Hi-Z
Hi-Z Hi-Z
t13
t13
t3
t3
Hi-Z
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TIMING DIAGRAMS (continued)
Figure 3. SPI Timing for Daisy-Chain Mode
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Case6:ReadbackforStandalonemode.
t8t4
t1
t2
t7
t6
BIT23(=1) BIT22
InputWordSpecifiesRegistertobeRead NOPCommand(write ‘1’ toNOPbit)
DatafromtheSelectedRegister
BIT0
BIT23
BIT23(=1)
BIT22
BIT22
BIT1
BIT1
BIT0
BIT0
InternalRegisterUpdated
CS
SCLK
SDI
SDO
LDAC Low
t13 t11
=Don’tCare Bit23=MSB
Bit0=LSB
Hi-Z Hi-Z Hi-Z
t3
t5
DAC8718
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
TIMING DIAGRAMS (continued)
Figure 4. SPI Timing for Readback Operation in Standalone Mode
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 15
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DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TIMING CHARACTERISTICS: IOVDD = +5V(1)(2)(3)(4)
At –40°C to +105°C, DVDD = +5V, and IOVDD = +5V, unless otherwise noted.
PARAMETER MIN MAX UNIT
fSCLK Clock frequency 50 MHz
t1SCLK cycle time 20 ns
t2SCLK high time 10 ns
t3SCLK low time 7 ns
t4CS falling edge to SCLK falling edge setup time 8 ns
t5SDI setup time before falling edge of SCLK 5 ns
t6SDI hold time after falling edge of SCLK 5 ns
t7SCLK falling edge to CS rising edge 5 ns
t8CS high time 10 ns
t9CS rising edge to LDAC falling edge 5 ns
t10 LDAC pulse duration 10 ns
t11 Delay from SCLK rising edge to SDO valid 3 8 ns
t12 Delay from CS rising edge to SDO Hi-Z 5 ns
t13 Delay from CS falling edge to SDO valid 6 ns
t14 SDI to SDO delay during sleep mode 2 5 ns
(1) Specified by design. Not production tested.
(2) Sample tested during the initial release and after any redesign or process changes that may affect these parameters.
(3) All input signals are specified with tR= tF= 2ns (10% to 90% of IOVDD) and timed from a voltage level of IOVDD/2.
(4) SDO loaded with 10Ωseries resistance and 10pF load capacitance for SDO timing specifications, with tR= tF≤5ns.
BLANKSPACE
TIMING CHARACTERISTICS: IOVDD = +3V(1)(2)(3)(4)
At –40°C to +105°C, DVDD = +3V/+5V, and IOVDD = +3V, unless otherwise noted.
PARAMETER MIN MAX UNIT
fSCLK Clock frequency 25 MHz
t1SCLK cycle time 40 ns
t2SCLK high time 19 ns
t3SCLK low time 7 ns
t4CS falling edge to SCLK falling edge setup time 15 ns
t5SDI setup time before falling edge of SCLK 5 ns
t6SDI hold time after falling edge of SCLK 5 ns
t7SCLK falling edge to CS rising edge 10 ns
t8CS high time 19 ns
t9CS rising edge to LDAC falling edge 5 ns
t10 LDAC pulse duration 10 ns
t11 Delay from SCLK rising edge to SDO valid 3 15 ns
t12 Delay from CS rising edge to SDO Hi-Z 7 ns
t13 Delay from CS falling edge to SDO valid 10 ns
t14 SDI to SDO delay during sleep mode 2 10 ns
(1) Specified by design. Not production tested.
(2) Sample tested during the initial release and after any redesign or process changes that may affect these parameters.
(3) All input signals are specified with tR= tF= 3ns (10% to 90% of IOVDD) and timed from a voltage level of IOVDD/2.
(4) SDO loaded with 10Ωseries resistance and 10pF load capacitance for SDO timing specifications, with tR= tF≤5ns.
16 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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DAC8718
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
TIMING CHARACTERISTICS: IOVDD = +1.8V(1)(2)(3)(4)
At –40°C to +105°C, DVDD = +3V/+5V, and IOVDD = +1.8V, unless otherwise noted.
PARAMETER MIN MAX UNIT
fSCLK Clock frequency 16.6 MHz
t1SCLK cycle time 60 ns
t2SCLK high time 28 ns
t3SCLK low time 7 ns
t4CS falling edge to SCLK falling edge setup time 28 ns
t5SDI setup time before falling edge of SCLK 10 ns
t6SDI hold time after falling edge of SCLK 5 ns
t7SCLK falling edge to CS rising edge 10 ns
t8CS high time 28 ns
t9CS rising edge to LDAC falling edge 5 ns
t10 LDAC pulse duration 10 ns
t11 Delay from SCLK rising edge to SDO valid 3 25 ns
t12 Delay from CS rising edge to SDO Hi-Z 15 ns
t13 Delay from CS falling edge to SDO valid 23 ns
t14 SDI to SDO delay during sleep mode 2 25 ns
(1) Specified by design. Not production tested.
(2) Sample tested during the initial release and after any redesign or process changes that may affect these parameters.
(3) All input signals are specified with tR= tF= 6ns (10% to 90% of IOVDD) and timed from a voltage level of IOVDD/2.
(4) SDO loaded with 10Ωseries resistance and 10pF load capacitance for SDO timing specifications, with tR= tF≤15ns.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): DAC8718
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
AllEightChannelsShown
8192
0
65536573444915240960327682457616384
DigitalInputCode
AllEightChannelsShown
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
Gain=4
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
Gain=4
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Bipolar
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (All 8 Channels) vs DIGITAL INPUT CODE (All 8 Channels)
Figure 5. Figure 6.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C) vs DIGITAL INPUT CODE (+25°C)
Figure 7. Figure 8.
18 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
TYPICAL CHARACTERISTICS: Bipolar (continued)
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C) vs DIGITAL INPUT CODE (–40°C)
Figure 9. Figure 10.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C) vs DIGITAL INPUT CODE (+25°C)
Figure 11. Figure 12.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C) vs DIGITAL INPUT CODE (+105°C)
Figure 13. Figure 14.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): DAC8718
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
1.0
-
-
-
-
-
DNLError(LSB)
-55 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature(°C)
DNLMin
DNLMax
-55 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature(°C)
Gain=4
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
1.0
-
-
-
-
-
DNLError(LSB)
DNLMax
DNLMin
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
1.0 5.55.04.54.03.53.01.5 2.0
V (V)
REF
INLMax
AVDD =+18V
AV = -
SS 18V
INLMin
2.5
1.0 5.55.04.54.03.53.01.5 2.0
V (V)
REF
2.5
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
AVDD =+18V
AV = -
SS 18V
DNLMax
DNLMin
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Bipolar (continued)
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 15. Figure 16.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 17. Figure 18.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs REFERENCE VOLTAGE vs REFERENCE VOLTAGE
Figure 19. Figure 20.
20 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0 16.5 18.0
AV = AV (V)-
DD SS
INLMax
DVDD =IOVDD =4.5V
V =2.048V
REF
Gain=4
INLMin
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0 16.5 18.0
AV =
DD SS
-AV (V)
DNLMax
DVDD DD
=IOV =4.5V
V =2.048V
REF
Gain=4
DNLMin
5
4
3
2
1
0
-1
-2
-3
-4
-5
BipolarZeroError(mV)
4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0 16.5 18.0
A VV = A (V)-
DD SS
DV =IOV =4.5V
DD DD
V =2.048V
REF
Gain=4
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
5
4
3
2
1
0
-1
-2
-3
-4
-5
BipolarGainError(mV)
4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0 16.5 18.0
AV = AV (V)
DD SS
-
DVDD =IOVDD =4.5V
V =2.048V
REF
Gain=4
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
5
4
3
2
1
0
-1
-2
-3
-4
-5
BipolarZeroError(mV)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
AVDD =+18V
AV = -
SS 18V
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
5
4
3
2
1
0
-1
-2
-3
-4
-5
BipolarZeroError(mV)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
AVDD =+18V
AV = -
SS 18V
Gain=4
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
TYPICAL CHARACTERISTICS: Bipolar (continued)
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs AVDD AND AVSS vs AVDD AND AVSS
Figure 21. Figure 22.
BIPOLAR ZERO ERROR BIPOLAR GAIN ERROR
vs AVDD AND AVSS vs AVDD AND AVSS
Figure 23. Figure 24.
BIPOLAR ZERO ERROR BIPOLAR ZERO ERROR
vs REFERENCE VOLTAGE vs REFERENCE VOLTAGE
Figure 25. Figure 26.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Link(s): DAC8718
5
4
3
2
1
0
-1
-2
-3
-4
-5
BipolarGainError(mV)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
AVDD =+18V
AV = -
SS 18V
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
5
4
3
2
1
0
-1
-2
-3
-4
-5
BipolarGainError(mV)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
AVDD =+18V
AV = -
SS 18V
Gain=4
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Bipolar (continued)
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
BIPOLAR GAIN ERROR BIPOLAR GAIN ERROR
vs REFERENCE VOLTAGE vs REFERENCE VOLTAGE
Figure 27. Figure 28.
BIPOLAR ZERO ERROR BIPOLAR ZERO ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 29. Figure 30.
BIPOLAR GAIN ERROR BIPOLAR GAIN ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 31. Figure 32.
22 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
8
7
6
5
4
3
2
1
0
AnalogPower-SupplyCurrent(mA)
-55 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature(°C)
IAVDD
-IAVSS
8
7
6
5
4
3
2
1
0
AnalogPower-SupplyCurrent(mA)
-IAVSS
IAVDD
1.0 5.55.04.54.03.53.01.5 2.0
V (V)
REF
2.5
AllDACsLoadedwithMidscaleCode
AVDD =+18V
A =VSS -18V
250
200
150
100
50
0
DigitalPower-SupplyCurrent( A)m
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
LogicInputVoltage(V)
SweepFrom
5.5Vto0V
SweepFrom
0Vto5.5V
OneDigitalInputSwept,AllOthersatGNDorIOVDD
DV (mV)
OUT
-15 -9-3 3 9-12 -6 0 6 12 15
CurrentOutputI (mA)
OUT
6
5
4
3
2
1
0
1
2
3
4
5
-
-
-
-
-
-
6
FFFFh
C000h
8000h
4000h
0000h
2000
1800
1600
1400
1200
1000
800
600
400
200
0
Noise(nV/ )ÖHz
1 100k10k1k10010
Frequency(Hz)
DACLoadedwithMidscaleCode
Gain=6
Gain=4
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
TYPICAL CHARACTERISTICS: Bipolar (continued)
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
ANALOG POWER-SUPPLY CURRENT ANALOG POWER-SUPPLY CURRENT
vs TEMPERATURE vs REFERENCE VOLTAGE
Figure 33. Figure 34.
ANALOG POWER-SUPPLY CURRENT DIGITAL POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE vs LOGIC INPUT VOLTAGE
Figure 35. Figure 36.
DELTA OUTPUT VOLTAGE DAC OUTPUT NOISE DENSITY
vs SOURCE AND SINK CURRENTS vs FREQUENCY
Figure 37. Figure 38.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Link(s): DAC8718
Time(10 s/div)m
1LSB/div
5V/div
5V/div
TriggerPulse: LDAC
FromCode:0000h
ToCode:
Load:10k ||240pF
FFFFh
W
Small-SignalError
Large-SignalVOUT
Time(10 s/div)m
1LSB/div
5V/div
TriggerPulse: LDAC
FromCode:FFFFh
ToCode:
Load:10k ||240pF
0000h
W
5V/div
Large-SignalVOUT
Small-SignalError
Time(10 s/div)m
1LSB/div
5V/div
FromCode:4000h
ToCode:
Load:10k ||240pF
C000h
W
5V/div
Large-SignalVOUT
Small-SignalError
TriggerPulse: LDAC
Time(10 s/div)m
1LSB/div
5V/div
FromCode:C000h
ToCode:
Load:10k ||240pF
4000h
W
5V/div
TriggerPulse: LDAC
Large-SignalVOUT
Small-SignalError
Time(2 s/div)m
V (1mV/div)
OUT
GlitchImpulse
TriggerPulse5V/div
FromCode:7FFFh
ToCode:
Channel0asExample
8000h
Load:10k ||200pFW
Time(2 s/div)m
V (1mV/div)
OUT
FromCode:8000h
ToCode:
Channel0asExample
Load:10k ||200pF
7FFFh
W
TriggerPulse5V/div
GlitchImpulse
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Bipolar (continued)
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
SETTLING TIME SETTLING TIME
–15V TO +15V TRANSITION +15V TO –15V TRANSITION
Figure 39. Figure 40.
SETTLING TIME SETTLING TIME
1/4 TO 3/4 FULL-SCALE TRANSITION 3/4 TO 1/4 FULL-SCALE TRANSITION
Figure 41. Figure 42.
GLITCH ENERGY GLITCH ENERGY
1 LSB STEP, RISING EDGE 1 LSB STEP, FALLING EDGE
Figure 43. Figure 44.
24 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10
BipolarZeroError(LSB)
40
35
30
25
20
15
10
5
0
Population(%)
-15
-13
-11
-9
-7
-5
-3
-1
1
3
5
7
9
11
13
15
BipolarZeroError(LSB)
Gain=4
60
55
50
45
40
35
30
25
20
15
10
5
0
Population(%)
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10
BipolarGainError(LSB)
25
20
15
10
5
0
Population(%)
-15
-13
-11
-9
-7
-5
-3
-1
1
3
5
7
9
11
13
15
BipolarGainError(LSB)
Gain=4
25
20
15
10
5
0
Population(%)
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
AI (mA)
DD
30
25
20
15
10
5
0
Population(%)
-4.0
-3.6
-3.2
-2.8
-2.4
-2.0
-1.6
-1.2
-0.8
AI (mA)
SS
45
40
35
30
25
20
15
10
5
0
Population(%)
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
TYPICAL CHARACTERISTICS: Bipolar (continued)
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
BIPOLAR ZERO ERROR BIPOLAR ZERO ERROR
HISTOGRAM HISTOGRAM
Figure 45. Figure 46.
BIPOLAR GAIN ERROR BIPOLAR GAIN ERROR
HISTOGRAM HISTOGRAM
Figure 47. Figure 48.
NEGATIVE ANALOG POWER SUPPLY POSITIVE ANALOG POWER SUPPLY
HISTOGRAM HISTOGRAM
Figure 49. Figure 50.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 25
Product Folder Link(s): DAC8718
Time(2 s/div)m
DACCode=8000h
NoLoad
Gain=6
Channel0asExample
V (5 V/div)m
OUT
Time(2 s/div)m
DACCode=8000h
NoLoad
Gain=4
Channel0asExample
V (5 V/div)m
OUT
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Bipolar (continued)
At TA= 25°C, AVDD = 16.5V, AVSS = –16.5V, VREF = IOVDD = DVDD = 5V, gain = 6, data format=USB, unless otherwise noted.
DAC OUTPUT NOISE DAC OUTPUT NOISE
0.1Hz TO 10Hz 0.1Hz TO 10Hz
Figure 51. Figure 52.
26 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
AllEightChannelsShown
8192
0
65536573444915240960327682457616384
DigitalInputCode
AllEightChannelsShown
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
Gain=4
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
Gain=4
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
TYPICAL CHARACTERISTICS: Unipolar
At TA= 25°C, AVDD = 32V, AVSS = 0V, VREF = 5V, IOVDD = DVDD = 5V, gain=6, and data format=USB, unless otherwise noted.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (All 8 Channels) vs DIGITAL INPUT CODE (All 8 Channels)
Figure 53. Figure 54.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C) vs DIGITAL INPUT CODE (+25°C)
Figure 55. Figure 56.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 27
Product Folder Link(s): DAC8718
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
8192
0
65536573444915240960327682457616384
DigitalInputCode
TypicalChannelShown
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Unipolar (continued)
At TA= 25°C, AVDD = 32V, AVSS = 0V, VREF = 5V, IOVDD = DVDD = 5V, gain=6, and data format=USB, unless otherwise noted.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C) vs DIGITAL INPUT CODE (–40°C)
Figure 57. Figure 58.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C) vs DIGITAL INPUT CODE (+25°C)
Figure 59. Figure 60.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C) vs DIGITAL INPUT CODE (+105°C)
Figure 61. Figure 62.
28 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
DNLError(LSB)
-55 -40 -25 -10 520 35 50 65 80 95 110 125
Temperature(°C)
DNLMin
DNLMax
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
1.0
-
-
-
-
-
DNLError(LSB)
-55 -40 -25 -10 520 35 50 65 80 95 110 125
Temperature(°C)
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
1.0
-
-
-
-
-
DNLMin
DNLMax
Gain=4
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
1.0 5.55.04.54.03.53.01.5 2.0
V (V)
REF
2.5
AVDD =+36V
DNLMax
DNLMin
4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
1.0 5.55.04.54.03.53.01.5 2.0
V (V)
REF
2.5
INLMax
INLMin
AVDD =+36V
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
TYPICAL CHARACTERISTICS: Unipolar (continued)
At TA= 25°C, AVDD = 32V, AVSS = 0V, VREF = 5V, IOVDD = DVDD = 5V, gain=6, and data format=USB, unless otherwise noted.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 63. Figure 64.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 65. Figure 66.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs REFERENCE VOLTAGE vs REFERENCE VOLTAGE
Figure 67. Figure 68.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 29
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4
3
2
1
0
-1
-2
-3
-4
INLError(LSB)
9 12 15 18 21 24 27 30 33 36
AV (V)
DD
INLMax
INLMin
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
DNLError(LSB)
9 12 15 18 21 24 27 30 33 36
AV (V)
DD
DNLMax
DNLMin
5
4
3
2
1
0
-1
-2
-3
-4
-5
Zero-ScaleError(mV)
9 12 15 18 21 24 27 30 33 36
+AV (V)
DD
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
AllDACSLoadedwith0100h
Gain=4
V =2.048V
REF
5
4
3
2
1
0
-1
-2
-3
-4
-5
UnipolarGainError(mV)
9 12 15 18 21 24 27 30 33 36
+AV (V)
DD
DVDD =IOVDD =4.5V
V =2.048V
REF
Gain=4
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
5
4
3
2
1
0
-1
-2
-3
-4
-5
Zero-ScaleError(mV)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
AllDACSLoadedwith0100h
AV =+36V
DD
5
4
3
2
1
0
-1
-2
-3
-4
-5
Zero-ScaleError(mV)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
AllDACSLoadedwith0100h
Gain=4
AV =+36V
DD
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Unipolar (continued)
At TA= 25°C, AVDD = 32V, AVSS = 0V, VREF = 5V, IOVDD = DVDD = 5V, gain=6, and data format=USB, unless otherwise noted.
LINEARITY ERROR DIFFERENTIAL LINEARITY ERROR
vs ANALOG SUPPLY VOLTAGE vs ANALOG SUPPLY VOLTAGE
Figure 69. Figure 70.
ZERO-SCALE ERROR UNIPOLAR GAIN ERROR
vs ANALOG SUPPLY VOLTAGE vs ANALOG SUPPLY VOLTAGE
Figure 71. Figure 72.
ZERO-SCALE ERROR ZERO-SCALE ERROR
vs REFERENCE VOLTAGE vs REFERENCE VOLTAGE
Figure 73. Figure 74.
30 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
5
4
3
2
1
0
-1
-2
-3
-4
-5
UnipolarGainError(mV)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
AVDD =+36V
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
5
4
3
2
1
0
-1
-2
-3
-4
-5
UnipolarGainError(mV)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
AVDD =+36V
Gain=4
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
UnipolarGainError(mV)
-55 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature(°C)
5
4
3
2
1
0
1
2
3
4
5
-
-
-
-
-
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
UnipolarGainError(mV)
-55 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature(°C)
5
4
3
2
1
0
1
2
3
4
5
-
-
-
-
-
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
Gain=4
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
TYPICAL CHARACTERISTICS: Unipolar (continued)
At TA= 25°C, AVDD = 32V, AVSS = 0V, VREF = 5V, IOVDD = DVDD = 5V, gain=6, and data format=USB, unless otherwise noted.
UNIPOLAR GAIN ERROR UNIPOLAR GAIN ERROR
vs REFERENCE VOLTAGE vs REFERENCE VOLTAGE
Figure 75. Figure 76.
ZERO-SCALE ERROR ZERO-SCALE ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 77. Figure 78.
UNIPOLAR GAIN ERROR UNIPOLAR GAIN ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 79. Figure 80.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 31
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8
7
6
5
4
3
2
1
0
AnalogPower-SupplyCurrent(mA)
-55 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature(°C)
8
7
6
5
4
3
2
1
0
AnalogPower-SupplyCurrent(mA)
1.51.0 5.55.04.54.03.53.02.52.0
V (V)
REF
IAVDD
AllDACsLoadedwithMidscaleCode
AVDD =+36V
8
7
6
5
4
3
2
1
0
AnalogPower-SupplyCurrent(mA)
8192
0
65536573444915240960327682457616384
DigitalInputCode
AllDACsLoadedwithSameCode
IAVDD
30.5
30.0
29.5
29.0
28.5
28.0
27.5
OutputVoltageV (V)
OUT
0 3 6 9 12 15
I (mA)
SOURCE
FFFFh
FF00h
FE00h
FC00h
F800h
2.5
2.0
1.5
1.0
0.5
0
OutputVoltageV (V)
OUT
-15 -12 -9-6-3 0
I (mA)
SINK
0000h
0100h
0200h
0400h
0800h
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Unipolar (continued)
At TA= 25°C, AVDD = 32V, AVSS = 0V, VREF = 5V, IOVDD = DVDD = 5V, gain=6, and data format=USB, unless otherwise noted.
ANALOG POWER-SUPPLY CURRENT ANALOG POWER-SUPPLY CURRENT
vs TEMPERATURE vs REFERENCE VOLTAGE
Figure 81. Figure 82.
ANALOG POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
Figure 83.
OUTPUT VOLTAGE OUTPUT VOLTAGE
vs SOURCE CURRENT CAPABILITY vs SINK CURRENT CAPABILITY
Figure 84. Figure 85.
32 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
Time(10 s/div)m
1LSB/div
5V/div
5V/div
TriggerPulse: LDAC
FromCode:0100h
ToCode:
Load:10k ||240pF
FFFFh
W
Large-SignalVOUT
Small-SignalError
Time(10 s/div)m
1LSB/div
5V/div 5V/div
TriggerPulse: LDAC
FromCode:FFFFh
ToCode:
Load:10k ||240pF
0100h
W
Large-SignalVOUT
Small-SignalError
Time(10 s/div)m
1LSB/div
5V/div
FromCode:4000h
ToCode:
Load:10k ||240pF
C000h
W
5V/div
TriggerPulse: LDAC
Large-SignalVOUT
Small-SignalError
Time(10 s/div)m
1LSB/div
5V/div
FromCode:C000h
ToCode:
Load:10k ||240pF
4000h
W
5V/div
TriggerPulse: LDAC
Large-SignalVOUT
Small-SignalError
Time(2 s/div)m
V (1mV/div)
OUT
TriggerPulse5V/div
GlitchImpulse FromCode:7FFFh
ToCode:
Channel0asExample
8000h
Load:10k ||200pFW
Time(2 s/div)m
V (1mV/div)
OUT
GlitchImpulse
TriggerPulse5V/div
FromCode:8000h
ToCode:
Channel0asExample
7FFFh
Load:10k ||200pFW
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
TYPICAL CHARACTERISTICS: Unipolar (continued)
At TA= 25°C, AVDD = 32V, AVSS = 0V, VREF = 5V, IOVDD = DVDD = 5V, gain=6, and data format=USB, unless otherwise noted.
SETTLING TIME SETTLING TIME
0V TO 30V TRANSITION 30V TO 0V TRANSITION
Figure 86. Figure 87.
SETTLING TIME SETTLING TIME
1/4 TO 3/4 TRANSITION 3/4 TO 1/4 TRANSITION
Figure 88. Figure 89.
GLITCH ENERGY GLITCH ENERGY
1 LSB STEP, RISING EDGE 1 LSB STEP, FALLING EDGE
Figure 90. Figure 91.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 33
Product Folder Link(s): DAC8718
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10
Zero-ScaleError(LSB)
45
40
35
30
25
20
15
10
5
0
Population(%)
Code=0100h
-15
-13
-11
-9
-7
-5
-3
-1
1
3
5
7
9
11
13
15
Zero-ScaleError(LSB)
45
40
35
30
25
20
15
10
5
0
Population(%)
Code=0100h
Gain=4
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10
UnipolarGainError(LSB)
25
20
15
10
5
0
Population(%)
-15
-13
-11
-9
-7
-5
-3
-1
1
3
5
7
9
11
13
15
UnipolarGainError(LSB)
Gain=4
25
20
15
10
5
0
Population(%)
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
AI (mA)
DD
30
25
20
15
10
5
0
Population(%)
DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS: Unipolar (continued)
At TA= 25°C, AVDD = 32V, AVSS = 0V, VREF = 5V, IOVDD = DVDD = 5V, gain=6, and data format=USB, unless otherwise noted.
ZERO-SCALE ERROR ZERO-SCALE ERROR
HISTOGRAM HISTOGRAM
Figure 92. Figure 93.
UNIPOLAR GAIN ERROR UNIPOLAR GAIN ERROR
HISTOGRAM HISTOGRAM
Figure 94. Figure 95.
ANALOG POWER-SUPPLY CURRENT
HISTOGRAM
Figure 96.
34 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
REF-x
R
R
R
R
ToOutput
Amplifier
R
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
THEORY OF OPERATION
GENERAL DESCRIPTION
The DAC8718 contains eight DAC channels and eight output amplifiers in a single package. Each channel
consists of a resistor-string DAC followed by an output buffer amplifier. The resistor-string section is simply a
string of resistors, each with a value of R, from REF-x to AGND, as shown in Figure 97. This type of architecture
provides DAC monotonicity. The 16-bit binary digital code loaded to the DAC latch determines at which node on
the string the voltage is tapped off before being fed into the output amplifier. The output amplifier multiplies the
DAC output voltage by a gain of six or four. Using a gain of 6 and power supplies allowing for at least 0.5V
headroom, the output span is 9V with a 1.5V reference, 18V with a 3V reference, and 30V with a 5V reference.
Figure 97. Resistor String
CHANNEL GROUPS
The eight DAC channels and two Offset DACs are arranged into two groups (A and B) with four channels and
one Offset DAC per group. Group A consists of DAC-0, DAC-1, DAC-2, DAC-3, and Offset DAC-A. Group B
consists of DAC-4, DAC-5, DAC-6, DAC-7, and Offset DAC-B. Group A derives its reference voltage from
REF-A, and Group B derives its reference voltage from REF-B.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 35
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DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
USER-CALIBRATION FOR ZERO-CODE ERROR AND GAIN ERROR
The DAC8718 implements a digital user-calibration function that allows for trimming gain and zero errors on the
entire signal chain. This function can eliminate the need for external adjustment circuits. Each DAC channel has
a Zero Register and Gain Register. Using the correction engine, the data from the Input Data Register are
operated on by a digital adder and multiplier controlled by the contents of the Zero and Gain registers,
respectively. The calibrated DAC data are then stored in the DAC Data Register where they are finally
transferred into the DAC latch and set the DAC output. Each time the data are written to the Input Data Register
(or to the Gain or Zero registers), the data in the Input Data Register are corrected, and the results automatically
transferred to the DAC Data Register.
The range of the gain adjustment coefficient is 0.5 to 1.5. The range of the zero adjustment is –32768 LSB to
+32767 LSB, or ±50% of full scale.
There is only one correction engine in the DAC8718, which is shared among all channels.
If the user-calibration function is not needed, the correction engine can be turned off. Setting the SCE bit in the
Configuration Register to '0' turns off the correction engine. Setting SCE to '1' enables the correction engine.
When SCE = '0', the data are directly transferred to the DAC Data Register. In this case, writing to the Gain
Register or Zero Register updates the Gain and Zero registers but does not start a math engine calculation.
Reading these registers returns the written values.
36 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
V =
OUT V Gain
REF ´ ´ INPUT_CODE
65536
´OFFSETDAC_CODE
65536
V (Gain 1)- ´ -
REF
V =
OUT V Gain
REF ´ ´ DAC_DATA_CODE
65536
´OFFSETDAC_CODE
65536
V (Gain 1)- ´ -
REF
DAC_DATA_CODE =INPUT_CODE (USER_GAIN+215
´)
216 +USER_ZERO
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
ANALOG OUTPUTS (VOUT-0 to VOUT-7, with reference to the ground of REF-x)
When the correction engine is off (SCE = '0'):
(1)
SPACE
When the correction engine is on (SCE = '1'):
(2)
SPACE
Where:
Gain = the DAC gain defined by the GAIN bit in the Configuration Register.
INPUT_CODE = data written into the Input Data Register (SCE = '1') or the DAC Data Register (SCE = '0').
OFFSETDAC_CODE = the data written into the Offset DAC Register.
USER_GAIN = the code of the Gain Register.
USER_ZERO = the code of the Zero Register.
For single-supply operation, the OFFSET-A pin must be connected to the AGND-A pin and the OFFSET-B pin
must be connected to the AGND-B pin through low-impedance connections (see the Layout section for details).
Offset DAC-A and Offset DAC-B are in a power-down state.
For dual-supply operation, the OFFSET-A and OFFSET-B default codes for a gain of 6 are 39322 with a ±10
LSB variation, depending on the linearity of the Offset DACs. The default code for a gain of 4 is 43691 with a ±10
LSB variation. The default codes of OFFSET-A and OFFSET-B are independently factory trimmed for both gains
of 6 and 4.
The power-on default value of the Gain Register is 32768, and the default value of the Zero Register is '0'. The
DAC input registers are set to a default value of 0000h.
Note that the maximum output voltage must not be greater than (AVDD – 0.5V) and the minimum output voltage
must not be less than (AVSS + 0.5V); otherwise, the output may be saturated.
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 37
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DAC8718
SBAS467A –MAY 2009–REVISED DECEMBER 2009
www.ti.com
INPUT DATA FORMAT
The USB/BTC pin defines the input data format and the Offset DAC format. When this pin is connected to
DGND, the Input DAC data and Offset DAC data are straight binary, as shown in Table 1 and Table 3. When this
pin is connected to IOVDD, the Input DAC data and Offset DAC data are in twos complement format, as shown in
Table 2 and Table 4.
Table 1. Bipolar Output vs Straight Binary Code Using Dual Power Supplies with Gain = 6
USB CODE NOMINAL OUTPUT DESCRIPTION
FFFFh +3 × VREF × (32767/32768) +Full-Scale – 1 LSB
••• ••• ••• ••• ••• •••
8001h +3 × VREF × (1/32768) +1 LSB
8000h 0 Zero
7FFFh –3 × VREF × (1/32768) –1 LSB
••• ••• ••• ••• ••• •••
0000h –3 × VREF × (32768/32768) –Full-Scale
Table 2. Bipolar Output vs Twos Complement Code Using Dual Power Supplies with Gain = 6
BTC CODE NOMINAL OUTPUT DESCRIPTION
7FFFh +3 × VREF × (32767/32768) +Full-Scale – 1 LSB
••• ••• ••• ••• ••• •••
0001h +3 × VREF × (1/32768) +1 LSB
0000h 0 Zero
FFFFh –3 × VREF × (1/32768) –1 LSB
••• ••• ••• ••• ••• •••
8000h –3 × VREF × (32768/32768) –Full-Scale
Table 3. Unipolar Output vs Straight Binary Code Using Single Power Supply with Gain = 6
USB CODE NOMINAL OUTPUT DESCRIPTION
FFFFh +6 × VREF × (65535/65536) +Full-Scale – 1 LSB
••• ••• ••• ••• ••• •••
8001h +6 × VREF × (32769/65536) Midscale + 1 LSB
8000h +6 × VREF × (32768/65536) Midscale
7FFFh +6 × VREF × (32767/65536) Midscale – 1 LSB
••• ••• ••• ••• ••• •••
0000h 0 0
Table 4. Unipolar Output vs Twos Complement Code Using Single Power Supply with Gain = 6
BTC CODE NOMINAL OUTPUT DESCRIPTION
7FFFh +6 × VREF × (65535/65536) +Full-Scale – 1 LSB
••• ••• ••• ••• ••• •••
0001h +6 × VREF × (32769/65536) Midscale + 1 LSB
0000h +6 × VREF × (32768/65536) Midscale
FFFFh +6 × VREF × (32767/65536) Midscale – 1 LSB
••• ••• ••• ••• ••• •••
8000h 0 0
The data written to the Gain Register are always in straight binary, data to the Zero Register are in twos
complement, and data to all other control registers are as specified in the definitions, regardless of the USB/BTC
pin status.
In reading operation, the read-back data are in the same format as written.
38 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
V = V (Gain 1)
OUT REF
- ´ - ´ OFFSETDAC_CODE
65536
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
OFFSET DACS
There are two 16-bit Offset DACs: one for Group A, and one for Group B. The Offset DACs allow the entire
output curve of the associated DAC groups to be shifted by introducing a programmable offset. This offset allows
for asymmetric bipolar operation of the DACs or unipolar operation with bipolar supplies. Thus, subject to the
limitations of headroom, it is possible to set the output range of Group A and/or Group B to be unipolar positive,
unipolar negative, symmetrical bipolar, or asymmetrical bipolar, as shown in Table 5 and Table 6. Increasing the
digital input codes for the offset DAC shifts the outputs of the associated channels in the negative direction. The
default codes for the Offset DACs in the DAC8718 are factory trimmed to provide optimal offset and gain
performance for the default output range and span of symmetric bipolar operation. When the output range is
adjusted by changing the value of the Offset DAC, an extra offset is introduced as a result of the linearity and
offset errors of the Offset DAC. Therefore, the actual shift in the output span may vary slightly from the ideal
calculations. For optimal offset and gain performance in the default symmetric bipolar operation, the Offset DAC
input codes should not be changed from the default power-on values. The maximum allowable offset depends on
the reference and the power supply. If INPUT_CODE from Equation 1 or DAC_DATA_CODE from Equation 2 is
set to 0, then these equations simplify to Equation 3:
(3)
This equation shows the transfer function of the Offset DAC to the output of the DAC channels. In any case, the
analog output must not go beyond the specified range shown in the Analog Outputs section. After power-on or
reset, the Offset DAC is set to the value defined by the selected data format and the selected analog output
voltage. If the DAC gain setting is changed, the offset DAC code is reset to the default value corresponding to
the new DAC gain setting. Refer to the Power-On Reset and Hardware Reset sections for details.
For single-supply operation (AVSS = 0V), the Offset DAC is turned off, and the output amplifier is in a Hi-Z state.
The OFFSET-x pin must be connected to the AGND-x pin through a low-impedance connection (see the Layout
section for details). For dual-supply operation, this pin provides the output of the Offset DAC. The OFFSET-x pin
is not intended to drive an external load. See Figure 98 for the internal Offset DAC and output amplifier
configuration.
Table 5. Example of Offset DAC Codes and Output Ranges with Gain = 6 and VREF = 5V
OFFSET DAC OFFSET DAC DAC CHANNELS MFS(1) DAC CHANNELS PFS(1)
CODE VOLTAGE VOLTAGE VOLTAGE
999Ah(2) 3.0V –15V +15V – 1 LSB
0000h 0V 0V +30V – 1 LSB
FFFFh ~5.0V –25V +5V – 1 LSB
6666h ~2.0V –10V +20V – 1 LSB
CCCDh ~4.0V –20V +10V – 1 LSB
(1) MFS = minus full-scale; PFS = plus full-scale.
(2) This is the default code for symmetric bipolar operation; actual codes may vary ±10 LSB. Codes are in straight binary format.
Table 6. Example of Offset DAC Codes and Output Ranges with Gain = 4 and VREF = 5V
OFFSET DAC OFFSET DAC DAC CHANNELS MFS(1) DAC CHANNELS PFS(1)
CODE VOLTAGE VOLTAGE VOLTAGE
AAABh(2) ~3.33333V –10V +10V – 1 LSB
0000h 0V 0V +20V – 1 LSB
FFFFh ~5.0V –15V +5V – 1 LSB
5555h ~1.666V –5V +15V – 1 LSB
8000h 2.5V –7.5V +12.5V – 1 LSB
D555h ~4.1666V –12.5V +7.5V – 1 LSB
(1) MFS = minus full-scale; PFS = plus full-scale.
(2) This is the default code for symmetric bipolar operation; actual codes may vary ±10 LSB. Codes are in straight binary format.
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DAC
Channel
Offset
DAC
V1
VOFF
AGND-x
VOUT
OFFSET
V =GAINxV (GAIN 1)xV- -
OUT 1 OFF
DAC8718
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Figure 98. Output Amplifier and Offset DAC
OUTPUT AMPLIFIERS
The output amplifiers can swing to 0.5V below the positive supply and 0.5V above the negative supply. This
condition limits how much the output can be offset for a given reference voltage. The maximum range of the
output for ±17V power and a +5.5V reference is –16.5V to +16.5V for gain = 6.
Each output amplifier is implemented with individual over-current protection. The amplifier is clamped at 8mA,
even if the output current goes over 8mA.
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BitGPIO-n(whenwriting)
BitGPIO-n(whenreading)
Enable
GPIO-n
+V
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
GENERAL-PURPOSE INPUT/OUTPUT PINS (GPIO-0 to GPIO-2)
The GPIO pins are general-purpose, bidirectional, digital input/outputs, as shown in Figure 99. When a GPIO pin
acts as an output, the pin status is determined by the corresponding GPIO bit in the GPIO Register. The pin
output is high-impedance when the GPIO bit is set to '1', and is logic low when the GPIO bit is cleared to '0'.
Note that a pull-up resistor to IOVDD is required when using a GPIO pin as an output. When a GPIO pin acts as
an input, the digital value on the pin is acquired by reading the corresponding GPIO bit. After power-on reset, or
any forced hardware or software reset, the GPIO bits are set to '1', and the GPIO pins are in a high-impedance
state. If not used, the GPIO pins must be tied to either DGND or to IOVDD through a pull-up resistor. Leaving the
GPIO pins floating can cause high IOVDD supply currents.
Figure 99. GPIO-n Pin
ANALOG OUTPUT PIN (CLR)
The CLR pin is an active low input that should be high for normal operation. When this pin is in logic '0', all VOUT
outputs connect to AGND-x through internal 15kΩresistors and are cleared to 0V, and the output buffer is in a
Hi-Z state. While CLR is low, all LDAC pulses are ignored. When CLR is taken high again while the LDAC is
high, the DAC outputs remain cleared until LDAC is taken low. However, if LDAC is tied low, taking CLR back to
high sets the DAC output to the level defined by the value of the DAC latch. The contents of the Zero Registers,
Gain Registers, Input Data Registers, DAC Data Registers, and DAC latches are not affected by taking CLR low.
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POWER-ON RESET
The DAC8718 contains a power-on reset circuit that controls the output during power-on and power down. This
feature is useful in applications where the known state of the DAC output during power-on is important. The
Offset DAC Registers, DAC Data Registers, and DAC latches are loaded with the value defined by the RSTSEL
pin, as shown in Table 7. The Gain Registers and Zero Registers are loaded with default values. The Input Data
Register is reset to 0000h, independent of the RSTSEL state.
Table 7. Bipolar Output Reset Values for Dual Power-Supply Operation
VALUE OF DAC VALUE OF OFFSET
DATA REGISTER DAC REGISTER
RSTSEL PIN USB/BTC PIN INPUT FORMAT AND DAC LATCH FOR GAIN = 6(1) VOUT
DGND DGND Straight Binary 0000h 999Ah –Full-Scale
IOVDD DGND Straight Binary 8000h 999Ah 0 V
DGND IOVDD Twos Complement 8000h 199Ah –Full-Scale
IOVDD IOVDD Twos Complement 0000h 199Ah 0 V
(1) Offset DAC A and Offset DAC B are trimmed in manufacturing to minimize the error for symmetrical output. The default value may vary
no more than ±10 LSB from the nominal number listed in this table.
In single-supply operation, the Offset DAC is turned off and the output is unipolar. The power-on reset is defined
as shown in Table 8.
Table 8. Unipolar Output Reset Values for Single Power-Supply Operation
VALUE OF DAC DATA
REGISTER AND DAC
RSTSEL PIN USB/BTC PIN INPUT FORMAT LATCH VOUT
DGND DGND Straight Binary 0000h 0 V
IOVDD DGND Straight Binary 8000h Midscale
DGND IOVDD Twos Complement 8000h 0 V
IOVDD IOVDD Twos Complement 0000h Midscale
HARDWARE RESET
When the RST pin is low, the device is in hardware reset. All the analog outputs (VOUT-0 to VOUT-7), the DAC
registers, and the DAC latches are set to the reset values defined by the RSTSEL pin as shown in Table 7 and
Table 8. In addition, the Gain and Zero Registers are loaded with default values, communication is disabled, and
the signals on CS and SDI are ignored (note that SDO is in a high-impedance state). The Input Data Register is
reset to 0000h, independent of the RSTSEL state. On the rising edge of RST, the analog outputs (VOUT-0 to
VOUT-7) maintain the reset value as defined by the RSTSEL pin until a new value is programmed. After RST
goes high, the serial interface returns to normal operation. CS must be set to a logic high whenever RST is used.
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UPDATING THE DAC OUTPUTS
Depending on the status of both CS and LDAC, and after data have been transferred into the DAC Data
registers, the DAC outputs can be updated either in asynchronous mode or synchronous mode. This update
mode is established at power-on. If asynchronous mode is desired, the LDAC pin must be permanently tied low
before power is applied to the device. If synchronous mode is desired, LDAC must be logic high before and
during power-on.
The DAC8718 updates a DAC latch only if it has been accessed since the last time LDAC was brought low or if
the LD bit is set to '1', thereby eliminating any unnecessary glitch. Any DAC channels that were not accessed are
not loaded again. When the DAC latch is updated, the corresponding output changes to the new level
immediately.
Asynchronous Mode
In this mode, the LDAC pin is set low at power-up. This action places the DAC8718 into Asynchronous mode,
and the LD bit and LDAC signal are ignored. When the correction engine is off (SCE bit = '0'), the DAC Data
Registers and DAC latches are updated immediately when CS goes high. When the correction engine is on (SCE
bit = '1'), each DAC latch is updated individually when the correction engine updates the corresponding DAC
Data Register.
Synchronous Mode
To use this mode, set LDAC high before CS goes low, and then take LDAC low or set the LD bit to '1' after CS
goes high. If LDAC goes low or if the LD bit is set to '1' when SCE = '0', all DAC latches are updated
simultaneously. If LDAC goes low or if the LD bit is set to '1' when SCE = '1', all DAC latches are updated
simultaneously after the correction engine has updated the corresponding DAC register.
In this mode, when LDAC stays high, the DAC latch is not updated; therefore, the DAC output does not change.
The DAC latch is updated by taking LDAC low (or by setting the LD bit in the Configuration Register to '1') any
time after the delay of t9from the rising edge of CS. If the timing requirement of t9is not satisfied, invalid data are
loaded. Refer to the Timing Diagrams and the Configuration Register (Table 11) for details.
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MONITOR OUTPUT PIN (VMON)
The VMON pin is the channel monitor output. It can be either high-impedance or monitor any one of the DAC
outputs, auxiliary analog inputs, offset DAC outputs, or reference buffer outputs. The channel monitor function
consists of an analog multiplexer addressed via the serial interface, allowing any channel output, reference buffer
output, auxiliary analog inputs, or offset DAC output to be routed to the VMON pin for monitoring using an external
ADC. The monitor function is controlled by the Monitor Register, which allows the monitor output to be enabled
or disabled. When disabled, the monitor output is high-impedance; therefore, several monitor outputs may be
connected in parallel with only one enabled at a time.
Note that the multiplexer is implemented as a series of analog switches. Care should be taken to ensure the
maximum current from the VMON pin must not be greater than the given specification because this could
conceivably cause a large amount of current to flow from the input of the multiplexer (that is, from VOUT-X) to the
output of the multiplexer (VMON). Refer to the Monitor Register section and Table 12 for more details.
ANALOG INPUT PINS (AIN-0 and AIN-1)
Pins AIN-0 and AIN-1 are two analog inputs that directly connect to the analog mux of the analog monitor output.
When AIN-0 or AIN-1 is accessed, it is routed via the mux to the VMON pin. Thus, one external ADC channel can
monitor eight DACs plus two extra external analog signals, AIN-0 and AIN-1.
POWER-DOWN MODE
The DAC8718 is implemented with a power-down function to reduce power consumption. Either the entire device
or each individual group can be put into power-down mode. If the proper power-down bit (PD-x) in the
Configuration Register is set to '1', the individual group is put into power down mode. During power-down mode,
the analog outputs (VOUT-0 to VOUT-7) connect to AGND-X through an internal 15kΩresistor, and the output
buffer is in Hi-Z status. When the entire device is in power-down, the bus interface remains active in order to
continue communication and receive commands from the host controller, but all other circuits are powered down.
The host controller can wake the device from power-down mode and return to normal operation by clearing the
PD-x bit; it takes 200μs or less for recovery to complete.
POWER-ON RESET SEQUENCING
The DAC8718 permanently latches the status of some of the digital pins at power-on. These digital levels should
be well-defined before or while the digital supply voltages are applied. Therefore, it is advised to have a pull up
resistor to IOVDD for the digital initialization pins (LDAC, CLR, RST, CS, and RSTSEL) to ensure that these levels
are set correctly while the digital supplies are raised.
For proper power-on initialization of the device, IOVDD and the digital pins must be applied before or at the same
time as DVDD. If possible, it is preferred that IOVDD and DVDD can be connected together in order to simplify the
supply sequencing requirements. Pull-up resistors should go to either supply. AVDD should be applied after the
digital supplies (IOVDD and DVDD) and digital initialization pins (LDAC, CLR, RST, CS, and RSTSEL). AVSS can
be applied at the same time as or after AVDD. The REF-x pins must be applied last.
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SERIAL INTERFACE
The DAC8718 is controlled over a versatile, three-wire serial interface that operates at clock rates of up to
50MHz and is compatible with SPI, QSPI™, Microwire™, and DSP™ standards.
SPI Shift Register
The SPI Shift Register is 24 bits wide. Data are loaded into the device MSB first as a 24-bit word under the
control of the serial clock input, SCLK. The SPI Shift Register consists of a read/write bit, five register address
bits, 16 data bits, and two reserve bits for future devices, as shown in Table 9. The falling edge of CS starts the
communication cycle. The data are latched into the SPI Shift Register on the falling edge of SCLK while CS is
low. When CS is high, the SCLK and SDI signals are blocked and the SDO pin is in a high-impedance state. The
contents of the SPI shifter register are decoded and transferred to the proper internal registers on the rising edge
of CS. The timing for this operation is shown in the Timing Diagrams section.
The serial interface works with both a continuous and non-continuous serial clock. A continuous SCLK source
can only be used if CS is held low for the correct number of clock cycles. In gated clock mode, a burst clock
containing the exact number of clock cycles must be used and CS must be taken high after the final clock in
order to latch the data.
The serial interface requires CS to be logic high during the power-on sequencing; therefore, it is advised to have
a pullup resistor to IOVDD on the CS pin. Refer to the Power-On Reset Sequencing section for further details.
Stand-Alone Operation
The serial clock can be a continuous or a gated clock. The first falling edge of CS starts the operation cycle.
Exactly 24 falling clock edges must be applied before CS is brought back high again. If CS is brought high before
the 24th falling SCLK edge, then the data written are not transferred into the internal registers. If more than 24
falling SCLK edges are applied before CS is brought high, then the last 24 bits are used. The device internal
registers are updated from the Shift Register on the rising edge of CS. In order for another serial transfer to take
place, CS must be brought low again.
When the data have been transferred into the chosen register of the addressed DAC, all DAC latches and analog
outputs can be updated by taking LDAC low.
Daisy-Chain Operation
For systems that contain more than one device, the SDO pin can be used to daisy-chain multiple devices
together. Daisy-chain operation can be useful in system diagnostics and in reducing the number of serial
interface lines. Note that before daisy-chain operation can begin, the SDO pin must be enabled by setting the
SDO disable bit (DSDO) in the Configuration Register to '0'; this bit is cleared by default.
The DAC8718 provides two modes for daisy-chain operation: normal and sleep. The SLEEP bit in the SPI Mode
register determines which mode is used.
In Normal mode (SLEEP bit = '0'), the data clocked into the SDI pin are transferred into the Shift Register. The
first falling edge of CS starts the operating cycle. SCLK is continuously applied to the SPI Shift Register when CS
is low. If more than 24 clock pulses are applied, the data ripple out of the Shift Register and appear on the SDO
line. These data are clocked out on the rising edge of SCLK and are valid on the falling edge. By connecting the
SDO pin of the first device to the SDI input of the next device in the chain, a multiple-device interface is
constructed. Each device in the system requires 24 clock pulses. Therefore, the total number of clock cycles
must equal 24 × N, where Nis the total number of DAC8718s in the chain. When the serial transfer to all devices
is complete, CS is taken high. This action latches the data from the SPI Shift Registers to the device internal
registers for each device in the daisy-chain, and prevents any further data from being clocked in. The serial clock
can be a continuous or a gated clock. Note that a continuous SCLK source can only be used if CS is held low for
the correct number of clock cycles. For gated clock mode, a burst clock containing the exact number of clock
cycles must be used and CS must be taken high after the final clock in order to latch the data.
In Sleep mode (SLEEP bit = '1'), the data clocked into SDI are routed to the SDO pin directly; the Shift Register
is bypassed. The first falling edge of CS starts the operating cycle. When SCLK is continuously applied with CS
low, the data clocked into the SDI pin appear on the SDO pin almost immediately (with approximately a 5 ns
delay; see the Timing Diagrams section); there is no 24 clock delay, as there is in normal operting mode. While
in Sleep mode, no data bits are clocked into the Shift Register, and the device does not receive any new data or
commands. Putting the device into Sleep mode eliminates the 24 clock delay from SDI to SDO caused by the
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DB23 DB0
=Don’tCare Bit23=MSB
Bit0=LSB
MultipleReadings
CS
SCLK
SDI
CommandtoRead
RegisterA
CommandtoRead
RegisterB
DB23 DB0 DB23 DB0 DB23 DB0
CommandtoRead
RegisterC
NOPCommand
(write ‘1’ toNOPbit)
DB23 DB0
SDO
Undefined Datafrom
RegisterA
DB23 DB0 DB23 DB0 DB23 DB0
Datafrom
RegisterB
Datafrom
RegisterC
DB23DB0
SingleReading
CS
SCLK
SDI
READCommandSpecifies
RegistertobeRead
NOPCommand
(write ‘1’ toNOPbit)
DB23
DB23DB0
SDO
Undefined Datafrom
SelectedRegister
DB23
R/W= ‘1’ R/W= ‘0’
R/W= ‘1’ R/W= ‘1’ R/W= ‘1’ R/W= ‘0’
DB23
Command
DB23
Undefined
DB0
DB0
DB0
DB0
DAC8718
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Shift Register, thus greatly speeding up the data transfer. For example, consider three DAC8718s (A, B, and C)
in a daisy-chain configuration. The data from the SPI controller are transferred first to A, then to B, and finally to
C. In normal daisy-chain operation, a total of 72 clocks are needed to transfer one word to C. However, if A and
B are placed into Sleep mode, the first 24 data bits are directly transferred to C (through A and B); therefore, only
24 clocks are needed.
To wake the device up from sleep mode and return to normal operation, either one of following methods can be
used:
1. Pull the WAKEUP pin low, which forces the SLEEP bit to '0' and returns the device to normal operating
mode.
2. Use the W2 bit and the CS pin.
When the W2 bit = '1', if CS is applied with no more than one falling edge of SCLK, then the rising edge of CS
wakes the device from sleep mode back to normal operation. However, the device will not wake-up if more than
one falling edge of SCLK exists while CS is low.
Read-Back Operation
The READ command is used to start read-back operation. However, before read-back operation can be initiated,
the SDO pin must be enabled by setting the DSDO bit in the Configuration Register to '0'; this bit is cleared by
default. Read-back operation is then started by executing a READ command (R/W bit = '1', see Table 9). Bits A4
to A0 in the READ command select the register to be read. The remaining data in the command are don’t care
bits. During the next SPI operation, the data appearing on the SDO output are from the previously addressed
register. For a read of a single register, a NOP command can be used to clock out the data from the selected
register on SDO. Multiple registers can be read if multiple READ commands are issued. The readback diagram
in Figure 100 shows the read-back sequence.
Figure 100. Read-Back Operation
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SPI SHIFT REGISTER
The SPI Shift Register is 24 bits wide, as shown in Table 9. The register mapping is shown in Table 10; X = don't
care—writing to it has no effect, reading it returns '0'.
Table 9. Shift Register Format
MSB
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15:DB0
R/W X X A4 A3 A2 A1 A0 DATA
R/W Indicates a read from or a write to the addressed register.
R/W = '0' sets a write operation and the data are written to the specified register.
R/W = '1' sets a read-back operation. Bits A4 to A0 select the register to be read. The remaining bits
are don’t care bits. During the next SPI operation, the data appearing on SDO pin are from the
previously addressed register.
A4:A0 Address bits that specify which register is accessed.
DATA 16 data bits
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Table 10. Register Map
ADDRESS BITS DATA BITS
A4 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3:D0 REGISTER
Configuration
0 0 0 0 0 A/B LD RST PD-A PD-B SCE X GAIN-A GAIN-B DSDO NOP W2 X(1) Register
0 0 0 0 1 Analog Monitor Select X(1) Monitor Register
0 0 0 1 0 GPIO-2 GPIO-1 GPIO-0 X(1) GPIO Register
Offset DAC-A
0 0 0 1 1 OS15:OS0(2) Data
Offset DAC-B
0 0 1 0 0 OS15:OS0(2) Data
0 0 1 0 1 Reserved(3) Reserved
0 0 1 1 0 SLEEP Reserved(3) SPI MODE
0 0 1 1 1 DB15:DB0 Broadcast
0 1 0 0 0 DB15:DB0 DAC-0
0 1 0 0 1 DB15:DB0 DAC-1
0 1 0 1 0 DB15:DB0 DAC-2
0 1 0 1 1 DB15:DB0 DAC-3
0 1 1 0 0 DB15:DB0 DAC-4
0 1 1 0 1 DB15:DB0 DAC-5
0 1 1 1 0 DB15:DB0 DAC-6
0 1 1 1 1 DB15:DB0 DAC-7
1 0 0 0 0 Z15:Z0, default = 0 (0000h), twos complement Zero Register-0
1 1 0 0 0 G15:G0, default = 32768 (8000h), straight binary Gain Register-0
1 0 0 0 1 Z15:Z0, default = 0 (0000h), twos complement Zero Register-1
1 1 0 0 1 G15:G0, default = 32768 (8000h), straight binary Gain Register-1
1 0 0 1 0 Z15:Z0, default = 0 (0000h), twos complement Zero Register-2
1 1 0 1 0 G15:G0, default = 32768 (8000h), straight binary Gain Register-2
1 0 0 1 1 Z15:Z0, default = 0 (0000h), twos complement Zero Register-3
1 1 0 1 1 G15:G0, default = 32768 (8000h), straight binary Gain Register-3
1 0 1 0 0 Z15:Z0, default = 0 (0000h), twos complement Zero Register-4
1 1 1 0 0 G15:G0, default = 32768 (8000h), straight binary Gain Register-4
1 0 1 0 1 Z15:Z0, default = 0 (0000h), twos complement Zero Register-5
1 1 1 0 1 G15:G0, default = 32768 (8000h), straight binary Gain Register-5
1 0 1 1 0 Z15:Z0, default = 0 (0000h), twos complement Zero Register-6
1 1 1 1 0 G15:G0, default = 32768 (8000h), straight binary Gain Register-6
1 0 1 1 1 Z15:Z0, default = 0 (0000h), twos complement Zero Register-7
1 1 1 1 1 G15:G0, default = 32768 (8000h), straight binary Gain Register-7
(1) X = don't care—writing to this bit has no effect; reading the bit returns '0'.
(2) Table 7 lists the default values for a dual power supply. Offset DAC A and Offset DAC B are trimmed in manufacturing to minimize the
error for symmetrical output. The default value may vary no more than ±10 LSB from the nominal number listed in Table 7. For a single
power supply, the Offset DACs are turned off.
(3) Writing to a reserved bit has no effect; reading the bit returns '0'.
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INTERNAL REGISTERS
The DAC8718 internal registers consist of the Configuration Register, the Monitor Register, the DAC Input Data
Registers, the Zero Registers, the DAC Data Registers, and the Gain Registers, and are described in the
following section.
The Configuration Register specifies which actions are performed by the device. Table 11 shows the details.
Table 11. Configuration Register (Default = 8000h)
DEFAULT
BIT NAME VALUE DESCRIPTION
A/B bit.
When A/B = '0', reading DAC-x returns the value in the Input Data Register.
D15 A/B 1 When A/B = '1', reading DAC-x returns the value in the DAC Data Register.
When the correction engine is enabled, the data returned from the Input Data Register is the original data written to the
bus, and the value in the DAC Data Register is the corrected data.
Synchronously update DACs bit.
When LDAC is tied high, setting LD = '1' at any time after the write operation and the correction process complete
synchronously updates all DAC latches with the content of the corresponding DAC Data Register, and sets VOUT to a new
level. The DAC8718 updates the DAC latch only if it has been accessed since the last time LDAC was brought low or the
D14 LD 0 LD bit was set to '1', thereby eliminating unnecessary glitch. Any DACs that were not accessed are not reloaded. After
updating, the bit returns to '0'. When the correction engine is turned off, bit LD can be set to '1' any time after the writing
operation is complete; the DAC latch is immediately updated when bit LD is set. When the LDAC pin is tied low, this bit is
ignored.
Software reset bit.
D13 RST 0 Set the RST bit to '1' to reset the device; functions the same as a hardware reset. After reset completes, the RST bit
returns to '0'.
Power-down bit for Group A (DAC-0, DAC-1, DAC-2, and DAC-3).
Setting the PD-A bit to '1' places Group A (DAC-0, DAC-1, DAC-2, and DAC-3) into power-down operation. All output
D12 PD-A 0 buffers are in Hi-Z and all analog outputs (VOUT-X) connect to AGND-A through an internal 15-kΩresistor. The interface is
still active.
Setting the PD-A bit to '0' returns group A to normal operation.
Power-down bit for Group B (DAC-4, DAC-5, DAC-6, and DAC-7).
Setting the PD-B bit to '1' places Group B (DAC-4, DAC-5, DAC-6, and DAC-7) into power-down operation. All output
D11 PD-B 0 buffers are in Hi-Z and all analog outputs (VOUT-X) connect to AGND-B through an internal 15-kΩresistor. The interface is
still active.
Setting the PD-B bit to '0' returns group B to normal operation.
System-calibration enable bit.
Set the SCE bit to '1' to enable the correction engine. When the engine is enabled, the input data are adjusted by the
correction engine according to the contents of the corresponding Gain Register and Zero Register. The results are
transferred to the corresponding DAC Data Register, and finally loaded into the DAC latch, which sets the VOUT-x pin
D10 SCE 0 output level.
Set the SCE bit to '0' to turn off the correction engine. When the engine is turned off, the input data are transferred to the
corresponding DAC Data Register immediately, and then loaded into the DAC latch, which sets the output voltage. Refer
to the User Calibration for Zero-Code Error and Gain Error section for details.
D9 — 0 Reserved. Writing to this bit has no effect; reading this bit returns '0'.
Gain bit for Group A (DAC-0, DAC-1, DAC-2, and DAC-3). Updating this bit to a new value automatically resets the Offset
DAC-A Register to the factory-trimmed value for the new gain setting.
D8 GAIN-A 0 Set the GAIN-A bit to '0' for an output span = 6 × REF-A.
Set the GAIN-A bit to '1' for an output span = 4 × REF-A.
Gain bit for Group B (DAC-4, DAC-5, DAC-6, and DAC-7). Updating this bit to a new value automatically resets the Offset
DAC-B Register to the factory-trimmed value for the new gain setting.
D7 GAIN-B 0 Set the GAIN-B bit to '0' for an output span = 6 × REF-B.
Set the GAIN-B bit to '1' for an output span = 4 × REF-B.
Disable SDO bit.
Set the DSDO bit to '0' to enable the SDO pin (default). The SDO pin works as a normal SPI output.
D6 DSDO 0 Set the DSDO bit to '1' to disable the SDO pin. The SDO pin is always in a Hi-Z state no matter what the status of the CS
pin is.
No operation bit.
During a write operation, setting the NOP bit to '1' has no effect (the bit returns to '0' when the write operation completes).
D5 NOP 0 Setting the NOP bit to '0', returns the device to normal operation.
During a read operation, the bit always returns “0”
Second wake-up operation bit.
If the WAKEUP pin is high, an alternative method to wake-up the device from sleep in SPI is by using the CS pin. When
W2 = '1', the rising edge of CS restores the device from sleep mode to normal operation, if no more than one falling edge
D4 W2 0 of SCLK exists while CS is low. However, the device will not wake up if more than one falling edge of SCLK exists. Setting
the W2 bit to '0' disables this function, and the rising edge of CS does not wake up the device.
If the WAKEUP is low, this bit is ignored and the device is always in normal mode.
D3:D0 — 0 Reserved. Writing to these bits has no effect; reading these bits returns '0'.
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Monitor Register (default = 0000h).
The Monitor Register selects one of the DAC outputs, auxiliary analog inputs, reference buffer outputs, or offset
DAC outputs to be monitored through the VMON pin. When bits [D15:D4] = '0', the monitor is disabled and VMON is
in a Hi-Z state.
Note that if any value is written other than those specified in Table 12, the Monitor Register stores the invalid
value; however, the VMON pin is forced into a Hi-Z state.
Table 12. Monitor Register (Default = 0000h)
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3:D0 VMON CONNECTS TO
0 0 0 0 0 0 0 0 0 0 0 1 X(1) Reference buffer B output
0 0 0 0 0 0 0 0 0 0 1 0 X Reference buffer A output
0 0 0 0 0 0 0 0 0 1 0 1 X Offset DAC B output
0 0 0 0 0 0 0 0 0 1 1 0 X Offset DAC A output
0 0 0 0 0 0 0 0 0 1 0 0 X AIN-0
0 0 0 0 0 0 0 0 1 0 0 0 X AIN-1
0 0 0 0 0 0 0 1 0 0 0 0 X DAC-0
0 0 0 0 0 0 1 0 0 0 0 0 X DAC-1
0 0 0 0 0 1 0 0 0 0 0 0 X DAC-2
0 0 0 0 1 0 0 0 0 0 0 0 X DAC-4
0 0 0 1 0 0 0 0 0 0 0 0 X DAC-4
0 0 1 0 0 0 0 0 0 0 0 0 X DAC-5
0 1 0 0 0 0 0 0 0 0 0 0 X DAC-6
1 0 0 0 0 0 0 0 0 0 0 0 X DAC-7
0 0 0 0 0 0 0 0 0 0 0 0 X Monitor function disabled, Hi-Z (default)
(1) X = don't care.
BLANKSPACE
GPIO Register (default = E000h).
The GPIO Register determines the status of each GPIO pin.
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
GPIO-2 GPIO-1 GPIO-0 X X X X X X X X X X X X X
GPIO-2:0 For write operations, the GPIO-n pin operates as an output. Writing a '1' to the GPIO-n bit sets the
GPIO-n pin to high impedance, and writing a '0' sets the GPIO-n pin to logic low. An external
pull-up resistor is required when using the GPIO-n pin as an output.
For read operations, the GPIO-n pin operates as an input. Read the GPIO-n bit to receive the
status of the corresponding GPIO-n pin. Reading a '0' indicates that the GPIO-n pin is low, and
reading a '1' indicates that the GPIO-n pin is high.
After power-on reset, or any forced hardware or software reset, all GPIO-n bits are set to '1', and
the GPIO pins are in a high impedance state.
50 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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SBAS467A –MAY 2009–REVISED DECEMBER 2009
Offset DAC-A/B Registers (default = 999Ah for dual supplies or 0000h for single supplies).
The Offset DAC-A and Offset DAC-B registers contain, by default, the factory-trimmed Offset DAC code
providing optimal offset and span for symmetric bipolar operation when dual supplies are detected, and contain
code 0000h when a single supply is detected.
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
OS15 OS14 OS13 OS12 OS11 OS10 OS9 OS8 OS7 OS6 OS5 OS4 OS3 OS2 OS1 OS0
OS15:0 For dual-supply operation, the default code for a gain of 6 is 999Ah with a ±10 LSB variation,
depending on the linearity of each Offset DAC. The default code for a gain of 4 is AAABh with a
±10 LSB variation. The default codes of Offset DAC-A and Offset DAC-B registers are
independently factory trimmed for both gains of 6 and 4.
When single-supply operation is present, writing to these registers is ignored and reading returns
0000h. When dual-supply operation is present, updating the GAIN-A (GAIN-B) bit on the
configuration register automatically reloads the factory-trimmed code into the Offset DAC-A (Offset
DAC-B) register for the new GAIN-A (GAIN-B) setting. See the Offset DACs for further details.
BLANKSPACE
SPI MODE Register (default = 0000h).
The SPI Mode Register is used to put the device into SPI sleep mode.
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
SLEEP X X X X X X X X X X X X X X X
SLEEP Set the SLEEP bit to '1' to put the device into SPI sleep mode.
When the SLEEP bit = '0', the SPI is in normal mode. The bit is cleared ('0') after a hardware reset
(through the RST pin) or if the WAKEUP pin is low.
For normal SPI operation, the data entering the SDI pin is transferred into the Shift Register.
However, for SPI sleep mode, the Shift Register is bypassed. The data entering into the SDI pin
are directly transferred to the SDO pin instead of the Shift Register.
BLANKSPACE
Broadcast Register.
The DAC8718 broadcast register can be used to update all eight DAC register channels simultaneously using
data bits D15:D0. This write-only register uses address A4:A0 = 07h, and is only available when the SCE bit = '0'
(default). If the SCE bit = '1', this register is ignored. Reading this register always returns 0000h.
BLANKSPACE
Input Data Register for DAC-n, where n = 0 to 7 (default = 0000h).
This register stores the DAC data written to the device when the SCE bit = '1' and is controlled by the correction
engine. When the SCE bit = '0' (default), the DAC Data Register stores the DAC data written to the device. When
the data are loaded into the corresponding DAC latch, the DAC output changes to the new level defined by the
DAC latch. The default value after power-on or reset is 0000h.
Table 13. DAC-n(1) Input Data Register
MSB LSB
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DB15(2) DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
(1) n = 0, 1, 2, 3, 4, 5, 6, or 7.
(2) DB15:DB0 are the DAC data bits.
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Zero Register n, where n = 0 to 7 (default = 0000h).
The Zero Register stores the user-calibration data that are used to eliminate the offset error. The data are 16 bits
wide, 1 LSB/step, and the total adjustment is –32768 LSB to +32767 LSB, or ±50% of full-scale range. The Zero
Register uses a twos complement data format.
Table 14. Zero Register
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Z15 Z14 Z13 Z12 Z11 Z10 Z9 Z8 Z7 Z6 Z5 Z4 Z3 Z2 Z1 Z0
Z15:Z0—OFFSET BITS ZERO ADJUSTMENT
7FFFh +32767 LSB
7FFEh +32766 LSB
••• ••• ••• ••• ••• •••
0001h +1 LSB
0000h 0 LSB (default)
FFFFh –1 LSB
••• ••• ••• ••• ••• •••
8001h –32767 LSB
8000h –32768 LSB
BLANKSPACE
Gain Register n, where n = 0 to 7 (default = 8000h).
The Gain Register stores the user-calibration data that are used to eliminate the gain error. The data are 16 bits
wide, 0.0015% FSR/step, and the total adjustment range 0.5 to 1.5. The Gain Register uses a straight binary
data format.
Table 15. Gain Register
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
G15 G14 G13 G12 G11 G10 G9 G8 G7 G6 G5 G4 G3 G2 G1 G0
G15:G0—GAIN-CODE BITS GAIN ADJUSTMENT COEFFICIENT
FFFFh 1.499985
FFFEh 1.499969
••• ••• ••• ••• ••• •••
8001h 1.000015
8000h 1 (default)
7FFFh 0.999985
••• ••• ••• ••• ••• •••
0001h 0.500015
0000h 0.5
52 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
AVDD
NC
AIN-1
V -4
OUT
REF-B
V -5
OUT
V -6
OUT
AGND-B
AGND-B
OFFSET-B
V -7
OUT
AVSS
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
AVDD
NC
AIN-0
V -3
OUT
REF-A
V -2
OUT
V -1
OUT
AGND-A
AGND-A
OFFSET-A
V -0
OUT
AVSS
NC
VMON
NC
NC
NC
WAKEUP
LDAC
SDO
NC
SDI
CS
SCLK
DVDD
IOVDD
DGND
NC
NC
RSTSEL
USB/BTC
NC
64 63 62 61 60 59 58 57 56 55 54
17 18 19 20 21 22 23 24 25 26 27
53 52 51 50 49
28 29 30 31 32
DAC8718
NC
NC
GPIO-2
CLR
RST
NC
NC
DVDD
DGND
NC
NC
DGND
GPIO-1
GPIO-0
NC
NC
10 Fm
AVDD
V -3
OUT
AIN-0
REF-A
V -2
OUT
V -1
OUT
OFFSET-A
V -0
OUT
AVSS
10 Fm
VMON
RST
CLR
10kW10kW10kW
1 Fm
DVDD
AVSS
V -7
OUT
OFFSET-B
10 Fm
V -4
OUT
AIN-1
REF-B
V -5
OUT
V -6
OUT
10 Fm
AVDD
WAKEUP
LDAC
SDO
SDI
CS
SCLK
DVDD
1 Fm
1 Fm
IOVDD
RSTSEL
10kW
DAC8718
www.ti.com
SBAS467A –MAY 2009–REVISED DECEMBER 2009
APPLICATION INFORMATION
BASIC OPERATION
The DAC8718 is a highly-integrated device with high-performance reference buffers and output buffers, greatly
reducing the printed circuit board (PCB) area and production cost. On-chip reference buffers eliminate the need
for a negative external reference. Figure 101 shows a basic application for the DAC8718.
NOTES: AVDD = +15V, AVSS = -15V, DVDD = +5V, IOVDD = +1.8V to +5V, REF-A = +5V, and REF-B = +2.5V.
NOTES: The OFFSET-A and OFFSET-B pins must be connected to the AGND pin when used in unipolar operation.
Figure 101. Basic Application Example
Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 53
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PRECISION VOLTAGE REFERENCE SELECTION
To achieve the optimum performance from the DAC8718 over the full operating temperature range, a precision
voltage reference must be used. Careful consideration should be given to the selection of a precision voltage
reference. The DAC8718 has two reference inputs, REF-A and REF-B. The voltages applied to the reference
inputs are used to provide a buffered positive reference for the DAC cores. Therefore, any error in the voltage
reference is reflected in the outputs of the device. There are four possible sources of error to consider when
choosing a voltage reference for high-accuracy applications: initial accuracy, temperature coefficient of the output
voltage, long-term drift, and output voltage noise. Initial accuracy error on the output voltage of an external
reference can lead to a full-scale error in the DAC. Therefore, to minimize these errors, a reference with low
initial accuracy error specification is preferred. Long-term drift is a measure of how much the reference output
voltage drifts over time. A reference with a tight, long-term drift specification ensures that the overall solution
remains relatively stable over its entire lifetime. The temperature coefficient of a reference output voltage affects
the output drift when the temperature changes. Choose a reference with a tight temperature coefficient
specification to reduce the dependence of the DAC output voltage on ambient conditions. In high-accuracy
applications, which have a relatively low noise budget, the reference output voltage noise also must be
considered. Choosing a reference with as low an output noise voltage as practical for the required system
resolution is important. Precision voltage references such as TI's REF50xx (2V to 5V) and REF32xx (1.25V to
4V) provide a low-drift, high-accuracy reference voltage.
POWER-SUPPLY NOISE
The DAC8718 must have ample supply bypassing of 1μF to 10μF in parallel with 0.1μF on each supply, located
as close to the package as possible; ideally, immediately next to the device. The 1μF to 10μF capacitors must be
the tantalum-bead type. The 0.1μF capacitor must have low effective series resistance (ESR) and low effective
series inductance (ESI), such as common ceramic types, which provide a low-impedance path to ground at high
frequencies to handle transient currents because of internal logic switching. The power-supply lines must be as
large a trace as possible to provide low-impedance paths and reduce the effects of glitches on the power-supply
line. Apart from these considerations, the wideband noise on the AVDD, AVSS, DVDD and IOVDD supplies should
be filtered before feeding to the DAC to obtain the best possible noise performance.
LAYOUT
Precision analog circuits require careful layout, adequate bypassing, and a clean, well-regulated power supply to
obtain the best possible dc and ac performance. Careful consideration of the power-supply and ground-return
layout helps to meet the rated performance. DGND is the return path for digital currents and AGND is the power
ground for the DAC. For the best ac performance, care should be taken to connect DGND and AGND with very
low resistance back to the supply ground. The PCB must be designed so that the analog and digital sections are
separated and confined to certain areas of the board. If multiple devices require an AGND-to-DGND connection,
the connection is to be made at one point only. The star ground point is established as close as possible to the
device.
The power-supply traces must be as large as possible to provide low impedance paths and reduce the effects of
glitches on the power-supply line. Fast switching signals must never be run near the reference inputs. It is
essential to minimize noise on the reference inputs because it couples through to the DAC output. Avoid
crossover of digital and analog signals. Traces on opposite sides of the board must run at right angles to each
other. This configuration reduces the effects of feedthrough on the board. A microstrip technique may be
considered, but is not always possible with a double-sided board. In this technique, the component side of the
board is dedicated to the ground plane, and signal traces are placed on the solder-side.
Each DAC group has a ground pin, AGND-x, which is the ground of the output from the DACs in the group. It
must be connected directly to the corresponding reference ground in low-impedance paths to get the best
performance. AGND-A must be connected with REFGND-A and AGND-B must be connected with REFGND-B.
AGND-A and AGND-B must be tied together and connected to the analog power ground and DGND.
During single-supply operation, the OFFSET-x pins must be connected to AGND-x with a low-impedance path
because these pins carry DAC-code-dependent current. Any resistance from OFFSET-x to AGND-x causes a
voltage drop by this code-dependent current. Therefore, it is very important to minimize routing resistance to
AGND-x or to any ground plane that AGND-x is connected to.
54 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): DAC8718
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
DAC8718SPAG ACTIVE TQFP PAG 64 160 Green (RoHS &
no Sb/Br) CU NIPDAU Level-4-260C-72 HR
DAC8718SPAGR ACTIVE TQFP PAG 64 1500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-4-260C-72 HR
DAC8718SRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
DAC8718SRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 5-May-2010
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DAC8718SPAGR TQFP PAG 64 1500 330.0 24.4 13.0 13.0 1.5 16.0 24.0 Q2
DAC8718SRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2
DAC8718SRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DAC8718SPAGR TQFP PAG 64 1500 367.0 367.0 45.0
DAC8718SRGZR VQFN RGZ 48 2500 336.6 336.6 28.6
DAC8718SRGZT VQFN RGZ 48 250 336.6 336.6 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PAG (S-PQFP-G64) PLASTIC QUAD FLATPACK
0,13 NOM
0,25
0,45
0,75
Seating Plane
0,05 MIN
4040282/C 11/96
Gage Plane
33
0,17
0,27
16
48
1
7,50 TYP
49
64
SQ
9,80
1,05
0,95
11,80
12,20
1,20 MAX
10,20 SQ
17
32
0,08
0,50 M
0,08
0°–7°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
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