Gap Filler 1500 (Two-Part)
Features and Benefits
• Thermal conductivity: 1.8 W/mK
• Optimized shear thinning characteristics for
ease of dispensing
• Excellent slump resistance (stays in place)
• Ultra-conforming with excellent wet-out for
low stress interface applications
• 100% solids – no cure by-products
• Excellent low and high temperature
mechanical and chemical stability
Gap Filler 1500 is a two-part, high performance,
thermally conductive liquid gap filling material,
which features superior slump resistance and
high shear thinning characteristics for optimized
consistency and control during dispensing.The
mixed system will cure at room temperature
and can be accelerated with the addition of
heat. Unlike cured thermal pad materials, a liquid
approach offers infinite thickness variations with
little or no stress to the sensitive components
during assembly. Gap Filler 1500 exhibits low
level natural tack characteristics and is intended
for use in applications where a strong structural
bond is not required. As cured, Gap Filler 1500
provides a soft, thermally conductive, form-in-
place elastomer that is ideal for fragile assemblies
and filling unique and intricate air voids and gaps.
Thermally Conductive Liquid Gap Filling Material
Typical Applications Include:
• Automotive electronics • Telecommunications
• Computer and peripherals
• Between any heat generating semiconductor and a heat sink
Configurations Available:
• Supplied in cartridge or kit form
• With or without glass beads
Building a Part Number Standard Options
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GF1500 = Gap Filler 1500 (Two-Part) Material
GF1500 00 60 10G NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
00 = No spacer beads, 07 = 0.007" spacer beads,
10 = 0.010" spacer beads
Pot Life: 60 = 60 min, 480 = 480 min
Cartridges: 50cc = 50.0cc, 400cc = 400.0cc
Kits: 1200cc = 1200.00cc, 10G = 10 gallon
– – – –
www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GF1500_0312
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-4156
The Bergquist Company
European Headquarters
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company
Asian Headquarters
Hong Kong
Ph: 852-2690-9296
Fax: 852-2690-0782
TYPICAL PROPERTIES OF GAP FILLER 1500
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A Yellow Yellow Visual
Color / Part B White White Visual
Viscosity, High Shear (Pa-s)(1) 25 25 ASTM D5099
Density (g/cc) 2.7 2.7 ASTM D792
Mix Ratio 1:1 1:1 —
Shelf Life @ 25°C (months) 6 6 —
PROPERTY AS CURED
Color Yellow Yellow Visual
Hardness (Shore 00)(2) 50 50 ASTM D2240
Heat Capacity (J/g-K) 1.0 1.0 ASTM D1269
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —
ELECTRICAL AS CURED
Dielectric Strength (V/mil) 400 400 ASTM D149
Dielectric Constant (1000 Hz) 6.4 6.4 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating V-O V- O U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K) 1.8 1.8 ASTM D5470
CURE SCHEDULE SCHEDULE 1 SCHEDULE 2
Pot Life @ 25°C (3) 60 min 480 min (8 hr) -
Cure @ 25°C (4) 5 hours 3 days -
Cure @ 100°C (4) 10 min 30 min -
1) Capillary viscosity, initial, 3000 sec-1. Part A and B measured separately
2) Thirty second delay value Shore 00 hardness scale.
3) Parallel Plate Rheometer - Working life as liquid.
4) Parallel Plate Rheometer - Estimated time to read 90% cure.
