AP03N70H/J-H RoHS-compliant Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET 100% Avalanche Test D Fast Switching Speed Simple Drive Requirement G RoHS Compliant BVDSS 700V RDS(ON) 4.4 ID 2.5A S Description The TO-252 package is widely preferred for all commercial-industrial surface mount applications and suited for AC/DC converters. The through-hole version (AP03N70J) is available for low-profile applications. G G D S DS TO-252(H) TO-251(J) Absolute Maximum Ratings Parameter Symbol Rating Units VDS Drain-Source Voltage 700 V VGS Gate-Source Voltage +30 V ID@TC=25 Continuous Drain Current, VGS @ 10V 2.5 A ID@TC=100 Continuous Drain Current, VGS @ 10V 1.6 A 8 A 54.3 W 0.44 W/ 1 IDM Pulsed Drain Current PD@TC=25 Total Power Dissipation Linear Derating Factor 2 EAS Single Pulse Avalanche Energy 31 mJ IAR Avalanche Current 2.5 A TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Parameter Value Units Rthj-c Maximum Thermal Resistance, Junction-case 2.3 /W Rthj-a Maximum Thermal Resistance, Junction-ambient 110 /W Data & specifications subject to change without notice 1 200812114 AP03N70H/J-H Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. 700 - - V - 0.6 - V/ VGS=10V, ID=1.6A - - 4.4 BVDSS Drain-Source Breakdown Voltage BVDSS/Tj Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA VGS=0V, ID=1mA 3 Max. Units RDS(ON) Static Drain-Source On-Resistance VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 2 - 4 V gfs Forward Transconductance VDS=10V, ID=1.6A - 2 - S IDSS Drain-Source Leakage Current VDS=600V, VGS=0V - - 10 uA Drain-Source Leakage Current (Tj=150 C) VDS=480V, VGS=0V - - 100 uA Gate-Source Leakage VGS=+30V - - +100 nA ID=1A - 12 20 nC o IGSS 3 Qg Total Gate Charge Qgs Gate-Source Charge VDS=480V - 3 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 4 - nC VDD=300V - 8.5 - ns 3 td(on) Turn-on Delay Time tr Rise Time ID=2.5A - 6 - ns td(off) Turn-off Delay Time RG=10,VGS=10V - 19 - ns tf Fall Time RD=120 - 8 - ns Ciss Input Capacitance VGS=0V - 590 950 pF Coss Output Capacitance VDS=25V - 50 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 6 - pF Rg Gate Resistance f=1.0MHz - 3.4 5.1 Min. Typ. - - Source-Drain Diode Symbol VSD Parameter 3 Forward On Voltage Test Conditions IS=2.5A, VGS=0V 3 trr Reverse Recovery Time Qrr Reverse Recovery Charge Max. Units 1.5 V IS=2.5A, VGS=0V, - 407 - ns dI/dt=100A/s - 2110 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Starting Tj=25oC , VDD=50V , L=10mH , RG=25 , IAS=2.5A. 3.Pulse test THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP03N70H/J-H 4 3 10V 6.0V o T C =25 C o 10V 5.0V T C =150 C ID , Drain Current (A) ID , Drain Current (A) 2 3 2 5.0V 2 4.5V 1 4.0V 1 1 4.5V V G =3.5V V G =4.0V 0 0 0 5 10 15 20 25 0 V DS , Drain-to-Source Voltage (V) 10 15 20 25 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 3.0 Normalized RDS(ON) 1.2 Normalized BVDSS (V) 5 1.1 1.0 I D =2.5A V G =10V 2.0 1.0 0.9 0.8 0.0 -50 0 50 100 150 -50 0 50 100 150 T j , Junction Temperature ( o C) T j , Junction Temperature ( o C) Fig 3. Normalized BVDSS v.s. Junction Fig 4. Normalized On-Resistance Temperature v.s. Junction Temperature 1.6 100 Normalized VGS(th) (V) 1.4 IS (A) 10 T j = 150 o C T j = 25 o C 1 1.2 1 0.8 0.1 0.6 0.4 0.01 0.1 0.3 0.5 0.7 0.9 1.1 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.3 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP03N70H/J-H f=1.0MHz 10000 I D =1A V DS =480V 12 C iss C (pF) VGS , Gate to Source Voltage (V) 16 8 100 C oss 4 C rss 0 1 0 5 10 15 1 5 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 10 100us Normalized Thermal Response (Rthjc) DUTY=0.5 1ms ID (A) 1 10ms 100ms 0.1 DC o T c =25 C Single Pulse 0.2 0.1 0.05 0.1 0.02 PDM 0.01 t T Single Pulse Duty factor = t/T Peak Tj = PDM x Rthjc + T C 0.01 0.01 1 10 100 1000 10000 0.00001 0.0001 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.001 0.01 0.1 1 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4 ADVANCED POWER ELECTRONICS CORP. Package Outline : TO-252 D D1 E2 MIN NOM MAX A2 1.80 2.30 2.80 A3 0.40 0.50 0.60 B1 0.40 0.70 1.00 D 6.00 6.50 7.00 D1 4.80 5.35 5.90 E3 3.50 4.00 4.50 E3 E1 B1 F1 e Millimeters SYMBOLS F 2.20 2.63 3.05 F1 0.5 0.85 1.20 E1 5.10 5.70 6.30 E2 0.50 1.10 1.80 e -- 2.30 -- C 0.35 0.50 0.65 F e 1.All Dimensions Are in Millimeters. 2.Dimension Does Not Include Mold Protrusions. R : 0.127~0.381 A2 A3 (0.1mm C Part Marking Information & Packing : TO-252 Part Number Package Code 03N70H LOGO YWWSSS Date Code (YWWSSS) YLast Digit Of The Year WWWeek SSSSequence 5 ADVANCED POWER ELECTRONICS CORP. Package Outline : TO-251 D Millimeters A SYMBOLS c1 D1 E1 E A1 B2 F B1 MIN NOM MAX A 2.20 2.30 2.40 A1 0.90 1.20 1.50 B1 0.50 0.69 0.88 B2 0.60 0.87 1.14 c c1 0.40 0.50 0.60 0.40 0.50 0.60 D 6.40 6.60 6.80 D1 5.20 5.35 5.50 E 6.70 7.00 7.30 E1 5.40 5.80 6.20 e ---- 2.30 ---- F 5.88 6.84 7.80 1.All Dimensions Are in Millimeters. c e 2.Dimension Does Not Include Mold Protrusions. e Part Marking Information & Packing : TO-251 Part Number 03N70J LOGO YWWSSS Package Code Date Code (YWWSSS) Y Last Digit Of The Year WW Week SSS Sequence 6