Product Folder Order Now Support & Community Tools & Software Technical Documents LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 LMZ35003 2.5-A Power Module With 7V-50V Input in QFN Package 1 Features 3 Description * The LMZ35003 power module is an easy-to-use integrated power solution that combines a 2.5-A DC/DC converter with a shielded inductor and passives into a low profile, QFN package. This total power solution allows as few as five external components and eliminates the loop compensation and magnetics part selection process. 1 * * * * * * * * * * * * * * * * * * Complete Integrated Power Solution Allows Small Footprint, Low-Profile Design Wide Input Voltage Range from 7 V to 50 V Output Adjustable from 2.5 V to 15 V 65-V Surge Capability Efficiencies Up To 96% Adjustable Switching Frequency (300 kHz to 1 MHz) Synchronizes to an External Clock Adjustable Slow-Start Output Voltage Sequencing and Tracking Power Good Output Programmable Undervoltage Lockout (UVLO) Output Overcurrent Protection Over Temperature Protection Pre-bias Output Start-up Operating Temperature Range: -40C to 85C Enhanced Thermal Performance: 14C/W Meets EN55022 Class B Emissions - Integrated Shielded Inductor For Design Help visit http://www.ti.com/LMZ35003 Create a Custom Design Using the LMZ35003 With the WEBENCH(R) Power Designer The small 9 mm x 11 mm x 2.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation capability. The LMZ35003 offers the flexibility and the featureset of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques. Simplified Application LMZ35003 VIN VOUT VIN VOUT CIN RSET INH/UVLO COUT VADJ PWRGD 2 Applications * * * * RT/CLK Industrial and Motor Controls Automated Test Equipment Medical and Imaging Equipment High Density Power Systems SS/TR STSEL AGND PGND 100 Efficiency (%) 95 90 85 80 75 70 VIN = 24 V, VOUT = 15 V, fSW = 1 MHz VIN = 24 V, VOUT = 12 V, fSW = 800 kHz 0 0.5 1 1.5 Output Current (A) 2 2.5 G000 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com Table 1. Ordering Information For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see the TI website at www.ti.com. 4 Specifications 4.1 Absolute Maximum Ratings (1) over operating temperature range (unless otherwise noted) Input Voltage Output Voltage MIN MAX UNIT VIN -0.3 65 V INH/UVLO -0.3 5 V VADJ -0.3 3 V PWRGD -0.3 6 V SS/TR -0.3 3 V STSEL -0.3 3 V RT/CLK -0.3 3.6 V PH -0.6 65 V -2 65 V PH 10ns Transient VOUT -0.6 VIN V 200 mV RT/CLK 100 A INH/UVLO 100 A SS/TRK 200 A PWRGD 10 mA VDIFF (GND to exposed thermal pad) Source Current Sink Current Operating Junction Temperature -40 105 (2) C Storage Temperature -65 150 C 250 (4) C Peak Reflow Case Temperature (3) Maximum Number of Reflows Allowed (3) Mechanical Shock Mechanical Vibration (1) (2) (3) (4) 3 Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted (4) 1500 Mil-STD-883D, Method 2007.2, 20-2000Hz G 20 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. See the temperature derating curves in the Typical Characteristics section for thermal information. For soldering specifications, refer to the Soldering Requirements for BQFN Packages application note. Devices with a date code prior to week 14 2018 (1814) have a peak reflow case temperature of 240C with a maximum of one reflow. 4.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input Voltage 7 50 VOUT Output Voltage 2.5 15 fSW Switching Frequency 400 1000 kHz TA Operating Ambient Temperature -40 85 C 2 Submit Documentation Feedback V V Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 4.3 Thermal Information LMZ35003 THERMAL METRIC (1) RKG UNIT 41 PINS Junction-to-ambient thermal resistance (2) JA 14 (3) JT Junction-to-top characterization parameter JB Junction-to-board characterization parameter (4) (1) 3.3 C/W 6.8 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics (SPRA953) application report. The junction-to-ambient thermal resistance, JA, applies to devices soldered directly to a 100 mm x 100 mm double-sided, 4-layer PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces JA. The junction-to-top characterization parameter, JT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = JT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device. The junction-to-board characterization parameter, JB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = JB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device. (2) (3) (4) 4.4 Package Specifications LMZ35003 UNIT Weight Flammability MTBF Calculated reliability 0.9 grams Meets UL 94 V-O Per Bellcore TR-332, 50% stress, TA = 40C, ground benign 31.7 MHrs 4.5 Electrical Characteristics -40C TA +85C, VIN = 24 V, VOUT = 5.0 V, IOUT = 2.5 A, RT = Open CIN = 2 x 2.2 F ceramic, COUT = 2 x 47 F ceramic (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP IOUT Output current Over input voltage and output voltage range VIN Input voltage range Over output current range UVLO VIN Undervoltage lockout No hysteresis, Rising and Falling VOUT(adj) Output voltage adjust range Over output current range Set-point voltage tolerance TA = 25C; IOUT = 100 mA Temperature variation -40C TA +85C 0.5% Line regulation Over input voltage range 0.1% Load regulation Over output current range 0.4% Total output voltage variation Includes set-point, line, load, and temperature variation VOUT VIN = 24 V IOUT = 1.5 A Efficiency VIN = 48 V IOUT = 1.5 A ILIM 0 2.5 A 50 (2) V 2.5 VINH (1) (2) (3) (4) (5) Inhibit threshold voltage No hysteresis 15 2.0% VOUT = 12 V, fSW = 800 kHz 93 % VOUT = 5.0 V, fSW = 500 kHz 84 % VOUT = 3.3 V, fSW = 400 kHz 79 % VOUT = 12 V, fSW = 800 kHz 87 % VOUT = 5.0 V, fSW = 500 kHz 79 % V (4) 1.0% 3.0% (4) 74 % 1% Current limit threshold 1.0 A/s load step from 50 to 100% IOUT(max) V 2.5 (3) 20 MHz bandwith, 0.25 A IOUT 2.5 A, VOUT 3.3V Transient response UNIT 7.0 (1) VOUT = 3.3 V, fSW = 400 kHz Output voltage ripple MAX (3) VOUT 5.1 A Recovery time 400 s VOUT over/undershoot 90 mV 1.15 1.25 1.36 (5) V For output voltages 12 V, the minimum input voltage is 7 V or (VOUT+ 3 V), whichever is greater. For output voltages > 12 V, the minimum input voltage is (1.33 x VOUT). See Figure 27 for more details. The maximum input voltage is 50 V or (15 x VOUT), whichever is less. Output voltages < 3.3 V are subject to reduced VIN(max) specifications and higher ripple magnitudes. The stated limit of the set-point voltage tolerance includes the tolerance of both the internal voltage reference and the internal adjustment resistor. The overall output voltage tolerance is affected by the tolerance of the external RSET resistor. Value when no voltage divider is present at the INH/UVLO pin. Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 3 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com Electrical Characteristics (continued) -40C TA +85C, VIN = 24 V, VOUT = 5.0 V, IOUT = 2.5 A, RT = Open CIN = 2 x 2.2 F ceramic, COUT = 2 x 47 F ceramic (unless otherwise noted) PARAMETER IINH INH Input current II(stby) Input standby current TEST CONDITIONS VINH > 1.36 V -3.8 INH pin to AGND PWRGD Thresholds VOUT falling PWRGD Low Voltage I(PWRGD) = 3.5 mA fSW Switching frequency RT/CLK pin OPEN fCLK Synchronization frequency VCLK-H CLK High-Level Threshold VCLK-L CLK Low-Level Threshold DCLK CLK Duty cycle Thermal Shutdown CIN External input capacitance COUT External output capacitance (6) (7) 4 TYP -0.9 VOUT rising Power Good MIN VINH < 1.15 V 1.3 Good 94% Fault 109% Fault 91% Good 106% MAX A A 4 A 500 kHz 1000 kHz 0.2 300 400 300 1.9 CLK Control 0.5 0.7 25% 50% Thermal shutdown Thermal shutdown hysteresis Ceramic 4.4 (6) Non-ceramic V 2.2 (7) V V 75% 180 C 15 C 10 F 22 100 UNIT 430 F A minimum of 4.4F of ceramic external capacitance is required across the input (VIN and PGND connected) for proper operation. Locate the capacitor close to the device. See Table 3 for more details. The required capacitance must include at least 2 x 47F ceramic capacitors (or 4 x 22F). Locate the capacitance close to the device. Adding additional capacitance close to the load improves the response of the regulator to load transients. See Table 3 for more details. Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 5 Device Information FUNCTIONAL BLOCK DIAGRAM LMZ35003 Thermal Shutdown PWRGD PWRGD Logic Shutdown Logic VADJ OCP INH/UVLO VIN UVLO VIN PH + + SS/TR VREF STSEL RT/CLK Comp Power Stage and Control Logic VOUT OSC w/PLL PGND AGND Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 5 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com Table 2. PIN DESCRIPTIONS TERMINAL NAME DESCRIPTION NO. 1 4 5 30 AGND 32 33 These pins are connected to the internal analog ground (AGND) of the device. This node should be treated as the zero volt ground reference for the analog control circuitry. Pad 37 should be connected to PCB ground planes using multiple vias for good thermal performance. Not all pins are connected together internally. All pins must be connected together externally with a copper plane or pour directly under the module. Connect AGND to PGND at a single point (GND_PT; pins 8 & 9). See Layout Recommendations. 34 37 2 DNC 3 Do Not Connect. Do not connect these pins to AGND, to another DNC pin, or to any other voltage. These pins are connected to internal circuitry. Each pin must be soldered to an isolated pad. 25 6 7 21 22 PH 23 Phase switch node. Do not place any external component on these pins or tie them to a pin of another function. 24 38 41 GND_PT 8 9 Ground Point. Connect AGND to PGND at these pins as shown in the Layout Considerations. These pins are not connected to internal circuitry, and are not connected to one other. 10 11 12 VOUT 13 14 Output voltage. These pins are connected to the internal output inductor. Connect these pins to the output load and connect external bypass capacitors between these pins and PGND. Connect a resistor from these pins to VADJ to set the output voltage. 15 39 16 17 18 PGND 19 This is the return current path for the power stage of the device. Connect these pins to the load and to the bypass capacitors associated with VIN and VOUT. Pad 40 should be connected to PCB ground planes using multiple vias for good thermal performance. 20 40 VIN 26 Input voltage. This pin supplies all power to the converter. Connect this pin to the input supply and connect bypass capacitors between this pin and PGND. INH/UVLO 27 Inhibit and UVLO adjust pin. Use an open drain or open collector logic device to ground this pin to control the INH function. A resistor divider between this pin, AGND, and VIN sets the UVLO voltage. SS/TR 28 Slow-start and tracking pin. Connecting an external capacitor to this pin adjusts the output voltage rise time. A voltage applied to this pin allows for tracking and sequencing control. STSEL 29 Slow-start or track feature select. Connect this pin to AGND to enable the internal SS capacitor. Leave this pin open to enable the TR feature. RT/CLK 31 This pin is connected to an internal frequency setting resistor which sets the default switching frequency. An external resistor can be connected from this pin to AGND to increase the frequency. This pin can also be used to synchronize to an external clock. PWRGD 35 Power Good flag pin. This open drain output asserts low if the output voltage is more than approximately 6% out of regulation. A pull-up resistor is required. VADJ 36 Connecting a resistor between this pin and VOUT sets the output voltage. 6 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 DNC AGND AGND AGND RT/CLK AGND 1 PWRGD AGND VADJ RKG PACKAGE (TOP VIEW) 36 35 34 33 32 31 30 2 29 STSEL 28 SS/TR 27 INH/UVLO 26 VIN 25 DNC 24 PH 23 PH 22 PH 21 PH 20 PGND 37 DNC 3 AGND 4 AGND 5 AGND PH PH PH 6 PH 7 38 41 GND_PT 8 VOUT GND_PT 9 PGND VOUT 39 10 12 13 14 15 16 17 18 VOUT VOUT PGND PGND PGND 11 VOUT VOUT VOUT 40 19 PGND Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 7 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 6 Typical Characteristics (VIN = 12 V) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for the converter. Applies to Figure 1, Figure 2, and Figure 3. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper. Applies to Figure 4. 100 40 VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz Output Voltage Ripple (mV) 95 Efficiency (%) 90 85 80 75 70 65 VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz 60 55 50 0 0.5 1 1.5 Output Current (A) 2 30 20 10 0 2.5 0 Figure 1. Efficiency vs. Output Current 1 1.5 Output Current (A) 2 2.5 G000 Figure 2. Voltage Ripple vs. Output Current 2.5 90 VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz 2 80 Ambient Temperature (C) Power Dissipation (W) 0.5 G000 1.5 1 0.5 70 60 50 40 30 All Output Voltages 0 0.5 1 1.5 Output Current (A) 2 20 2.5 0 G000 Natural Convection 1 1.5 Output Current (A) 2 2.5 G000 Figure 4. Safe Operating Area 120 40 120 30 90 30 90 20 60 20 60 10 30 10 30 0 0 0 0 -30 -10 -60 -20 -30 -40 1000 Gain (dB) 40 Phase () Gain (dB) Figure 3. Power Dissipation vs. Output Current Gain Phase -90 10000 Frequency (Hz) 100000 -30 -10 -60 -20 -30 -120 300000 -40 1000 G000 Figure 5. VOUT= 5 V, IOUT= 2 A, COUT1= 44 F ceramic, COUT2= 56 F electrolytic, fSW= 500 kHz 8 0.5 Phase () 0 Gain Phase -90 10000 Frequency (Hz) 100000 -120 300000 G000 Figure 6. VOUT= 3.3 V, IOUT= 2 A, COUT1= 44 F ceramic, COUT2= 56 F electrolytic, fSW= 400 kHz Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 7 Typical Characteristics (VIN = 24 V) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for the converter. Applies to Figure 7, Figure 8, and Figure 9. At light load the output voltage ripple may increase due to pulse skipping. See Light-Load Behavior for more information. Applies to Figure 8. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper. Applies to Figure 10. 60 100 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz 95 Output Voltage Ripple (mV) 90 80 75 70 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz 60 55 50 0 0.5 1 1.5 Output Current (A) 2 40 30 20 10 0 2.5 0 Figure 7. Efficiency vs. Output Current 1 1.5 Output Current (A) G000 Ambient Temperature (C) 2 80 1.5 1 0.5 70 60 50 40 30 All Output Voltages 0 0.5 1 1.5 Output Current (A) 2 20 2.5 0 0.5 G000 Figure 9. Power Dissipation vs. Output Current Natural Convection 1 1.5 Output Current (A) 2 2.5 G000 Figure 10. Safe Operating Area 120 40 120 30 90 30 90 20 60 20 60 10 30 10 30 0 0 0 0 -30 -10 -20 -30 -40 1000 Gain Phase 10000 Frequency (Hz) 100000 Gain (dB) 40 Phase () Gain (dB) 2.5 90 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz 2.5 0 2 Figure 8. Voltage Ripple vs. Output Current 3 Power Dissipation (W) 0.5 G000 -60 -20 -90 -30 -120 300000 -40 1000 G000 Figure 11. VOUT= 5 V, IOUT= 2 A, COUT1= 44 F ceramic, COUT2= 56 F electrolytic, fSW= 500 kHz -30 -10 Phase () Efficiency (%) 85 65 50 -60 Gain Phase -90 10000 Frequency (Hz) 100000 -120 300000 G000 Figure 12. VOUT= 12 V, IOUT= 2 A, COUT1= 44 F ceramic, COUT2= 56 F electrolytic, fSW= 800 kHz Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 9 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 8 Typical Characteristics (VIN = 36 V) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for the converter. Applies to Figure 13, Figure 14, and Figure 15. At light load the output voltage ripple may increase due to pulse skipping. See Light-Load Behavior for more information. Applies to Figure 14. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper. Applies to Figure 16. 60 100 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz 95 Output Voltage Ripple (mV) 90 80 75 70 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz 60 55 50 0 0.5 1 1.5 Output Current (A) 2 40 30 20 10 0 2.5 Figure 13. Efficiency vs. Output Current 0.5 1 1.5 Output Current (A) 2 G000 90 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz VOUT = 2.5 V, fSW = 400 kHz 2.5 80 Ambient Temperature (C) 3 2 1.5 1 70 60 50 40 0.5 30 0 20 VO = 5 V VO = 12 V VO = 15 V Natural Convection 0 0.5 1 1.5 Output Current (A) 2 2.5 0 1 1.5 Output Current (A) 2 2.5 G000 Figure 16. Safe Operating Area 120 40 120 30 90 30 90 20 60 20 60 10 30 10 30 0 0 0 0 -30 -10 -20 -30 -40 1000 Gain Phase 10000 Frequency (Hz) 100000 Gain (dB) 40 Phase () Gain (dB) 0.5 G000 Figure 15. Power Dissipation vs. Output Current -20 -90 -30 -120 300000 -30 -10 -60 -40 1000 G000 Figure 17. VOUT= 5 V, IOUT= 2 A, COUT1= 44 F ceramic, COUT2= 56 F electrolytic, fSW= 500 kHz 10 2.5 Figure 14. Voltage Ripple vs. Output Current 4 3.5 Power Dissipation (W) 0 G000 Phase () Efficiency (%) 85 65 50 -60 Gain Phase -90 10000 Frequency (Hz) 100000 -120 300000 G000 Figure 18. VOUT= 12 V, IOUT= 2 A, COUT1= 44 F ceramic, COUT2= 56 F electrolytic, fSW= 800 kHz Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 9 Typical Characteristics (VIN = 48 V) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for the converter. Applies to Figure 19, Figure 20, and Figure 21. At light load the output voltage ripple may increase due to pulse skipping. See Light-Load Behavior for more information. Applies to Figure 20. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper. Applies to Figure 22. 70 100 95 Output Voltage Ripple (mV) 90 80 75 70 65 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz 60 55 50 0 0.5 1 1.5 Output Current (A) 2 50 40 30 20 10 0 2.5 Figure 19. Efficiency vs. Output Current 0.5 1 1.5 Output Current (A) 2 G000 90 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz 80 Ambient Temperature (C) 5 4 3 2 1 70 60 50 40 VO = 5 V VO = 12 V VO = 15 V 30 Natural Convection 0 0 0.5 1 1.5 Output Current (A) 2 20 2.5 0 0.5 G000 Figure 21. Power Dissipation vs. Output Current 1 1.5 Output Current (A) 2 2.5 G000 Figure 22. Safe Operating Area 120 40 120 30 90 30 90 20 60 20 60 10 30 10 30 0 0 0 0 -30 -10 -20 -30 -40 1000 Gain Phase 10000 Frequency (Hz) 100000 Gain (dB) 40 Phase () Gain (dB) 2.5 Figure 20. Voltage Ripple vs. Output Current 6 Power Dissipation (W) 0 G000 -60 -20 -90 -30 -120 300000 -40 1000 G000 Figure 23. VOUT= 5 V, IOUT= 2 A, COUT1= 44 F ceramic, COUT2= 56 F electrolytic, fSW= 500 kHz -30 -10 Phase () Efficiency (%) 85 VOUT = 15 V, fSW = 1 MHz VOUT = 12 V, fSW = 800 kHz VOUT = 5.0 V, fSW = 500 kHz VOUT = 3.3 V, fSW = 400 kHz 60 -60 Gain Phase -90 10000 Frequency (Hz) 100000 -120 300000 G000 Figure 24. VOUT= 12 V, IOUT= 2 A, COUT1= 44 F ceramic, COUT2= 56 F electrolytic, fSW= 800 kHz Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 11 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 10 Capacitor Recommendations for the LMZ35003 Power Supply 10.1 Capacitor Technologies 10.1.1 Electrolytic, Polymer-Electrolytic Capacitors When using electrolytic capacitors, high-quality, computer-grade electrolytic capacitors are recommended. Polymer-electrolytic type capacitors are recommended for applications where the ambient operating temperature is less than 0C. The Sanyo OS-CON capacitor series is suggested due to the lower ESR, higher rated surge, power dissipation, ripple current capability, and small package size. Aluminum electrolytic capacitors provide adequate decoupling over the frequency range of 2 kHz to 150 kHz, and are suitable when ambient temperatures are above 0C. 10.1.2 Ceramic Capacitors The performance of aluminum electrolytic capacitors is less effective than ceramic capacitors above 150 kHz. Multilayer ceramic capacitors have a low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be used to reduce the reflected ripple current at the input as well as improve the transient response of the output. 10.1.3 Tantalum, Polymer-Tantalum Capacitors Polymer-tantalum type capacitors are recommended for applications where the ambient operating temperature is less than 0C. The Sanyo POSCAP series and Kemet T530 capacitor series are recommended rather than many other tantalum types due to their lower ESR, higher rated surge, power dissipation, ripple current capability, and small package size. Tantalum capacitors that have no stated ESR or surge current rating are not recommended for power applications. 10.2 Input Capacitor The LMZ35003 requires a minimum input capacitance of 4.4 F of ceramic type. The voltage rating of input capacitors must be greater than the maximum input voltage. The ripple current rating of the capacitor must be at least 450 mArms. Table 3 includes a preferred list of capacitors by vendor. 10.3 Output Capacitor The output capacitance of the LMZ35003 can be comprised of either all ceramic capacitors, or a combination of ceramic and bulk capacitors. The required output capacitance must include at least 100 F of ceramic type (or 2 x 47 F). When adding additional non-ceramic bulk capacitors, low-ESR devices like the ones recommended in Table 3 are required. Additional capacitance above the minimum is determined by actual transient deviation requirements. Table 3 includes a preferred list of capacitors by vendor. Table 3. Recommended Input/Output Capacitors (1) CAPACITOR CHARACTERISTICS VENDOR SERIES PART NUMBER WORKING VOLTAGE (V) CAPACITANCE (F) ESR (2) (m) Murata X5R GRM31CR61H225KA88L 50 4.7 2 TDK X5R C3216X5R1H475K 50 4.7 2 Murata X5R GRM32ER61E226K 16 22 2 TDK X5R C3225X5R0J476K 6.3 47 2 Murata X5R GRM32ER60J476M 6.3 47 2 Sanyo POSCAP 16TQC68M 16 68 50 Sanyo POSCAP 6TPE100MI 6.3 100 25 Kemet T530 T530D227M006ATE006 6.3 220 6 (1) (2) 12 Capacitor Supplier Verification, RoHS, Lead-free and Material Details Consult capacitor suppliers regarding availability, material composition, RoHS and lead-free status, and manufacturing process requirements for any capacitors identified in this table. Maximum ESR @ 100 kHz, 25C. Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 11 Application Information 11.1 LMZ35003 Operation The LMZ35003 can operate over a wide input voltage range of 7 V to 50 V and produce output voltages from 2.5 V to 15 V. The performance of the device varies over this wide operating range, and there are some important considerations when operated near the boundary limits. This section offers guidance in selecting the optimum components depending on the application and operating conditions. The user must select three primary parameters when designing with the LMZ35003. * Output Voltage * UVLO Threshold * Switching Frequency The adjustment of each of these parameters can be made using just one or two resistors. Figure 25 below shows a typical LMZ35003 schematic with the key parameter-setting resistors labeled. LMZ35003 VIN VIN PWRGD VOUT CIN2 CIN1 RUVLO1 VOUT INH/UVLO RSET COUT1 COUT2 RUVLO2 VADJ COMP RT/CLK RRT SS/TR STSEL AGND PGND Figure 25. LMZ35003 Typical Schematic Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 13 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 11.2 Adjusting the Output Voltage The LMZ35003 is designed to provide output voltages from 2.5V to 15V. The output voltage is determined by the value of RSET, which must be connected between the VOUT node and the VADJ pin (Pin 36). For output voltages greater than 5.0V, improved operating performance can be obtained by increasing the operating frequency. This adjustment requires the addition of RRT between RT/CLK (Pin 31) and AGND (Pin 30). See the Switching Frequency section for more details. Table 4 gives the standard external RSET resistor for a number of common bus voltages and also includes the recommended RRT resistor for output voltages above 5.0V. Table 4. Standard RSET Resistor Values for Common Output Voltages OUTPUT VOLTAGE VOUT (V) RESISTORS 2.5 3.3 5.0 8.0 12.0 15.0 RSET (k) 21.5 31.6 52.3 90.9 140 178 RRT (k) open open 1100 549 267 178 For other output voltages the value of RSET can be calculated using the following formula, or simply selected from the range of values given in Table 5. aeV o RSET = 10 c OUT - 1/ (kW ) e 0.798 o (1) Table 5. Standard RSET and RRT Resistor Values VOUT (V) RSET (k) RRT(k) fSW(kHz) VOUT (V) RSET (k) RRT(k) fSW(kHz) 2.5 21.5 open 400 9.0 102 365 700 3.0 27.4 open 400 9.5 110 365 700 3.3 31.6 open 400 10.0 115 365 700 3.5 34.0 open 400 10.5 121 267 800 4.0 40.2 open 400 11.0 127 267 800 4.5 46.4 open 400 11.5 133 267 800 5.0 52.3 1100 500 12.0 140 267 800 5.5 48.7 1100 500 12.5 147 215 900 6.0 64.9 1100 500 13.0 154 215 900 6.5 71.5 1100 500 13.5 158 215 900 7.0 78.7 549 600 14.0 165 178 1000 7.5 84.5 549 600 14.5 174 178 1000 8.0 90.9 549 600 15.0 178 178 1000 8.5 97.6 365 700 11.3 Input Voltage The LMZ35003 operates over the input voltage range of 7 V to 50 V. For reliable start-up and operation at light loads, the minimum input voltage depends on the output voltage. For output voltages 12V, the minimum input voltage is 7V or (VOUT + 3V), whichever is greater. For output voltages > 12V, the minimum input voltage is (1.33 x VOUT). The maximum input voltage is (15 x VOUT) or 50 V, whichever is less. While the device can safely handle input surge voltages up to 65 V, sustained operation at input voltages above 50 V is not recommended. See the Undervoltage Lockout (UVLO) Threshold section of this datasheet for more information. 14 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 11.4 Undervoltage Lockout (UVLO) Threshold At turn-on, the VON UVLO threshold determines the input voltage level where the device begins power conversion. During the power-down sequence, the VOFF UVLO threshold determines the input voltage where power conversion ceases. The turn-on and turn-off thresholds are set by two resistors, RUVLO1 and RUVLO2 as shown in Figure 26. The VON UVLO threshold must be set to at least (VOUT + 3 V) or 7 V whichever is greater to insure proper startup and reduce current surges on the host input supply as the voltage rises. If possible, it is recommended to set the UVLO threshold to appproximantely 80 to 85% of the minimum expected input voltage. Use Equation 2 and Equation 3 to calculate the values of RUVLO1 and RUVLO2. VON is the voltage threshold during power-up when the input voltage is rising. VOFF is the voltage threshold during power-down when the input voltage is decreasing. VOFF should be selected to be at least 500mV less than VON. Table 6 lists standard resistor values for RUVLO1 and RUVLO2 for adjusting the VON UVLO threshold for several input voltages. RUVLO1 = RUVLO2 = (VON - VOFF ) 2.9 10-3 (kW ) (2) 1.25 ae (VON - 1.25 ) o -3 cc // + 0.9 10 R UVLO1 e o (kW ) (3) VIN VIN RUVLO1 INH/UVLO RUVLO2 AGND Figure 26. Adjustable VIN UVLO Table 6. Standard Resistor Values to set VON UVLO Threshold VON THRESHOLD (V) 6.5 10.0 15.0 20.0 25.0 30.0 35.0 40.0 RUVLO1 (k) 174 174 174 174 174 174 174 174 45.0 174 RUVLO2 (k) 40.2 24.3 15.8 11.5 9.09 7.50 6.34 5.62 4.99 11.5 Power Good (PWRGD) The PWRGD pin is an open drain output. Once the output voltage is between 94% and 106% of the set voltage, the PWRGD pin pull-down is released and the pin floats. The recommended pull-up resistor value is between 10 k and 100 k to a voltage source that is 5.5 V or less. The PWRGD pin is in a defined state once VIN is greater than 1.0 V, but with reduced current sinking capability. The PWRGD pin achieves full current sinking capability once the VIN pin is above 4.5V. The PWRGD pin is pulled low when the output voltage is lower than 91% or greater than 109% of the nominal set voltage. Also, the PWRGD pin is pulled low if the input UVLO or thermal shutdown is asserted, the INH pin is pulled low, or the SS/TR pin is below 1.4 V. Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 15 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 11.6 Switching Frequency Nominal switching frequency of the LMZ35003 is set from the factory at 400 kHz. This switching frequency is optimum for output voltages below 5.0 V. For output voltages 5.0V and above, better operating performance can be obtained raising the operating frequency. This is easily done by adding a resistor, RRT in , from the RT/CLK pin (Pin 31) to the AGND pin (Pin 30). Raising the operating frequency reduces output voltage ripple, lowers the load current threshold where pulse skipping begins, and improves transient response. The recommended switching frequency for all output voltages is listed in Table 5. For the maximum recommended output voltage value of 15 V, the switching frequency computes to 1000 kHz or 1 MHz. Operation above 1 MHz is not recommended. Use Table 7 below to select the value of the timing resistor for the given values of switching frequencies. Table 7. Standard Resistor Values to set the Switching Frequency fSW (kHz) 400 500 600 700 800 900 1000 RRT(k) OPEN 1100 549 365 267 215 178 It is also possible to synchronize the switching frequency to an external clock signal. See the Synchronization (CLK) section for further details. While it is possible to set the operating frequency higher than 400 kHz when using the device at output voltages of 5 V or less, minimum duty cycle and pulse skipping issues restrict the maximum recommended input voltage under these conditions. The recommended operating conditions for the LMZ35003 can be summarized by Figure 27. The graph shows the maximum input voltage vs. output voltage restriction for several operating frequencies. The lower boundary of the graph shows the minimum input voltage as a function of the output voltage. Figure 27. Optimum Operating Range with Switching Frequency 16 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 11.7 Application Schematics VIN 7-36 V LMZ35003 VIN 4.7 F 50 V PWRGD 174k VOUT 3.3V @ 2.5A VOUT INH/UVLO 31.6k 40.2k 47 F 6.3 V 47 F 6.3 V VADJ RT/CLK SS/TR STSEL AGND PGND Figure 28. Typical Schematic VIN = 7 V to 36 V, VOUT = 3.3 V VIN 15-50 V LMZ35003 VIN 2.2 F 100 V 2.2 F 100 V PWRGD VOUT 12 V @ 2.5 A VOUT 174k INH/UVLO 140k 15.4k 47 F 16 V 47 F 16 V VADJ RT/CLK SS/TR 22 nF 267k STSEL AGND PGND Figure 29. Typical Schematic VIN = 15 V to 50 V, VOUT = 12 V Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 17 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com Application Schematics (continued) VIN 8-50 V LMZ35003 VIN 2.2 F 100 V 2.2 F 100 V 174k PWRGD VOUT 5 V @ 2.5 A VOUT INH/UVLO 52.3k 31.6k 47 F 6.3 V 47 F 6.3 V VADJ RT/CLK SS/TR 1100k STSEL AGND PGND Figure 30. Typical Schematic VIN = 8 V to 50 V, VOUT = 5 V 18 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 11.8 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the LMZ35003 device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. 11.9 Power-Up Characteristics When configured as shown in the front page schematic, the LMZ35003 produces a regulated output voltage following the application of a valid input voltage. During the power-up, internal soft-start circuitry slows the rate that the output voltage rises, thereby limiting the amount of in-rush current that can be drawn from the input source. The soft-start circuitry introduces a short time delay from the point that a valid input voltage is recognized. Figure 31 shows the start-up waveforms for a LMZ35003, operating from a 24-V input and the output voltage adjusted to 5 V. The waveform were measured with a 2-A constant current load. Figure 31. Start-Up Sequence Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 19 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 11.10 Output On/Off Inhibit (INH) The INH pin provides electrical on/off control of the device. Once the INH pin voltage exceeds the threshold voltage, the device starts operation. If the INH pin voltage is pulled below the threshold voltage, the regulator stops switching and enters low quiescent current state. The INH pin has an internal pull-up current source, allowing the user to float the INH pin for enabling the device. If an application requires controlling the INH pin, use an open drain/collector device, or a suitable logic gate to interface with the pin. Figure 32 shows the typical application of the inhibit function. The Inhibit control has its own internal pull-up to VIN potential. An open-collector or open-drain device is recommended to control this input. Turning Q1 on applies a low voltage to the inhibit control (INH) pin and disables the output of the supply, shown in Figure 33. If Q1 is turned off, the supply executes a soft-start power-up sequence, as shown in Figure 34. A regulated output voltage is produced within 5 ms. The waveforms were measured with a 2-A constant current load. VIN VIN RUVLO1 INH/UVLO Q1 INH Control RUVLO2 AGND Figure 32. Typical Inhibit Control Figure 34. Inhibit Turn-On Figure 33. Inhibit Turn-Off 20 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 11.11 Slow Start (SS/TR) For outputs voltages of 5V or less, the slow start capacitance built into the LMZ35003 is sufficient to provide for a turn-on ramp rate that does not induce large surge currents while charging the output capacitors. Connecting the STSEL pin (Pin 29) to AGND while leaving SS pin (Pin 28) open enables the internal SS capacitor with a slow start interval of approximately 5 ms. For output voltages greater than 5V, additional slow start capacitance is recommended. For 12V to 15V output voltages, a 22nF capacitor should be connected between the SS/TR pin (Pin 28) and AGND, while connecting the STSEL pin (Pin 29) to AGND as well. Figure 35 shows an additional SS capacitor connected to the SS pin and the STSEL pin connected to AGND. See Table 8 below for SS capacitor values and timing interval. SS/TR CSS (Optional) AGND STSEL Figure 35. Slow Start Capacitor (CSS) and STSEL Connection Table 8. Slow Start Capacitor Values and Slow Start Time CSS (nF) open 4.7 10 15 22 SS Time (msec) 5 7 10 13 17 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 21 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 11.12 Overcurrent Protection For protection against load faults, the LMZ35003 incorporates cycle-by-cycle current limiting. During an overcurrent condition the output current is limited and the output voltage is reduced, as shown in Figure 36. As the output voltage drops more than 8% below the set point, the PWRGD signal is pulled low. If the output voltage drops more than 25%, the switching frequency is reduced to reduce power dissipation within the device. When the overcurrent condition is removed, the output voltage returns to the established voltage. The LMZ35003 is not designed to endure a sustained short circuit condition. The use of an output fuse, voltage supervisor circuit, or other overcurrent protection circuit is recommended. A recommended overcurrent protection circuit is shown in Figure 37. This circuit uses the PWRGD signal as an indication of an overcurrent condition. As PWRGD remains low, the 555 timer operates as a low frequency oscillator, driving the INH/UVLO pin low for approximately 400ms, halting the power conversion of the device. After the inhibit interval, the INH/UVLO pin is released and the LMZ35003 restarts. If the overcurrent condition is removed, the PWRGD signal goes high, resetting the oscillator and power conversion resumes, otherwise the inhibit cycle repeats. 3.3V/5V 475k VDD DIS CONT 47.5k To INH/UVLO Pin 27 TLC555 THRS BSS138 TRIG OUT 3.3V/5V 1 F 100k 100k RST GND From PWRGD Pin 35 BSS138 Figure 37. Over-Current Protection Circuit Figure 36. Overcurrent Limiting 22 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 11.13 Light-Load Behavior The LMZ35003 is a non-synchronous converter. One of the characteristics of a non-synchronous converter is that as the load current on the output is decreased, a point is reached where the energy delivered by a single switching pulse is more than the load can absorb. This causes the output voltage to rise slightly. This rise in output voltage is sensed by the feedback loop and the device responds by skipping one or more switching cycles until the output voltages falls back to the set point. At very light loads or no load, many switching cycles are skipped. The observed effect during this pulse skipping mode of operation is an increase in the peak to peak ripple voltage, and a decrease in the ripple frequency. The load current where pulse skipping begins is a function of the input voltage, the output voltage, and the switching frequency. A plot of the pulse skipping threshold current as a function of input voltage is given in Figure 38 for a number of popular output voltage and switching frequency combinations. 900 2.5 V, 400 kHz 3.3 V, 400 kHz 5.0 V, 400 kHz 9 V, 600 kHz 12 V, 800 kHz 15 V, 1 MHz Output Current (mA) 800 700 600 500 400 300 200 100 0 10 15 20 25 30 35 Input Voltage (V) 40 45 50 G000 Figure 38. Pulse Skipping Threshold 11.14 Synchronization (CLK) An internal phase locked loop (PLL) allows synchronization between 400 kHz and 1 MHz, and to easily switch from RT mode to CLK mode. To implement the synchronization feature, connect a square wave clock signal to the RT/CLK pin with a duty cycle between 20% to 80%. The clock signal amplitude must transition lower than 0.8 V and higher than 2.0 V. The start of the switching cycle is synchronized to the falling edge of RT/CLK pin. In applications where both RT mode and CLK mode are needed, the device can be configured as shown in Figure 39. Before the external clock is present, the device works in RT mode where the switching frequency is set by the RRT resistor. When the external clock is present, the CLK mode overrides the RT mode. The first time the CLK pin is pulled above the RT/CLK high threshold (2.0 V), the device switches from RT mode to CLK mode and the RT/CLK pin becomes high impedance as the PLL starts to lock onto the frequency of the external clock. It is not recommended to switch from CLK mode back to RT mode because the internal switching frequency drops to 100 kHz first before returning to the switching frequency set by the RRT resistor . 470 pF 1 k RT/CLK External Clock 300 kHz to 1 MHz RRT AGND Figure 39. CLK/RT Configuration Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 23 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 11.15 Thermal Shutdown The internal thermal shutdown circuitry forces the device to stop switching if the junction temperature exceeds 180C typically. The device reinitiates the power up sequence when the junction temperature drops below 165C typically. 11.16 Layout Considerations To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 40 and Figure 41 show two layers of a typical PCB layout. Some considerations for an optimized layout are: * Use large copper areas for power planes (VIN, VOUT, and PGND) to minimize conduction loss and thermal stress. * Place ceramic input and output capacitors close to the module pins to minimize high frequency noise. * Locate additional output capacitors between the ceramic capacitor and the load. * Place a dedicated AGND copper area beneath the LMZ35003. * Isolate the PH copper area from the VOUT copper area using the PGND copper area. * Connect the AGND and PGND copper area at one point; at pins 8 & 9. * Place RSET, RRT, and CSS as close as possible to their respective pins. * Use multiple vias to connect the power planes to internal layers. * Use a dedicated sense line to connect RSET to VOUT near the load for best regulation. PGND VIN LOAD VOUT sense Via VOUT PGND Plane COUT2 CIN1 Thermal Vias COUT1 PH RSET VOUT sense Via AGND to PGND Connection AGND Figure 40. Typical Top-Layer Recommended Layout 24 Figure 41. Typical PGND-Layer Recommended Layout Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 11.17 EMI The LMZ35003 is compliant with EN55022 Class B radiated emissions. Figure 42 and Figure 43 show typical examples of radiated emissions plots for the LMZ35003 operating from 24 V and 12 V respectively. Both graphs include the plots of the antenna in the horizontal and vertical positions. Figure 42. Radiated Emissions 24-V Input, 5-V Output, 2-A Load (EN55022 Class B) Figure 43. Radiated Emissions 12-V Input, 5-V Output, 2-A Load (EN55022 Class B) Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 25 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 12 Revision History Changes from Revision A (June 2017) to Revision B Page * Added WEBENCH(R) design links for the LMZ35003.............................................................................................................. 1 * Increased the peak reflow temperature and maximum number of reflows to JEDEC specifications for improved manufacturability .................................................................................................................................................................... 2 * Added Device and Documentation Support section ............................................................................................................ 27 * Added Mechanical, Packaging, and Orderable Information section..................................................................................... 28 Changes from Original (July 2013) to Revision A Page * Deleted graphic above title .................................................................................................................................................... 1 * Added peak reflow and maximum number of reflows information ........................................................................................ 2 26 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 13 Device and Documentation Support 13.1 Device Support 13.1.1 Development Support 13.1.1.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the LMZ35003 device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. 13.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 13.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 13.4 Trademarks E2E is a trademark of Texas Instruments. WEBENCH is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. 13.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 13.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 27 LMZ35003 SNVS988B - JULY 2013 - REVISED APRIL 2018 www.ti.com 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14.1 Tape and Reel Information REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants 28 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant LMZ35003RKGR B1QFN RKG 41 500 330.0 24.4 9.35 11.35 3.1 16.0 24.0 Q1 LMZ35003RKGT B1QFN RKG 41 250 330.0 24.4 9.35 11.35 3.1 16.0 24.0 Q1 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 LMZ35003 www.ti.com SNVS988B - JULY 2013 - REVISED APRIL 2018 TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ35003RKGR B1QFN RKG 41 500 383.0 353.0 58.0 LMZ35003RKGT B1QFN RKG 41 250 383.0 353.0 58.0 Submit Documentation Feedback Copyright (c) 2013-2018, Texas Instruments Incorporated Product Folder Links: LMZ35003 29 PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2019 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LMZ35003RKGR ACTIVE B1QFN RKG 41 500 RoHS Exempt & Green CU NIPDAU Level-3-250C-168 HR -40 to 85 (54260, LMZ35003) LMZ35003RKGT ACTIVE B1QFN RKG 41 250 RoHS Exempt & Green CU NIPDAU Level-3-250C-168 HR -40 to 85 (54260, LMZ35003) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2019 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 7-Mar-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMZ35003RKGR B1QFN RKG 41 500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2 LMZ35003RKGT B1QFN RKG 41 250 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Mar-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ35003RKGR B1QFN RKG 41 500 346.0 346.0 35.0 LMZ35003RKGT B1QFN RKG 41 250 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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