4 5 37 34 35 0 2-0.1 (2x) 4.3 0.14 44.45 26 B 20 A 38 36 1.2 39 20.32 32 30 (1.8 ) 10.2 0.1 6 .3 SECTION A-A SCALE 10:1 3.94 27 8 0.01 +0.1 0 0.8 0.1 7 33 0.9 0.05 0.61 0.07 28 A 31 0.6 0.05 29 6 R0 3 2 2.4 0.05 1 7312P002XA13LF 14.7 0.1 8 9 A B 40 Durability 4: 50000 Mating Cycles 5: 100000 Mating Cycles Stop card 3 7 C 15.1 16 ELECTRICAL Insulation resistance : 1000MOhms Dielectric withstand voltage between card contacts and detection switch : 1000 Vrms Contact resistance:100mOhms} Current carrying : min 10 microA max 1A 10 D 0.8 0.05 24 25 A 0.2 C 2.54 23 19 5.08 0 54.35 -0.1 15 Copyright FCI. 0 55.95 -0.1 D SWITCH Contact closed : contact resistance 100mOhms Open contact : voltage proof 300Vms MATERIAL Contacts : copper alloy Plating : Gold / Equivalent PdNi over Nickel on contact area Solder talls : Sn bare edge allowed Housing : self extinguishing, Thermoplastic UL94-V0 rated 2.54 18 26.35 A 21 0.2 C 20 22 7.62 E 1 0.05 C MECHANICAL Contacts force : between 0.2N-0.5N Insertion force : 10N max Extraction force : 3N min 29.2 0.2 B 5.1 0.1 0.1 B 5 (21.8 ) 1 12 25.4 0.1 24.1 0.2 31.2 0.2 32.78 0.2 4 10.16 2 C DESCRIPTION Connector especially designed for SMT technology EMV compatible and in accordance with ISO 7816-2 11 17 ENVIRONMENT Storage temperature : -40 C, +85 C Operating temperature : -20 C, +70 C Packaging : Tray Compatible reflow soldering process 13 E 14 0.1 C surface www.fciconnect.com -- ISO 1302 tolerance std ISO 406 projection mm ISO 1101 TOLERANCES UNLESS OTHERWISE SPECIFIED BERNARDET 96/08/23 Eng GAMACHO 96/08/23 Chr CAILLER 96/08/23 0 Appr GAMACHO 96/08/23 Product family ecn no dr date A F20307 - 02/04/30 LS2038 PRI 02/06/10 C B LS05-0047 LGO 05/06/08 D LS05-0059 HLE 05/06/30 E LS06-0206 HLE 2006/12/11 F I09-0239 - - RPK 2009/10/30 - ANGULAR LINEAR 2 0.3 0.XX 0.1 0.XXX 0.05 Scale size A2 F 3:1 ECN I09-0239 MOBILE I/O Spec ref CHIP CARD CONNECTOR TYPE : P00 (8cts without cover) 7312P0025A13 catalog no - 0.X dwg no F rev title Dr -Rev. VJW53664 CUSTOMER sheet F 1 of 2 REV F - 2006-04-17 1 2 3 4 5 6 7 PDM: Rev:F STATUS:Released 8 Printed: Oct 29, 2011. 1 3 2 4 5 6 7 8 A A 44.45 22.86 43 46 1.9 1.2 0.1 2.84 10.4 47 4 20 20.6 2.54 8.2 0.74 41 45 (8.52 ) 12.16 42 44 B B 20.32 1.9 =26 = 48 3.28 B +0.1 2.1 0 (2x) 1.4 0.05 0.1 C 49 21.8 58 2.54 13 57 5.08 7.62 (24.1 ) (31.2 ) 29 1.9 C (24.26 ) D SCALE PCB LAYOUT (RECOMMENDED) 50 3:1 D NOTE: RoHS INFORMATIONS 52 51 6.8 -The "LF" products meet European Union Directives and other country regulations as described in GS-22-008. - The housing will withstand exposure to 260 c peak temperature for 30 seconds in a convection, infra-red or vapor reflow oven. See Application notes/procedures, if they are available. - Packaging spec: see GS-14-920 13.1 E E 56 Copyright FCI. 9.62 21.9 54 (4.3 ) 53 55 surface (55.95 ) www.fciconnect.com -- ISO 1302 tolerance std ISO 406 projection mm ISO 1101 TOLERANCES UNLESS OTHERWISE SPECIFIED 96/08/23 Eng GAMACHO 96/08/23 Chr CAILLER 96/08/23 0 Appr GAMACHO 96/08/23 Product family title ANGULAR 0.X LINEAR 2 0.3 0.XX 0.1 0.XXX 0.05 CHIP CARD CONNECTOR TYPE : P00 (8cts without cover) catalog no Scale size A2 F 5:1 ECN I09-0239 MOBILE I/O Spec ref 7312P0025A13 dwg no LAYOUT FOR KEEP OUT ZONE (CONNECTOR SIDE) F BERNARDET Dr -Rev. VJW53664 CUSTOMER sheet F 2 of 2 REV F - 2006-04-17 1 2 3 4 5 6 PDM: Rev:F STATUS:Released 8 Printed: Oct 29, 2011.