SEMICONDUCTOR TECHNICAL DATA
2–1 REV 3
Motorola, Inc. 1996
5/95
The MC10E/100E111 is a low skew 1-to-9 differential driver, designed
with clock distribution in mind. It accepts one signal input, which can be
either differential or else single-ended if the VBB output is used. The
signal is fanned out to 9 identical differential outputs. An enable input is
also provided. A HIGH disables the device by forcing all Q outputs LOW
and all Q outputs HIGH.
•Low Skew
•Guarateed Skew Spec
•Differential Design
•VBB Output
•Enable
•Extended 100E VEE Range of –4.2 to –5.46V
•75kΩ Input Pulldown Resistors
The device is specifically designed, modeled and produced with low
skew as the key goal. Optimal design and layout serve to minimize gate to
gate skew within-device, and empirical modeling is used to determine
process control limits that ensure consistent tpd distributions from lot to
lot. The net result is a dependable, guaranteed low skew device.
To ensure that the tight skew specification is met it is necessary that
both sides of the differential output are terminated into 50Ω, even if only
one side is being used. In most applications, all nine differential pairs will
be used and therefore terminated. In the case where fewer than nine
pairs are used, it is necessary to terminate at least the output pairs on the
same package side (i.e. sharing the same VCCO) as the pair(s) being
used on that side, in order to maintain minimum skew. Failure to do this
will result in small degradations of propagation delay (on the order of
10–20ps) of the output(s) being used which, while not being catastrophic
to most designs, will mean a loss of skew margin.
PIN NAMES
Pin Function
IN, IN
EN
Q0, Q0–Q8, Q8
VBB
Differential Input Pair
Enable
Differential Outputs
VBB Output
1
567891011
25 24 23 22 21 20 19
26
27
28
2
3
4
18
17
16
15
14
13
12
VEE
EN
IN
VCC
IN
VBB
NC
Q3
Q3
Q4
VCCO
Q4
Q5
Q5
Pinout: 28-Lead PLCC
(Top View)
Q0Q0Q1VCCO Q1Q2Q2
Q8Q7Q6
Q8VCCO Q7Q6
1:9 DIFFERENTIAL
CLOCK DRIVER
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
IN
IN
LOGIC SYMBOL
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
Q5
Q5
Q6
Q6
Q7
Q7
Q8
Q8
EN
VBB
MC10E111 MC100E111
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE (min) to VEE (max); VCC = VCCO = GND)
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Cond
VBB Output Reference
Voltage 10E
100E –1.43
–1.38 –1.30
–1.26 –1.38
–1.38 –1.27
–1.26 –1.35
–1.38 –1.25
–1.26 –1.31
–1.38 –1.19
–1.26
V
IIH Input HIGH
Current 150 150 150 150 µA
IEE Power Supply
Current 10E
100E 48
48 60
60 48
48 60
60 48
48 60
60 48
55 60
69
mA
VPP(DC) Input Sensitivity 50 50 50 50 mV 1
VCMR Commom Mode
Range –1.6 –0.4 –1.6 –0.4 –1.6 –0.4 –1.6 –0.4 V 2
1. Differential input voltage required to obtain a full ECL swing on the outputs.
2. VCMR is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The VIL level
must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min).
AC CHARACTERISTICS (VEE = VEE (min) to VEE (max); VCC = VCCO = GND)
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Cond
tPLH
tPHL Propagation Delay to
Output IN (Diff)
IN (SE)
Enable
Disable
380
280
400
400
680
780
900
900
460
410
450
450
560
610
850
850
480
430
450
450
580
630
850
850
510
460
450
450
610
660
850
850
ps 1
2
3
3
tsSetup T ime EN to IN 250 0 200 0 200 0 200 0 ps 5
tHHold Time IN to EN 50 –200 0 –200 0 –200 0 –200 ps 6
tRRelease T ime EN to IN 350 100 300 100 300 100 300 100 ps 7
tskew Within-Device Skew 25 75 25 50 25 50 25 50 ps 4
VPP(AC) Minimum Input Swing 250 250 250 250 mV 8
tr, tfRise/Fall Time 250 450 650 275 375 600 275 375 600 275 375 600 ps
1. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the
differential output signals. See
Definitions and T esting of ECLinPS AC Parameters
in Chapter 1 (page 1–12) of the Motorola High Performance
ECL Data Book (DL140/D).
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. See
Definitions and Testing of ECLinPS AC Parameters
in Chapter 1 (page 1–12) of the Motorola High Performance ECL Data Book (DL140/D).
3. Enable is defined as the propagation delay from the 50% point of a negative transition on EN to the 50% point of a positive transition on Q
(or a negative transition on Q). Disable is defined as the propagation delay from the 50% point of a positive transition on EN to the 50% point
of a negative transition on Q (or a positive transition on Q).
4. The within-device skew is defined as the worst case difference between any two similar delay paths within a single device.
5. The setup time is the minimum time that EN must be asserted prior to the next transition of IN/IN to prevent an output response greater than
±75 mV to that IN/IN transition (see Figure 1).
6. The hold time is the minimum time that EN must remain asserted after a negative going IN or a positive going IN to prevent an output response
greater than ±75 mV to that IN/IN transition (see Figure 2).
7. The release time is the minimum time that EN must be deasserted prior to the next IN/IN transition to ensure an output response that meets
the specified IN to Q propagation delay and output transition times (see Figure 3).
8. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited
for the E111 as a differential input as low as 50 mV will still produce full ECL levels at the output.
MC10E111 MC100E111
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
Figure 1. Setup Time
ts
IN
IN
EN 50%
Q
≤
75mV
≤
75mV
Q
≤
75mV
≤
75mV
Figure 2. Hold Time
th
IN
IN
EN 50%
Q
Q
Figure 3. Release Time
tr
IN
IN
EN 50%
Q
Q
MC10E111 MC100E111
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L –M SNSM
0.007 (0.180) T L –M SNSM
0.007 (0.180) T L –M SNSM
0.010 (0.250) T L –M SNSS
0.007 (0.180) T L –M SNSM
0.010 (0.250) T L –M SNSS
0.007 (0.180) T L –M SNSM
0.007 (0.180) T L –M SNSM
0.004 (0.100)
SEATING
PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
—
2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81
—
—
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92
—
1.27 BSC
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
—
2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
—
—
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430
—
0.050 BSC
-N- Y BRK
D
D
W
-M-
-L-
28 1 V
G1
K1
MC10E111 MC100E111
2–5 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
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MC10E111/D
*MC10E111/D*
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