Advanced Power N-CHANNEL ENHANCEMENT MODE
Electronics Corp. POWER MOSFET
▼ Low On-resistance BVDSS 40V
▼ Simple Drive Requirement RDS(ON) 10mΩ
▼ Fast Switching Characteristic ID51A
▼ RoHS Compliant & Halogen-Free
Description
□
Absolute Maximum Ratings
Symbol Units
VDS V
VGS V
ID@TC=25℃A
ID@TC=100℃A
IDM A
PD@TC=25℃W
TSTG ℃
TJ℃
Symbol Value Units
Rthj-c Maximum Thermal Resistance, Junction-case 2.8 ℃/W
Rthj-a 62.5 ℃/W
Rthj-a Maixmum Thermal Resistance, Junction-ambient 110 ℃/W
Data & specifications subject to change without notice
Storage Temperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
Thermal Data
Parameter
Maximum Thermal Resistance, Junction-ambient (PCB mount)3
200912012
1
Total Power Dissipation
Gate-Source Voltage +20
Continuous Drain Current, VGS @ 10V 51
Continuous Drain Current, VGS @ 10V 32
Pulsed Drain Current1
Parameter Rating
Drain-Source Voltage 40
AP0904GH/J-HF
44.6
Halogen-Free Product
200
The TO-252 package is widely preferred for commercial-industrial
surface mount applications and suited for low voltage applications
such as DC/DC converters. The through-hole version (AP0904GJ)
are available for low-profile applications.
G
D
S
A
dvanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
GDSTO-251(J)
GDSTO-252(H)
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 40 - - V
VGS=10V, ID=30A - - 10 mΩ
VGS=4.5V, ID=20A - - 15 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V
gfs Forward Transconductance VDS=10V, ID=20A - 45 - S
IDSS Drain-Source Leakage Current VDS=40V, VGS=0V - - 10 uA
IGSS Gate-Source Leakage VGS=+20V - - +100 nA
QgTotal Gate Charge2ID=20A - 9 14.4 nC
Qgs Gate-Source Charge VDS=20V - 2 - nC
Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 6 - nC
td(on) Turn-on Delay Time2VDS=20V - 6.5 - ns
trRise Time ID=1A - 6.5 - ns
td(off) Turn-off Delay Time RG=3.3Ω,VGS=10V - 20 - ns
tfFall Time RD=20Ω-10-ns
Ciss Input Capacitance VGS=0V - 680 1080 pF
Coss Output Capacitance VDS=25V - 160 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 95 - pF
Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
VSD Forward On Voltage2IS=20A, VGS=0V - - 1.2 V
trr Reverse Recovery Time2IS=10A, VGS=0V, - 22 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 16 - nC
Notes:
1.Pulse width limited by max. junction temperature
2.Pulse test
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
3.Surface mounted on 1 in2 copper pad of FR4 board
AP0904GH/J-HF
RDS(ON) Static Drain-Source On-Resistance2
A
P0904GH/J-HF
Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance
v.s. Junction Temperature
Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s.
Reverse Diode Junction Temperature
3
0
20
40
60
80
100
0246810
VDS , Drain-to-Source Voltage (V)
ID , Drain Current (A)
TC=150oC10V
7.0V
6.0V
5.0V
VG=4.0V
0
20
40
60
80
100
120
02468
VDS , Drain-to-Source Voltage (V)
ID , Drain Current (A)
TC=25oC10V
7.0V
6.0V
5.0V
VG=4.0V
0.4
0.8
1.2
1.6
2.0
-50 0 50 100 150
Tj , Junction Temperature ( oC)
Normalized RDS(ON)
ID=30A
VG=10V
0
10
20
30
0 0.2 0.4 0.6 0.8 1 1.2 1.4
VSD , Source-to-Drain Voltage (V)
IS(A)
Tj=25oC
Tj=150oC
8
9
10
11
12
13
246810
VGS , Gate-to-Source Voltage (V)
RDS(ON) (m
Ω
)
I
D=20A
TC=25oC
0.0
0.4
0.8
1.2
1.6
-50 0 50 100 150
Tj , Junction Temperature ( oC)
Normalized VGS(th) (V)
AP0904GH/J-HF
Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform
4
1
10
100
1000
0.1 1 10 100
VDS ,Drain-to-Source Voltage (V)
ID (A)
TC=25oC
S
in
g
le Puls
e
100us
1ms
10ms
100ms
DC 0.01
0.1
1
0.00001 0.0001 0.001 0.01 0.1 1 10
t , Pulse Width (s)
Normalized Th e rmal Re sponse (Rthjc)
PDM
Duty Factor = t/T
Peak Tj = PDM x Rthjc + TC
t
T
0.02
0.01
0.05
0.1
0.2
Duty factor = 0.5
Single Pulse
0
2
4
6
8
10
0 4 8 12 16 20
QG , Total Gate Charge (nC)
VGS , Gate to Sourc e Voltage ( V)
I D=20A
VDS =20V
0
200
400
600
800
1000
1200
1 5 9 13 17 21 25 29
VDS ,Drain-to-Source Voltage (V)
C (pF)
f=1.0MHz
Ciss
Coss
Crss
Q
VG
4.5V
QGS QGD
QG
Charge
td(on) trtd(off) tf
VDS
VGS
10%
90%
Operation in this area
limited by RDS(ON)
