SPEC NO: DSAD1151 REV NO: V.1 DATE:MAR/25/2003 PAGE: 1 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN: L.ZHANG
3.2X1.6mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
Features
!3.2mmX1.6mm SMT LED, 1.1mm THICKNESS.
!LOW POWER CONSUMPTION.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE :2000PCS / REEL.
Package Dimensions
APK3216TGC GREEN
Description
The Green source color devices are made with
InGaN on SiC Light Emitting Diode.
SPEC NO: DSAD1151 REV NO: V.1 DATE:MAR/25/2003 PAGE: 2 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN: L.ZHANG
Electrical / Optical Characteristics at T)=25°°
°°
°C
Absolute Maximum Ratings at T)=25°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
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SPEC NO: DSAD1151 REV NO: V.1 DATE:MAR/25/2003 PAGE: 3 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN: L.ZHANG
Green APK3216TGC
SPEC NO: DSAD1151 REV NO: V.1 DATE:MAR/25/2003 PAGE: 4 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN: L.ZHANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APK3216TGC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
