ASHL-0004-ES REV A
C. WANG
S. YAO
I. ENOMOTO
108-60038
ES
LOC
TITLE
Tyco Electronics
AMP Shanghai Ltd
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LTR
DIST
REVISION RECORD
DR
DATE
C.W
O
20AUG
CHAMP .050 (I) Board-to-Board connector
RELEASED FB00-0268-04
DR
CHK
APP NO REV
O
Product Specification
108-60038
CHAMP .050(I) Board-to-Board Connector
Lead Free Version
1. Scope:
1.1 Contents:
This specification covers the requirements for product performance, test methods and quality
assurance provisions of CHAMP .050 (I) Board-to-Board Connector.
The applicable product description and part numbers are as shown in Fig. 1:
2. Applicable Documents
The following documents form a part of this specification to the extent specified herein. In
the event of conflict between the requirements this specification and the product drawing, the
product drawing shall take precedence. In the event of conflict between the requirements
this specification and referenced documents, this specification shall take precedence.
2.1 AMP Specifications:
A. 109-5000: Test Specification, General Requirements for Test Methods
B. 501-60009: Test Report (Dip Type)
2.2 Military Standard and Specifications:
MIL-STD-202 Test Methods for Electronic and Electrical Component Parts
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3. Requirements:
3.1 Design and Construction:
Product shall be of the design, construction and physical dimensions specified in the applicable
Product drawing.
3.2 Materials:
A. Contact: Phosphor Bronze
1. 3 m minimum thick nickel underplate
0.2 µm, 0.5 µm and 0.76 µm minimum thick gold-plated on contact area
only.
1.0 µm minimum thick solder-plated on tine area only.
B. Housing and Tine Plate: Molded Thermoplastic
C. Accessories and Hardware:
Retention Leg: Brass
1 µm minimum thick nickel underplate
2 µm minimum thick solder-plated
3.3 Ratings:
A. Voltage Rating: 250 VAC
B. Current Rating: 1 A
C. Temperature Rating: -55°C~85°C
3.4 Performance and Test Descriptions:
The product shall be designed to meet the electrical, mechanical and environmental performance
requirements specified in Fig. 1. All tests shall be performed in the room temperature unless
otherwise specified.
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3.5 Test Requirements and Procedures Summary
Pare. Test Items Requirements Procedures
3.5.1 Confirmation of
Product Product shall be
conforming to the
requirements of a
applicable product
drawing,
Visually, dimensionally and
functionally inspected per
applicable inspections plan.
Electrical Requirements
3.5.2 Termination
Resistance
(Low Level)
35 m max.(Initial)
R=20 m max.(Final)
Subject mated contacts assembled
in housing to closed circuit of 50
mA max. at open circuit voltage of
50 mV max. Fig.3.
AMP Spec. 109-5306
3.5.3 Insulation Resistance 1,000 M MIN. (Initial)
100 M Min. (Final)
Measure by applying test potential
between the adjacent contacts, and
between the contacts and ground in
the mated connector.
MIL-STD-202,
Method 302,Condition B
3.5.4 Dielectric Strength Connector must withstand
test potential of 0.5 KVAC
for 1 minute. Current
leakage must be 0.5mA
max.
Measure by applying test potential
between the adjacent contacts, and
between the contacts and ground in
the mated connectors.
MIL-STD-202, Method 301
3.5.5 Temperature Rising
vs. Curent
30°C max. under loaded
specified current. Measure temperature rising by
energized current.
Fig.3.
AMP Spec.109-5310
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Para. Test Items Requirements Procedures
Physical Requirements
3.5.6 Vibration Sinusoidal
Low Frequency
No electrical discontinuity
greater than 1 microsecond
(s) shall occur.
Subject mated connectors to 10-55-
10 Hz traversed in 1 minute at 1.52
mm amplitude 2 hours each of 3
mutually perpendicular planes.
MIL-STD-202, Method 201
3.5.7 Physical Shock No electrical discontinuity
greater than 1 microsecond
(s) shall occur.
Subject mated connectors to 50 G’s
halfsine shock pulses of 11
millisecond duration:3 shocks in
each direction applied along the 3
mutually perpendicular planes
totally 18shocks;MIL-STD-
202,Method 213,Condition A
3.5.8 Connector Mating
Force 90 g max. per contact Using autograph, measure the force
required to mate connector using
locking latch by operating at 100
mm a minute. Calculate the value
for a contact. AMP Spec. 109-5206
3.5.9 Connector Unmating
Force 15 g min. per contact Using autograph, measure the force
required to unmate connector
without locking latch set in effect,
by operating at 100 mm a minute.
Calculate value for a contact. AMP
Spec. 109-5206
3.5.10 Durability (Repeated
Mate/Unmating) The requirements per
Para.3.5.2 shall be met. Mate and unmate connectors for
500 cycles at a maximum rate of 40
cycles minute. AMP Spec. 109-27
3.5.11 Solderability Solderable area shall have a
solder coverage of 95%
minimum.
With the connector mounted on
PCB. immerse in melted soldering
tub so that the lower surface of PCB
get wetted in the temperature of
230°C±5°C PCB for 5 seconds.
Fig.1 (To be continued)
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Para. Test items Requirements Procedures
3.5.12 Resistance to
Soldering Heat
(Dip Type)
No physical damage shall
occur.
Subject connector mounted on
printed circuit boards to solder bath
at 260±5°C for 5 seconds.
MIL-STD-202, Method 210 except
as indicated above
3.5.13 Thermal Shock The requirements per Para.
3.5.2 shall be met. Subject mated connectors to 5
cycles between –55 +0/-3 °C and
+85 +3/-0 °C. MIL-STD-202,
Method 107,Condition A
3.5.14 Humidity-
Temperature Cycling The requirements per
Paras.3.5.2, 3.5.3, and
3.5.4 shall be met.
Subject mated connectors to 10
cycles of humidity-temperature
changes between 25°C and 65°C at
95% R.H.
3.5.15 Salt Spay The requirements per Para.
3.5.2 shall be met.
Subject mated connectors to 5% salt
concentration for 48 hours;
MIL-STD-202, Method 101
Condition B.
3.5.16 Temperature Life The requirements per Para.
3.5.2 shall be met.
Subject mated connectors to
temperature life;85°C±2°C, 250
hours
MIL-STD-202, Method 108
Condition B.
3.5.17 Sulfurous acid gas The requirements per Para.
3.5.2 shall be met.
Subject mated connectors to
sulfurous acid gas of 10±3ppm
concentration in the room
temperature with 90% min. R.H. for
48 hours.
Fig.1 (End)
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3.6 Product Qualification and Requalification Tests.
Test Groups (a)
1 2 3 4 5 6 7 8 9 10 11
Test of Examination
Test Sequence (b)
Examination of
Product 1,7 1,5 1,5 1,5 1,5 1,5 1,6 1 1 1 1
Termination
Resistance, Dry
Circuit 2,6 2,4 2,4 2,4 2,4 2,4 2,5
Dielectric
Withstanding Voltage 2.5 3 3 3
Insulation Resistance 3,6
Temperature Rise vs
Current 2
Vibration 3
Physical Shock 4
Mating Force 3
Unmating Force 4
Durability 5
Solderability 4 2
Resistance to
Soldering Heat 2
Thermal Shock 3
Humidity-
Temperature Cycling 3
Corrosin, Salt Spray 3
Temperature Life 3
Sulfurous acid gas 3
Number of Samples 5 3 3 3 3 3 3 3 3 3 10
(a) Numbers indicate sequence in which tests are performed.
Fig.2
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Product Part No. Description
X-5175610-X Plug Connector, Horizontal Type, W/O Retention Leg.
X-5175472-X Plug Connector, Horizontal Type, with Retention Leg.
X-5175611-X Plug Connector, Vertical Type, W/O Retention Leg.
X-5175473-X Plug Connector, Vertical Type, with Retention Leg.
X-5175612-X Receptacle Connector, Horizontal Type, W/O Retention Leg.
X-5175474-X Receptacle Connector, Horizontal Type, with Retention Leg.
X-5175613-X Receptacle Connector, Vertical Type, W/O Retention Leg.
X-5175475-X Receptacle Connector, Vertical Type, with Retention Leg.
NOTE: Prefix and suffix numbers vary depending on the variations of the number of contacts and
plating designation.
Appendix 1