Description
The ATS636LSE programmable, true power-on state (TPOS),
device is optimized Hall-effect IC and rare-earth pellet
combinations that switch in response to magnetic signals
created by ferromagnetic targets in gear-tooth sensing and
proximity applications.
The device is externally programmable. A wide range of
programmability is available on the magnetic operate point
(BOP) while the hysteresis remains fixed. This advanced
feature allows for optimization of the circuit switchpoint and
can drastically reduce the effects of mechanical placement
tolerances found in production environments .
A proprietary dynamic offset cancellation technique, with
an internal high-frequency clock, reduces the residual offset
voltage, which is normally caused by device overmolding,
temperature dependencies, and thermal stress. Having the Hall
element and amplifier in a single chip minimizes many problems
normally associated with low-level analog signals.
This device is ideal for use in gathering speed or position
information using gear-tooth-based configurations, or for
proximity sensing with ferromagnetic targets.
635LSE-DS, Rev. 5
Features and Benefits
Chopper Stabilization
Extremely low switchpoint drift over temperature
On-chip Protection
Supply transient protection
Output short-circuit protection
Reverse-battery protection
True Zero-Speed Operation
True Power-On State
Single-chip Sensing IC for High Reliability
Optimized Magnetic Circuit
Wide Operating Voltage Range
Internal Regulator
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
Continued on the next page…
Package: 4-pin SIP (suffix SE)
Not to scale
ATS636LSE
Functional Block Diagram
Reg
Clock/Logic
AMP S/H LPF Current
Limit
VCC
OUT
GND
Programmming
Logic
Program / Lock
Offset Adjust
To all
subcircuits
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
2
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
The ATS636LSE has the opposite polarity and switches low in the
presence of a ferromagnetic target or tooth and switches high in
the presence of a target valley, window, or when the ferromagnetic
target is removed.
These devices are lead (Pb) free, with 100% matte tin leadframe
plating.
Description (continued)
Pin-out Diagram
Absolute Maximum Ratings
Characteristic Symbol Notes Rating Unit
Supply Voltage VCC
Fault conditions that produce supply voltage
transients will be clamped by an internal Zener
diode. These conditions can be tolerated but
should be avoided.
28 V
Reverse Supply Voltage VRCC –18 V
Overvoltage Supply Current ICC 100 mA
Output Off Voltage VOUT 26.5 V
Output Sink Current IOUT
Internal current limiting is intended to protect
the device from output short circuits, but is not
intended for continuous operation.
20 mA
Magnetic Flux Density B Unlimited
Package Power Dissipation PDSee Graph
Operating Ambient Temperature TARange L –40 to 150 ºC
Junction Temperature TJ165 ºC
Storage Temperature Range Tstg –65 to 170 ºC
Terminal List
Number Name Function
1 VCC Device supply
2 VOUT Device output
3 NC No connect
4 GND Device ground
Selection Guide
Part Number Output
(Tooth) Packing*
ATS636LSETN-T Low 13-in. reel, 450 pieces/reel
*Contact Allegro® for additional packing options.
2431
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
3
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
ELECTRICAL CHARACTERISTICS over operating voltage and junction temperature range; unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ.1Max. Unit
Supply Voltage2VCC Operating 4.2 24 V
Power-Up State POS After programming VCC = 0 × VCC
(min), t > tON
: B < BOP High High High
Low Output Voltage VOUT(SAT) Output on, IOUT = 20 mA 175 400 mV
Output Current Limit3IOUTM Pulse test method, output on 30 50 90 mA
Output Leakage Current IOFF Output off, VOUT = 24 V 10 A
Supply Current ICC Output off (high) 2.5 5.5 mA
Output on (low) 2.5 5.5 mA
Reverse Supply Current IRCC VRCC = –18 V –5 mA
Power-On Delay4tON Output off, VCC > VCC(min) – 35 50 s
Output Rise Time tr R
L = 820 , CL = 10 pF 1.2 5 s
Output Fall Time tf R
L = 820 , CL = 10 pF 1.2 5 s
Sampling Frequency fsample 250 kHz
Supply Zener Voltage VZsupply I
CC = ICC(max) + 3 mA, TA = 25°C 28 V
Output Zener Voltage VZoutput I
OUT = 3 mA, TA = 25°C 30 V
Supply Zener Current5IZsupply V
S = 28 V 8.5 mA
Output Zener Current IZoutput V
O = 30 V 3 mA
1Typical data is at VCC = 12 V and TA = 25°C.
2Do not exceed the maximum thermal junction temperature: see power derating curve.
3Short circuit protection is not intended for continuous operation and is tested using pulses.
4The Power-On Delay is the time that is necessary before the output signal is valid.
5The maximum spec limit for this parameter is equivalent to ICC
(max) + 3 mA.
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
4
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
MAGNETIC CHARACTERISTICS over operating voltage and junction temperature range using reference target; unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
Number of Programming Bits
Switchpoint 7 bit
Switchpoint Polarity 1 bit
Programming Lock 1 bit
Gear Tooth / Proximity Characteristics (Low switchpoint only)
Programming Air Gap Range1AGRange
Temperature = 25°C, Code = –127 2.5 mm
Temperature = 25°C, Code = +127 1.5 mm
Programming Resolution AGRes Temperature = 25°C Program Air Gap = 2.5 mm 0.05 mm
Air Gap Drift Over Full Temperature
Range2AGDrift Device programmed to 2.5 mm 0.2 mm
Polarity P Over tooth (ATS636LSE) Low
Over valley (ATS636LSE) High
1The switchpoint will vary over temperature. A sufficient margin obtained through customer testing is required to guarantee functionality over
temperature. Programming at larger air gaps leaves no safety margin for switchpoint drift. See the applications note Proximity Sensing
Programming Technique on the Allegro website at http://www.allegromicro.com for additional information.
2The switchpoint will vary over temperature, proportionally to the programmed air gap. This parameter is based on characterization data and is not
a tested parameter in production. Switchpoint air gap generally drifts downward as temperature increases.
Tooth and Valley Field vs. Air Gap
Reference Target
0
200
400
600
800
1000
1200
1400
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Air Gap [mm]
Flux Density [Gauss]
Reference Target Tooth
Reference Target Valley
Reference Target Tooth and Valley Field vs. Air Gap
Reference Target Flux Density vs. Position
0
200
400
600
800
1000
1200
1400
0 30 60 90 120 150 180 210 240 270 300 330 360
Position (º)
Flux Density (Gauss)
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.00
3.25
3.50
3.75
4.00
4.25
4.50
4.75
5.00
5.25
5.50
5.75
6.00
Reference Target Flux Density vs. Position: Typical
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
5
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
Characteristic Performance
ICC ON
0
1
2
3
4
5
6
-50 -25 0 2 5 50 75 100 125 150 175
TEMPERATURE (°C)
ICC (mA)
4V
15V
24V
ICC OFF
0
1
2
3
4
5
6
-50 -25 0 2 5 5 0 75 1 00 125 150 175
TEMPERATURE (°C)
ICC (mA)
4V
15V
24V
VSAT
0
100
200
300
400
500
-50 -25 0 25 50 75 100 125 150 175
TEMPERATURE (°C)
VSAT (mV)
20mA
Data taken from 3 lots, 30 pieces/lot
Reference Target 8x
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
6
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
BOP/BRP vs. Program Code
0
1
2
3
4
5
6
7
-50 0 50 100 150 200
TEMPERATURE (°C)
AIR GAP (mm)
Code -8 BOP
Code -8 BRP
Code 0 BOP
Code 0 BRP
Code +32 BOP
Code +32 BRP
Code +127 BOP
Code +127 BRP
Notes:
Air gaps for Code 127 at 150°C are interpolated due to test limitations at minimum air gap.
• These graphs are intended to provide an understanding of how the program codes affect the switchpoints. In a production
environment, individual devices would be programmed to individual codes to ensure all devices switch at the same air gap.
Data taken from 3 lots, 30 pieces/lot
Reference Target 8x
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
7
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
Gear Parameters for Correct Operation
Characteristic Description Min. Typ. Max. Unit
Tooth Whole Depth (ht) Depth of Target Valley 5 mm
Circular Valley Length (Pc – T) Length of Target Valley 13 mm
Circular Tooth Length (T) Length of Target Tooth 5 mm
Face Width (F) Thickness or Width of Target Tooth 5 mm
REFERENCE TARGET DIMENSIONS
Target Outside Diameter
(Do) Face Width
(F) Circular Tooth Length
(T) Circular Valley Length
(PC – T) Tooth Whole Depth
(ht)
Reference Target 120 mm 6 mm 23.5 mm 23.5 mm 5 mm
Reference Target Reference Target
Material: CRS 1018
Electromagnetic Capability (EMC) Performance
Please Contact Allegro MicroSystems for EMC Performance
Test Name Reference Specification
ESD – Human Body Model AEC-Q100-002
ESD – Machine Model AEC-Q100-003
Conducted Transients ISO 7637-1
Direct RF Injection ISO 11452-7
Bulk Current Injection ISO 11452-4
TEM Cell ISO 11452-3
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
8
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
Functional Description
Chopper-Stabilized Technique
The basic Hall element is a small sheet of semiconductor material
in which a constant bias current will flow when a constant volt-
age source is applied. The output will take the form of a voltage
measured across the width of the sheet and will have negligible
value in the absence of a magnetic field. When a magnetic field
with flux lines at right angles to the Hall current is applied, a
small signal voltage directly proportional to the strength of the
magnetic field will occur at the output terminals.
This signal voltage is proportionally small relative to the offset
produced at the input of the chip. This makes it very difficult
to process the signal and maintain an accurate, reliable output
over the specified temperature and voltage range. Therefore, it is
important to reduce any offset on the signal that could be ampli-
fied when the signal is processed.
Chopper stabilization is a unique approach used to minimize
input offset on the chip. This technique removes a key source of
output drift with temperature and stress, and produces a 3× reduc-
tion in offset over other conventional methods.
This offset reduction chopping technique is based on a signal
modulation-demodulation process. The undesired offset signal is
separated from the magnetically induced signal in the frequency
domain. The offset (and any low frequency noise) component of
the signal can be seen as signal corruption added after the signal
modulation process has taken place. Therefore, the DC offset is
not modulated and remains a low frequency component. Con-
sequently, the signal demodulation process acts as a modulation
process for the offset causing the magnetically induced signal
to recover its original spectrum at baseband while the DC offset
becomes a high frequency signal. Then, using a low pass filter,
the signal passes while the modulated DC offset is suppressed.
The advantage of this approach is significant offset reduction,
which desensitizes the chip against the effects of temperature and
stress. The disadvantage is that this technique features a demodu-
lator that uses a sample and hold block to store and recover the
signal. This sampling process can slightly degrade the signal-to-
noise Ratio (SNR) by producing replicas of the noise spectrum at
the baseband. The degradation is a function of the ratio between
the white noise spectrum and the sampling frequency. The effect
of the degradation of the SNR is higher jitter, a.k.a. signal repeat-
ability. In comparison to a continuous time device, the jitter spec
can be increased by a factor of five.
Regulator
Amplifier Sample/
Hold
Clock
Hall Element
Figure 1. Concept of Chopper-Stabilization Algorithm
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
9
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
The ATS636LSE magnetic operate point, BOP , is programmed by
serially addressing the devices through the supply terminal (1).
After the correct operate point is determined, the device program-
ming bits are selected and blown, then a lock bit is selected and
blown to prevent any further (accidental) programming.
Addressing BOP is programmable in both the positive and
negative direction from its initial value. Addressing is used to
determine the desired code, while programming is used to lock
the code. A unique key is needed to blow fuses, while addressing
as described below does not allow for the device to be pro-
grammed accidentally.
Addressing with positive polarity The magnetic oper-
ate point, BOP
, is adjustable using 7 bits or 128 addresses. The
addresses are sequentially selected (figure 2) until the required
operate point is reached. The first address must be selected with
a high voltage pulse, VPP , while the remaining pulses should
be VPH pulses. Note that the difference between BOP and the
magnetic release point, BRP
, the hysteresis, BHYS , is fixed for all
addresses.
Addressing with negative polarity The magnetic operate
point, BOP
, is adjustable with negative polarity using 7 bits or
128 addresses. To invert the polarity it is necessary to first apply
a keying sequence (figure 3). The polarity key contains a VPP
pulse and at least 1 VPH pulse, but no more than 6 VPH pulses;
the key in figure 3 shows 2 VPH pulses. The addresses are then
sequentially selected until the required operate point is reached.
The first address must be selected with a high voltage pulse, VPP ,
while the remaining pulses should be VPH pulses.
0
V
PL
V
PH
t
d(1)
t
d(0)
Code 1
Code 2
Code 3
Code N-2
Code N-1
Code N
(Up to 127)
V
PP
Figure 2. Addressing Pulses: Positive Polarity
0
V
PP
V
PL
V
PH
t
d(1)
t
d(0)
Code -1
Code -2
Code -3
Code -(N-2)
Code -(N-1)
Code -N
(Up to -127)
Polarity
Key
Figure 3. Addressing Pulses: Negative Polarity
Addressing / Programming Protocol
PROGRAMMING PROTOCOL Valid over operating temperature range, unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Programming Protocol (TA = 25°C)
Programming Voltage1,2
VPL Minimum voltage range during programming 4.5 5 5.5 V
VPH 8.5 15 V
VPP 25 27 V
Programming Current IPP Maximum supply current during programming 500 mA
Pulse Width
td(0) Off-time between bits 20 s
td(1) Enable, address, program, or lock bit on-time 20 s
tdP Program pulse on-time 100 300 s
Pulse Rise Time tr V
PL to VPH or VPP11 s
Pulse Fall Time tf V
PH or VPP to VPL5 s
1Programming voltages are measured at pin 1 (VCC) of the SIP. A minimum capacitance of 0.1 F must be connected from VCC to GND of the SIP to
provide the current necessary to blow the fuse.
2Testing is the only method that guarantees successful programming.
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
10
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
Program Enable To program the device, a keying sequence
is used to activate / enable the programming mode as shown in
figure 4. This program key sequence consisting of a VPP pulse, at
least seven VPH pulses, and a VPP pulse with no supply interrup-
tions. The sequence is designed to prevent the device from being
programmed accidentally (e.g., as a result of noise on the supply
line).
Code Programming After the desired switchpoint code is
selected (0 through 127), each bit of the corresponding binary
address should be programmed individually, not at the same
time. For example, to program code 5 (binary 000101), bits 1 and
3 need to be programmed. A bit is programmed by addressing
the code and then applying a VPP pulse, the programming is not
reversible. An appropriate sequence for blowing code 5 is shown
in figure 5.
Polarity Bit Programming If the desired switchpoint has
negative polarity, the polarity bit must be programmed. To do this
it is necessary to first apply the polarity key sequence before the
program key sequence (figure 6). Finally a VPP pulse of duration
tdP must be applied to program this bit, the programming is not
reversible. The polarity bit is for adjusting programming range
only and will not affect the output polarity.
0
t
d(1)
t
d(1)
t
d(0)
PROGRAM ENABLE
7 or More Pulses
(8 Pulses Shown)
V
PL
V
PH
V
PP
Figure 4. Program Enable Pulse Sequence
Figure 5. Code Programming Example
V
PH
V
PP
Program Enable
0
V
PL
t
d(1)
t
d(1)
t
d(0)
t
dP
Polarity
Key
Polarity Bit
Program
Figure 6. Polarity Bit Programming
V
PH
V
PP
Program Enable
Bit 1 Address
Bit 1 Program
Bit 3 Address
000100
Code 4
Bit 3 Program
Program Enable
0
V
PL
t
d(1)
t
d(1)
t
d(0)
t
dP
000001
Code 1
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
11
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
Lock-Bit Programming After the desired code is programmed, the
lock bit (code 128), can be programmed (figure 7) to prevent further
programming of the device. Again, programming is not reversible.
See Allegro website at http://www.allegromicro.com for extensive
information on device programming as well as programming
products. Programming hardware is available for purchase and
programming software is available for free.
Figure 7. Lock -Bit Programming Pulse Sequence
VPH
VPP
Program Enable
0
VPL
td(1) td(1) td(0) tdP
Lock Bit
Address
128 Pulses
Lock Bit
Program
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
12
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
For applications it is strongly recommended that an external
ceramic bypass capacitor in the range of 0.01 μF to 0.1 μF be
connected between the supply and ground of the device to reduce
both external noise and noise generated by the chopper-stabi-
lization technique. (The diagram below shows a 0.1 μF bypass
capacitor.)
The series resistor RS in combination with the bypass capacitor
creates a filter for EMC pulses. The series resistor will have a
drop of approximately 800 mV, this must be considered for the
minimum VCC requirement of the ATS636LSE. The small capaci-
tor on the output of the device improves the EMC performance
of the device. The pull-up resistor should be chosen to limit the
current through the output transistor; do not exceed the maximum
continuous output current of the device.
Note: This circuit cannot be used to program the device, as the
series resistance is too large, and a minimum capacitance of
0.1 μF must be connected from VCC to GND of the SIP to pro-
vide the current necessary to blow the fuse.
Extensive applications information on magnets and Hall-
effect ICs including chopper stabilization is available in
the Allegro Electronic Data Book CD, or at the website:
http://www.allegromicro.com.
1.2k Ohm
V
Supply
VCC
1
R
L
100 Ohm
2
4
GND
R
S
0.1 F
5V
VOUT
ATS636
120 pF
Typical Application:
Typical Application Circuit
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
13
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
Power Derating – SE Package
Due to internal power consumption, the junction temperature
of the IC (junction temperature, TJ) is higher than the ambient
environment temperature, TA. To ensure that the device does not
operate above the maximum rated junction temperature use the
following calculations:
ΔT = PD × RθJA
Where:
PD = VCC × ICC
∴ΔT = VCC × ICC × RθJA
Where ΔT denotes the temperature rise resulting from the IC’s
power dissipation.
T
J = TA + ΔT
R
θJA = 77°C/W
TJ(max) = 165°C
Typical TJ calculation:
T
A = 25°C
V
CC
= 5 V
I
CC(on) = 5.5 mA
P
D = VCC × ICC = 5 V × 5.5 mA = 27.5 mW
ΔT = PD × RθJA = 27.5 mW × 77°C/W = 2.0°C
T
J = TA + ΔT = 25°C + 2.0°C = 27.0°C
Maximum Allowable Power Dissipation Calculation:
T
J = TA + ΔT
T
J(max) = 165°C, if TA = 150°C
then:
165 = 150 + ΔT
ΔT = 15°C
ΔT = PD × RθJA (RθJA = 77°C/W)
\ PD(max) = 15°C / 77°C/W = 195 mW at TA = 150°C
Maximum VCC for PD(max) = 111 mW at TA = 150°C
P
D = VCC × ICC , ICC = 10 mA (max) at 150°C
V
CC = PD / ICC = 195 mW / 5.5 mA = 35.4 V
0
500
1000
1500
2000
2500
3000
3500
4000
4500
20 40 60 80 100 120 140 160 180
Temperature (°C)
Power Dissipation, P
D
(mW)
Power Dissipation versus Ambient Temperature
(RQJA = 77 ºC/W)
2-layer PCB
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
14
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
Package SE 4-Pin SIP
1.0 REF
0.9±0.1
1.3±0.1
4.9±0.1
3.3±0.1
10.00±0.05
7.00±0.05
6.23±0.10
11.60±0.10
0.60±0.10
24.65±0.10
0.71±0.10 0.71±0.10
1.60±0.10
1.27±0.10
5.50±0.10
2.00±0.10
1.0 REF
For Reference Only, not for tooling use (reference DWG-9001)
Dimensions in millimeters
243
1
A
A
A
B
C
C
D
D
B
Dambar removal protrusion (16X)
Metallic protrusion, electrically connected to pin 4 and substrate (both sides)
Thermoplastic Molded Lead Bar for alignment during shipment
Standard Branding Reference View
LLLLLLL
YYWW
NNN
Branded
Face
= Supplier emblem
L = Lot identifier
N = Last three numbers of device part number
Y = Last two digits of year of manufacture
W = Week of manufacture
Branding scale and appearance at supplier discretion
0.38 +0.06
–0.04
E
E
F
F
Active Area Depth, 0.43 mm
Hall element (not to scale)
Programmable Back Biased Hall-Ef fect
Switch with TPOS Functionality
15
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ATS636LSE
For the latest version of this document, visit our website:
www.allegromicro.com
Copyright ©2005-2012, Allegro MicroSystems, Inc.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to per-
mit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
Revision History
Revision Revision Date Description of Revision
Rev. 5 January 30, 2012 Update product availability