Features * * * * * * * * * * * Fast Read Access Time - 90 ns Word-wide or Byte-wide Configurable 4-megabit Flash and Mask ROM Compatible Low-power CMOS Operation - 100 A Maximum Standby - 50 mA Maximum Active at 5 MHz Wide Selection of JEDEC Standard Packages - 40-lead 600 mil PDIP - 44-lead SOIC (SOP) - 48-lead TSOP (12 mm x 20 mm) 5V 10% Power Supply High-reliability CMOS Technology - 2,000V ESD Protection - 200 mA Latch-up Immunity RapidTM Programming Algorithm - 50 s/Word (Typical) CMOS- and TTL-compatible Inputs and Outputs Integrated Product Identification Code Commercial and Industrial Temperature Ranges 4-megabit (256K x 16 or 512K x 8) OTP EPROM AT27C400 Description The AT27C400 is a low-power, high-performance, 4,194,304-bit, one-time programmable read-only memory (OTP EPROM) organized as either 256K by 16 or 512K by 8 bits. It requires a single 5V power supply in normal read mode operation. Any word can be accessed in less than 90 ns, eliminating the need for speed-reducing WAIT states. The by-16 organization makes this part ideal for high-performance 16- and 32(continued) bit microprocessor systems. PLCC A0 - A17 Addresses O0 - O15 Outputs O15/A-1 Output/Address BYTE/VPP Byte Mode/ Program Supply CE Chip Enable OE Output Enable NC No Connect A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC NC NC A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 O9 O2 O10 O3 O11 39 38 37 36 35 34 33 32 31 30 29 A12 A13 A14 A15 A16 BYTE/VPP GND O15/A-1 O7 O14 O6 TSOP Type 1 Note: Both GND pins must be connected. PDIP Top View SOIC (SOP) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Function O9 O2 O10 O3 O11 NC VCC O4 O12 O5 O13 Pin Name 6 5 4 3 2 1 44 43 42 41 40 A5 A6 A7 A17 NC NC NC A8 A9 A10 A11 Pin Configurations A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 O9 O2 O10 O3 O11 Not Recommended for New Designs 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 NC NC A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC A15 A14 A13 A12 A11 A10 A9 A8 NC NC NC NC NC NC NC NC A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE/VPP GND O15/A-1 I/O7 O14 O6 O13 O5 O12 O4 VCC O11 O3 O10 O2 O9 O1 O8 O0 OE GND CE A0 Rev. 0844C-05/00 1 The AT27C400 can be organized as either word-wide or byte-wide. The organization is selected via the BYTE/VPP pin. When BYTE/VPP is asserted high (VIH), the word-wide organization is selected and the O15/A-1 pin is used for O15 data output. When BYTE/VPP is asserted low (VIL), the byte-wide organization is selected and the O15/A-1 pin is used for the address pin A-1. When the AT27C400 is logically regarded as x16 (word-wide), but read in the bytewide mode, then with A-1 = VIL, the lower eight bits of the 16-bit word are selected and with A-1 = VIH, the upper eight bits of the 16-bit word are selected. In read mode, the AT27C400 typically consumes 15 mA. Standby mode supply current is typically less than 10 A. The AT27C400 is available in industry-standard, JEDECapproved, one-time programmable (OTP) PDIP, SOIC (SOP) and TSOP packages. The device features two-line control (CE, OE) to eliminate bus contention in high-speed systems. With high-density 256K word or 512K byte storage capability, the AT27C400 allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media. Atmel's AT27C400 has additional features that ensure high quality and efficient production use. The Rapid TM Block Diagram 2 AT27C400 Programming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 50 s/word. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industrystandard programming equipment to select the proper programming algorithms and voltages. System Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 F high-frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the V CC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 F bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. AT27C400 Absolute Maximum Ratings* Temperature under Bias ................................ -55C to +125C *NOTICE: Storage Temperature ..................................... -65C to +150C Voltage on Any Pin with Respect to Ground ........................................ -2.0V to +7.0V (1) Voltage on A9 with Respect to Ground .....................................-2.0V to +14.0V (1) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VPP Supply Voltage with Respect to Ground ......................................-2.0V to +14.0V (1) Integrated UV Erase Dose........ ................... .7258 W *sec/cm2 Note: 1. Minimum voltage is -0.6V DC, which undershoots to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC + 0.75V DC, which may overshoot to +7.0V for pulses of less than 20 ns. Operating Modes Outputs Mode/Pin CE Read Word-wide VIL Read Byte-wide Upper VIL OE VIL VIL BYTE/VPP O0 - O7 O8 - O14 O15/A-1 (1) VIH DOUT DOUT DOUT (1) VIL DOUT High-Z VIH (1) DOUT High-Z VIL Ai X X Read Byte-wide Lower VIL VIL X VIL Output Disable X(1) VIH X(1) X (1) (1) (5) High-Z VIH X X X High-Z Rapid Program VIL VIH Ai VPP DIN PGM Verify X VIL Ai VPP DOUT PGM Inhibit VIH VIH X(1) VPP High-Z VIL A9 = VH(3) A0 = VIH or VIL A1 - A17 = VIL VIH Identification Code Standby (2) (4) Product Identification Notes: VIL 1. X can be VIL or VIH. 2. Refer to the programming characteristics tables in this datasheet. 3. VH = 12.0 0.5V. 4. Two identifier words may be selected. All inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled low (VIL) to select the Manufacturer's Identification word and high (VIH) to select the Device Code word. 5. Standby VCC current (ISB) is specified with VPP = VCC. VCC > VPP will cause a slight increase in ISB. 3 DC and AC Operating Conditions for Read Operation AT27C400 -90 -12 -15 0C - 70C 0C - 70C 0C - 70C -40C - 85C -40C - 85C -40C - 85C 5V =10% 5V =10% 5V =10% Com. Operating Temperature (Case) Ind. VCC Power Supply DC and Operating Characteristics for Read Operation Symbol Parameter Condition ILI Input Load Current ILO IPP1(2) Max Units VIN = 0V to VCC 1 A Output Leakage Current VOUT = 0V to VCC 5 A VPP(1) Read/Standby Current VPP = VCC 10 A ISB1 (CMOS), CE = VCC 0.3V 100 A ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1 mA f = 5 MHz, IOUT = 0 mA, CE = VIL 40 mA VCC(1) Standby Current ISB VCC Active Current Min VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1 mA 0.4 V VOH Output High Voltage IOH = -400 A Notes: 2.4 V 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. 2. VPP may be connected directly to VCC , except during programming. The supply current would then be the sum of ICC and IPP. AC Characteristics for Read Operation AT27C400 -90 Symbol Parameter tACC(2) Address to Output Delay CE = OE = VIL 90 tCE(2) CE to Output Delay OE = VIL OE to Output Delay CE = VIL tOE (2)(3) Condition Min -12 Max Min -15 Max Min Max Units 120 150 ns 90 120 150 ns 35 40 50 ns 20 30 35 ns tDF(4)(5) OE or CE High to Output Float, whichever occurred first tOH(4) Output Hold from Address, CE or OE, whichever occurred first tST BYTE High to Output Valid 90 120 150 ns tSTD BYTE Low to Output Transition 40 50 60 ns Note: 4 2, 3, 4, 5. See the AC Waveforms for Read Operation diagram. AT27C400 5 5 5 ns AT27C400 Byte-wide Read Mode AC Waveforms Note: BYTE/VPP = VIL Word-wide Read Mode AC Waveforms Note: BYTE/VPP = VIH BYTE Transition AC Waveforms Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified. 2. OE maybe delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE maybe delayed up to tACC - tOE after the address is valid without impact on tACC. 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. 5 Input Test Waveforms and Measurement Levels Output Test Load 1.3V (1N914) OUTPUT PIN 3.3K CL tR, tF < 20 ns (10% to 90%) Note: CL = 100 pF including jig capacitance. Pin Capacitance f = 1 MHz, T = 25C(1) Symbol Typ Max Units Conditions CIN 4 10 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 6 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. AT27C400 AT27C400 Programming Waveforms(1) Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but mist be accommodated by the programmer. 3. When programming the AT27C400, a 0.1 F capacitor is required across VPP and ground to suppress spurious voltage transients. DC Programming Characteristics TA = 25= 5C, VCC = 6.5= 0.25V, VPP = 13.0= 0.25V Limits Symbol Parameter Test Conditions ILI Input Load Current VIN = VIL, VIH VIL Input Low Level VIH Input High Level VOL Output Low Voltage IOL = 2.1 mA VOH Output High Voltage IOH = -400 A ICC2 VCC Supply Current (Program and Verify) IPP2 VPP Supply Current VID A9 Product Identification Voltage Min Max Units 10 A -0.6 0.8 V 2.0 VCC + 0.5 V 0.4 V 2.4 CE = VIL 11.5 V 50 mA 30 mA 12.5 V 7 AC Programming Characteristics TA = 25= 5C, VCC = 6.5= 0.25V, VPP = 13.0= 0.25V Limits (1) Symbol Parameter Test Conditions tAS Address Setup Time tOES OE Setup Time tDS Data Setup Time tAH Address Hold Time Input Rise and Fall Times: (10% to 90%) 20 ns Input Pulse Levels: tDH Data Hold Time tDFP OE High to Output Float Delay(2) tVPS VPP Setup Time tVCS VCC Setup Time 0.45V to 2.4V (3) CE Program Pulse Width tOE Data Valid from OE tPRT BYTE/VPP Pulse Rise Time During Programming Max s 2 s 2 s 0 s 2 s 130 ns 2 s 2 s 47.5 Output Timing Reference Level: 0.8V to 2.0V Units 2 0 Input Timing Reference Level: 0.8V to 2.0V tPW Notes: Min 52.5 s 150 ns 50 ns 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven -- see timing diagram. 3. Program Pulse width tolerance is 50 sec 5%. Atmel's 27C400 Integrated Product Identification Code Pins A0 Codes 8 O15 O14 O13 O12 O11 O10 O9 O8 O7 O6 O5 O4 O3 O2 O1 O0 Hex Data Manufacturer 0 0 0 0 1 1 1 1 0 1E1E Device Type 1 1 1 1 1 0 1 0 0 F4F4 AT27C400 AT27C400 Rapid Programming Algorithm A 50 s CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and BYTE/VPP is raised to 13.0V. Each address is first programmed with one 50 s CE pulse without verification. Then a verification/reprogramming loop is executed for each address. In the event a word fails to pass verification, up to 10 successive 50 s pulses are applied with a verification after each pulse. If the word fails to verify after 10 pulses have been applied, the part is considered failed. After the word verifies properly, the next address is selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All words are read again and compared with the original data to determine if the device passes or fails. 9 Ordering Information ICC (mA) tACC (ns) Active Standby Ordering Code Package 90 40 0.1 AT27C400-90PC AT27C400-90RC AT27C400-90TC AT27C400-90JC 40P6 44R 48T 44J Commercial (0C to 70C) 40 0.1 AT27C400-90PI AT27C400-90RI AT27C400-90TI AT27C400-90JI 40P6 44R 48T 44J Industrial (-40C to 85C) 40 0.1 AT27C400-12PC AT27C400-12RC AT27C400-12TC AT27C400-12JC 40P6 44R 48T 44J Commercial (0C to 70C) 40 0.1 AT27C400-12PI AT27C400-12RI AT27C400-12TI AT27C400-12JI 40P6 44R 48T 44J Industrial (-40C to 85C) 40 0.1 AT27C400-15PC AT27C400-15RC AT27C400-15TC AT27C400-15JC 40P6 44R 48T 44J Commercial (0C to 70C) 40 0.1 AT27C400-15PI AT27C400-15RI AT27C400-15TI AT27C400-15JI 40P6 44R 48T 44J Industrial (-40C to 85C) 120 150 Package Type 40P6 40-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44R 44-lead, 0.525" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP) 48T 48-lead, Plastic Thin Small Outline Package (TSOP) 12 x 20 mm 44J 44-lead, Plastic J-leaded Chip Carrier (PLCC) 10 AT27C400 Operation Range AT27C400 Packaging Information 40P6, 40-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) Dimensions in Inches and (Millimeters) 44R, 44-lead, 0.525" Wide, Plastic Gull Wing Small Outline (SOIC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-011 AC 2.07(52.6) 2.04(51.8) PIN 1 .566(14.4) .530(13.5) .090(2.29) MAX 1.900(48.26) REF .220(5.59) MAX .005(.127) MIN SEATING PLANE .065(1.65) .015(.381) .022(.559) .014(.356) .161(4.09) .125(3.18) .110(2.79) .090(2.29) .012(.305) .008(.203) .065(1.65) .041(1.04) .630(16.0) .590(15.0) 0 REF 15 .690(17.5) .610(15.5) 48T, 48-lead, Plastic Thin Small Outline Package (TSOP) Dimensions in Millimeters and (Inches)* 44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AC JEDEC OUTLINE MO-142 DD .045(1.14) X 45 PIN NO. 1 IDENTIFY .045(1.14) X 30 - 45 .012(.305) .008(.203) .630(16.0) .590(15.0) .656(16.7) SQ .650(16.5) .032(.813) .026(.660) .695(17.7) SQ .685(17.4) .050(1.27) TYP .500(12.7) REF SQ .021(.533) .013(.330) .043(1.09) .020(.508) .120(3.05) .090(2.29) .180(4.57) .165(4.19) .022(.559) X 45 MAX (3X) *Controlling dimension: millimeters 11 Atmel Headquarters Atmel Operations Corporate Headquarters Atmel Colorado Springs 2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441-0311 FAX (408) 487-2600 Europe 1150 E. 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Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Atmel's Terms and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel's products are not authorized for use as critical components in life suppor t devices or systems. Marks bearing (R) and/or TM are registered trademarks and trademarks of Atmel Corporation. Terms and product names in this document may be trademarks of others. Printed on recycled paper. 0844C-05/00/xM