DE475-501N44A
RF Power MOSFET
V
DSS = 500 V
ID25 = 48 A
RDS(on) ≤ 0.13 Ω
ΩΩ
Ω
PDC = 1800W
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C 500 V
V
DGR
T
J
= 25°C to 150°C; R
GS
= 1 MΩ 500 V
V
GS
Continuous ±20 V
V
GSM
Transient ±30 V
I
D25
T
c
= 25°C 48 A
I
DM
T
c
= 25°C, pulse width limited by T
JM
288 A
I
AR
T
c
= 25°C 44 A
E
AR
T
c
= 25°C 30 mJ
dv/dt
I
S
≤ I
DM
, di/dt ≤ 100A/µs, V
DD
≤ V
DSS
,
T
j
≤ 150°C, R
G
= 0.2Ω 5 V/ns
I
S
= 0 >200 V/ns
P
DC
1800 W
P
DHS
T
c
= 25°C
Derate 4.0W/°C above 25°C 730 W
P
DAMB
T
c
= 25°C 4.5 W
R
thJC
0.08 C/W
R
thJHS
0.20 C/W
Symbol Test Conditions Characteristic Values
T
J
= 25°C unless otherwise specified
min. typ. max.
V
DSS
V
GS
= 0 V, I
D
= 3 ma 500 V
V
GS(th)
V
DS
= V
GS
, I
D
= 4 ma 3.5 4.5 5.5 V
I
GSS
V
GS
= ±20 V
DC
, V
DS
= 0 ±100 nA
I
DSS
V
DS
= 0.8 V
DSS
T
J
= 25°C
V
GS
= 0 T
J
= 125°C
50
1 µA
mA
R
DS(on)
V
GS
= 15 V, I
D
= 0.5I
D25
Pulse test, t ≤ 300µS, duty cycle d ≤ 2% 0.13 Ω
g
fs
V
DS
= 15 V, I
D
= 0.5I
D25
, pulse test 14 S
T
J
-55 +175 °C
T
JM
175 °C
T
stg
-55 +175 °C
T
L
1.6mm (0.063 in) from case for 10 s 300 °C
Weight 3 g
Features
• Isolated Substrate
− high isolation voltage (>2500V)
− excellent thermal transfer
− Increased temperature and power
cycling capability
• IXYS advanced low Q
g
process
• Low gate charge and capacitances
− easier to drive
− faster switching
• Low R
DS(on)
• Very low insertion inductance (<2nH)
• No beryllium oxide (BeO) or other haz-
ardous materials
Advantages
• Optimized for RF and high speed
switching at frequencies to 30MHz
• Easy to mount—no insulators needed
• High power density
♦
N-Channel Enhancement Mode
♦
Low Q
g
and R
g
♦
High dv/dt
♦
Nanosecond Switching
♦
30MHz Maximum Frequency
DRAIN
SG1 SG2
GATE
SD1 SD2
DE475-501N44A
RF Power MOSFET
Symbol Test Conditions Characteristic Values
(T
J
= 25°C unless otherwise specified)
min. typ. max.
R
G
0.3 Ω
C
iss
5100 pF
C
oss
V
GS
= 0 V, V
DS
= 0.8 V
DSS(max)
,
f = 1 MHz 300 pF
C
rss
92 pF
C
stray
Back Metal to any Pin 46 pF
T
d(on)
5 ns
T
on
V
GS
= 15 V, V
DS
= 0.8 V
DSS
I
D
= 0.5 I
DM
R
G
= 0.2 Ω (External)
5 ns
T
d(off)
5 ns
T
off
8 ns
Q
g(on)
155 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 V
DSS
I
D
= 0.5 I
D25
35 nC
Q
gd
87 nC
Source-Drain Diode Characteristic Values
(T
J
= 25°C unless otherwise specified)
Symbol Test Conditions min. max.
I
S
V
GS
= 0 V 44 A
I
SM
Repetitive; pulse width limited by T
JM
288 A
V
SD
1.5 V
T
rr
200 ns
I
F
= I
S
, V
GS
= 0 V,
Pulse test, t ≤ 300 µs, duty cycle ≤ 2%
Q
RM
I
F
= I
S
, -di/dt = 100A/µs,
V
R
= 100V
0.6 µC
I
RM
14 A
IXYS RF reserves the right to change limits, test conditions and dimensions.
IXYS RF MOSFETS are covered by one or more of the following U.S. patents:
4,835,592 4,860,072 4,881,106 4,891,686 4,931,844 5,017,508
5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,486,715
5,381,025 5,640,045
For detailed device mounting and installation instructions, see the “Device Installation & Mounting Instructions” technical note on the
IXYSRF web site at;
http://www.ixysrf.com/pdf/switch_mode/appnotes/7de_series_mosfet_installation_instructions.pdf
CAUTION: Operation at or above the Maximum Ratings values may impact device reliability or cause permanent damage to the device.
Information in this document is believed to be accurate and reliable. IXYSRF reserves the right to make changes to information pub-
lished in this document at any time and without notice.
DE475-501N44A
RF Power MOSFET
V
D S
vs. Capacitance
10
100
1000
10000
0 100 200 300 400
V
DS
Voltage (V)
Capacitance (pF)
Extended Typical Output Characteristics
0
50
100
150
200
250
0 10 20 30 40 50 60 70 80 90 100 110 120
V
DS
, Drain-to-Source Voltage (V)
I
D
, Drain Currnet (A)
Typical Transfer Characteristics
V
DS
= 50V, PW = 15µS
0
20
40
60
80
100
120
140
160
5 6 7 8 9 10 11 12 13 14 15
V
GS
, Gate-to Source Voltage (V)
I
D
, Drain Current (A)
Gate Charge vs. Gate-to-Source Voltage
V
DS
= 250V, I
D
= 22A
0
2
4
6
8
10
12
14
16
0 50 100 150 200 250
Gate Charge (nC)
Gate-to-Source Voltage (V)
Typical Output Characteristics
0
25
50
0 10 20 30 40 50 60 70 80 90 100 110 120
V
DS
, Drain-to-Source Voltage (V)
I
D
, Drain Currnet (A)
Top 10-15V
9V
8.5V
8V
7.5V
7V
Bottom 6.5V
C
rss
C
oss
C
iss
6V
8V - 15V
7.5V
7V
6.5V
Fig. 4
Fig. 5
Fig. 1 Fig. 2
Fig. 3
DE475-501N44A
RF Power MOSFET
Fig. 6 Package Drawing
Gate
Source
Source
Source
Source
Drain
DE475-501N44A
RF Power MOSFET
501N44A DE-SERIES SPICE Model
(Preliminary)
The DE-SERIES SPICE Model is illustrated in Figure 7. The model is an expansion of the SPICE
level 3 MOSFET model. It includes the stray inductive terms L
G
, L
S
and L
D
. Rd is the R
DS(ON)
of the
device, Rds is the resistive leakage term. The output capacitance, C
OSS
, and reverse transfer ca-
pacitance, C
RSS
are modeled with reversed biased diodes. This provides a varactor type response
necessary for a high power device model. The turn on delay and the turn off delay are adjusted via
Ron and Roff.
Figure 7 DE-SERIES SPICE Model
This SPICE model may be downloaded as a text file from the IXYSRF web site at
http://www.ixysrf.com/products/switch_mode.html
http://www.ixysrf.com/spice/de475-501n44a.html
Net List:
.SUBCKT 501N44A 10 20 30
* TERMINALS: D G S
* 500 Volt 44 Amp 0.13 ohm N-Channel Power MOSFET
* REV.A 01-09-02
M1 1 2 3 3 DMOS L=1U W=1U
RON 5 6 0.3
DON 6 2 D1
ROF 5 7 .1
DOF 2 7 D1
D1CRS 2 8 D2
D2CRS 1 8 D2
CGS 2 3 5.2N
RD 4 1 0.13
DCOS 3 1 D3
RDS 1 3 5.0MEG
LS 3 30 .5N
LD 10 4 1N
LG 20 5 1N
.MODEL DMOS NMOS (LEVEL=3 VTO=3.0 KP=3.8)
.MODEL D1 D (IS=.5F CJO=1P BV=100 M=.5 VJ=.6 TT=1N)
.MODEL D2 D (IS=.5F CJO=400P BV=500 M=.4 VJ=.6 TT=400N RS=10M)
.MODEL D3 D (IS=.5F CJO=900P BV=500 M=.3 VJ=.4 TT=400N RS=10M)
.ENDS
Doc #9200-0248 Rev 6
© 2009 IXYS RF
An IXYS Company
2401 Research Blvd., Suite 108
Fort Collins, CO USA 80526
970-493-1901 Fax: 970-493-1903
Email: sales@ixyscolorado.com
Web: http://www.ixyscolorado.com
