TECHNICAL DATA SHEET
1 / 5
SMT RECEPTACLE
R123.427.823
REEL 300
Series : QMA
Issue : 0923 D
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
All dimensions are in mm.
. .
pn ao
COMPONENTS
BODY
CENTER CONTACT
OUTER CONTACT
INSULATOR
GASKET
OTHERS PARTS
-
-
MATERIALS
BRASS
BERYLLIUM COPPER
PTFE
-
-
-
PLATING (
µm
)
NPGR
NPGR
-
-
-
TECHNICAL DATA SHEET
2 / 5
SMT RECEPTACLE
R123.427.823
REEL 300
Series : QMA
Issue : 0923 D
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
PACKAGING
SPECIFICATION
Standard
Unit
Other
300
Contact us
ELECTRICAL CHARACTERISTICS
ENVIRONMENTAL
Impedance
50
Ω
Operating temperature
-
40/+105
° C
Frequency
0
-
6
GHz
Hermetic seal
NA
Atm.cm3/s
VSWR
1.04
+
0,0450
x F(GHz) Maxi
Pane
l leakage
NA
Insertion loss
0.05
√
F(GHz) dB Maxi
RF leakage
-
(
80
- F(GHz)) dB Maxi
Voltage rating
500
Veff Maxi
Dielectric withstanding voltage
1000
Veff mini
Insulation resistance 5000
MΩ mini
OTHER CHARACTERISTICS
Assembly instruction
Others
:
MECHANICAL CHARACTERISTICS
Intermod.:-120dBc at 1.8GHz(2 x 20W)
RF leakage:Interf. only:3<F<6GHz:>70dB
Center contact retention
Axial force
–
Mating end
27
N mini
Axial force
–
Opposite end
27
N mini
Torque
2.8
N.cm mini
Recommende
d torque
Mating
NA
N.cm
Panel nut
NA
N.cm
Mating life
100
Cycles mini
Weight
1,2180
g
TECHNICAL DATA SHEET
3 / 5
SMT RECEPTACLE
R123.427.823
REEL 300
Series : QMA
Issue : 0923 D
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
QMA SERIE - INFORMATIONS
COPLANAR LINE : Pattern and signal are on the same side. Thickness of PCB = 0.063 (1.6mm).
The material of PCB is the epoxy resin of glass fabrics bacs (Er = 4.8). The solder resist should be printed except for
the land pattern on the PCB.
SHADOW OF QMA RECEPTACLE FOR VIDEO CAMERA
TECHNICAL DATA SHEET
4 / 5
SMT RECEPTACLE
R123.427.823
REEL 300
Series : QMA
Issue : 0923 D
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
40
80
120
160
200
240
280
320
360
20
40
60
80
100
120
140
160
180
200
220
240
260
280
Temps (Seconde)
130
180
260
10 s
40 s
10 s
Typique
Limites process
Temperature (Degre C)
215
245
SOLDER PROCEDURE
1. Deposit solder paste ‘SN62RP11AGS90’ on mounting zone by screen printing application. We recommend a
low residue flux.
We advise a thickness of 150 micromm (5.850 microinch). Verify that the edges of the zone are clean.
2. Placement of the receptacle on the mounting zone with an automatic ‘pick and place’ machine.
Video camera is preferred to check the positioning of the component (See page 3).
Adhesive agents are forbidden on the receptacle.
3. Soldering by infra-red reflow.
We give under, the typical profile to use.
4. Cleaning of the printed circuits board.
5. Checking of solder joints and position of the components by visual inspection.
TEMPERATURE PROFIL
TECHNICAL DATA SHEET
5 / 5
SMT RECEPTACLE
R123.427.823
REEL 300
Series : QMA
Issue : 0923 D
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
