PHASE SHIFTERS - DIGITAL - CHIP
3
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC647
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 2.5 - 3.1 GHz
v01.0208
General Description
Features
Functional Diagram
The HMC647 is a 6-bit digital phase shifter
die which is rated from 2.5 to 3.1 GHz, providing 360
degrees of phase coverage, with a LSB of 5.625
degrees. The HMC647 features very low RMS phase
error of 1.0 degrees and extremely low insertion loss
variation of ±0.5 dB across all phase states. This
high accuracy phase shifter is controlled with positive
control logic of 0/+5V, and is internally matched to 50
Ohms with no external components.
Low RMS Phase Error: 1.0°
Low Insertion Loss: 4 dB
High Linearity: +54 dBm
Positive Control Logic
360° Coverage, LSB = 5.625°
Die Size: 3.85 x 1.90 x 0.1 mm
Typical Applications
The HMC647 is ideal for:
• EW Receivers
• Weather & Military Radar
• Satellite Communications
• Beamforming Modules
• Phase Cancellation
Parameter Min. Typ. Max. Units
Frequency Range 2.5 3.1 GHz
Insertion Loss* 46dB
Input Return Loss* 16 dB
Output Return Loss* 17 dB
Phase Error* ±3 +5 / -15 deg
RMS Phase Error 1.0 deg
Insertion Loss Variation* ±0.5 dB
Input Power for 1 dB Compression 31 dBm
Input Third Order Intercept 54 dBm
Control Voltage Current 35 250 μA
Bias Control Current 515mA
*Note: Major States Shown
Electrical Speci cations, TA = +25° C,
Vss= -5V, Vdd= +5V, Control Voltage = 0/+5V, 50 Ohm System
PHASE SHIFTERS - DIGITAL - CHIP
3
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 2.5 - 3.1 GHz
v01.0208
HMC647
Insertion Loss, Major States Only Normalized Loss, Major States Only
Phase Error, Major States OnlyInput Return Loss, Major States Only
Output Return Loss, Major States Only
-12
-10
-8
-6
-4
-2
0
2 2.4 2.8 3.2 3.6
INSERTION LOSS (dB)
FREQUENCY (GHz)
-20
-15
-10
-5
0
5
10
15
20
2 2.4 2.8 3.2 3.6
PHASE ERROR (degrees)
FREQUENCY (GHz)
-30
-25
-20
-15
-10
-5
0
2 2.4 2.8 3.2 3.6
RETURN LOSS (dB)
FREQUENCY (GHz)
0
50
100
150
200
250
300
350
400
2 2.4 2.8 3.2 3.6
RELATIVE PHASE SHIFT (degrees)
FREQUENCY (GHz)
-30
-25
-20
-15
-10
-5
0
2 2.4 2.8 3.2 3.6
RETURN LOSS (dB)
FREQUENCY (GHz)
-4
-3
-2
-1
0
1
2
3
4
2 2.4 2.8 3.2 3.6
NORMALIZED LOSS (dB)
FREQUENCY (GHz)
Relative Phase Shift
Major States, Including All Bits
PHASE SHIFTERS - DIGITAL - CHIP
3
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Relative Phase Shift,
RMS, Average, Max, All States Input IP3, Major States Only
Input IP2, Major States Only Input P1dB, Major States Only
RMS Phase Error vs. Temperature
Insertion Loss vs. Temperature,
Major States Only
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 2.5 - 3.1 GHz
v01.0208
HMC647
-10
-8
-6
-4
-2
0
2.5 2.6 2.7 2.8 2.9 3.0 3.1
INSERTION LOSS (dB)
FREQUENCY (GHz)
-10
-5
0
5
10
15
20
2.5 2.6 2.7 2.8 2.9 3.0 3.1
+25C
+85C
-55C
RELATIVE PHASE SHIFT (degrees)
FREQUENCY (GHz)
10
15
20
25
30
35
40
2.5 2.6 2.7 2.8 2.9 3.0 3.1
P1dB (dBm)
FREQUENCY (GHz)
80
90
100
110
120
130
140
2.5 2.6 2.7 2.8 2.9 3.0 3.1
IP2 (dBm)
FREQUENCY (GHz)
40
45
50
55
60
65
70
75
80
2.5 2.6 2.7 2.8 2.9 3.0 3.1
IP3 (dBm)
FREQUENCY (GHz)
-10
-5
0
5
10
15
20
25
30
2.5 2.6 2.7 2.8 2.9 3.0 3.1
RMS
AVERAGE
MAX
RELATIVE PHASE SHIFT (degrees)
FREQUENCY (GHz)
PHASE SHIFTERS - DIGITAL - CHIP
3
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Phase Error vs. State
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 2.5 - 3.1 GHz
v01.0208
HMC647
Absolute Maximum Ratings
Input Power (RFIN) 33 dBm (T= +85 °C)
Bias Voltage Range (Vdd) -0.2 to +12V
Bias Voltage Range (Vss) +0.2 to -12V
Channel Temperature (Tc) 150 °C
Thermal Resistance
(channel to die bottom) 140 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Truth Table
Control Voltage
State Bias Condition
Low (0) 0 to 0.2 Vdc
High (1) Vdd ±0.2 Vdc @ 35 μA Typ.
Control Voltage Input Phase Shift
(Degrees)
RFIN - RFOUT
Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6
000000Reference*
100000 5.625
010000 11.25
001000 22.5
000100 45.0
000010 90.0
000001 180.0
111111 354.375
Any combination of the above states will provide a phase shift
approximately equal to the sum of the bits selected.
*Reference corresponds to monotonic setting
Bias Voltage & Current
Vdd Idd
5.0 5.3mA
Vss Iss
-5.0 5.3mA
-10
-5
0
5
10
0 45 90 135 180 225 270 315 360
PHASE ERROR (degrees)
STATE (degrees)
2.7, 2.8, 2.9, 3.0, 3.1 GHz
Pad Number Function Description Interface Schematic
1 RFIN This port is DC coupled and matched to 50 Ohms.
2, 11 GND These pads and die bottom
must be connected to RF/DC ground.
3Vdd Supply voltage.
4 - 6,
8 - 10
BIT1, BIT2, BIT3,
BIT4, BIT5. BIT6
Control Input. See truth table
and control voltage tables.
7Vss Supply voltage.
12 RFOUT This port is DC coupled and matched to 50 Ohms.
Pad Descriptions
PHASE SHIFTERS - DIGITAL - CHIP
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 2.5 - 3.1 GHz
v01.0208
HMC647
NOTES:
1. ALL DIMENSIONS IN INCHES (MILLIMETERS)
2. DIE THICKNESS IS 0.004
3. BACKSIDE METALLIZATION: GOLD
4. BACKSIDE METAL IS GROUND
5. BOND PADS METALLIZATION: GOLD
6. OVERALL DIE SIZE ±0.002
Die Packaging Information [1]
Standard Alternate
GP-1 (Gel Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
PHASE SHIFTERS - DIGITAL - CHIP
3
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 2.5 - 3.1 GHz
v01.0208
HMC647
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag
for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or ngers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean
and at.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy llet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).
Assembly Diagram
