EP2645TTS-26.000M TR REGULATORY COMPLIANCE (Data Sheet downloaded on Aug 16, 2019) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) 26.000MHz 50ppm -20C to +70C ELECTRICAL SPECIFICATIONS Nominal Frequency 26.000MHz Frequency Tolerance/Stability 50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range,Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration) Aging at 25C 5ppm/year Maximum Operating Temperature Range -20C to +70C Supply Voltage 3.3Vdc 10% Input Current 28mA Maximum (Unloaded) Output Voltage Logic High (Voh) Vdd-0.4Vdc Minimum (IOH= -8mA) Output Voltage Logic Low (Vol) 0.4Vdc Maximum (IOL= +8mA) Rise/Fall Time 4nSec Maximum (Measured at 20% to 80% of waveform) Duty Cycle 50 5(%) (Measured at 50% of waveform) Load Drive Capability 30pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (Disabled Output: High Impedance) Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output, No Connect to enable output. Disable Current 16mA Maximum (Pin 1 = Ground) Absolute Clock Jitter 250pSec Maximum, 100pSec Typical One Sigma Clock Period Jitter 50pSec Maximum Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 1 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2645TTS-26.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 0.15 5.08 0.15 4 3 MARKING ORIENTATION 5.00 0.15 2.20 0.15 2 1 1.4 0.2 1.4 0.1 3.68 0.15 PIN CONNECTION 1 Tri-State (High Impedance) 2 Ground/Case Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 26.000M 3 XXXXX XXXXX=Ecliptek Manufacturing Identifier 1.60 0.20 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 2 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2645TTS-26.000M TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 3 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2645TTS-26.000M TR Test Circuit for CMOS Output Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State or Power Down Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for `Load Drive Capability'. www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 4 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EP2645TTS-26.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 0.10 1.75 0.10 7.50 0.10 MARKING ORIENTATION 16.00 0.30 1.50 MIN 8.00 0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 16.4 +2.0/-0.0 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 5 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2645TTS-26.000M TR Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/Second Maximum 150C 175C 200C 60 - 180 Seconds 3C/Second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 Seconds 6C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 6 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EP2645TTS-26.000M TR Recommended Solder Reflow Methods Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/Second Maximum N/A 150C N/A 60 - 120 Seconds 5C/Second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 2 Times / 230C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 7 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200