REGULATORY COMPLIANCE (Data Sheet downloaded on Aug 16, 2019)
2011/65 +
2015/863 191 SVHC
EP2645TTS-26.000M TR
ITEM DESCRIPTION
Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
26.000MHz ±50ppm -20°C to +70°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency 26.000MHz
Frequency Tolerance/Stability ±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating
Temperature Range,Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration)
Aging at 25°C ±5ppm/year Maximum
Operating Temperature Range -20°C to +70°C
Supply Voltage 3.3Vdc ±10%
Input Current 28mA Maximum (Unloaded)
Output Voltage Logic High (Voh) Vdd-0.4Vdc Minimum (IOH= -8mA)
Output Voltage Logic Low (Vol) 0.4Vdc Maximum (IOL= +8mA)
Rise/Fall Time 4nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle 50 ±5(%) (Measured at 50% of waveform)
Load Drive Capability 30pF Maximum
Output Logic Type CMOS
Pin 1 Connection Tri-State (Disabled Output: High Impedance)
Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output, No Connect to enable output.
Disable Current 16mA Maximum (Pin 1 = Ground)
Absolute Clock Jitter ±250pSec Maximum, ±100pSec Typical
One Sigma Clock Period Jitter ±50pSec Maximum
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 1 of 7
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EP2645TTS-26.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
1.60 ±0.20
5.00
±0.15
7.00
±0.15
MARKING
ORIENTATION
3.68
±0.15
1.4 ±0.1 1.4 ±0.2
2.20
±0.15
5.08
±0.15
12
34
PIN CONNECTION
1 Tri-State (High
Impedance)
2 Ground/Case Ground
3 Output
4 Supply Voltage
LINE MARKING
1ECLIPTEK
226.000M
3XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
2.88
1.81
2.0 (X4)
2.2 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 2 of 7
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EP2645TTS-26.000M TR
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80% of Waveform
50% of Waveform
20% of Waveform
Fall
Time
Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUT TRI-STATE INPUT
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 3 of 7
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EP2645TTS-26.000M TR
Supply
Voltage
(VDD)
Test Circuit for CMOS Output
Output
Tri-State or
Power Down
Ground
+ +
+_
__
Power
Supply
0.01µF
(Note 1) 0.1µF
(Note 1)
CL
(Note 3)
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.
Voltage
Meter
Current
Meter
Oscilloscope Frequency
Counter
Probe
(Note 2)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 4 of 7
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
Tape & Reel Dimensions
All Dimensions in Millimeters
Compliant to EIA-481
DIA 50 MIN
DIA 20.20 MIN
DIA 13.00 ±0.20
2.50 MIN Width
10 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.50 MIN
Direction of Unreeling
MARKING
ORIENTATION
EP2645TTS-26.000M TR
16.00 ±0.30
7.50 ±0.10
1.50 MIN
4.00 ±0.10
2.00 ±0.10
8.00 ±0.10 A0
DIA 1.50 +0.10/-0.00
1.75 ±0.10
B0
0.60 MAX
0.10 MAX
K0
22.4 MAX
Quantity Per Reel: 1,000 units
360 MAX
16.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 5 of 7
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EP2645TTS-26.000M TR
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/Second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 Seconds
Ramp-down Rate 6°C/Second Maximum
Time 25°C to Peak Temperature (t) 8 Minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 6 of 7
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EP2645TTS-26.000M TR
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/Second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tp)10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate 5°C/Second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 03/25/2014 | Page 7 of 7
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
