MC14585BCP - Motorola / Freescale Semiconductor

MOTOROLA CMOS LOGIC DATA 1

MC14585B

  

The MC14585B 4–Bit Magnitude Comparator is constructed with comple-

mentary MOS (CMOS) enhancement mode devices. The circuit has eight

comparing inputs (A3, B3, A2, B2, A1, B1, A0, B0), three cascading inputs

(A < B, A = B, and A > B), and three outputs (A < B, A = B, and A > B). This

device compares two 4–bit words (A and B) and determines whether they

are “less than”, “equal to”, or “greater than” by a high level on the appropriate

output. For words greater than 4–bits, units can be cascaded by connecting

outputs (A > B), (A < B), and (A = B) to the corresponding inputs of the next

significant comparator. Inputs (A < B), (A = B), and (A > B) on the least

significant (first) comparator are connected to a low, a high, and a low,

respectively.

Applications include logic in CPU’s, correction and/or detection of

instrumentation conditions, comparator in testers, converters, and controls.

•Diode Protection on All Inputs

•Expandable

•Applicable to Binary or 8421–BCD Code

•Supply Voltage Range = 3.0 Vdc to 18 Vdc

•Capable of Driving Two Low–power TTL Loads or One Low–power

Schottky TTL Load over the Rated Temperature Range

•Can be Cascaded – See Fig. 3

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

MAXIMUM RATINGS* (Voltages Referenced to VSS)

Symbol Parameter Value Unit

VDD DC Supply Voltage – 0.5 to + 18.0 V

Vin, Vout Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V

Iin, Iout Input or Output Current (DC or Transient),

per Pin ± 10 mA

PDPower Dissipation, per Package† 500 mW

Tstg Storage Temperature – 65 to + 150

TLLead Temperature (8–Second Soldering) 260

*Maximum Ratings are those values beyond which damage to the device may occur.

†Temperature Derating:

Plastic “P and D/DW” Packages: – 7.0 mW/

C From 65

C To 125

Ceramic “L” Packages: – 12 mW/

C From 100

C To 125

TRUTH TABLE (x = Don’t Care)

Inputs

Outputs

Comparing Cascading

Outputs

A3, B3 A2, B2 A1, B1 A0, B0 A < B A = B A > B A < B A = B A > B

A3 > B3 x x x x x x 0 0 1

A3 = B3 A2 > B2 x x x x x 0 0 1

A3 = B3 A2 = B2 A1 > B1 x x x x 0 0 1

A3 = B3 A2 = B2 A1 = B1 A0 > B0 x x x 0 0 1

A3 = B3 A2 = B2 A1 = B1 A0 = B0 0 0 x 0 0 1

A3 = B3 A2 = B2 A1 = B1 A0 = B0 0 1 x 0 1 0

A3 = B3 A2 = B2 A1 = B1 A0 = B0 1 0 x 1 0 0

A3 = B3 A2 = B2 A1 = B1 A0 = B0 1 1 x 1 1 0

A3 = B3 A2 = B2 A1 = B1 A0 < B0 x x x 1 0 0

A3 = B3 A2 = B2 A1 < B1 x x x x 1 0 0

A3 = B3 A2 < B2 x x x x x 1 0 0

A3 < B3 x x x x x x 1 0 0



SEMICONDUCTOR TECHNICAL DATA

 Motorola, Inc. 1995

REV 3

1/94



L SUFFIX

CERAMIC

CASE 620

ORDERING INFORMATION

MC14XXXBCP Plastic

MC14XXXBCL Ceramic

MC14XXXBD SOIC

TA = – 55° to 125°C for all packages.

P SUFFIX

PLASTIC

CASE 648

D SUFFIX

SOIC

CASE 751B

BLOCK DIAGRAM

VDD = PIN 16

VSS = PIN 8

(A > B)in

(A = B)in

(A < B)in

(A > B)out

(A = B)out

(A < B)out

MOTOROLA CMOS LOGIC DATAMC14585B

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)

Characteristic

Symbol

VDD

Vdc

– 55

C 25

C 125

Unit

Characteristic

Symbol

VDD

Vdc

Min Max Min Typ # Max Min Max

Unit

Output Voltage “0” Level

Vin = VDD or 0 VOL 5.0

—

0.05

—

0.05

—

0.05

Vdc

“1” Level

Vin = 0 or VDD VOH 5.0

4.95

9.95

14.95

—

4.95

9.95

14.95

5.0

—

4.95

9.95

14.95

—

Vdc

Input Voltage “0” Level

(VO = 4.5 or 0.5 Vdc)

(VO = 9.0 or 1.0 Vdc)

(VO = 13.5 or 1.5 Vdc)

VIL 5.0

—

1.5

3.0

4.0

—

2.25

4.50

6.75

1.5

3.0

4.0

—

1.5

3.0

4.0

Vdc

“1” Level

(VO = 0.5 or 4.5 Vdc)

(VO = 1.0 or 9.0 Vdc)

(VO = 1.5 or 13.5 Vdc)

VIH 5.0

3.5

7.0

—

3.5

7.0

2.75

5.50

8.25

—

3.5

7.0

—

Vdc

Output Drive Current

(VOH = 2.5 Vdc) Source

(VOH = 4.6 Vdc)

(VOH = 9.5 Vdc)

(VOH = 13.5 Vdc)

IOH 5.0

5.0

– 3.0

– 0.64

– 1.6

– 4.2

—

– 2.4

– 0.51

– 1.3

– 3.4

– 4.2

– 0.88

– 2.25

– 8.8

—

– 1.7

– 0.36

– 0.9

– 2.4

—

mAdc

(VOL = 0.4 Vdc) Sink

(VOL = 0.5 Vdc)

(VOL = 1.5 Vdc)

IOL 5.0

0.64

1.6

4.2

—

0.51

1.3

3.4

0.88

2.25

8.8

—

0.36

0.9

2.4

—

mAdc

Input Current Iin 15 — ±0.1 — ±0.00001 ±0.1 — ±1.0 µAdc

Input Capacitance

(Vin = 0) Cin — — — — 5.0 7.5 — — pF

Quiescent Current

(Per Package) IDD 5.0

—

5.0

—

0.005

0.010

0.015

5.0

—

150

300

600

µAdc

Total Supply Current**†

(Dynamic plus Quiescent,

Per Package)

(CL = 50 pF on all outputs, all

buffers switching)

IT5.0

IT = (0.6 µA/kHz) f + IDD

IT = (1.2 µA/kHz) f + IDD

IT = (1.8 µA/kHz) f + IDD

µAdc

#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

**The formulas given are for the typical characteristics only at 25

†To calculate total supply current at loads other than 50 pF:

IT(CL) = IT(50 pF) + (CL – 50) Vfk

where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.

PIN ASSIGNMENT

125

B)out

VDD

B)in

(A = B)out

VSS

(A = B)in

B)in

MOTOROLA CMOS LOGIC DATA 3

MC14585B

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25

Characteristic Symbol VDD Min Typ # Max Unit

Output Rise and Fall Time

tTLH, tTHL = (1.5 ns/pF) CL + 25 ns

tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns

tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns

tTLH,

tTHL 5.0

—

100

200

100

Turn–On, Turn–Off Delay Time

tPLH, tPHL = (1.7 ns/pF) CL + 345 ns

tPLH, tPHL = (0.66 ns/pF) CL + 147 ns

tPLH, tPHL = (0.5 ns/pF) CL + 105 ns

tPLH,

tPHL 5.0

—

430

180

130

860

360

260

*The formulas given are for the typical characteristics only at 25

#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

Figure 1. Dynamic Power Dissipation

Signal Waveforms Figure 2. Dynamic Signal Waveforms

20 ns

VDD

VSS

VDD

VSS

VOH

VOL

VOH

VOL

VOH

VOL

(A < B)out

(A = B)out

(A > B)out

20 ns 20 ns

VDD

VSS

VOH

VOL

90%

50%

10%

tPLH tPHL

tTLH tTHL

90%

50%

10%

(A = B)out

(A < B)out

Inputs (A>B) and (A=B) high, and inputs B3, A3, B2,

A2, B1, A1, A0, and (A<B) low.

Inputs (A>B) and (A=B) high, and inputs B2, A2, B1,

A1, B0, A0 and (A<B) low.

f in respect to a system clock.

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However ,

precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance

circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must

be left open.

MOTOROLA CMOS LOGIC DATAMC14585B

Figure 3. Cascading Comparators

B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0

A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 VSS VDDVSS

WORD

B =

A =

WORD

MC14585B

B3 A3 B2 A2 B1 A1 B0 A0

(A<B)

(A=B)

(A>B)

INPUTS

(A<B)

(A=B)

(A>B)

OUTPUT

(A<B)

(A=B)

(A>B)

OUTPUTS

WORD B = B11, B10, ..., B0.

WORD A = A11, A10, ..., A0.

(A > B)in

(A = B)in

(A < B)in

(A < B)out

(A = B)out

(A > B)out

LOGIC DIAGRAM

MOTOROLA CMOS LOGIC DATA 5

MC14585B

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

HGD

16 PL

SEATING

1 8

916

PLANE

–T–

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.740 0.770 18.80 19.55

B0.250 0.270 6.35 6.85

C0.145 0.175 3.69 4.44

D0.015 0.021 0.39 0.53

F0.040 0.70 1.02 1.77

G0.100 BSC 2.54 BSC

H0.050 BSC 1.27 BSC

J0.008 0.015 0.21 0.38

K0.110 0.130 2.80 3.30

L0.295 0.305 7.50 7.74

M0 10 0 10

S0.020 0.040 0.51 1.01

____

L SUFFIX

CERAMIC DIP PACKAGE

CASE 620–10

ISSUE V

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)

WHERE THE LEAD ENTERS THE CERAMIC

BODY.

–A–

–B–

–T–

SEATING

PLANE

16 PLD

0.25 (0.010) T

16 PLJ

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.750 0.785 19.05 19.93

B0.240 0.295 6.10 7.49

C––– 0.200 ––– 5.08

D0.015 0.020 0.39 0.50

E0.050 BSC 1.27 BSC

F0.055 0.065 1.40 1.65

G0.100 BSC 2.54 BSC

H0.008 0.015 0.21 0.38

K0.125 0.170 3.18 4.31

L0.300 BSC 7.62 BSC

M0 15 0 15

N0.020 0.040 0.51 1.01

_ _ _ _

16 9

1 8

MOTOROLA CMOS LOGIC DATAMC14585B

OUTLINE DIMENSIONS

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B–05

ISSUE J

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

1 8

16 9

SEATING

PLANE

RX 45

8 PLP

–B–

–A–

0.25 (0.010) B S

–T–

16 PL

0.25 (0.010) A S

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A9.80 10.00 0.386 0.393

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.229 0.244

R0.25 0.50 0.010 0.019

____

How to reach us:

USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,

P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315

MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,

and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided

in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters,

including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent

rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant

into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a

situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application,

Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or

unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered

trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Af firmative Action Employer.

MC14585B/D

*MC14585B/D*

◊