AH117 - WJ Communications, Inc.

This document contains information on a new product.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com April 2003

The Communications Edg e TM

AH117

¼ Watt, High Linearity InGaP HBT Amplifier Preliminary Product Information

Product Features

• 400 – 2200 MHz

• +24 dBm P1dB

• +41 dBm Output IP3

• 18.5 dB Gain @ 900 MHz

• 15 dB Gain @ 1900 MHz

• Single Positive Supply (+5V)

• SOT-89 SMT Package

Product Description

The AH117 is a high gain, high dynamic range driver

amplifier in a low-cost surface mount package. The

InGaP/GaAs HBT is able to achieve performance over a

broad range with +41 dBm OIP3 and +24 dBm of

compressed 1-dB power and is housed in an industry

standard SOT-89 SMT package. All devices are 100%

RF and DC tested.

The product is targeted for use as a gain block/driver

amplifier for various current and next generation wireless

technologies such as GPRS, GSM, CDMA, W-CDMA,

and UMTS, where high linearity and medium power is

required. In addition, the AH117 will work for numerous

other applications within the 440 to 2000 MHz frequency

range such as CATV and fixed wireless. The internal

active bias allows the AH117 to maintain high

performance and low gain variation over temperature.

Functional Di agram

1 3

Function Pin No.

Input / Base 1

Output / Collector 3

Ground 2, 4

Specifications

Parameters Units Min Typ Max

Frequency Range MHz 400 1900 2200

Gain dB 15

Input R.L. dB 14

Output R.L. dB 8

Output P1dB dBm +24

Output IP32 dBm +41

Noise Figure dB 5.5

IS-95 Channel Power

@ -65 dBc ACP R, 9 Ch .Fwd. , 1960M Hz dBm +11

Operating Current Range mA 120

Device Voltage V 5

Test conditions unless otherwise noted. Specifications apply across entire frequency band.

1. T = 25ºC, Vsupply = +5 V, Frequency = 1900 MHz, in recommended application circuit

2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz.

The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

Typical Performance

Parameters Units Typical

Frequency MHz 900 1900

S21 dB 18.5 15

S11 dB -13 -14

S22 dB -11 -8

Output P1dB dBm + 24 +23

Output IP32 dBm +39 +39

Noise Figure dB 5.0 5.5

Supp ly Bias +5 V @ 120 mA

Typical parameters reflect performance in recommended application circuit:

Absolute Maximum Rating Ordering Information

Parameters Rating Part No. Description

Operating Case Temperature -40 to +85 °C A H117 0.2 5 Watt, H igh L i n e arity I n G aP H B T Am pli fie r

Stor age Te mperat ure -55 to +150 °C (Available in Tape & Reel)

RF Input Power (Continuous) +12 dBm

dc Voltage / Current +6 V / 200mA

Operation of this device above any of these parameters may cause permanent damage.

This document contains information on a new product.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com April 2003

The Communications Edg e TM

AH117

¼ Watt, High Linearity InGaP HBT Amplifier Preliminary Product Information

Outline Drawing

Land Pattern

Product Marking

The component will be marked with an “AH117”

designator with a four- or five-digit alphanumeric lot

code on the top surface of the package. Tape and reel

specifications for this part is located on the website in

the “Applica tion Note s” section.

ESD / MSL Info rmation

ESD Classification: Class 1B

Value: Passes at 1000V

Test: Human Body Model (HBM)

Standa rd: JEDEC Standard JE SD22-A114

MSL Ra ting: Level 2

Standard: JEDEC Standard J-STD-020A

Mounting Confi g. Notes

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

(#80 / .0135”) diameter drill and have a final plated

thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

3. Mounting screws can be added near the part to fasten

the board to a heatsink. Ensure that the ground /

thermal via region contac ts th e heatsink .

4. Do not put solder mask on the backside of the PC

board in the region where the board contacts the

heatsink.

5. RF trace width depends upon the PC board material

and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are

in degrees.

This document contains information on a new product.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com April 2003

The Communications Edg e TM

AH117

¼ Watt, High Linearity InGaP HBT Amplifier Preliminary Product Information

Typical Device Data

S-Parameters (VD = +5 V, ID = 120 mA, T = 25°C , calibrated to device leads)

Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

50 -2.65 177.33 17.51 152.58 -31.50 -0.15 -3.65 -177.48

100 -2.57 168.77 16.57 153.47 -31.42 -6.89 -3.50 171.39

200 -2.59 155.22 16.22 143.38 -31.36 -16.84 -3.49 155.69

300 -2.57 142.28 16.10 130.25 -31.38 -26.35 -3.52 141.70

400 -2.55 129.43 15.88 116.45 -31.34 -35.08 -3.57 128.21

500 -2.54 116.66 15.68 101.74 -31.37 -44.64 -3.63 115.10

600 -2.54 104.00 15.53 87.19 -31.18 -53.64 -3.72 102.05

700 -2.50 91.29 15.32 73.27 -31.23 -62.35 -3.80 89.03

800 -2.46 78.85 15.02 58.60 -31.20 -71.87 -3.90 76.35

900 -2.48 66.07 14.92 44.31 -30.96 -80.68 -3.98 63.64

1000 -2.47 53.51 14.58 31.42 -30.92 -88.65 -4.08 51.08

1100 -2.45 40.86 14.24 16.61 -30.89 -99.45 -4.17 38.62

1200 -2.41 28.14 14.11 3.55 -30.63 -107.77 -4.28 26.05

1300 -2.42 15.33 13.65 -10.11 -30.78 -116.61 -4.37 13.46

1400 -2.43 2.44 13.51 -25.13 -30.47 -128.20 -4.46 1.13

1500 -2.42 -10.30 13.36 -36.95 -30.12 -135.92 -4.57 -11.46

1600 -2.45 -23.37 12.90 -50.59 -30.33 -146.12 -4.67 -23.86

1700 -2.42 -36.30 12.79 -64.30 -29.95 -156.80 -4.76 -36.59

1800 -2.46 -49.39 12.52 -76.30 -29.77 -164.31 -4.85 -48.97

1900 -2.48 -62.48 12.14 -89.28 -29.90 -174.43 -4.97 -61.57

2000 -2.47 -76.10 11.88 -103.20 -29.75 175.27 -5.01 -74.30

2100 -2.50 -89.48 11.61 -116.14 -29.53 165.09 -5.10 -87.08

2200 -2.47 -102.75 11.38 -130.40 -29.40 154.30 -5.12 -99.62

2300 -2.48 -115.96 11.32 -141.99 -29.11 145.05 -5.20 -112.43

2400 -2.49 -129.34 10.77 -154.82 -29.18 134.89 -5.21 -125.02

2500 -2.48 -142.86 10.78 -168.81 -28.67 123.06 -5.22 -137.81

2600 -2.47 -155.90 10.34 -177.90 -28.56 119.33 -5.25 -150.27

2700 -2.47 -169.14 9.60 166.21 -29.51 104.59 -5.25 -162.60

2800 -2.45 178.16 9.77 153.14 -28.46 92.39 -5.23 -174.85

2900 -2.44 165.28 9.23 142.29 -28.79 86.95 -5.26 172.90

3000 -2.43 152.51 9.02 127.63 -28.69 70.65 -5.24 160.87

Thermal Information

Parameters Rating

Operating Case Temperature -40 to +85 °C

Stor age Te mperat ure -55 to +150 °C

Thermal Resistance 125 °C/W