XAA170 Dual Single-Pole, Normally Open OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Input Control Current Rating 350 100 50 5 Units VP mArms / mADC mA The XAA170 is a dual, normally open (1-Form-A) solid state relay comprising two independent, optically coupled relays in a single 8-pin package. Using optically coupled MOSFET technology, it provides 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Features * * * * * * * * * * Description 3750Vrms Input/Output Isolation Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Version Available By incorporating two independent single-pole relays into a single 8-pin package, the XAA170 saves board space by providing a more compact design solution than two discrete single-pole relays in a variety of applications. Approvals Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # Description XAA170 XAA170S XAA170STR 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount T&R (1000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-XAA170-R06 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION XAA170 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Ratings 350 5 50 1 150 800 Units VP V mA A mW mW Isolation Voltage, Input to Output Operational Temperature Storage Temperature 3750 -40 to +85 -40 to +125 Vrms C C 1 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / C Derate linearly 6.67 mW / C 2 Electrical Characteristics @ 25C Parameter Output Characteristics Load Current, Continuous Peak Load Current On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance Input to Output 2 Conditions Symbol Min Typ Max Units t=10ms IL=100mA VL=350VP IL ILPK RON ILEAK - 33 - 100 350 50 1 mArms / mADC mAP IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 5 5 - IL = 100mA - IF - 0.4 0.7 5 - mA mA IF = 5mA VR = 5V VF IR 0.9 - 1.2 - 1.5 10 V A VIO=0V, f=1MHz CIO - 3 - pF IF = 5mA, VL = 10V www.ixysic.com A ms pF R06 INTEGRATED CIRCUITS DIVISION XAA170 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 25 20 15 10 5 1.17 15 10 5 Device Count (N) 15 10 5 0.75 0.83 0.91 0.99 1.06 Turn-On Time (ms) 0.44 0.50 0.56 0.62 0.69 0.75 LED Current (mA) 10 5 0.11 20 15 10 5 0.14 0.17 0.19 0.22 0.25 Turn-Off Time (ms) 0.28 Typical On-Resistance Distribution (N=50, IL=100mADC) 25 0 0 15 1.14 Typical IF for Switch Dropout (N=50, IL=100mADC) 25 20 20 0 0.67 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mADC) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC) 25 Device Count (N) Device Count (N) 30 Device Count (N) 35 Typical Turn-On Time (N=50, IF=5mA, IL=100mADC) 20 15 10 5 0 0.44 0.81 0.50 0.56 0.62 0.69 0.75 LED Current (mA) 0.81 29.09 29.86 30.63 31.40 32.16 32.93 33.70 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) Device Count (N) 25 20 15 10 5 0 424.0 429.3 434.5 439.7 444.9 450.1 455.4 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=100mADC) 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 80 Temperature (C) 100 120 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION XAA170 PERFORMANCE DATA* 1.8 1.4 1.2 1.0 IF=10mA 0.8 IF=20mA 0.6 0.4 0.2 0 -40 -20 0 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 100 120 20 40 60 80 Temperature (OC) 6 LED Current (mA) LED Current (mA) 3 2 1 0 20 40 60 80 Temperature (C) 100 -20 0 20 40 60 80 Temperature (C) Typical IF for Switch Dropout vs. Temperature (IL=100mADC) 4 3 2 100 120 30 20 10 -40 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 0 -40 40 120 1 0 -40 -20 0 20 40 60 80 Temperature (C) 100 120 0.016 450 0.014 80 IF=10mA IF=5mA IF=2mA 60 40 445 440 435 430 20 425 0 -40 420 -20 0 20 40 60 80 Temperature (C) 100 120 Leakage (PA) Blocking Voltage (VP) 455 140 100 0 20 40 60 80 Temperature (OC) 100 120 -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 Typical Leakage vs. Temperature Measured Across Pins 4&6 160 120 -20 Typical Load Current vs. Load Voltage (IF=5mA) Typical Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature Load Current (mA) -20 5 4 50 0 6 5 70 60 -40 Typical IF for Switch Operation vs. Temperature (IL=100mADC) Typical On-Resistance vs. Temperature (IF=5mA, IL=100mADC) Load Current (mA) Turn-On Time (ms) Turn-Off Time (ms) IF=5mA 1.6 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=120mADC) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=100mADC) 0.012 0.010 0.008 0.006 0.004 0.002 -40 -20 0 20 40 60 Temperature (C) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION XAA170 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification XAA170 / XAA170S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles XAA170 XAA170S 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION XAA170 Mechanical Dimensions XAA170 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 0.457 0.076 (0.018 0.003) 3.302 0.051 (0.130 0.002) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 0.0127 (0.010 0.0005) 7.620 0.127 (0.300 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) XAA170S 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) 6 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION XAA170 XAA170STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-XAA170-R06 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/29/2018