10900 PAGE AVE.
ST. LOUIS, MO. 63132 USA
FEATURES PRODUCT DESCRIPTION
PACKAGE DIMENSIONS inch (mm)
ELECTRO-OPTICAL CHARACTERISTICS @ 25° C
0.6
±70
17
30
ISC
SR
ID
VBR
CJ
θ1/2
SHORT CIRCUIT CURRENT @ 100 2850 K
SENSITIVITY @ PEAK
DARK CURRENT @ VR = 10 V
REVERSE BREAKDOWN VOLTAGE @ 100 µA
JUNCTION CAPACITANCE @ VR = 0 V, 1 MHz
ANGULAR RESPONSE (50% RESPONSE POINT)
TYP.MIN.SYMBOLPARAMETER
µA
A/W
nA
V
pF
Degrees
25
100
UNITSMAX.
This VTP processed P on N planar silicon
photodiode is housed in an IR transmitting,
T-1 3/4 endlooking package.
These diodes exhibit low dark current under
reverse bias. The VTP process offers low
capacitance, resulting in fast response times.
•Low dark current
•Fast response
•Infrared transmiting/visible blocking
spectral range
•Low junction capacitance
CASE 26F T-1 3/4 FLAT
CHIP SIZE: .075 x .075 (1.90 x 1.90)
TOTAL EXPOSED AREA: .0036 in2 (2.326 mm2)
FAX 314-423-3956
PHONE 314-423-4900
PRELIMINARY ENGINEERING DATA SHEET
SILICON PHOTODIODE
VTP1332F