1MBH50-060,1MBH50D-060, Molded IGBT
600V / 50A
Molded Package
Features
· Small molded package
· Low power loss
· Soft switching with low switching surge and noise
· High reliability, high ruggedness (RBSOA, SCSOA etc.)
· Comprehensive line-up
Applications
· Inverter for Motor drive
· AC and DC Servo drive amplifier
· Uninterruptible power supply
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25°C unless otherwise specified)
Item Symbol
Collector-Emitter voltage VCES
Gate-Emitter voltaga VGES
Collector DC Tc=25°C IC25
current Tc=100°C IC100
1ms Tc=25°C Icp
Max. power dissipation(IGBT) PC
Operating temperature Tj
Storage temperature Tstg
Screw torque -
Rating
600
±20
82
50
328
310
+150
-40 to +150
70
Unit
V
V
A
A
A
W
°C
°C
cm
Equivalent Circuit Schematic
Item Symbol
Collector-Emitter voltage VCES
Gate-Emitter voltaga VGES
Collector DC Tc=25°C IC25
current Tc=100°C IC100
1ms Tc=25°C Icp
Max. power dissipation (IGBT) PC
Max. power dissipation (FWD) PC
Operating temperature Tj
Storage temperature Tstg
Screw torque -
Rating
600
±20
82
50
328
310
140
+150
-40 to +150
70
Unit
V
V
A
A
A
W
W
°C
°C
cm
1MBH50-060 / IGBT
1MBH50D-060 / IGBT+FWD
C:Collector
E:Emitter
G:Gate
IGBT
C:Collector
E:Emitter
G:Gate
IGBT + FWD
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Item
Zero gate voltage collector current
Gate-Emitter leakage current
Gate-Emitter threshold voltage
Collector-Emitter saturation voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on time
Turn-off time
ICES
IGES
VGE(th)
VCE(sat)
Cies
Coes
Cres
ton
tr
toff
tf
1.0
––20
5.5 8.5
3.0
3000
650
150
1.2
0.6
1.0
0.35
VGE=0V, VCE=600V
VCE=0V, VGE=±20V
VCE=20V, I C=50mA
VGE=15V, IC=50A
VGE=0V
VCE=10V
f=1MHz
VCC=300V, IC=50A
VGE=±15V
RG=62 ohm
(Half Bridge)
mA
µA
V
V
pF
µs
Electrical characteristics (at Tj=25°C unless otherwise specified)
Thermal resistance characteristics
Thermal resistance 0.40
0.89 IGBT
FWD °C/W
°C/W
Item Symbol Characteristics Conditions Unit
Min. Typ. Max.
Rth(j-c)
Rth(j-c)
Symbol Characteristics Conditions Unit
Min. Typ. Max.
Item
Zero gate voltage collector current
Gate-Emitter leakage current
Gate-Emitter threshold voltage
Collector-Emitter saturation voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on time
Turn-off time
FWD forward on voltage
Reverse recovery time
ICES
IGES
VGE(th)
VCE(sat)
Cies
Coes
Cres
ton
tr
toff
tf
VF
trr
1.0
––20
5.5 8.5
3.0
3000
650
150
1.2
0.6
1.0
0.35
3.0
0.3
VGE=0V, VCE=600V
VCE=0V, VGE=±20V
VCE=20V, I C=50mA
VGE=15V, IC=50A
VGE=0V
VCE=10V
f=1MHz
VCC=300V, IC=50A
VGE=±15V
RG=62 ohm
(Half Bridge)
IF=50A, VGE=0V
IF=50A, VGE=-10V, di/dt=100A/µs
mA
µA
V
V
pF
µs
V
µs
Symbol Characteristics Conditions Unit
Min. Typ. Max.
1MBH50-060, 1MBH50D-060 Molded IGBT
1MBH50-060 / IGBT
1MBH50D-060 / IGBT+FWD
Thermal resistance 0.40 IGBT °C/W
Item Symbol Characteristics Conditions Unit
Min. Typ. Max.
Rth(j-c)
1MBH50-060 / IGBT
1MBH50D-060 / IGBT+FWD
Outline drawings, mm
1MBH50-060, 1MBH50D-060
TO-3PL
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Characteristics
1MBH50-060,1MBH50D-060
1MBH50-060, 1MBH50D-060 Molded IGBT
Collector current vs. Collector-Emitter voltage
Tj=25°C Collector current vs. Collector-Emitter voltage
Tj=125°C
Collector-Emitter vs. Gate-Emitter voltage
Tj=25°C Collector-Emitter vs. Gate-Emitter voltage
Tj=125°C
Switching time vs. Collector current
Vcc=300V, RG=62 ohm, VGE=±15V, Tj=25°C Switching time vs. Collector current
Vcc=300V, RG=62 ohm, VGE=±15V, Tj=125°C
Collector-Emitter voltage : VCE [V] Collector-Emitter voltage : VCE [V]
Collector current : Ic [A]
Collector current : Ic [A]
0 1 2 3 4 5
Collector-Emitter voltage : VCE [V]
Collector-Emitter voltage : VCE [V]
0 5 10 15 20
Gate-Emitter voltage : VGE [V] Gate-Emitter voltage : VGE [V]
Switching time : ton, tr, toff, tf [n sec.]
100
10
Collector current : Ic [A] Collector current : Ic [A]
Switching time : ton, tr, toff, tf [n sec.]
0 20 40 60 80
100
80
60
40
20
0
10
8
6
4
2
0
1000
10
8
6
4
2
0
100
10
1000
0 1 2 3 4 5
0 5 10 15 20
100
80
60
40
20
0
0 20 40 60 80
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Collector-Emitter voltage : VCE [V]
10
Capacitance : Cies, Coes, Cres [nF]
Capacitance vs. Collector-Emitter voltage
Tj=25°C
0 5 10 15 20 25 30 35
100
IGBT Module
Switching time vs. RG
Vcc=300V, Ic=50A, VGE=±15V, Tj=25°C
Dynamic input characteristics
Tj=25°C
Gate resistance : RG [ohm]
0 50 100 150 200 250
Gate charge : Qg [nC]
100
1000
10
Switching time : ton, tr, toff, tf [n sec.]
Collector-Emitter voltage : VCE [V]
Gate-Emitter voltage : VGE [V]
120
100
80
60
40
20
00 100 200 300 400 500 600 700
Collector-Emitter voltage : VCE [V]
Collector current : Ic [A]
25
20
15
10
5
0
500
400
300
200
100
0
Switching time vs. RG
Vcc=300V, Ic=50A, VGE=±15V, Tj=125°C
Gate resistance : RG [ohm]
100
1000
10
Switching time : ton, tr, toff, tf [n sec.]
Reversed biased safe operating area
+VGE=15V, -VGE = 15V, Tj = 125°C, RG = 62 ohm
<<> Typical short circuit capability
Vcc=400V, RG=62 ohm, Tj=125°C
Short circuit time : tsc [µs]
1000
600
500
400
300
200
100
0 5 10 15 20 25
Short circuit time current : Isc [A]
Characteristics
1MBH50-060,1MBH50D-060
1MBH50-060, 1MBH50D-060
Gate voltage : VGE [V]
0 50 100 150 200 250
0 50 100 150 200 250
60
50
40
30
20
10
0
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IGBT Module
10-4 10-3 10-2 10-1 100
Pulse width : PW [sec.]
Thermal resistance : Rth (j-c) [°C/W]
Transient thermal resistance
Characteristics
1MBH50-060,1MBH50D-060
1MBH50D-060
Reverse recovery time vs. Forward current
-di/dt=150A / µsec Reverse recovery current vs. Forward current
-di/dt=150A / µsec
reverse recovery time : trr [nsec]
reverse recovery current : Irr [A]
400
300
200
100
0
15
10
5
0
0 20 40 60 80
Forward current : IF [A] Forward current : IF [A]
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 100 200 300 400 500
Forward voltage : VF [V]
Forward current : IF [A]
reverse recovery time : trr [nsec]
-di/dt [ A / µsec ]
Forward current vs. Foeward voltage Reverse recovery time characteristics vs. -di/dt
IF=50A, Tj=125°C 25
20
15
10
5
0
reverse recovery current : Irr [A]
100
10-1
10-2
101
100
80
60
40
20
0
500
400
300
200
100
0
1MBH50-060, 1MBH50D-060
0 20 40 60 80
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