AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 1
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
Data Sheet
Part number(s)
AKU143
Package type
4-pin LGA top port
Data sheet revision
1.01
Release date
12 December 2014
Document number
DS37-1.01 AKU143 Data Sheet
Notes
Specifications are subject to change without notice.
Product photos and pictures are for illustration purposes only and may differ
from the real product’s appearance.
Data Sheet
AKU143
Top Port, Analog Silicon MEMS Microphone
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 2
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
AKU143
Analog, HD Voice Silicon MEMS Microphone
General Description
AKU143 is an HD Voice quality, top port,
analog output MEMS semiconductor
microphone. It is a microphone consisting of a
MEMS acoustic sensor, and an integrated
circuit (IC) with a pre-amplifier, charge pump,
and supporting circuitry in an industry standard
package footprint of 2.95mm x 3.76mm x
1.10mm.
Designed specifically to meet the demanding
requirements of mobile handset OEMs,
AKU143 offers excellent acoustic performance
with 65dB signal-to-noise ratio (SNR) and
uniform sensitivity matching of just +1dB
between microphones. Unlike other top port
analog microphones, AKU143 offers a flat
wideband frequency response, with deviations
less than 5dB from 50Hz to 14kHz and a
resonance past 20kHz, delivering uniform audio
capture across a broad acoustic spectrum. The
AKU143 Faraday-cage constructed package is
immune to RF and Electromagnetic (EM)
interferences, allowing for easy integration into
wireless devices.
Key Features
Analog output, Top Port Design with
Bottom Port Performance
Omni-directional silicon microphone
Excellent acoustic performance: 65dB SNR
Tight sensitivity tolerance: -42dB + 1dB
Acoustic Overload Point (AOP): 126dBSPL
Matched microphones in frequency and
phase response for array applications
Flat frequency response for super-
wideband audio
Package immune to RF/EM interference
Lead-free, surface-mountable and RoHS2
compliant
Halogen-free compliance, IEC61249-2-21
Thin profile, SMT packaging
Industry std. package: 2.95x3.76x1.10mm3
Built-in support for 2-wire mode
Typical Applications
Smartphones and mobile phones
Digital still/video cameras
IC / digital voice recorders
Portable media players
Gaming consoles / controllers
Voice activated entertainments systems
and remote controllers
Smart-home sensor hubs / clusters, and
IoTS acoustic sensor nodes
Microphone arrays – multi-mic applications
and noise cancellation algorithms which
benefit from uniform microphones
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 3
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
Index of Contents
1. ABSOLUTE MAXIMUM RATINGS .............................................................................................................. 4
2. STANDARD OPERATING CONDITIONS ................................................................................................... 4
3. ELECTRICAL AND ACOUSTIC SPECIFICATIONS ................................................................................... 4
4. DEVICE CHARACTERISTICS ..................................................................................................................... 5
4.1 Typical Frequency Response
5. MECHANICAL SPECIFICATIONS .............................................................................................................. 6
6. PIN-OUT AND CONNECTION DIAGRAMS ................................................................................................ 7
6.1 Pin Out
6.2 Typical Application Schematic
6.2.1 3-wire mode application diagram
6.2.2 2-wire mode application diagram
7. MANUFACTURING NOTES ....................................................................................................................... 9
7.1 Solder Reflow
7.2 Microphone Handling
7.3 PCB Land Pattern & Stencil Pattern
8. RELIABILITY SPECIFICATIONS .............................................................................................................. 12
9. PART MARKING INFORMATION ............................................................................................................. 12
10. PACKAGING INFORMATION ................................................................................................................. 13
11. ORDERING INFORMATION .................................................................................................................... 14
12. DOCUMENT REVISIONS ........................................................................................................................ 14
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 4
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
1. ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD to GND 5.5V
ESD Tolerance
Human Body Model 2000V
Machine Model 200V
Storage Temperature Range -40°C to 105°C
2. STANDARD OPERATING CONDITIONS
Operating Temperature Range -40°C to 85°C
Supply Voltage (VDD) 1.62V to 3.6V
3. ELECTRICAL AND ACOUSTIC SPECIFICATIONS
Unless otherwise noted, test conditions are:
VDD = 2.0V Ta = 25°C RH = 50% Mode = 3-wire
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Directivity
Omni-directional
Signal to Noise Ratio (SNR)
fin = 1kHz, A-weighted, 20Hz-
10kHz
65
dB
Low Frequency Corner1
-3dB from 1kHz sensitivity value
50
100
Hz
Upper Frequency Corner
+3dB from 1kHz sensitivity value
11.5
kHz
Sensitivity1
1kHz, 94dBSPL
-43
-42
-41
dBV/Pa
Total Harmonic Distortion1
(THD)
@ 94dB SPL, fin = 1kHz
1
%
@ 114dB SPL, fin = 1kHz
3
Acoustic Overload Point
(AOP)
< 10% THD, fin = 1kHz
126
dBSPL
Power Supply Rejection
Ratio (PSRR)
100mVpp, f = 217Hz
55
dB
Current Consumption1
No load
155
170
A
Output Impedance
200
Sensitivity loss across
voltage
Change in sensitivity over 3.6V
to 1.62V
0.75
dB
Part-to-part phase matching
From nominal @ 1kHz
±10
°
Polarity
Increasing sound pressure
Increasing output voltage
Note 1: Max./min. value of parameter 100% tested
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 5
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
4. DEVICE CHARACTERISTICS
4.1 Frequency Response
(Measured frequency response normalized to
1kHz)
4.2 IDD vs. VDD
(Measured current consumption relative to
supply voltage)
4.3 Sensitivity vs. VDD
(Measured sensitivity changes relative to supply
voltage)
4.4 Total Harmonic Distortion
(Measured THD relative to speaker output
pressure level)
4.5 Sensitivity vs. Temperature
(Typical sensitivity changes relative to
temperature)
4.6 PSRR vs. Frequency
(Typical PSRR relative to frequency)
-10
-5
0
5
10
15
10.0 100.0 1000.0 10000.0
Normalized Microphone Output re:1kHz Mo
Frequency (Hz)
100.0
150.0
200.0
250.0
1 1.5 2 2.5 3 3.5 4 4.5
IDD (µA)
VDD (V)
-3
-2
-1
0
1
2
3
1 1.5 2 2.5 3 3.5 4 4.5 5
Output (dB) VDD = 2.0V
VDD (V)
0
5
10
15
20
25
THD, (%)
Speaker Output Pressure, (dBSPL)
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
-60 -40 -20 020 40 60 80 100
Change in Sensitivity (dB) re: 25C
Temperature (ºC)
20
30
40
50
60
70
10 100 1000 10000
PSR (dB)
Frequency (Hz)
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 6
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
5. MECHANICAL SPECIFICATIONS
Item
Dimension
Tolerance
Units
Length (L)
3.76
± 0.10
mm
Width (W)
2.95
± 0.10
mm
Height (H)
1.10
± 0.10
mm
Acoustic Port (AP)
0.50
± 0.05
mm
Solder Mask (SRO)
0.850
± 0.05
mm
Planarity
Top/Bottom
± 0.10
mm
All dimensions in mm
Tolerance ± 0.05mm unless otherwise specified
Top View
Bottom View
Side View
Pin 1
Location/
Indicator
SRO
1
2
3
4
1
2
3
4
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 7
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
6. PIN-OUT AND CONNECTION DIAGRAMS
6.1 Pin-Out
(As viewed from bottom of package)
Pin
Name
Function
1
VDD
Power supply voltage
2
GND
Ground
3
GND
Ground
4
VOUT
Analog output voltage
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 8
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
6.2 Typical Application Schematic
6.2.1 3-wire mode application diagram*
6.2.2 2-wire mode application diagram
*All testing performed in 3-wire mode.
2.0V
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 9
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
7. MANUFACTURING NOTES
7.1 Solder Reflow
Typical solder reflow profile
Average ramp-up rate
max. 3°C/s
Time ts between Tsmin (150°C) and Tsmax (200°C)
60s – 120s
Time tL above liquidous temperature TL (217°C)
60s – 90s
Peak temperature TP
max. 260°C
Time tP at TP
max. 20s
Average ramp-down rate
max. 6°C/s
Note: It is recommended to fine-tune the reflow process to optimize for variations in materials,
environment, handling, PCB board size and thickness, etc.
Please refer to AN60-Handling, Soldering, and Mounting Instructions for more detailed information
and precautions.
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 10
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
7.2. Microphone Handling
Although the microphone may not appear damaged immediately due to inappropriate handling,
there can be long term effects that affect the lifetime of the component.
Rule of thumb: The microphone is an artificial ear so treat it like your own ear.
Do not blow air into the acoustic port of the microphone for any reason. Do not subject it to
pressurized air
- e.g. when cleaning the board or other components on the same board
Do not apply vacuum to the acoustic port of the microphone
- See section 5.0 for pick & place location
Do not insert liquids
- If populated circuit boards are washed, the microphone must be protected
Do not insert dust
- The production facilities must be clean
- e.g. if PCB routing/sawing is done close to the microphone after SMT assembly and
reflow
Do not insert any objects
- If assembly or rework is done manually, care must be taken that the tools cannot enter
the mic sound port
- It is best to choose tool size so that it does not fit through the sound port of the
microphone
Do not cover the acoustic port with tape when heating during assembly or reflow
Do not apply extreme mechanical stresses on the microphone, including mechanical
shocks above 10kG or compression of the microphone package.
After a bottom port microphone has been assembled on a circuit board, protect the sound
port (now on the other side of the board) from dust, liquids, and other foreign materials as
well as any tools and pressurized air.
ESD Handling Procedures
Follow CMOS handling procedures with Akustica MEMS microphones. Handle the
microphone with proper workplace grounding to include wrist straps and ionized
airflow over open trays and reels of microphones. Do not hot-swap/hot-plug during
testing. Device pins have ESD ratings of 2kV/200V for HBM/MM respectively.
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 11
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
7.3 PCB Land Pattern and Stencil Pattern
Note: Stencil printer settings will likely require minor optimizations when transferring this stencil
pattern to a high volume production printer.
Please refer to AN60-Handling, Soldering, and Mounting Instructions for more detailed information
and precautions.
1
2
3
4
PCB Land
Pattern Layout
Suggested Solder Paste
Stencil Pattern Layout
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 12
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
8. RELIABILITY SPECIFICATIONS
The microphone sensitivity after stress must deviate by no more than 3dB from the initial value.
Test
Test Condition
1
Cold Temp Operation
Temperature = -40°C, 1000 hours (with bias)
2
Hot Temp Operation
Temperature = 105°C, 1000 hours (with bias)
3
Humidity Operation
Temperature = 85°C, RH = 85%, 1000 hours (with bias)
4
Cold Temp Storage
Temperature = -40°C, 1000 hours (without bias)
5
Hot Temp Storage
Temperature = 105°C, 1000 hours (without bias)
6
Humidity Storage
Temperature = 85°C, RH = 85%, 1000 hours (without bias)
7
Thermal Cycle
100 Cycles, -40°C to +125°C, 15min soaks, <30sec ramps
8
Vibration
Sinusoidal Vibration, 20Hz-2000Hz, 4min sweeps, 16min along each
of 3 axis, amplitude 3 limits of 20G and 0.06”
9
Mechanical Shock
10,000G shocks, 5 impacts along each of 6 axes
10
Drop Test
Using 150gm aluminum fixture, 3 drops along each of 6 axes (total 18
drops) from 1.5m height onto concrete drop surface.
11
ESD (HBM)
+/- 2000V, 1 discharge for each polarity, 11 pin combinations, 22 total
discharges per microphone
12
ESD (MM)
+/- 200V, 1 discharge for each polarity, 11 pin combinations, 22 total
discharges per microphone
13
ESD
+/- 8kV, contact discharge to lid with DUT grounded
14
Moisture Sensitivity
Level
24 hour bake at 125°C, followed by 168 hours at 85°C, 85%RH,
followed by 3 passes solder reflow (MSL Level 1)
9. PART MARKING INFORMATION
Line 1: A143X (A = Akustica | 143 = Part Num | X = Assembly Facility)
Line 2: WWYLL (WW = Work Week | Y = Year | LL = Lot Number
Processed During Work Week)
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 13
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
10. PACKAGING INFORMATION
10.1 Tape Specification
Notes:
1. 10 sprocket hole pitch cumulative tolerance +/- 0.2
2. Pocket position relative to sprocket hole measured as true position of pocket, not pocket
hole.
3. Ao and Bo are calculated on a plane at a distance of “R” above the bottom of the pocket.
10.2 Component Orientation
Ao = 4.16
Bo = 3.40
Ko = 1.30
Pin 1
Location
AKU143
Analog Silicon MEMS Microphone
Data Sheet
DS37-1.01
Page 14
12Dec2014
© Akustica, Inc. reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. Bosch Group and the symbol are registered trademarks of Robert Bosch
GmbH, Germany. Note: Specifications within this document are subject to change without notice.
11. ORDERING INFORMATION
Order Number
Part
Marking
Package
Shipping Method
Standard Quantity
02730A0014
A143
4-Pad LGA
13” Reel
5,700
For more information, sample requests, or to place an order, please contact Akustica.
12. DOCUMENT REVISIONS
Rev. No
Description of modification/changes
Date
0.75
Released preliminary datasheet
24-Feb-14
0.76
Added AOP value to section 3. Updated 2-wire mode diagram.
28-Apr-14
0.77
Updated pin-out
09-Sep-14
1.0
Released 1.0
12-Nov-14
1.01
Updated section 3
12-Dec-14
Akustica, Inc.
2835 E Carson St. Suite 301
Pittsburgh, PA / USA 15203
(412) 390-1730
sales@akustica.com
www.akustica.com/contact.asp
Modifications reserved | Printed in USA
Specifications subject to change without notice
