LP38858T-0.8 - Texas Instruments High-Performance Analog

BIAS

GND

OUT VOUT

VIN

VBIAS

CIN

10 PF Ceramic

COUT

10 PF

Ceramic

CBIAS

1 PF

GND GND

LP38858-x.x

CSS

LP38858

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SNVS462D –OCTOBER 2006–REVISED APRIL 2013

1.5A Fast-Response High-Accuracy LDO Linear Regulator with Soft-Start

Check for Samples: LP38858

1FEATURES DESCRIPTION

The LP38858 is a high current, fast response

2• Standard VOUT Values of 0.8V and 1.2V regulator which can maintain output voltage

• Wide VBIAS Supply Operating Range of 3.0V to regulation with extremely low input to output voltage

5.5V drop. Fabricated on a CMOS process, the device

• Stable with 10µF Ceramic Capacitors operates from two input voltages: VBIAS provides

voltage to drive the gate of the N-MOS power

• Dropout Voltage of 130 mV (Typical) at 1.5A transistor, while VIN is the input voltage which

Load Current supplies power to the load. The use of an external

• Precision Output Voltage across All Line and bias rail allows the part to operate from ultra low VIN

Load Conditions: voltages. Unlike bipolar regulators, the CMOS

architecture consumes extremely low quiescent

– ±1.0% VOUT for TJ= 25°C current at any output load current. The use of an N-

– ±2.0% VOUT for 0°C ≤TJ≤+125°C MOS power transistor results in wide bandwidth, yet

– ±3.0% VOUT for -40°C ≤TJ≤+125°C minimum external capacitance is required to maintain

• Over-Temperature and Over-Current loop stability.

Protection The fast transient response of this device makes it

• Available in 5 Lead TO-220 and DDPAK/TO-263 suitable for use in powering DSP, Microcontroller

Packages Core voltages and Switch Mode Power Supply post

regulators. The LP38858 is available in TO-220 and

• Custom VOUT Values between 0.8V and 1.2V DDPAK/TO-263 5-Lead packages.

are Available Dropout Voltage: 130mV (typical) at 1.5A load

•−40°C to +125°C Operating Temperature Range current.

APPLICATIONS Low Ground Pin Current: 10 mA (typical) at 1.5A

load current.

• ASIC Power Supplies In:

– Desktops, Notebooks, and Graphics Cards, Soft-Start: Programmable Soft-Start time.

Servers Precision Output Voltage: ±1.0% for TJ= 25°C and

– Gaming Set Top Boxes, Printers and ±2.0% for 0°C ≤TJ≤+125°C, across all line and load

Copiers conditions

• Server Core and I/O Supplies

• DSP and FPGA Power Supplies

• SMPS Post-Regulator

Typical Application Circuit

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TAB

GND

BIAS

OUT

GND

SS 1

LP38858S-x.x

TAB

GND

BIAS

OUT

GND

SS 1

LP38858T-x.x

LP38858

SNVS462D –OCTOBER 2006–REVISED APRIL 2013

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Connection Diagram

Figure 1. DDPAK/TO-263–5 Package (Top View) Figure 2. TO220–5 Package (Top View)

See Package Number KTT0005B See Package Number NDH0005D

Pin Descriptions

TO-220–5 and DDPAK/TO-263–5 Packages

Pin # Pin Symbol Pin Description

1 SS Soft-Start capacitor connection. Used to slow the rise time of VOUT at turn-on.

2 IN The unregulated voltage input pin.

3 GND Ground

4 OUT The regulated output voltage pin.

5 BIAS The supply for the internal control and reference circuitry.

The TAB is a thermal connection that is physically attached to the backside of the

TAB TAB die, and used as a thermal heat-sink connection. See the Application Information

section for details.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings(1)(2)

Storage Temperature Range −65°C to +150°C

Lead Temperature Soldering, 5 seconds 260°C

ESD Rating Human Body Model(3) ±2 kV

Power Dissipation(4) Internally Limited

VIN Supply Voltage (Survival) −0.3V to +6.0V

VBIAS Supply Voltage (Survival) −0.3V to +6.0V

VSS Soft-Start Voltage (Survival) −0.3V to +6.0V

VOUT Voltage (Survival) −0.3V to +6.0V

IOUT Current (Survival) Internally Limited

Junction Temperature −40°C to +150°C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114. The

HBM rating for device pin 1 (SS) is ±1.5 kV.

(4) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

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SNVS462D –OCTOBER 2006–REVISED APRIL 2013

Operating Ratings(1)

VIN Supply Voltage (VOUT + VDO) to VBIAS

VBIAS Supply Voltage 3.0V to 5.5V

IOUT 0 mA to 1.5A

Junction Temperature Range(2) −40°C to +125°C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

Electrical Characteristics

Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF, CBIAS = 1 µF, CSS = open.

Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C

to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent

the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only.

Symbol Parameter Conditions MIN TYP MAX Units

VOUT(NOM) + 1V ≤VIN ≤VBIAS,-1.0 1.0

3.0V ≤VBIAS ≤5.5V, 0

-3.0 3.0

10 mA ≤IOUT ≤1.5A

VOUT VOUT Accuracy %

VOUT(NOM) + 1V ≤VIN ≤VBIAS,

3.0V ≤VBIAS ≤5.5V, -2.0 0 2.0

10 mA ≤IOUT ≤1.5A,

0°C ≤TJ≤+125°C

ΔVOUT/ΔVIN Line Regulation, VIN(1) VOUT(NOM) + 1V ≤VIN ≤VBIAS - 0.04 - %/V

ΔVOUT/ΔVBIAS Line Regulation, VBIAS(1) 3.0V ≤VBIAS ≤5.5V - 0.10 - %/V

ΔVOUT/ΔIOUT Output Voltage Load Regulation(2) 10 mA ≤IOUT ≤1.5A - 0.2 - %/A

165

VDO Dropout Voltage(3) IOUT = 1.5A - 130 mV

180

LP38858-0.8 8.5

- 7.0

10 mA ≤IOUT ≤1.5A 9.0

Quiescent Current Drawn from VIN

IGND(IN) mA

Supply LP38858-1.2 12

10 mA ≤IOUT ≤1.5A 15

Quiescent Current Drawn from 3.8

IGND(BIAS) 10 mA ≤IOUT ≤1.5A - 3.0 mA

VBIAS Supply 4.5

VBIAS rising until device is 2.20 2.70

UVLO Under-Voltage Lock-Out Threshold 2.45 V

functional 2.00 2.90

VBIAS falling from UVLO threshold 60 300

UVLO(HYS) Under-Voltage Lock-Out Hysteresis 150 mV

until device is non-functional 50 350

VIN = VOUT(NOM) + 1V,

ISC Output Short-Circuit Current - 4.5 - A

VBIAS = 3.0V, VOUT = 0.0V

Soft-Start

LP38858-0.8 11.0 13.5 16.0

rSS Soft-Start internal resistance kΩ

LP38858-1.2 13.5 16.0 18.5

LP38858-0.8, CSS = 10 nF - 675 -

Soft-Start time

tSS μs

tSS = CSS × rSS × 5 LP38858-1.2, CSS = 10 nF - 800 -

(1) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.

(2) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from no load

to full load.

(3) Dropout voltage is defined the as input to output voltage differential (VIN - VOUT) where the input voltage is low enough to cause the

output voltage to drop 2% from the nominal value.

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Electrical Characteristics (continued)

Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF, CBIAS = 1 µF, CSS = open.

Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C

to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent

the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only.

Symbol Parameter Conditions MIN TYP MAX Units

AC Parameters

VIN = VOUT(NOM) + 1V, - 80 -

f = 120 Hz

PSRR Ripple Rejection for VIN Input

(VIN) Voltage VIN = VOUT(NOM) + 1V, - 65 -

f = 1 kHz dB

VBIAS = VOUT(NOM) + 3V, - 58 -

f = 120 Hz

PSRR Ripple Rejection for VBIAS Voltage

(VBIAS)VBIAS = VOUT(NOM) + 3V, - 58 -

f = 1 kHz

Output Noise Density f = 120 Hz - 1 - µV/√Hz

enBW = 10 Hz −100 kHz - 150 -

Output Noise Voltage µVRMS

VOUT = 1.8V BW = 300 Hz −300 kHz - 90 -

Thermal Parameters

Thermal Shutdown Junction

TSD - 160 -

Temperature °C

TSD(HYS) Thermal Shutdown Hysteresis - 10 -

TO-220-5 - 60 -

Thermal Resistance, Junction to

θJ-A Ambient(4) DDPAK/TO-263-5 - 60 - °C/W

TO-220-5 - 3 -

Thermal Resistance, Junction to

θJ-C Case(4) DDPAK/TO-263-5 - 3 -

(4) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

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SNVS462D –OCTOBER 2006–REVISED APRIL 2013

Typical Performance Characteristics

Unless otherwise specified: TJ= 25°C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS =

1 µF Ceramic, CSS = open.

VBIAS Ground Pin Current (IGND(BIAS)) VBIAS Ground Pin Current (IGND(BIAS))

vs VBIAS vs Temperature

Figure 3. Figure 4.

VIN Ground Pin Current

vs Temperature Load Regulation vs Temperature

Figure 5. Figure 6.

Dropout Voltage (VDO) Output Current Limit (ISC)

vs Temperature vs Temperature

Figure 7. Figure 8.

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Typical Performance Characteristics (continued)

Unless otherwise specified: TJ= 25°C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS =

1 µF Ceramic, CSS = open.

UVLO Thresholds

VOUT vs Temperature vs Temperature

Figure 9. Figure 10.

Soft-Start Resistor (rSS) Soft-Start rSS Variation

vs Temperature vs Temperature

Figure 11. Figure 12.

VOUT

vs CSS, 10 nF to 47 nF VIN Line Transient Response

Figure 13. Figure 14.

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SNVS462D –OCTOBER 2006–REVISED APRIL 2013

Typical Performance Characteristics (continued)

Unless otherwise specified: TJ= 25°C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS =

1 µF Ceramic, CSS = open.

VIN Line Transient Response VBIAS Line Transient Response

Figure 15. Figure 16.

VBIAS Line Transient Response Load Transient Response, COUT = 10 µF Ceramic

Figure 17. Figure 18.

Load Transient Response, COUT = 10 µF Ceramic Load Transient Response, COUT = 100 µF Ceramic

Figure 19. Figure 20.

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Typical Performance Characteristics (continued)

Unless otherwise specified: TJ= 25°C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS =

1 µF Ceramic, CSS = open.

Load Transient Response, COUT = 100 µF Ceramic Load Transient Response, COUT = 100 µF Tantalum

Figure 21. Figure 22.

Load Transient Response, COUT = 100 µF Tantalum VBIAS PSRR

Figure 23. Figure 24.

VIN PSRR Output Noise

Figure 25. Figure 26.

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GND

OUT

BIAS

Under-Voltage

Lock-Out

Thermal

Shut Down

VREF

0.6V

ILIMIT

LP38858-x.x

rSS

LP38858

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SNVS462D –OCTOBER 2006–REVISED APRIL 2013

Block Diagram

APPLICATION INFORMATION

EXTERNAL CAPACITORS

To assure regulator stability, input and output capacitors are required as shown in the Typical Application Circuit.

Output Capacitor

A minimum output capacitance of 10 µF, ceramic, is required for stability. The amount of output capacitance can

be increased without limit. The output capacitor must be located less than 1 cm from the output pin of the IC and

returned to the device ground pin with a clean analog ground.

Only high quality ceramic types such as X5R or X7R should be used, as the Z5U and Y5F types do not provide

sufficient capacitance over temperature.

Tantalum capacitors will also provide stable operation across the entire operating temperature range. However,

the effects of ESR may provide variations in the output voltage during fast load transients. Using the minimum

recommended 10 µF ceramic capacitor at the output will allow unlimited capacitance, Tantalum and/or

Aluminum, to be added in parallel.

Input Capacitor

The input capacitor must be at least 10 µF, but can be increased without limit. It's purpose is to provide a low

source impedance for the regulator input. A ceramic capacitor, X5R or X7R, is recommended.

Tantalum capacitors may also be used at the input pin. There is no specific ESR limitation on the input capacitor

(the lower, the better).

Aluminum electrolytic capacitors can be used, but are not recommended as their ESR increases very quickly at

cold temperatures. They are not recommended for any application where the ambient temperature falls below

0°C.

Bias Capacitor

The capacitor on the bias pin must be at least 1 µF, and can be any good quality capacitor (ceramic is

recommended).

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INPUT VOLTAGE

The input voltage (VIN) is the high current external voltage rail that will be regulated down to a lower voltage,

which is applied to the load. The input voltage must be at least VOUT + VDO, and no higher than whatever values

is used for VBIAS.

BIAS VOLTAGE

The bias voltage (VBIAS) is a low current external voltage rail required to bias the control circuitry and provide

gate drive for the N-FET pass transistor. The bias voltage must be in the range of 3.0V to 5.5V to ensure proper

operation of the device.

UNDER VOLTAGE LOCKOUT

The bias voltage is monitored by a circuit which prevents the device from functioning when the bias voltage is

below the Under-Voltage Lock-Out (UVLO) threshold of approximately 2.45V.

As the bias voltage rises above the UVLO threshold the device control circuitry becomes active. There is

approximately 150 mV of hysteresis built into the UVLO threshold to provide noise immunity.

When the bias voltage is between the UVLO threshold and the Minimum Operating Rating value of 3.0V the

device will be functional, but the operating parameters will not be within the specified limits.

SUPPLY SEQUENCING

There is no requirement for the order that VIN or VBIAS are applied or removed.

One practical limitation is that the Soft-Start circuit starts charging CSS when VBIAS rises above the UVLO

threshold. If the application of VIN is delayed beyond this point the benefits of Soft-Start will be compromised.

In any case, the output voltage cannot be ensured until both VIN and VBIAS are within the range of specified

operating values.

If used in a dual-supply system where the regulator output load is returned to a negative supply, the output pin

must be diode clamped to ground. A Schottky diode is recommended for this diode clamp.

REVERSE VOLTAGE

A reverse voltage condition will exist when the voltage at the output pin is higher than the voltage at the input pin.

Typically this will happen when VIN is abruptly taken low and COUT continues to hold a sufficient charge such that

the input to output voltage becomes reversed.

The NMOS pass element, by design, contains no body diode. This means that, as long as the gate of the pass

element is not driven, there will not be any reverse current flow through the pass element during a reverse

voltage event. The gate of the pass element is not driven when VBIAS is below the UVLO threshold.

When VBIAS is above the UVLO threshold the control circuitry is active and will attempt to regulate the output

voltage. Since the input voltage is less than the output voltage the control circuit will drive the gate of the pass

element to the full VBIAS potential when the output voltage begins to fall. In this condition, reverse current will flow

from the output pin to the input pin , limited only by the RDS(ON) of the pass element and the output to input

voltage differential. Discharging an output capacitor up to 1000 μF in this manner will not damage the device as

the current will decay rapidly. However, continuous reverse current should be avoided.

SOFT-START

The LP38858 incorporates a Soft-Start function that reduces the start-up current surge into the output capacitor

(COUT) by allowing VOUT to rise slowly to the final value. This is accomplished by controlling VREF at the SS pin.

The soft-start timing capacitor (CSS) is internally held to ground until VBIAS rises above the Under-Voltage Lock-

Out threshold (ULVO).

VREF will rise at an RC rate defined by the internal resistance of the SS pin (rSS), and the external capacitor

connected to the SS pin. This allows the output voltage to rise in a controlled manner until steady-state

regulation is achieved. Typically, five time constants are recommended to assure that the output voltage is

sufficiently close to the final steady-state value. During the soft-start time the output current can rise to the built-in

current limit.

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Soft-Start Time = CSS × rSS × 5 (1)

Since the VOUT rise will be exponential, not linear, the in-rush current will peak during the first time constant (τ),

and VOUT will require four additional time constants (4τ) to reach the final value (5τ) .

After achieving normal operation, should VBIAS fall below the ULVO threshold the device output will be disabled

and the Soft-Start capacitor (CSS) discharge circuit will become active. The CSS discharge circuit will remain

active until VBIAS falls to 500 mV (typical). When VBIAS falls below 500 mV (typical), the CSS discharge circuit will

cease to function due to a lack of sufficient biasing to the control circuitry.

Since VREF appears on the SS pin, any leakage through CSS will cause VREF to fall, and thus affect VOUT. A

leakage of 50 nA (about 10 MΩ) through CSS will cause VOUT to be approximately 0.1% lower than nominal, while

a leakage of 500 nA (about 1 MΩ) will cause VOUT to be approximately 1% lower than nominal. Typical ceramic

capacitors will have a factor of 10X difference in leakage between 25°C and 85°C, so the maximum ambient

temperature must be included in the capacitor selection process.

Typical CSS values will be in the range of 1 nF to 100 nF, providing typical Soft-Start times in the range of 70 μs

to 7 ms (5τ). Values less than 1 nF can be used, but the Soft-Start effect will be minimal. Values larger than 100

nF will provide soft-start, but may not be fully discharged if VBIAS falls from the UVLO threshold to less than 500

mV in less than 100 µs.

Figure 27 shows the relationship between the COUT value and a typical CSS value.

Figure 27. Typical CSS vs COUT Values

The CSS capacitor must be connected to a clean ground path back to the device ground pin. No components,

other than CSS, should be connected to the SS pin, as there could be adverse effects to VOUT.

If the Soft-Start function is not needed the SS pin should be left open, although some minimal capacitance value

is always recommended.

POWER DISSIPATION AND HEAT-SINKING

Additional copper area for heat-sinking may be required depending on the maximum device dissipation (PD) and

the maximum anticipated ambient temperature (TA) for the device. Under all possible conditions, the junction

temperature must be within the range specified under operating conditions.

The total power dissipation of the device is the sum of three different points of dissipation in the device.

The first part is the power that is dissipated in the NMOS pass element, and can be determined with the

formula:

PD(PASS) = (VIN - VOUT) × IOUT (2)

The second part is the power that is dissipated in the bias and control circuitry, and can be determined with the

formula:

PD(BIAS) = VBIAS × IGND(BIAS)

where

• IGND(BIAS) is the portion of the operating ground current of the device that is related to VBIAS (3)

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THA d TJA - (TCH + TJC)

'TJ

TJA

'TJ = TJ(MAX) - TA(MAX)

LP38858

SNVS462D –OCTOBER 2006–REVISED APRIL 2013

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The third part is the power that is dissipated in portions of the output stage circuitry, and can be determined with

the formula:

PD(IN) = VIN × IGND(IN)

where

• IGND(IN) is the portion of the operating ground current of the device that is related to VIN (4)

The total power dissipation is then:

PD= PD(PASS) + PD(BIAS) + PD(IN) (5)

The maximum allowable junction temperature rise (ΔTJ) depends on the maximum anticipated ambient

temperature (TA) for the application, and the maximum allowable operating junction temperature (TJ(MAX)) .

(6)

The maximum allowable value for junction to ambient Thermal Resistance, θJA, can be calculated using the

formula:

(7)

Heat-Sinking the TO-220 Package

The TO-220-5 package has a θJA rating of 60°C/W and a θJC rating of 3°C/W. These ratings are for the package

only, no additional heat-sinking, and with no airflow. If the needed θJA, as calculated above, is greater than or

equal to 60°C/W then no additional heat-sinking is required since the package can safely dissipate the heat and

not exceed the operating TJ(MAX). If the needed θJA is less than 60°C/W then additional heat-sinking is needed.

The thermal resistance of a TO-220 package can be reduced by attaching it to a heat sink or a copper plane on

a PC board. If a copper plane is to be used, the values of θJA will be same as shown in next section for

DDPAK/TO-263 package.

The heat-sink to be used in the application should have a heat-sink to ambient thermal resistance, θHA:

where

•θJA is the required total thermal resistance from the junction to the ambient air

•θCH is the thermal resistance from the case to the surface of the heart-sink

•θJC is the thermal resistance from the junction to the surface of the case (8)

For this equation, θJC is about 3°C/W for a TO-220 package. The value for θCH depends on method of

attachment, insulator, etc. θCH varies between 1.5°C/W to 2.5°C/W. Consult the heat-sink manufacturer

datasheet for details and recommendations.

Heat-Sinking the DDPAK/TO-263 Package

The DDPAK/TO-263 package has a θJA rating of 60°C/W, and a θJC rating of 3°C/W. These ratings are for the

package only, no additional heat-sinking, and with no airflow.

The DDPAK/TO-263 package uses the copper plane on the PCB as a heat-sink. The tab of this package is

soldered to the copper plane for heat sinking. shows a curve for the θJA of DDPAK/TO-263 package for different

copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area for heat-

sinking.

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Figure 28. θJA vs Copper (1 Ounce) Area for the DDPAK/TO-263 package

Figure 28 shows that increasing the copper area beyond 1 square inch produces very little improvement. The

minimum value for θJA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.

Figure 29 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient

temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C.

Figure 29. Maximum Power Dissipation vs Ambient Temperature for the DDPAK/TO-263 Package

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REVISION HISTORY

Changes from Revision C (April 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 13

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PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP38858S-0.8/NOPB ACTIVE DDPAK/

TO-263 KTT 5 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP38858S

-0.8

LP38858S-1.2 NRND DDPAK/

TO-263 KTT 5 45 TBD Call TI Call TI -40 to 125 LP38858S

-1.2

LP38858S-1.2/NOPB ACTIVE DDPAK/

TO-263 KTT 5 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP38858S

-1.2

LP38858SX-0.8/NOPB ACTIVE DDPAK/

TO-263 KTT 5 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP38858S

-0.8

LP38858SX-1.2/NOPB ACTIVE DDPAK/

TO-263 KTT 5 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP38858S

-1.2

LP38858T-0.8/NOPB ACTIVE TO-220 NDH 5 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP38858T

-0.8

LP38858T-1.2/NOPB ACTIVE TO-220 NDH 5 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP38858T

-1.2

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP38858SX-0.8/NOPB DDPAK/

TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LP38858SX-1.2/NOPB DDPAK/

TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LP38858SX-0.8/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0

LP38858SX-1.2/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 2

MECHANICAL DATA

NDH0005D

www.ti.com

MECHANICAL DATA

KTT0005B

www.ti.com

BOTTOM SIDE OF PACKAGE

TS5B (Rev D)

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