CPC1010N Single-Pole, Normally Open 4-Lead SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 250 170 11.5 Units VP mArms / mADC Features * 1500Vrms Input/Output Isolation * Small 4-Pin SOP Package * Low Drive Power Requirements * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Tape & Reel Version Available Description The CPC1010N is a miniature single-pole, normally open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division's patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. IXYS Integrated Circuits Division's state of the art double-molded vertical construction packaging makes the CPC1010N one of the world's smallest relays. It offers board space savings over the competitor's larger 4-pin SOP relay. Applications * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Ordering Information Part # CPC1010N CPC1010NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 3 2 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1010N-R01 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1010N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 250 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / C Derate linearly 3.33 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units t=10ms IL=170mA VL=250VP IL ILPK RON ILEAK - 8.5 - 170 350 11.5 1 mArms / mADC mAP A IF=0mA, VL=20V, f=1MHz ton toff COUT - 9 3 3 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.6 1.2 - 2 1.4 10 mA mA V A 1 - pF IF=5mA, VL=10V VIO=0V, f=1MHz CIO Load current derates linearly from 170mA @ 25oC to 105mA @85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com ms pF R01 INTEGRATED CIRCUITS DIVISION CPC1010N PERFORMANCE DATA @25C (Unless Otherwise Noted)* Typical Turn-On Time vs. LED Forward Current Typical LED Forward Voltage Drop vs. Temperature 2.0 1.3 IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA 1.1 1.5 1.0 0.5 -20 0 20 40 60 Temperature (C) 80 Turn-On Time (ms) 0.40 0.35 0.30 10 20 30 LED Current (mA) 0.10 40 50 0 0.50 0.45 IF=2mA 2.0 1.5 IF=5mA 1.0 IF=10mA 20 40 60 Temperature (C) 80 Typical On-Resistance vs. Temperature (IF=2mA) 0.40 0.35 0.30 0.25 0.20 -20 0 20 40 60 Temperature (C) 80 -40 100 310 200 IL=20mA Load Current (mA) 12 10 IL=170mA 8 6 Blocking Voltage (VP) 150 14 50 IF=10mA IF=5mA IF=2mA Typical Load Current vs. Load Voltage (IF=2mA) 16 40 0.10 -40 100 20 30 LED Current (mA) 0.15 0.0 0 10 Typical Turn-Off Time vs. Temperature (VL=10V) 3.0 2.5 0.25 On-Resistance (:) 0.15 3.5 0.5 100 50 0 -50 -100 -20 0 20 40 60 Temperature (C) 80 100 80 100 80 100 Typical Blocking Voltage vs. Temperature (IF=0mA) 300 290 280 270 -150 4 -40 -20 0 20 40 60 Temperature (C) 80 100 -200 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 Load Voltage (V) 14 10 8 6 4 2 0 -40 0 20 40 60 Temperature (C) 80 100 60 40 20 50 100 150 Load Voltage (V) 200 0 20 40 60 Temperature (C) 200 80 0 -20 Maximum Load Current vs. Temperature 0 -20 260 -40 2.0 Load Current (mA) Output Capacitance (pF) 100 12 1.5 Typical Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) Typical Leakage vs. Temperature (IF=0mA, VL=250V) Leakage Current (nA) 0.20 Typical Turn-On Time vs. Temperature (VL=10V) 0.45 -20 0.25 0.00 0 100 Typical IF to Operate vs. Temperature (IL=100mA) -40 0.30 0.05 0.0 Turn-Off Time (ms) 1.2 Turn-Off Time (ms) 1.4 1.0 -40 LED Forward Current (mA) 0.40 0.35 1.5 Turn-On Time (ms) LED Forward Voltage (V) 1.6 Typical Turn-Off Time vs. LED Forward Current 250 180 160 140 120 100 -40 -20 0 20 40 60 Temperature (C) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R01 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1010N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1010N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)C. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1010N 260C 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R01 INTEGRATED CIRCUITS DIVISION CPC1010N MECHANICAL DIMENSIONS CPC1010N 4.089 0.203 (0.161 0.008) Recommended PCB Land Pattern 0.200 0.025 (0.008 0.001) 0.60 (0.0217) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 5.60 (0.2205) 1.02 0.025 (0.040 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Pin to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1010NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 5 Specification: DS-CPC1010N-R01 (c)Copyright 2016, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/10/2016