XLT44QFN2 - Microchip Technology

 2010 Microchip Technology Inc. DS51194S

Transition Socket

Specification

DS51194S-page 2  2010 Microchip Technology Inc.

Information contained in this publication regarding device

applications a nd the lik e is p ro vided on ly for yo ur con ve nien ce

and may be supers eded by up dates. I t is you r r es ponsibil it y to

ensure that your application meets with your specifications.

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Trademarks

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Printed on recycled paper.

ISBN: 978-1-60932-069-0

Note the following details of the code protection feature on Microch ip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

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• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

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 2010 Microchip Technology Inc. DS51194S-page 3

INTRODUCTION

Transition sockets are products that allow header

boards (for next generation in-circuit emulators or

in-circuit debuggers) or device adapters (for the

MPLAB ICE 2000 in-circuit emulator) to interface to

sockets on target applications.

Typically, header boards or device adapters have con-

nectors that match development cycle device formats,

such as DIP or PLCC. However, target sockets will

match compact production device formats, such as

SOIC, SSOP, QFP, or QFN. The solution is transition

sockets . A trans ition so cket is spe cifical ly desig ned to

provi de compat ibi lit y be twe en tw o di fferi ng t ype s of IC

package formats.

T ransition sockets are typically composed of two parts:

the adapter socket and the adapter header. The

adapter socket is designed to plug into the header

board or device adapter on one side, and the adapter

header on the other. The adapter header is then

soldered down to the target application.

WHY SHOULD I US E TRA NSITION

SOCKETS IN MY PRODUCT DESIGN?

There are two very significant advantages to using

transition sockets:

1. Shorter product development cycle

2. Reduced expense in the design, layout and

prototype testing

A typical product design cycle has two important

phases : the prototype design p hase and the pro duction

design phase. Traditionally, these phases were differ-

ent simply because the prototype used a microcon-

troller with a different package type. However, with the

availability of the transition sockets, the prototype

design can be identical to the production design

because a transition socket can be used to bridge

microcontroller package differences.

WHAT TRANSITION SOCKETS ARE

CURRENTLY AVAILABLE?

Microchip Technology currently offers the transition

sockets listed in the “Table of Contents” following this

introductory section.

Use the on-line Development Tools Selector (DTS) to

find the transition sockets available for each header

board o r fo r each devi ce ad apt er. For mor e on h ead er

boards or device adapters, see:

•Header Board Specification (DS51292)

•MPLAB® ICE 2000 Pr ocessor Module a nd Device

Adapter Specification (DS51140)

•MPLAB® ICE 4000 Pr ocessor Module a nd Device

Adapter Specification (DS512 98)

Please see the Microchip web site

(www.microchip.com) for the DTS and most current

version of all documents.

HOW CAN I OBTAIN MAXIMUM

BENEFIT FROM THE USE OF

TRANSITION SOCKETS?

Attention to component placement should be

considered to provide adequate clearance for the

transition socket interface to the PCB footprint. This is

especi ally true for any tall components such as connec-

tor headers, radial components or voltage regulators.

Refer to the transition socket mechanical drawings for

dimensions.

Transition Socket Specificatio n

Transition Socket Specification

DS51194S-page 4  2010 Microchip Technology Inc.

TRANSITION SOCKET

APPLICATIONS – COMMENTS

AND SUGGESTIONS

Attention to component placement should be consid-

ered in m ati ng t h e adap t e r so ck ets t o t he S OI C/ SS OP

headers.

The placement of vias around the Surface Mount

Technology (SMT) layout area should be examined.

Vias immediately adjacent to the end of a SMT pad

may inadvertently come into contact with the header

leads. Vias should be placed along the center line of

the SMT pad to lessen the chance of pin-to-pin shorts

while soldering.

Care should be taken when soldering some transition

sockets to target boards. See the releated section for

specific instructions.

For inform ati on on packaging dimens io ns, ple as e re fer

to the Packaging Specification (DS00049).

GLOSSARY

Terms used in this docume nt:

DFN – Dual Flat No lead

DIP – Dual In-line Package

MQFP – Metric Quad Flat Pack

PDIP – Plastic Dual In-line Package

PLCC – Plastic Leaded Chip Carrier

QFN – Quad Flat No lead

QFP – Quad Flat Pac k

SOIC – Small Outline IC

SOT – Small Outline Transistor

SSOP – Shrink Small Outline Package

TQFP – Thin Quad Fla t Pack

 2010 Microchip Technology Inc. DS51194S-page 5

Current Sockets

SOIC Transi tion Socke t

XLT08SO-1

8-lead DIP to 8-lead SOIC .............................................................................................................................................9

XLT08SN-1

8-lead DIP to 8-lead SOIC (Narrow) ............................................................................................................................10

XLT14SO-1

14-lead DIP to 14-lea d SOIC ............ ..... ...... ..... ...... ....................... ...................... .................... ....................................10

XLT18SO-1

18-lead DIP to 18-lea d SOIC ............ ..... ...... ..... ...... ....................... ...................... .................... ....................................11

XLT20SO1-1

20-lead DIP to 20-lea d SOIC ............ ..... ...... ..... ...... ....................... ...................... .................... ....................................11

XLT28SO-1

28-lead DIP to 28-lea d SOIC ............ ..... ...... ..... ...... ....................... ...................... .................... ....................................12

SSOP Transition Socket

XLT14SS-1

14-lead DIP to 14-lea d SSOP ..... ...................... ....................... ...................... ....................... .......................................13

XLT20SS-1

18-lead DIP to 20-lea d SSOP ..... ...................... ....................... ...................... ....................... .......................................14

XLT20SS1-1

20-lead DIP to 20-lea d SSOP ..... ...................... ....................... ...................... ....................... .......................................14

XLT28SS-1

28-lead DIP to 28-lea d SSOP ..... ...................... ....................... ...................... ....................... .......................................15

XLT28SS2-1

28-lead DIP to 28-lead SSOP (PIC16X55/57) .............................................................................................................15

PLCC Transi tion Socke t

XLT44L2

44-lead PLCC (0.050 ”) ................................. ...................... ....................... ..... ..............................................................16

QFP Transition Socket

XLT44PT3

44-lead QFP (0.8 mm) .................................................................................................................................................18

XLT64PT5, XLT80PT3

64/80-lead QFP (0.5 mm) ............................................................................................................................................18

XLT80PT2

80-lead QFP (0.65 mm) ...............................................................................................................................................19

SOT/DFN/QFN Transition Sockets

XLT06SOT

14-lead DIP to 6-lead SOT-23 .... ...... ..... ...... ..... ....................... ...................... ....................... .......................................22

XLT08DFN2

14-lead DIP to 8-lead DFN ................................ ....................... ...................... ...... ........................................................22

Table of Contents

Transition Socket Specification

DS51194S-page 6  2010 Microchip Technology Inc.

XLT16QFN1, XLT28QFN3, XLT28QFN4, XLT44QFN2, XLT44QFN3, XLT44QFN4, XLT44QFN5

Multi-lead DIP to Multi-lead QFN, Top View .................................................................................................................23

Multi-lead DIP to Multi-lead QFN, Side View ................................................................................................................23

Multi-lead DIP to Multi-lead QFN Cables .....................................................................................................................23

XLT20QFN-1

20-lead DIP Adapter Socket .........................................................................................................................................24

20-lead QFN Header (Surface Foot) ............................................................................................................................24

XLT20QFN-1 Soldering Suggestions ...........................................................................................................................25

 2010 Microchip Technology Inc. DS51194S-page 7

Transition Socket Specification

Discontinued Sockets

PDIP Transition Socket

XLT28XP (Discontinue d)

28-lead DIP 0.300-inch Male to 0.600-inch Female .....................................................................................................26

SOIC Transi tion Socke t

XLT08SO (Discontinued – see XLT08SO-1 or XLT08SN-1)

8-lead DIP to 0.050-inch Adapter Socket .....................................................................................................................27

8-lead SOIC Header ....................................................................................................................................................27

XLT14SO (Discontinued – see XLT14SO-1)

14-lead DIP to 0.050-inch Adapter Socket ...................................................................................................................28

14-lead SOI C Header ........... ...... ...................... ....................... ...................... ..............................................................28

XLT18SO (Discontinued – see XLT18SO-1)

18-lead DIP to 0.050-inch Adapter Socket ...................................................................................................................28

18-lead SOI C Header .......... ...... ...................... ....................... ...................... ..............................................................28

XLT20SO1 (Discontinued – see XLT20SO1-1)

20-lead DIP to 0.050-inch Adapter Socket ...................................................................................................................29

20-lead SOI C Header .......... ...... ...................... ....................... ...................... ..............................................................29

XLT28SO (Discontinued – see XLT28SO-1)

28-lead DIP to 0.050-inch Adapter Socket ...................................................................................................................29

28-lead SOI C Header ........... ...... ...................... ....................... ...................... ..............................................................29

SSOP Transition Socket

XLT14SS (Discontinued – see XLT14SS-1)

14-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................30

14-lead SSOP Header ................ ...... ..... ...... ..... ....................... ...... ...................... .................. ......................................30

XLT20SS (Discontinued – see XLT20SS-1)

18-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................31

20-lead SSOP Header ................ ...... ..... ...... ..... ....................... ...... ...................... .................. ......................................31

XLT20SS1 (Discontinue d – see XLT20SS1-1)

20-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................31

20-lead SSOP Header ................ ...... ..... ...... ..... ....................... ...... ...................... .................. ......................................31

XLT28SS (Discontinued – see XLT28SS-1)

XLT28SS2 (Discontinue d – see XLT28SS2-1)

28-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................32

28-lead SSOP Header ................ ...... ..... ...... ..... ....................... ...... ...................... .................. ......................................32

PLCC Transi tion Socke t

XLT68L1, XLT84L1 (Discontinued)

68/84-le ad Adap ter Sock et .................... ...... ..... ...... ...... ....................................... ........................................................34

QFP Transition Socket

XLT44PT (Discontinu ed – see XLT44PT3)

44-lead QF P to 0.8 mm Adapter Socket ........................................ ...................... ...................... ..................................35

XLT64PT1 (Discontinued)

XLT64PT 2 (D iscon tin ued – see XLT64 PT5)

XLT80PT (Discontinu ed – see XLT80PT3)

64/80-lead QFP to 0.5 mm Adapter Socket .................................................................................................................36

XLT64PT 3 (D iscon tin ued – see XLT64 PT5)

64-lead QFP to 0.8mm Adapter Socket .......................................................................................................................36

XLT64PT 4 (D iscon tin ued – see XLT64 PT5)

64-lead QFP (0.8 mm) .................................................................................................................................................37

Transition Socket Specification

DS51194S-page 8  2010 Microchip Technology Inc.

SOT/DFN/QFN Transition Sockets

XLT08DFN (Discontinued – see XLT08DFN2)

8-lead DIP to 0.025-inch Adapter Socket .....................................................................................................................39

XLT28QFN (Discontinued – see XLT28QFN4)

28-lead DIP to 0.025-inch Adapter Socket ...................................................................................................................39

XLT28QFN2 (Discontinued – see XLT28QFN3)

18-lead DIP to 0.025-inch Adapter Socket ...................................................................................................................40

XLT44QFN (Discontinued – see XLT44QFN2)

40-lead DIP to 0.025-inch Adapter Socket ...................................................................................................................40

44-lead QF N Header ............... ..... ...... ...................... ....................... ...................... ............... ........................................40

 2010 Microchip Technology Inc. DS51194S-page 9

Transition Socket Specification

CURRENT SOCKET S

The transition sockets in this section are currently

available from Microchip.

SOIC TRANSITION SOCKET

An SOIC transition socket and associated hardware is

shown in Figure 1.

FIGURE 1: SOIC TRANSITION SOCKET

There are two components of the SOIC transition

socket::

1. Adapter socket that connects to the DIP device

adapter

2. SOIC header that is to be soldered down to the

target application

Microchip offers the following SOIC transition sockets:

• XLT08SO-1: One 8-lead DIP adapter socket and

one 8-le ad SOIC hea der (5.2 8mm body siz e)

• XLT08SN-1: One 8-lead DIP adapter socket and

one 8-le ad SOIC hea der (3.9mm body size )

• XLT14SO-1: One 14-l ead DIP a dapter socket and

one 14-lead SOIC header

• XLT18SO-1: One 18-l ead DIP a dapter socket and

one 18-lead SOIC header

• XLT20SO1-1: One 20-lead DIP adapter socket

and one 20-lead SOIC header

• XLT28SO-1: One 28-l ead DIP a dapter socket and

one 28-lead SOIC header

See the draw ing s in thi s se cti on for layo ut dim en si ons .

XLT08SO-1

8-lead DIP to 8-lead SOIC

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/

Adapter Socket

SOIC Header Target/Application Board

SOIC Transition Socket

Adapters

10.16mm

[0.400"]

10.16mm

[0.400"]

7.62mm

[0.300"]

2.54mm [0.100"]

Top View

13.83mm ±0.38mm

[0.545" ±0.015"] 10.00mm[0.394"]

1.27mm typ. [0.050"]

assembled

Side View

8.15mm

[0.321"]

7.93mm

[0.312"]

End View

Tolerances: diameters ±0.03 mm [±0.001"],

PCB peri meters ±0.13 mm [±0.005 "],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

Transition Socket Specification

DS51194S-page 10  2010 Microchip Technology Inc.

XLT08SN-1

8-lead DIP to 8-lead SOIC (Narrow)

XLT14SO-1

14-lead DIP to 14-lead SOIC

10.16mm

[0.400"]

10.16mm

[0.400"]

7.62mm

[0.300"]

2.54mm [0.100"]

Top View

13.83mm ±0.38mm

[0.545" ±0.015"] 10.00mm[0.394"]

1.27mm typ. [0.050"]

assembled

Side View

8.15mm

[0.321"]

End View

Tolerances: diameters ±0.03 mm [±0.001"],

PCB peri meters ±0.13 mm [±0.005 "],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

5.99mm

[0.236"]

10.16mm

[0.400"]

18.16mm

[0.715"]

7.62mm

[0.300"]

2.54mm typ. [0.100"]

13.68mm[0.539"] 9.84mm[0.388"]

assembled assembled

1.27mm typ. [0.050"]

5.99mm

[0.236"]

8.25mm

[0.325"]

Tolerances: diameters ±0.03 mm [±0.001"],

PCB perimeters ±0.13 mm [±0.005"],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

Top View

Side View

End View

 2010 Microchip Technology Inc. DS51194S-page 11

Transition Socket Specification

XLT18SO-1

18-lead DIP to 18-lead SOIC

XLT20SO1-1

20-lead DIP to 20-lead SOIC

22.86mm

[0.900"]

10.16mm

[0.400"] 7.62mm

[0.300"]

2.54mm typ. [0.100"]

13.95mm ±.38mm assembled

[0.549" ±0.015"]

1.27mm typ. [0.050"]

0.43mm typ. [0.017"]

10.11mm ±.38mm assembled

[0.398" ±0.015"]

8.15mm

[0.321"]

9.93mm

[0.391"]

Tolerances: diameters ±0.03 mm [±0.001"],

PCB perimeters ±0.13 mm [±0.005"],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

Top View

Side View

End View

Tolerances: diameters ±0.03 mm [±0.001"],

PCB perimeters ±0.13 mm [±0.005"],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

[0.400"]

25.40mm [1.000"]

7.62mm

[0.300"]

2.54mm typ. [0.100"]

13.92mm ± 0.381mm

[0.548" ± 0.015"] assembled

1.27mm typ. [0.050"]

0.43mm typ. [0.017"]

8.15mm

[0.321"]

12.40mm[0.488"]

assembled

9.42mm

[0.371"]

Top View

Side View

End View

Transition Socket Specification

DS51194S-page 12  2010 Microchip Technology Inc.

XLT28SO-1

28-lead DIP to 28-lead SOIC

35.56mm

[1.400"]

10.16mm

[0.400"]

11.25mm

[0.443"]

7.62mm

[0.300"]

2.54mm typ. [0.100"]

10.46mm[0.412]

1.27mm typ. [0.050"]

0.43mm typ. [0.017"]

9.93mm

[0.391"]

8.15mm

[0.321"]

Tolerances: diameters ±0.03 mm [±0.001"],

PCB perimeters ±0.13 mm [±0.005"],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

Top View

Side View

End View

14.29mm ±.38mm

[0.563"±0.015"]

 2010 Microchip Technology Inc. DS51194S-page 13

Transition Socket Specification

SSOP TRANSITION SOCKET

An SSOP tra nsition sock et and asso ciated hardwa re is

shown in Figure 2.

FIGURE 2: SSOP TRANSITION SOCKET

The SSOP transition sockets are similar to the SOIC

transition sockets. There are two parts to the SSOP

transiti on soc k et:

1. Adapter socket that connects to the DIP device

adapter.

2. SSOP header that gets soldered down to the

target application.

Microc hip of fer s t he foll owing SSO P trans ition sock ets :

• XLT14SS-1: One 14-lead DIP adapter socket and

one 14-lead SSOP header

• XLT20SS-1: One 18-lead DIP adapter socket and

one 20-lead SSOP header

• XLT20SS1-1: One 20-lead DIP adapter socket

and one 20-lead SSOP header

• XLT28SS-1: One 28-lead DIP adapter socket and

one 28-lead SSOP header

• XLT28SS2-1: One 28-lead DIP adapter socket

and one 28-lead SSOP header (PIC16X55/57)

See the drawings in this section for layout dimensions

and clearances for tall components.

XLT14SS-1

14-lead DIP to 14-lead SSOP

Cable to Pr ocessor Module

PDIP Device Adapter

Adapter Socket

SSOP Header Target/Application Board

SSOP Transition Socket

Gold Standoffs/

Adapters

10.16mm

[0.400"]

18.16mm

[0.715"]

7.62mm

[0.300"]

2.54mm typ. [0.100"]

10.19mm ±0.38mm

[0.401" ±0.015"] assembled 6.35mm ±0.38mm

[0.250" ±0.0 15" ]

assembled

0.65mm typ.

7.10mm

[0.280"]

5.33mm ±0.38m m

[0.210" ±0.015"]

Top View

Side View

End View

Tolerances: diameters ±0.03 mm [±0.001"],

PCB peri meters ±0.13 mm [±0.005 "],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

Transition Socket Specification

DS51194S-page 14  2010 Microchip Technology Inc.

XLT20SS-1

18-lead DIP to 20-lead SSOP

XLT20SS1-1

20-lead DIP to 20-lead SSOP

22.9mm [0.900"]

10mm

[0.394"]

7.6mm

[0.300"]

0.65mm pitch typ.

2.5mm Typ. [0.100"]

8.3mm ±0.38mm

[0.328"±0.015"]

7.6mm ±0.38

[0.298"±0.015"]

7mm [0.275"]

7.6mm

[0.300"]

11.96mm ±0.38mm

[0.471" ±0.015"]

Top View

Side View

End View

Tolerances: diameters ±0.03 mm [±0.001"],

PCB peri meters ±0.13 mm [±0.005 "],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

Compati ble ta rget

board land pattern

(not to scale)

A < 0.235

B > 0.335

[0.026"]

assembled

10.2mm

7.6mm

25.4mm [1"]

0.65mm pitch typ.

[0.026"]

2.5mm Typ. [0.100"]

11.9mm [0.469"]

Tolerances: diameters ±0.03 mm [±0.001"],

PCB peri meters ±0.13 mm [±0.005 "],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

[0.300"]

[0.402"]

Top View

assembled

Side View

7mm [0.275"]

7.6mm

[0.300"]

11.96mm ±0.38mm

[0.471" ±0.015"]

End View

Compati ble ta rget

board land pattern

(not to scale)

A < 0.235

B > 0.335

assembled

 2010 Microchip Technology Inc. DS51194S-page 15

Transition Socket Specification

XLT28SS-1

28-lead DIP to 28-lead SSOP

XLT28SS2-1

28-lead DIP to 28-lead SSOP (PIC16X55/57)

35.56mm

[1.400"]

10.16mm

[0.400"] 7.62mm

[0.300"]

2.54mm typ. [0.100"]

10.57mm ±.38mm

[0.416"±0.015"] 1.27mm

[0.050"]

10.21mm

[0.402"]

7.77mm

[0.306"]

8.15mm

[0.321"]

6.35mm ±.38mm

[0.250"±0.015"]

Top View

Side View

End View

Tolerances: diameters ±0.03 mm [±0.001"],

PCB peri meters ±0.13 mm [±0.005 "],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

5.26mm [0.207"]

8.78mm [0.346"]

min.

max.

Recommended target

PCB land pattern

SF-SO28G-L-01

outline

0.65mm typ. [0.026"]

35.56mm

[1.400"]

10.16mm

[0.400"] 7.62mm

[0.300"]

2.54mm typ. [0.100"]

10.57mm ±.38mm

[0.416"±0.015"]

0.65mm typ. [0.026"]

1.27mm

[0.050"]

10.21mm

[0.402"]

7.77mm

[0.306"]

8.15mm

[0.321"]

6.35mm ±.38mm

[0.250"±0.015"]

Top View

Side View

End View

Tolerances: diameters ±0.03 mm [±0.001"],

PCB peri meters ±0.13 mm [±0.005 "],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

5.26mm [0.207"]

8.78mm [0.346"]

min.

max.

Recommended target

PCB land pattern

SF-SO28G-L-01

outline

Transition Socket Specification

DS51194S-page 16  2010 Microchip Technology Inc.

PLCC TRANSITION SOCKET

A PLCC transition socket and associated hardware is

shown in Figure 3.

FIGURE 3: PLCC TRANSITION SOCKET

The PLCC transition socket is required for use along

with the PLCC device adapters. The DAF18-1 device

adapter is equipped with eight socket strips that inter-

face with one of two transition sockets. The DAF18-3

device adapter is equipped with four socket strips that

interface with one transition socket.

The PLCC transition sockets are designed with a

threaded insert in the center of the footprint so that a

4/40 screw can securely fasten the transition socket to

the device adapter.

The PLCC transition sockets are designed to be sol-

dered to the target PCB PLCC surface mount pattern or

inserted into a PLCC socket on the target PCB.

Microc hip offers the fo ll ow in g PLCC tran si tio n sockets :

• XLT44L2: One 44-lead PLCC transition socket

RECOMMENDED PCB LAYOUT

XLT44L2

44-lead PLCC (0.050”)

Note: To avoid sol der bri dgi ng , do not pl ac e vi as

within 0.025-inch of the PLCC footprint.

Also, any vias near the PLCC should be

directly on the centerline of the pad.

Cable to Processor Module

PLCC Device Adapter

PLCC Transition Socket

Target/Application Board

0.865”

0.024”

0.050” 0.074”

27.94mm [1.100”]

TOP VIEW

*Caution: Pin 1 on the dev ic e ad apt er side (top of so cket)

is 180 degrees from pin 1 on the target side (bottom of

socket).

VIEW

FRONT/SIDE

27.94mm

[1.100”]

2.79mmx45° [0.110”]

20.32mm

[0.800”]

1.27mm typ. [0.050”]

1.27mm typ. [0.050”] 0.43mm typ. [0.017”]

21.93mm

[0.863”]

14.94mm

[0.588”]

 2010 Microchip Technology Inc. DS51194S-page 17

Transition Socket Specification

QFP TRANSITION SOCKET

QFP (MQFP, TQFP, PQFP) transition sockets and

associated hardware are shown below.

FIGURE 4: QFP TRANSITION SOCKET

The QFP transition socket is required for use along with

the QFP device adapter. The device adapter is

equipped with four socket strips that interface with the

transiti on soc k et.

There are two parts to the QFP transition socket:

1. Adapter soc ket tha t connect s to the Q FP devic e

adapter

2. QFP header that gets soldered down to the

target application

Microchip offers the following QFP transition sockets:

• XLT44PT3: On e 4 4-l ead QFP adapter s oc ke t and

one 44-lead QFP header (0.8 mm)

• XLT64PT5: On e 6 4-l ead QFP adapter s oc ke t and

one 64-lead QFP header (0.5 mm)

• XLT80PT2: On e 8 0-l ead QFP adapter s oc ke t and

one 80-lead QFP header (0.65 mm)

• XLT80PT3: On e 8 0-l ead QFP adapter s oc ke t and

one 80-lead QFP header (0.5 mm)

See the drawings in this section for layout dimensions

and clearances for tall components.

QFP TRANSITION SOCKET

SOLDERING TIPS

• Use controlled soldering iron tip temperatures

between 300C and 325C (570F to 615F)

• If possible, use a PACE mini wave soldering iron

tip or an equivalent tip design.

• Plan to solder one (1 of 4) side first, then the

opposite side, then the remaining two sides.

• Soldering iron tip movement should be in the

directio n of the leads (backw ard and forward), no t

across the leads; dragging the tip across the

leads may cause lead damage.

• Use generous amounts of soldering flux to aid in

the solder flow action.

Note: To avoid sol der bri dgi ng , do not pl ac e vi as

within 0.025-inch of the QFP footprint.

Also, any vias near the QFP should be

directly on the centerline of the pad.

Cable to Processor Module

QFP Device Adapter

QFP Transition Socket

Target/Application Board

Transition Socket Specification

DS51194S-page 18  2010 Microchip Technology Inc.

XLT44PT3

44-lead QFP (0.8 mm)

XLT64PT5, XLT80PT3

64/80-lead QFP (0.5 mm)

1.100

TOP

VIEW

44 34

12 22

QFP

PIN 1

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

0.352

0.225

0.80 mm

0.018 0.050

0.800

SIDE

VIEW

FRONT/

0.065

Refer to the “Package Specification” for

PCB footprint dimensions (DS00049).

0.300

TOP

VIEW

XLT64PT5 1.250 0.960

XLT80PT3 1.450 1.160

18 34

QFP

PIN 1

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

Drawing shown is for 64-lead.

0.352

0.225

0.50 mm

0.018 0.050

SIDE

VIEW

FRONT/

0.065

Refer to the “Package Specification” for

PCB footprint dimensions (DS00049).

 2010 Microchip Technology Inc. DS51194S-page 19

Transition Socket Specification

XLT80PT2

80-lead QFP (0 .65 mm)

TOP

VIEW

22 42

QFP

PIN 1

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

0.65mm

0.018

0.352

0.225

1.450 1.160

0.050

SIDE

VIEW

FRONT/

0.065

Refer to the “Package Specification” for

PCB footprin t dime nsions (DS00049).

TABLE 1: DVA/DAF INTERFACE

SPECIFICATION FOR QFP

PACKAGES

Socket Package Style* DVA/DAF

Interface

Specification**

XLT44PT3 44PT TQFP

44PQ MQFP

44KW PQFP

DVA-44PL

XLT64PT5 64PT DVA-68PL

XLT80PT2 80PF DVA-84PL

XLT80PT3

* Refer to the “Package Specification” for PCB

footprint dimensions (DS00049).

** Refer to the processor module and device

adapter specification for interface and

dimensions to DVA/DAF (ICE 2000: “MPLAB®

ICE 2000 Proc essor Module an d Device Adapter

Specification” (DS51140); ICE 4000: “MPLAB®

ICE 4000 Proc essor Module an d Device Adapter

Specification” (DS51298)).

Transition Socket Specification

DS51194S-page 20  2010 Microchip Technology Inc.

SOT/DFN/QFN TRANSITION

SOCKETS

SOT/DFN/QFN transition sockets and associated

hardware are shown below.

FIGURE 5: SOT TRANSITION SOCKET WITH

CABLE

FIGURE 6: DFN TRANSITION SOCKET WITH

CABLE

FIGURE 7: QFN TRANSITION SOCKET WITH

CABLE

FIGURE 8: QFN TWO-PART TRANSITION

SOCKET

Two-part transition sockets consist of:

1. Adapter socket that connects to the DIP device

adapter

2. QFN header that is to be soldered down to the

target application

Microc hip offers th e following SOT/DFN/Q FN transition

sockets:

• XLT06SOT: One 14-lead D IP t o 6-lead SOT-23

tran sition socket with cable

• XLT08DFN2: One 14-lead DIP to 8-lead DFN

tran sition socket with cable

• XLT16QFN1: One 14-lead DIP to 16-lead QFN

tran sition socket with cable

• XLT20QFN-1: One 20-lead DIP adapter socket

and one 20-lead QFN header

• XLT28QFN3: One 18-lead DIP to 28-lead QFN

tran sition socket with cable

• XLT28QFN4: One 28-lead DIP to 28-lead QFN

tran sition socket with cable

• XLT44QFN2: One 40-lead DIP to 44-lead QFN

tran sition socket with cable

• XLT44QFN3: One 28-lead DIP to 44-lead QFN

tran sition socket with cable

• XLT44QFN4: One 28-lead DIP to 44-lead QFN

tran sition socket with cable

• XLT44QFN5: One 18-lead DIP to 44-lead QFN

tran sition socket with cable

See the dra wing s in thi s se cti on for layout dimen si ons .

SOT Transition Socket

Target/Application Board

Cables

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/

Adapters

DFN Transition Socket

Target/A pplicati on Board

Cables

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/

Adapters

QFN Transition Socket

Target/Application Board

Cables

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/

Adapters

QFN Transition Socket

Target/A ppli cation Board

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/

Adapters

 2010 Microchip Technology Inc. DS51194S-page 21

Transition Socket Specification

RECOMMENDED INSTALLATION OF

TR ANSITION SOCKETS WITH

CABLES

For transition sockets that use a cable, follow these

instructions for installing your transition socket on the

target board.

PCB Layout Considerations:

Make sure you leave enough room on the PCB to

accommodate the cable, i.e., space your target pads

for each d evic e far eno ugh ap art s o that th e cable fro m

one p ad group will not interfere w ith another pad group.

6-Pin SOT So lder Instr uctions :

1. Remove protective cable covering from end of

cable.

2. Position cables on target board (see below).

Tape down to prevent movement.

3. Solder each lead to target pad.

4. Remove tape and clean.

8-Pin DFN Solder Instructions:

1. Prepare leads by trimming narrowest portion to

0.10-inch maximum in length (see below).

2. Position cables on target board (see below).

Tape down to prevent movement.

3. Solder each lead to target pad.

4. Remove tape and clean.

8-Pin DFN Assembly Instructions:

1. Start with cable associated with pin 1.

2. Fold cable up and over, forming a radius.

3. Mate with the header on the side of the transition

socket assembly, making sure pin 1 mates with

the pin labele d “DFN Pin 1”.

4. Fold over and mate the other cable.

16-Pin QFN Solder Instructions:

1. Remove protective cable jacket from stripped

end of cable.

2. Lay out the four cables in a “+” pattern (see

below).

3. Center each cable on the footprint (see below).

Tape down each cable to prevent movement.

4. Solder each lead to targ et pad.

5. Remove tape and clean

16-Pin QFN Assembly Instructio ns:

1. Start with cable associated with pin 1.

2. Fold cable up and over, forming a radius.

Header pins will now be facing upwards.

3. Mate with the socket on the underside of the

transition socket assembly, making sure pin 1

mates with the pin labeled “QFN Pin 1”.

4. Fold over and mate the other cables.

28/44-Pin QFN Solder Instru ction s:

1. Remove protective cable jacket from stripped

end of cable.

2. Lay out with long cables opposing each other

and short cables opposing each other (see

below).

3. Place center lead (6th lead for 44-pin, 4th lead

for 28-pin) on center target pad to center each

cable on the footprint (see below). Tape down

each cable to prevent movement.

4. Solder each lead to targ et pad.

5. Remove tape and clean

28/44-Pin QFN Assembly Instructions:

1. Start with cable associated with pin 1.

2. Fold cable up and over, forming a radius.

Header pins will now be facing upwards.

3. Mate with the socket on the underside of the

transition socket assembly, making sure pin 1

mates with the pin labeled “QFN Pin 1”.

4. Fold over and mate the other cables.

pin 1

trim leads

pin 1

header pi ns

facing down

center cable

on target footprint

pin 1

use center lead

to center cable

on target footprint

short short

long long

header pi ns

facing down

Transition Socket Specification

DS51194S-page 22  2010 Microchip Technology Inc.

RECOMMENDED PCB LAYOUT

The recommended target board footprint layout for

different pin-counts is shown here.

FIGURE 9: 6-PIN SOT, 8-PIN DFN

FIGURE 10: 16-PIN QFN

FIGURE 11 : 20-PIN QFN

FIGURE 12: 28-PIN QFN

FIGURE 13: 44-PIN QFN

XLT06SOT

14-lead DIP to 6-lead SOT-23

XLT08DFN2

14-lead DIP to 8-lead DFN

16 mils

24 mils

50 mils

24 mils 11 mils

26 mils

28 mils 11 mils

19 mils

24 mils 11 mils

26 mils

16 mils 13 mils

26 mils

DVA Pin 1

0.90

0.80

0.30

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

TOP

VIEW

SIDE

VIEW

1.50

DVA Pin 1

DFN Pin 1

0.90

1.35

0.30

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

TOP

VIEW

SIDE

VIEW

0.24

2.37

0.09

DVA Pin 1: Locati on of 14-lead DIP pin 1

 2010 Microchip Technology Inc. DS51194S-page 23

Transition Socket Specification

XLT16QFN1, XLT28QFN3, XLT28QFN4,

XLT44QFN2, XLT44QFN3, XLT44QFN4,

XLT44QFN5

Multi-lead DIP to Multi-lead QFN, Top View

Multi-lead DIP to Multi-lead QFN, Side View

Multi-lead DIP to Multi-lead QFN Cables

DVA Pin 1

QFN Pin 1

1.15

2.45

DVA Pin 1

1.15

2.45

XLT28QFN3 – 18L DIP to 28L QFN (Show n)

XLT44QFN2 – 40L DIP to 44L QFN

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

XLT28QFN4 – 28L DIP to 28L QFN (Show n)

XLT44QFN3 – 28L DIP to 44L QFN

DIP 1

DVA Pin 1

QFN Pin 1

1.15

1.25

XLT16QFN1 – 14L DIP to 16L QFN

TOP VIEW

XLT44QFN4 – 28L DIP to 44L QFN

XLT44QFN5 – 18L DIP to 44L QFN

DVA Pin 1

QFN Pin 1

1.15

2.45

TOP VIEW

QFN Pin 1

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

SIDE

VIEW

0.56

cable C

XLT16QFN1 1-4 1.30

XLT28QFN3/4 1,2 1.30

3,4 2.00

XLT44QFN2/3

XLT44QFN4/5 1,2 1.30

3,4 2.00

TOP

0.85

0.40

SIDE

VIEW

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

Drawing shown is for 28-lead DIP.

BOTTOM

VIEW

Transition Socket Specification

DS51194S-page 24  2010 Microchip Technology Inc.

XLT20QFN-1

20-lead DIP Adapter Socket

20-lead QFN Header (Surface Foot)

11.4mm

2.5mm

[0.100"]

7.6mm

26.6mm

[0.300"]

[0.450"]

[1.049"]

Top View

Side View

Bottom View

3.3mm [0.130"]

2.3mm [0. 093" ]

4.2mm [0.165"]

SF-MLF20A-A-02F

(included)

1.2mm [0.047"] *

3.9mm [0.154"] *

* Assembled

2.7mm [0.105"]

7.8mm [0.307"] *

Tolerances: diameters ±0.03 mm [±0.001"],

PCB perimeters ±0.13 mm [±0.005"],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

Top View

Side View

Bottom View

7891

0.80mm typ.

4.72mm

[0.186"]

4.72mm [0.186"]

3.20mm

[0.126"]

3.20mm [0.126"]

Gnd/index

7 8 9 1

2.13mm

[0.084"]

2.75mm

[0.108"]

2.13mm [0.084"]

2.75mm [0.108"]

4.00mm [0.157"]

4.00mm

[0.157"]

0.50mm typ. [0.020"]

3.30mm

[0.130"]

Tolerances: diameters ±0.03 mm [±0.001"],

PCB perimeters ±0.13 mm [±0.005"],

PCB thicknesses ±0.18 mm [±0.007"],

pitches (from true position) ±0.08 mm [±0.003"],

all other tolerances ±0.13 mm [±0.005"] unless

stated otherwise.

 2010 Microchip Technology Inc. DS51194S-page 25

Transition Socket Specification

XLT20QFN-1 Soldering Suggestions

This socket is difficult to solder since the device pins

are not exposed, but embedded, into the socket’s

Surface Foot (SF).

1. To start, add tack flux to the target land pattern.

2. Visually align the QFN SF with the target land

patte rn. The n sol der two op posit e SF pi ns to the

target lands so that the SF does not move

around.

3. Finish solder ing the rest of the SF pi ns.

4. If the SF has a middle ground pin, feed solder

through the bottom side of hte target board via

holes. This will connect the center QFN SF pin

to the target board.

5. Check each solder connection on the QFN SF

pins.

You a re now re ady t o att ach the QFN heade r to th e SF.

Transition Socket Specification

DS51194S-page 26  2010 Microchip Technology Inc.

DISCONTINUED SOCKETS

The transition sockets in this section are discontinued

and may no longer be ordered from Microchip. They

are kept in this do cu ment as a refe renc e for cus t o me rs

who still have these sockets.

PDIP TRANSITION SOCKET

A PDIP transition socket and associated hardware is

shown in Figure 1.

FIGURE 1: PDIP TRANSITION SOCKET

The PDIP transition socket is a 0.300-inch Male to

0.600-inch Female adapt er so cket.

Microchip offers the following PDIP transition socket:

• XLT28XP: One 28-lead DIP transition socket and

two 28-lead gold standoffs

See the draw ing s in thi s se cti on for layo ut dim en si ons .

XLT28XP (Discontinued)

28-lead DIP 0.300-inch Male to 0.600-inch Female

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/Ada pters

0.300-inch Male to 0.600-inch Female Adapter Socket

Target/A ppli cation Board

(PDIP Transition Socket)

0.300"

0.100"

0.600"

1.400"

0.700"

TOP

VIEW

SIDE

VIEW

REAR

VIEW

FRONT/

 2010 Microchip Technology Inc. DS51194S-page 27

Transition Socket Specification

SOIC TRANSITION SOCKET

An SOIC transition socket and associated hardware is

shown in Figure 2.

FIGURE 2: SOIC TRANSITION SOCKET

There are two components of the SOIC transition

socket:

1. Adapter socket that connects to the PDIP device

adapter

2. SOIC header that is to be soldered down to the

target application

The following SOIC transition sockets have been dis-

continued:

• XLT08SO: One adapter socket and three 8-lead

SOIC headers

• XLT14SO: One adapter socket and three 14-lead

SOIC headers

• XLT18SO: One adapter socket and three 18-lead

SOIC headers

• XLT20SO1: One adapter socket and three

20-lead SOIC headers

• XLT28SO: One adapter socket and three 28-lead

SOIC headers

See the dr awings in th is sectio n for layout di mension s.

XLT08SO (Discontinued – see XLT08SO-1 or

XLT08SN-1)

8-lead DIP to 0.050-inch Adapter Socket

8-lead SOIC Header

Note: The SOIC header is designed for SOIC

body width of 0.300-inch. The adapter

leads should be cut to fit the 0.150-inch

and 0.208-inch SOIC body widths.

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/

Adapter Socket

SOIC Header Target/Application Board

SOIC Transition Socket

Adapters

TOP

VIEW SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

The SOIC header is designed for an SOIC body width of

0.300-inch.

The adapter leads should be cut to fit the 0.150-inch and

0.208-inch SOIC body widths.

TOP

VIEW

SIDE

VIEW

FRONT/

REAR

VIEW

ABCDEFG

0.060 0.410 0.050 0.075 0.178 0.050 0.050

Transition Socket Specification

DS51194S-page 28  2010 Microchip Technology Inc.

XLT14SO (Discontinued – see XLT14SO-1)

14-lead DIP to 0.050-inch Adapter Socket

14-lead SOIC Head er

XLT18SO (Discontinued – see XLT18SO-1)

18-lead DIP to 0.050-inch Adapter Socket

18-lead SOIC Header

TOP

VIEW SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

TOP

VIEW

SIDE

VIEW

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

The SOIC header is designed for an SOIC body width of

0.300-inch.

The adapter leads should be cut to fit the 0.150-inch and

0.208-inch SOIC body widths.

FRONT/

REAR

VIEW

ABCDEFG

0.060 0.410 0.050 0.075 0.178 0.050 0.050

TOP

VIEW

SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

TOP

VIEW

SIDE

VIEW

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

The SOIC header is designed for an SOIC body width of

0.300-inch.

The adapter leads should be cut to fit the 0.150-inch and

0.208-inch SO IC body wi dths.

FRONT/

REAR

VIEW

ABCDEFG

0.060 0.410 0.050 0.075 0.178 0.050 0.050

 2010 Microchip Technology Inc. DS51194S-page 29

Transition Socket Specification

XLT20SO1 (Discontinued – see XLT20SO1-1)

20-lead DIP to 0.050-inch Adapter Socket

20-lead SOIC Head er

XLT28SO (Discontinued – see XLT28SO-1)

28-lead DIP to 0.050-inch Adapter Socket

28-lead SOIC Header

TOP

VIEW

SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

TOP

VIEW

SIDE

VIEW

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

The SOIC header is designed for an SOIC body width of

0.300-inch.

The adapter leads should be cut to fit the 0.150-inch and

0.208-inch SO IC body wi dths.

FRONT/

REAR

VIEW

ABCDEFG

0.060 0.410 0.050 0.075 0.178 0.050 0.050

TOP

VIEW

SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

TOP

VIEW

SIDE

VIEW

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

The SOIC header is designed for an SOIC body width of

0.300-inch.

The adapter leads should be cut to fit the 0.150-inch and

0.208-inch SOIC body widths.

FRONT/

REAR

VIEW

ABCDEFG

0.060 0.410 0.050 0.075 0.178 0.050 0.050

Transition Socket Specification

DS51194S-page 30  2010 Microchip Technology Inc.

SSOP TRANSITION SOCKET

An SSOP tra nsition sock et and asso ciated hardwa re is

shown in Figure 3.

FIGURE 3: SSOP TRANSITION SOCKET

The SSOP transition sockets are similar to the SOIC

transition sockets. There are two parts to the SSOP

transiti on soc k et:

1. Adapter socket that connects to the PDIP device

adapter.

2. SSOP header that gets soldered down to the

target application.

The following SSOP transition sockets have been dis-

continued:

• XLT14SS: One adapter socket and three 14-lead

SSOP headers

• XLT20SS: One adapter socket and three 20-lead

SSOP headers

• XL T20SS1: One adapter socket and three 20-lead

SSOP headers

• XLT28SS: One adapter socket and three 28-lead

SSOP headers

• XL T28SS2: One adapter socket and three 28-lead

SSOP headers for PIC16C55/57

See the drawings in this section for layout dimensions

and clearances for tall components.

XLT14SS (Discontinued – see XLT14SS-1)

14-lead DIP to 0.8 mm Adapter Socket

14-lead SSOP Header

Note: To keep the leads straight during assembly

and shipping, the SSOP headers are

shipped with break-away tabs attached to

the leads. Please remove the break-away

tabs before applying power to the target

system. Be careful not to bend the leads

prior to soldering to the target application.

Cable to Pr ocessor Module

PDIP Device Adapter

Adapter Socket

SSOP Header Target/Application Board

SSOP Transition Socket

Gold Standoffs/

Adapters

TOP

VIEW

SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

Shipped with

break-away tabs

attached to leads

Remove prior to

providing power

* Top dra wing sh own

with clip-on shrouds

installed

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN

INCHES.

Break-away tabs are to be removed prior to providing power.

TOP

VIEW

SIDE

VIEW

FRONT/

REAR

VIEW

ABCDEFG

0.035 0.300 0.023 0.080 0.186 0.043 0.025

 2010 Microchip Technology Inc. DS51194S-page 31

Transition Socket Specification

XLT20SS (Discontinued – se e XLT20SS-1)

18-lead DIP to 0.8 mm Adapter Socket

20-lead SSOP Head er

XLT20SS1 (Discontinued – see XLT20SS1-1)

20-lead DIP to 0.8 mm Adapter Socket

20-lead SSOP Header

TOP

VIEW

SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

Shipped with

break-away tabs

attached to leads

Remove prior to

providing power

* Top dra wing sh own

with clip-on shrouds

installed

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN

INCHES.

Break-away tabs are to be removed prior to providing power.

TOP

VIEW

SIDE

VIEW

FRONT/

REAR

VIEW

ABCDEF G

0.040 0.295 0.026 0.075 0.190 0.047 0.0315

TOP

VIEW

SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

Shipped with

break-away tabs

attached to leads

Remove prior to

providing power

* Top dra wing sh own

with clip-on shrouds

installed

UNLESS OTHERWISE SPECI FIED, DIMENSIONS ARE IN

INCHES.

Break-away tabs are to be removed prior to providing power.

TOP

VIEW

SIDE

VIEW

FRONT/

REAR

VIEW

ABCDEF G

0.040 0.295 0.026 0.075 0.190 0.047 0.0315

Transition Socket Specification

DS51194S-page 32  2010 Microchip Technology Inc.

XLT28SS (Discontinued – see XLT28SS-1)

XLT28SS2 (Discontinued – see XLT28SS2-1)

28-lead DIP to 0.8 mm Adapter Socket

28-lead SSOP Head er

TOP

VIEW

SIDE

VIEW

REAR

VIEW

FRONT/

BOTTOM

VIEW

Shipped with

break-away tabs

attached to leads

Remove prior to

applying power.

* Top drawing

shown with c lip-on

shrouds installed

TOP

VIEW

FRONT/

REAR

SIDE

VIEW

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

Break-away tabs are to be removed prior to applying

power.

VIEW

ABCDEF G

0.040 0.295 0.026 0.075 0.190 0.047 0.0315

 2010 Microchip Technology Inc. DS51194S-page 33

Transition Socket Specification

PLCC TRANSITION SOCKET

A PLCC transition socket and associated hardware is

shown in Figure 4.

FIGURE 4: PLCC TRANSITION SOCKET

The PLCC transition socket is required for use along

with the PLCC device adapters. The DAF18-1 device

adapter is equipped with eight socket strips that inter-

face with one of two transition sockets. The DAF18-3

device adapter is equipped with four socket strips that

interface with one transition socket.

The PLCC transition sockets are designed with a

threaded insert in the center of the footprint so that a

4/40 screw can securely fasten the transition socket to

the device adapter.

The PLCC transition sockets are designed to be sol-

dered to the target PCB PLCC surface mount pattern or

inserted into a PLCC socket on the target PCB.

The following PLCC transition sockets have been

discontinued:

• XLT68L1: One 68-lead PLCC transition socket

• XLT84L1: One 84-lead PLCC transition socket

RECOMMENDED PCB LAYOUT

Note: To avoid sol der bri dgi ng , do not pl ac e vi as

within 0.025-inch of the PLCC footprint.

Also, any vias near the PLCC should be

directly on the centerline of the pad.

Cable to Processor Module

PLCC Device Adapter

PLCC Transition Socket

Target/Application Board

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

Drawing shown i s for 68-lead.

0.024

0.050 0.074

68-lead 1.025

84-lead 1.225

Transition Socket Specification

DS51194S-page 34  2010 Microchip Technology Inc.

XLT68L1, XLT84L1 (Discontinued)

68/84-l ead A dapt er Socket

Tooling hole with

#4-40 threaded insert.

TOP VIEW

68-lead 1.300 0.960

84-lead 1.400 1.160

*Caution: Pin 1 on the device ad ap ter s ide ( top of socket)

is 180 degrees from pin 1 on the target side (bottom of

socket).

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

Drawing shown is for 68-lead.

0.050 0.018

0.850 0.580

SIDE

VIEW

FRONT/

 2010 Microchip Technology Inc. DS51194S-page 35

Transition Socket Specification

QFP TRANSITION SOCKET

QFP (MQFP, TQFP, PQFP) transition sockets and

associated hardware are shown below.

FIGURE 5: QFP TRANSITION SOCKET

The QFP transition socket is required for use along with

the QFP device adapter. The device adapter is

equipped with four socket strips that interface with the

transiti on soc k et.

The following QFP transition sockets have been

discontinued:

• XLT44PT: One 44-lead QFP transition socket,

0.80 mm

• XLT64PT1: One 64-lead QFP transition socket,

0.5 mm (PIC16C92X)

• XLT64PT2: One 64-lead QFP transition socket,

0.5 mm (PIC17CXXX)

• XLT64PT3: One 64-lead QFP transition socket,

0.8 mm (dsPIC30F)

• XLT64PT4: On e 6 4-l ead QFP adapter s oc ke t and

one 64-lead QFP header (0.8 mm)

• XLT80PT: One 80-lead QFP transition socket,

0.5 mm

QFP TRANSITION SOCKET

SOLDERING TIPS

• Before soldering, consider keeping the

break-away tabs in place during soldering.

• Use controlled soldering iron tip temperatures

between 300C and 325C (570F to 615F)

• If possible, use a PACE mini wave soldering iron

tip or an equivalent tip design.

• Plan to solder one (1 of 4) side first, then the

opposite side, then the remaining two sides.

• Soldering iron tip movement should be in the

directio n of the leads (backw ard and forward), no t

across the leads; dragging the tip across the

leads may cause lead damage.

• Use generous amounts of soldering flux to aid in

the solder flow action.

• If the brea k-away tabs are re moved after solder-

ing (using a dental pick or equivalent), any solder

bridg ing bet ween leads c an be re pai red by s impl y

gently touching the soldering tip to the lead tip.

XLT44PT (Discontinued – see XLT44PT3)

44-lead QFP to 0.8 mm Adapter Socket

Note: To avoid sol der bri dgi ng , do not pl ac e vi as

within 0.025-inch of the QFP footprint.

Also, any vias near the QFP should be

directly on the centerline of the pad.

Note: The XLT64PT1 for the PIC16C92X is not

symmetric al . Pl eas e not e Pi n 1 orientation

prior to soldering to the target system.

Cable to Processor Module

QFP Device Adapter

QFP Transition Socket

Target/Application Board

TOP

VIEW

1ST92X

Pin 1

CAUTION

The 64 and 80-pin QFP headers are very delicate

and can be easily damaged!

0.90

TOP

VIEW

0.90

UNLESS OTHERWISE SPECIFIED, DIMENSIONS

ARE IN INCHES.

0.300

0.130

0.80

0.65

0.55

0.365

0.05

0.80 mm

SIDE

VIEW

FRONT/

Transition Socket Specification

DS51194S-page 36  2010 Microchip Technology Inc.

XLT64PT1 (Discontinued)

XLT64PT2 (Discontinued – see XLT64PT5)

XLT80PT (Discontinued – see XLT80PT3)

64/80-lead QF P to 0.5 mm Adapter Socket

XLT64PT3 (Discontinued – see XLT64PT5)

64-lead QFP to 0.8mm Adapter Socket

UNLESS OTHERWISE SPECIFIED, DIMENSIONS

ARE IN INCHES.

Drawing shown is for 64-lead.

This drawing shown with break-away tabs attached to

the leads.

Break-away tabs are to be removed prior to applying

power.

TOP

VIEW

0.05

0.5 mm

0.330

0.100

ABCD

XLT64PT1

XLT64PT2 1.25 0.95 0.400 0.500

XLT80PT 1.45 1.15 0.475 0.575

SIDE

VIEW

FRONT/

Break-Away

Tabs

1.05

TOP

VIEW

1.05

UNLESS OTHERWISE SPECIFIED, DIMENSIONS

ARE IN INCHES.

0.300

0.140

0.95

0.80

0.70

0.50

0.05

0.80 mm

SIDE

VIEW

FRONT/

 2010 Microchip Technology Inc. DS51194S-page 37

Transition Socket Specification

XLT64PT4 (Discontinued – see XLT64PT5)

64-lead QFP (0.8 mm)

1.250

TOP

VIEW

68 52

18 34

QFP

PIN 1

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

0.355

0.225

0.80 mm

0.018 0.050

0.960

SIDE

VIEW

FRONT/

0.065

Refer to the “Package Specification” for

PCB footprint dimensions (DS00049).

TABLE 1: DVA/DAF INTERFACE

SPECIFICATION FOR QFP

PACKAGES

Socket Package Style* DVA/DAF

Interface

Specification**

XLT44PT 44PT TQFP

44PQ MQFP

44KW PQFP

DVA-44PL

XLT64PT1 64PT special –

PIC16C923/4,

PIC16C925/6 only

DVA-68PL2

XLT64PT2 64PT DVA-68PL

XLT64PT3

XLT64PT4

XLT80PT 80PT DVA-84PL

* Refer to the “Package Specification” for PCB

footprint dimensions (DS00049).

** Refer to the processor module and device

adapter specification for interface and

dimensions to DVA/DAF (ICE 2000: “MPLAB®

ICE 2000 Proc essor Module an d Device Adapter

Specification” (DS51140); ICE 4000: “MPLAB®

ICE 4000 Proc essor Module an d Device Adapter

Specification” (DS51298)).

Transition Socket Specification

DS51194S-page 38  2010 Microchip Technology Inc.

SOT/DFN/QFN TRANSITION

SOCKETS

SOT/DFN/QFN transition sockets and associated

hardware are shown below.

FIGURE 6: DFN/QFN TWO-PART

TRANSITION SOCKET

FIGURE 7: QFN TRANSITION SOCKET

The following SOT/DFN/QFN transition sockets have

been discontinued:

• XLT08DFN: One 8-lead DFN transition socket.

(Replaced by XLT08DFN2.)

• XLT28QFN: One 28-lead QFN transition socket.

(Replaced by XLT28QFN4.)

• XLT28QFN2: One 28-lead QFN transition socket.

(Replaced by XLT28QFN3.)

• XLT44QFN: One 44-lead QFN two-part transition

socket. (Replaced by XLT44QFN2.)

See the draw ing s in thi s se cti on for layo ut dim en si ons .

RECOMMENDED PCB LAYOUT

The recommended target board footprint layout for

different pin-counts is shown here.

FIGURE 8: 8-PIN DFN

FIGURE 9: 28-PIN QFN

FIGURE 10: 44-PIN QFN

DFN/QFN Transition Socket

Target/A ppli cation Board

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/

Adapters

QFN Transition Socket

Target/A ppli cation Board

Cable to Processor Module

PDIP Device Adapter

Gold Standoffs/

Adapters

16 mils

24 mils

50 mils

24 mils 11 mils

26 mils

16 mils 13 mils

26 mils

 2010 Microchip Technology Inc. DS51194S-page 39

Transition Socket Specification

XLT08DFN (Discontinued – see XLT08DFN2)

8-lead DIP to 0.025-inch Adapter Socket

XLT28 QF N (D iscon tin ued – see XLT 28Q FN4)

28-lead DIP to 0.025-inch Adapter Socket

400 mils

DIP socket

Solder

PCB pads

400 mils

250 mils

170 mils

62 mils

160 mils

TOP

VIEW

SIDE

VIEW

1400 mils

600 mils

DIP socket

Solder

PCB pads

480 mils 425 mils

TOP

VIEW

SIDE

VIEW

Transition Socket Specification

DS51194S-page 40  2010 Microchip Technology Inc.

XLT28QFN2 (Discontinued – see XLT28QFN3)

18-lead DIP to 0.025-inch Adapter Socket

XLT44 QF N (D iscon tin ued – see XLT 44Q FN2)

40-lead DIP to 0.025-inch Adapter Socket

44-lead QFN Header

TOP

VIEW

0.900

0.600

SIDE

VIEW

0.236

0.026

0.480 0.875

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

BOTTOM

VIEW

TOP

VIEW

2.058

0.695

SIDE

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE

IN INCHES.

BOTTOM

VIEW

DIP 1

Pin 1 of QFN

TOP

VIEW

SIDE

VIEW

0.026

UNLESS OTHERWISE SPECI FIED, DIMENSIONS ARE

IN INCHES.

BOTTOM

VIEW

0.195

0.315

Solder

PCB pads

 2010 Microchip Technology Inc. DS51194S-page 41

Transition Socket Specification

APPENDIX A: REVISION HISTORY

A.1 Revision N (February 2006)

The following is a list of modifications:

1. Added Appendix A: Re vision History.

2. Removed “Preliminary” from the document’s

footer.

3. Added notes referring user to the “Packaging

Specification” (DS00049) for PCB footprint

dimens io ns in the “Two-Part QFP Sockets”

section.

A.2 Revision P (September 2006)

The following is a list of modifications:

1. Removed “MPLAB ICE 2000/4000” from the

name of the document. This document now

applies to multiple tools, and the document title

was renamed to reflect this.

2. Updated document to reflect support of 4 tools.

3. Updated document to include break-away tab

information for XLT64PT1, XLT64PT2 and

XLT80PT.

A.3 Revision Q (July 2008)

The following is a list of modifications:

1. Update for n ew SOIC, SSOP an d Q FN so ck et s .

A.4 Revision R (July 2009)

The following is a list of modifications:

1. Updated the first paragraph in the

“Introduction” section.

A.5 Revision S (March 2010)

The following is a list of modifications:

1. Obsoleted XLT28XP and XLT64PT4

2. Added XLT44QFN4 and XLT44QFN5.

DS51194S-page 42  2010 Microchip Technology Inc.

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01/05/10