K M Y
Last update: 2015.4.4 No.RMC-K-HTS-0006-9
(Uncontrolled copy)
Specification
(Reference)
Title:
FIXED THICK FILM CHIP RESISTORS;
RECTANGULAR TYPE
Style:
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1
RoHS COMPLIANCE ITEM
Product specification contained in this specification
are subject to change at any time without notice
If you have any questions or a Purchasing Specification for any quality
Agreement is necessary, please contact our sales staff.
Issue Dept.: Research & Development Department Hokkaido Research Center
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
1/18
Product specification contained in this specification are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
1. Scope
1.1 This specification covers the detail requirements for fixed thick film chip resistors; rectangular type, style of RMC1/32, 1/20,
1/16S, 1/16, 1/10, 1/8, 1/4, 1/2, 1.
1.2 Applicable documents
JIS C 5201−1: 1998, JIS C 5201−8: 1998, JIS C 5201−8−1: 1998
IEC60115−1: 1999, IEC60115−8: 1989 Amendment 1: 1992, IEC60115−8−1: 1989
EIAJ RC−2134B−2002
2. Classification
Type designation shall be the following form.
(Example) 1) RMC
1/8
−
123
J
TP
1
2
3
4
5 6
Style
2) RMC
1/8
JP
TP
1
2
4
6
Style
1 Fixed thick film chip resistors; rectangular type
2 Rated dissipation and / or dimension
3 Temperature coefficient of resistance
4 Rated resistance Example; 123 → 12kΩ, Chip jumper: JP
5 Tolerance on rated resistance
6 Packaging form
3. Rating
3.1 The ratings shall be in accordance with Table−1. Table−1(1)
Style Rated
dissipation
(W)
Temperature coefficient of
resistance (10
−6
/ °C) Rated resistance
range (Ω)
Preferred
number series
for resistors
Tolerance on
rated resistance
±200 100∼1M
±300 10∼91
4.7∼9.1
F(±1%)
J(±5%)
RMC1/32 0.03 Standard +600∼−200 1.0∼4.3
E24
J(±5%)
±200 10∼1M B(±0.1%)
D(±0.5%)
±200 10∼10M
+350∼−100 4.02∼9.76
+600∼−200 1∼3.92
E24, 96 F(±1%)
±200 10∼1M G(±2%)
±200 10∼10M
+350∼−100 4.3∼9.1
RMC1/20 0.05 Standard
+600∼−200 1∼3.9
E24 J(±5%)
K ±100 10∼1M B(±0.1%)
D(±0.5%)
Standard ±200 1.02M∼3.3M D(±0.5%)
K ±100 10∼1M
±200 1.02M∼10M
+500∼−200 1∼9.76
E24, 96
F(±1%)
±200 10∼10M G(±2%)
±200 10∼10M
RMC1/16S 0.1
Standard
+500∼−200 1∼9.1 E24 J(±5%)
K ±100×10
−6
/ °C
−(Dash)
Standard
Style
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
2/18
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
Table−1(2)
Style Rated
dissipation
(W)
Temperature coefficient of
resistance (10
-6
/ °C) Rated resistance
range (Ω)
Preferred
number series
for resistors
Tolerance on
rated resistance
±100 10∼3.3M B(±0.1%)
D(±0.5%)
K ±100 10∼10M
+500∼−200 1∼9.76
E24, 96 F(±1%)
±200
+500∼−200 10∼10M
1.0∼9.1 G(±2%)
±200 10∼22M
RMC1/16 0.1
Standard
+500∼−200 1.0∼9.1
E24
J(±5%)
K ±100 10∼2.2M B(±0.1%)
D(±0.5%)
Standard
±200 2.21M∼3.3M D(±0.5%)
K ±100 10∼2.2M
±200 2.21M∼10M
+500∼−200 1.0∼9.76
E24,96
F(±1%)
±200 10∼10M
+500∼−200 1.0∼9.1 G(±2%)
±200 10∼22M
RMC1/10 0.125
Standard
+500∼−200 1.0∼9.1
E24
J(±5%)
K ±100 10∼1M B(±0.1%)
D(±0.5%)
F(±1%)
±200 1.02M∼10M
+500∼−200 1.0∼9.76
E24,96
F(±1%)
±200 10∼10M
+500∼−200 1.0∼9.1 G(±2%)
±200 10∼24M
RMC1/8 0.25
Standard
+500∼−200 1.0∼9.1
E24 J(±5%)
K ±100 10∼1M B(±0.1%)
D(±0.5%)
F(±1%)
±200 1.02M∼10M
+500∼−200 1.0∼9.76
E24,96
F(±1%)
10∼1M G(±2%)
±200 10∼22M
RMC1/4 0.5
Standard
+500∼−200 1.0∼9.1 E24 J(±5%)
K ±100 10∼1M
+500∼−200 1.0∼9.76 E24, 96 F(±1%)
10∼1M G(±2%)
±200 10∼22M
RMC1/2 0.75 Standard
+500∼−200 1.0∼9.1 E24 J(±5%)
K ±100 10∼1M
+500∼−200 1.0∼9.76 E24, 96 F(±1%)
10∼1M G(±2%)
±200 10∼22M
RMC1 1.0 Standard
+500∼−200 1.0∼9.1 E24 J(±5%)
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
3/18
Product specification contained in this specification are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
Table−1(3)
Style Limiting element
voltage (V) Isolation voltage
(V) Category temperature
range (°C)
RMC1/32 15 −55∼+125
RMC1/20 25 50
RMC1/16S
RMC1/16 50 100
RMC1/10 150
RMC1/8
RMC1/4
RMC1/2
RMC1
200 500
−55∼+155
Note. Rated current of chip jumper: RMC1/32: 0.5(A), RMC1/20, 1/16S: 1(A),
RMC1/16, 1/10, 1/8, 1/4, 1/2,1: 2(A)
Note. Resistance value of chip jumper: 50 mΩ max.
3.2 Climatic category
3.2.1 RMC1/32
55/125/56 Lower category temperature − 55 °C
Upper category temperature +125 °C
Duration of the damp heat, steady state test 56days
3.2.2 RMC1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1
55/155/56 Lower category temperature − 55 °C
Upper category temperature +155 °C
Duration of the damp heat, steady state test 56days
3.3 Stability class
5% Limits for change of resistance:
−for long−term tests ±(5%+0.1Ω) Chip jumper: 50 mΩ max.
−for short−term tests ±(1%+0.05Ω) Chip jumper: 50 mΩ max.
3.4 Derating
The derated values of dissipation (or current rating in case of chip jumper) at temperature in excess of 70 °C shall be as
indicated by the following curve.
Figure−1 Derating curve
−
55
100
70
125
0
Area of recommended
operation
Percentage of the
rated dissipation
(Current)
Ambient
temperature (°C)
(%)
155
RMC1/32
RMC1/20,1/16S,1/16,1/10,1/8,1/4, 1/2,1
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
4/18
Product specification contained in this specification are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
3.5 Rated voltage
d. c. or a. c. r. m. s. voltage calculated from the square root of the product of the rated resistance and the rated dissipation.
E : Rated voltage (V)
E = P · R P : Rated dissipation (W)
R : Rated resistance (Ω)
Limiting element voltage can only be applied to resistors when the resistance value is equal to or higher than the critical
resistance value.
At high value of resistance, the rated voltage may not be applicable.
4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol Packaging form Standard packaging
quantity / units Application
B Bulk (loose package) 1,000 pcs. RMC1/32,1/20,1/16S,1/16,1/10
,1/8,1/4,1/2,1
20,000 pcs. RMC1/32
PA Press pocket taping
(paper taping) 8mm width, 2mm pitches 15,000 pcs. RMC1/20
TH Paper taping 8mm width, 2mm pitches 10,000 pcs. RMC1/16S,1/16
TP Paper taping 8mm width, 4mm pitches 5,000 pcs. RMC1/16, 1/10, 1/8
8mm width, 4mm pitches RMC1/4
TE Embossed taping 12mm width, 4mm pitches 4,000 pcs. RMC1/2, 1
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
5/18
Product specification contained in this specification are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−3.
Figure−2
Table−3 Unit : mm
Style
Country of origin
L W H c d z
RMC1/32
Japan, Malaysia
0.4±0.02 0.2±0.02 0.13±0.02 0.08±0.03 0.1±0.03
RMC1/20
Japan, Malaysia
0.6±0.03 0.3±0.03 0.23±0.03 0.1±0.05 0.15±0.05
RMC1/16S
Malaysia, China
1.0±0.05 0.5±0.05 0.35±0.05 0.2±0.1
+0.05
0.25
−0.10
RMC1/16
Malaysia, China
1.6±0.1
+0.15
0.8
−0.05
0.45±0.10 0.3±0.1 0.3±0.1
RMC1/10
Malaysia, China
2.0±0.1 1.25±0.10 0.55±0.10 0.4±0.2 0.4±0.2
---------
Malaysia,
3.1±0.1 1.6±0.15 0.55±0.10 0.5±0.25 0.5±0.25 0.05~0.3
RMC1/8
China
3.1±0.1 1.6±0.1 0.6±0.15 0.5±0.2 0.45±0.20 0~0.1
RMC1/4
Malaysia
3.1±0.15 2.5±0.15 0.55±0.15 0.5±0.25 0.5±0.25 0.05~0.3
RMC1/2
Malaysia
5.0±0.15 2.5±0.15 0.55±0.15 0.6±0.2 0.6±0.2 0.05~0.35
RMC1
Malaysia
6.3±0.15 3.2±0.15 0.55±0.15 0.6±0.2 0.6±0.2 0.05~0.35
5.2 Net weight (Reference)
Style Net weight(mg)
RMC1/32 0.035
RMC1/20 0.16
RMC1/16S 0.6
RMC1/16 2
RMC1/10 5
RMC1/8 9
RMC1/4 16
RMC1/2 25
RMC1 40
L
c
H
d
d
z
W
c
z
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
6/18
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
6. Marking
The Rated resistance of RMC1/32, 1/20, 1/16S should not be marked.
6.1 RMC1/10,1/8,1/4,1/2,1
The nominal resistance shall be marked in 3 digits or 4 digits and marked on over coat side.
• Malaysia products: E24 series: 3 digits, E96 series: 4 digits
In case of the resistance value that E96 overlaps with E24, It is marked by either.
• China products(RMC1/10,1/8): J(±5%): 3 digits, F(±1%): 4 digits
Marking example
Malaysia China Contents Application
123 123 12×10 3 ［Ω］ → 12 ［kΩ］ RMC1/10,1/8,1/4,1/2,1
2R2 2R2 2. 2 ［Ω］ Less than 10Ω of RMC1/8,1/4,1/2,1
2 . 2 2R2 2. 2 ［Ω］ Less than 10Ω of RMC1/10
5623 5623 562×10 3 ［Ω］ → 562［kΩ］ RMC1/10,1/8,1/4,1/2,1
12R7 12R7 12.7 ［Ω］ RMC1/10,1/81/4,1/2,1
6.2 RMC1/16
The nominal resistance shall be marked in 3 digits (E24 and/or E96) and marked on over coat side.
No marking in the E96 series of a Malaysia.
In case of the resistance value that E96 overlaps with E24, there is a case to mark in E96.
Marking example
Malaysia China Contents Application
123 123 12×10 3 ［Ω］ → 12 ［kΩ］ E24
2R2 2R2 2. 2 ［Ω］ E24
No marking 02C 102×102 [Ω] → 10.2 [kΩ] E96
No marking 51X 332×10−1 [Ω] → 33.2 [Ω] E96
6.2.1 Symbol for E96 series of resistance value
E96 Symbol
E96 Symbol
E96 Symbol
E96 Symbol
E96 Symbol
100 01 162 21 261 41 422 61 681 81
102 02 165 22 267 42 432 62 698 82
105 03 169 23 274 43 442 63 715 83
107 04 174 24 280 44 453 64 732 84
110 05 178 25 287 45 464 65 750 85
113 06 182 26 294 46 475 66 768 86
115 07 187 27 301 47 487 67 787 87
118 08 191 28 309 48 499 68 806 88
121 09 196 29 316 49 511 69 825 89
124 10 200 30 324 50 523 70 845 90
127 11 205 31 332 51 536 71 866 91
130 12 210 32 340 52 549 72 887 92
133 13 215 33 348 53 562 73 909 93
137 14 221 34 357 54 576 74 931 94
140 15 226 35 365 55 590 75 953 95
143 16 232 36 374 56 604 76 976 96
147 17 237 37 388 57 619 77
150 18 243 38 392 58 634 78
154 19 249 39 402 59 649 79
158 20 255 40 412 60 665 80
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
7/18
Product specification contained in this specification are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
6.2.2 Symbol of multipliers
Symbol Y X A B C D E F
Multipliers
10−2
10−1
100 101 102 103 104 105
6.3 Marking example of Jumper Chip
Marking example
Malaysia China Contents Application
or 000 RMC1/16
000 RMC1/10,1/8
000 JP RMC1/4,1/2,1
7. Performance
7.1 The standard condition for tests shall be in accordance with Sub−clause 4.2, JIS C 5201−1: 1998.
7.2 The performance shall be satisfied in Table−4. Table−4(1)
No.
Test items Condition of test (JIS C 5201−1) Performance requirements
1 Visual examination Sub−clause 4.4.1
Checked by visual examination.
As in 4.4.1
The marking shall be legible, as
checked by visual examination.
2 Dimension
Resistance
Sub−clause 4.4.2
Sub−clause 4.5
As specified in Table−3 of this
specification.
As in 4.5.2
The resistance value shall
correspond with the rated resistance
taking into account the specified
tolerance.
Chip jumper: 50mΩ max.
3 Voltage proof Sub−clause 4.7
Method: 4.6.1.4(See Figure−5)
Test voltage: Alternating voltage with a peak
value of 1.42 times the
insulation voltage.
Duration: 60 s ± 5 s
Insulation resistance
Test voltage: Insulation voltage
Duration: 1 min.
No breakdown or flash over
R ≥ 1 G Ω
4 Solderability Sub−clause 4.17
Without ageing
Flux: The resistors shall be immersed in a
non−activated soldering flux for 2s.
Bath temperature: 235 °C ± 5 °C
Immersion time: 2 s ± 0.5 s
As in 4.17.4.5
The terminations shall be covered
with a smooth and bright solder
coating.
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
8/18
Product specification contained in this specification are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
Table−4(2)
No
Test items Condition of test (JIS C 5201−1) Performance requirements
5 Mounting
Overload
(in the mounted state)
Solvent resistance of the
marking
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Sub−clause 4.13
The applied voltage shall be 2.5 times the
rated voltage or twice the limiting element
voltage, whichever is the less severe.
Duration: 2 s
Visual examination
Resistance
Sub−clause 4.30
Solvent: 2−propanol
Solvent temperature: 23 °C ± 5 °C
Method 1
Rubbing material: cotton wool
Without recovery
No visible damage
∆R ≤ ± (1%+0.05Ω)
Chip jumper: 50mΩ max.
Legible marking
6 Mounting
Bound strength of the end face
plating
Final measurements
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−4
Sub−clause 4.33
Bent value: 3 mm (3225 size max.)
1 mm (5025 siz min.)
Resistance
Sub−clause 4.33.6
Visual examination
∆R ≤ ± (1%+0.05Ω)
Chip jumper: 50mΩ max.
No visible damage
7 Resistance to soldering heat
Component solvent resistance
Sub−clause 4.18
Solder temperature: 260 °C ± 5 °C
Immersion time: 10 s ± 0.5 s
Visual examination
Resistance
Sub−clause 4.29
Solvent: 2−propanol
Solvent temperature: 23 °C ± 5 °C
Method 2
Recovery: 48 h
Visual examination
Resistance
As in 4.18.3.4
No sign of damage such as cracks.
∆R ≤ ± (1%+0.05Ω)
Chip jumper: 50mΩ max.
No visible damage
∆R ≤ ± (1%+0.05Ω)
Chip jumper: 50mΩ max.
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
9/18
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
Table−4(3)
No
Test items Condition of test (JIS C 5201−1) Performance requirements
8 Mounting
Adhesion
Rapid change temperature
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Sub−clause 4.32
Force: 5 N
(RMC1/32: 2N, RMC1/20: 3N)
Duration: 10 s ± 1 s
Visual examination
Sub−clause 4.19
RMC1/32
Lower category temperature: −55 °C
Upper category temperature: +125 °C
RMC1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1
Lower category temperature: −55 °C
Upper category temperature: +155 °C
Duration of exposure at each temperature: 30
min.
Number of cycles: 5 cycles.
Visual examination
Resistance
No visible damage
No visible damage
∆R ≤ ±(1%+0.05Ω)
Chip jumper: 50mΩ max.
9 Climatic sequence
−Dry heat
−Damp heat, cycle
(12+12hour cycle)
First cycle
−Cold
−Damp heat, cycle
(12+12hour cycle)
Remaining cycle
−D.C. load
Sub−clause 4.23
Sub−clause 4.23.2
RMC1/32
Test temperature: +125 °C
RMC1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1:
Test temperature: +155 °C
Duration: 16 h
Sub−clause 4.23.3
Test method: 2
Test temperature: 55 °C
[Severity(2)]
Sub−clause 4.23.4
Test temperature −55 °C
Duration: 2h
Sub−clause 4.23.6
Test method: 2
Test temperature: 55 °C
[Severity (2)]
Number of cycles: 5 cycles
Sub−clause 4.23.7
The applied voltage shall be the rated voltage
or the limiting element voltage whichever is
the smaller.
Duration: 1 min.
Visual examination
Resistance
No visible damage
∆R ≤ ± (5%+0.1Ω)
Chip jumper: 50mΩ max.
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
10/18
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
Table−4(4)
No
Test items Condition of test (JIS C 5201−1) Performance requirements
10 Mounting
Endurance at 70 °C
Sub−clause 4.31
Substrate material: Epoxide woven glass
(RMC1may use Alumina substrate.)
Test substrate: Figure−3
Sub−clause 4.25.1
Ambient temperature: 70 °C ± 2 °C
Duration: 1000 h
The voltage shall be applied in cycles of 1.5 h
on and 0.5 h off.
The applied voltage shall be the rated voltage
or the limiting element voltage whichever is
the smaller.
Examination at 48 h , 500 h and
1000 h:
Visual examination
Resistance
No visible damage
∆R ≤ ± (5%+0.1Ω)
Chip jumper: 50mΩ max.
11 Mounting
Variation of resistance with
temperature
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Sub−clause 4.8
RMC1/32:
−55 °C / +20 °C
+20 °C / +125°C
RMC1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1:
−55 °C / +20 °C
+20 °C / +155°C
As in Table−1
12 Mounting
Damp heat, steady state
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Sub−clause 4.24
Ambient temperature: 40 °C ± 2 °C
+2
Relative humidity : 93 %
−3
a) 1st group: without voltage applied.
b) 2nd group: The d. c. voltage shall be
applied continuously.
The voltage shall be accordance with
Sub−clause 4.24.2.1 b). without polarizing
voltage [4.24.2.1, c)]
Visual examination
Resistance
No visible damage
Legible marking
∆R ≤ ± (5%+0.1Ω)
Chip jumper: 50mΩ max.
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
11/18
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
Table−4(5)
No
Test items Condition of test (JIS C 5201−1) Performance requirements
13 Dimensions (detail)
Mounting
Endurance at upper category
temperature
Sub−clause 4.4.3
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Sub−clause 4.25.3
RMC1/32:
Ambient temperature:125 °C ± 2 °C
RMC1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1:
Ambient temperature:155 °C ± 2 °C
Duration: 1000 h
Examination at 48 h, 500 h and
1000 h:
Visual examination
Resistance
As in Table−3
No visible damage
∆R ≤ ± (5%+0.1Ω)
Chip jumper: 50mΩ max.
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
12/18
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
8. Test substrate
Unit: mm
Style a b c d
RMC1/2 4.0 7.5 2.0 7.5
RMC 1 5.0 9.0 4.5 7.5
RMC1/2, 1 TEST SUBSTRATE
Unit: mm
Style a b c d
RMC1/32 0.2 0.56
0.2 5.3
RMC1/20 0.3 1.5 0.45
5.2
RMC1/16S 0.6 1.9 0.7 4.9
RMC1/16 1.0 3.6 1.0 4.5
RMC1/10 1.2 4.0 1.5 4.3
RMC1/4 2.2 5.0 2.9 3.3
RMC1/20, 1/16S, 1/16, 1/10 1/4 TEST SUBSTRATE
Unit: mm
RMC1/8 TEST SUBSTRATE
Figure−3
Remark 1). Material: Epoxide woven glass
Thickness: 1.6mm Thickness of copper clad: 0.035mm
2). In the case of connection by connector, the connecting terminals are gold plated.
However, the plating is not necessary when the connection is made by soldering.
b
d
c
a
40
10.16
60.96
2.5
8
1.5
2
5
1.5
2
2
2
49
4
2.5
7.5
5
2.5
30
4
3.5
2.5
Soldering land
:
Copper clad
:
Solder resist
:
Copper clad
:
Solder resist
:
Copper clad
:
Solder resist
c
3
3.5
d
a
5.5
7.5
25
b
2.5
5.08
5.08
3
58.5
Soldering land
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
13/18
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
Unit: mm
RMC1/2, 1 BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE
Unit: mm
Style a b c d
RMC1/20 0.3 1.1 0.45
2.15
RMC1/16S
0.6 1.9 0.7 2.0
RMC1/16 1.0 3.6 1.20
3.0
RMC1/10 1.2 4.0 1.65
3.0
RMC1/8 2.5 5.0 2.0 2.5
RMC1/4 2.2 5.0 2.9 2.5
RMC1/20,1/16S,1/16,1/10,1/8,1/4 BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE
Unit: mm
RMC1/32 BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE
Thickness: 1.6mm Thickness of copper clad: 0.035mm
Figure−4
Style a b c
RMC1/2
4.0
7.5
3.0
RMC 1 5.0
9.0
4.0
c
a
1
40
100
b
:
Copper clad
:
Solder resist
:
Copper clad
:
Solder resist
d
a
d
c
1
4.5
40
b
70
100
Soldering land
:
Copper clad
:
Solder resist
5.5
40
70
100
Soldering land
0.5
0.
5
0.5
0.2
0.56
0.2
0.53
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
14/18
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
⋅ RMC1/16S,1/16,1/10,1/8,1/4,1/2,1 ⋅ RMC1/32, 1/20
Figure−5
9. Taping
9.1 Applicable documents JIS C 0806−3: 1999, EIAJ ET−7103: 2004, EIAJ ET−7200B: 2003
9.2 Taping dimensions
9.2.1 Press pocket taping (Paper taping, 8mm width, 2mm pitches)
Taping dimensions shall be in accordance with Figure−6 and Table−5.
Unit: mm
Figure−6
Table−5 Unit: mm
Style A B t
1
t
2
t
3
RMC1/32 0.24±0.03 0.45±0.03 0.31±0.03 0.36±0.02 0.15±0.02
RMC1/20 0.37±0.05 0.67±0.05 0.42±0.03 0.45±0.05 0.27±0.02
t
1
+
0.1
φ1.5
0
4
±
0.05
1.75
±
0.1
t
3
t
2
2
±
0.05
3.5
±
0.05
8
±
0.2
A
B
Sprocket hole
Carrier cavity
Direction of unreeling
R0.25
∼
R0.5mm
Metal block measurement
Point A
Insulation plate
Metal plate
Measurement
point B Insulation surface Component Pressure by
spring (1±0.2N)
V
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
15/18
Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
9.2.2 Paper taping (8mm width, 2mm pitches)
Taping dimensions shall be in accordance with Figure−7 and Table−6.
Unit: mm
Figure−7
Table−6 Unit: mm
Style A B t
1
t
2
RMC1/16S
+0.05
0.65
−0.10 +0.05
1.15
− 0.10
0.4 ± 0.05 0.5max.
RMC1/16 1.15±0.15 1.9±0.2 0.6±0.1 0.8max.
9.2.3 Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−8 and Table−7.
Unit: mm
Figure−8
Table−7 Unit: mm
Style A B t
1
t
2
RMC1/16 1.15±0.15 1.9±0.2 0.6±0.1 0.8max.
RMC1/10 1.65±0.15 2.5±0.2
RMC1/8 2.00±0.15 3.6±0.2 0.8±0.1 1.0max.
t
1
+
0
0.
.1
1
φ1.5
0
4
±
0.1
1.75
±
0.1
8
±
0.2
3.5
±
0.05
2
±
0.05
t
2
A
B
Sprocket hole
Carrier cavity
Direction of unreeling
t
1
t
2
+
0.1
φ1.5
0
4
±
0.1
2
±
0.05
1.75
±
0.1
8
±
0.2
4
±
0.1
3.5
±
0.05
A
B
Sprocket hole
Carrier cavity
Direction of unreeling
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
16/18
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
9.2.4 Embossed taping dimensions shall be in accordance with Figure−9 and Table−8.
Unit: mm
Figure−9
Table−8 Unit: mm
Style A B W E t
1
RMC1/4 2.85±0.20 3.5±0.2 8.0±0.3 3.5±0.05 1.0±0.2
RMC1/2 3.1±0.2 5.5±0.2
RMC 1 3.6±0.2 6.9±0.2 12.0±0.3 5.5±0.05 1.1±0.15
1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the
following RMC1/32,1/20: Figure−10, RMC1/16S, 1/16, 1/10, 1/8: Figure−11, RMC1/4, 1/2, 1: Figure−12.
6). When the tape is bent with the minimum radius for RMC1/32, 1/20, 1/16S, 1/16, 1/10,1/8, 1/4: 25 mm, or RMC1/2, 1: 30
mm, the tape shall not be damaged and the components shall maintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The resistors shall be faced to upward at the over coating side in the carrier cavity.
Figure−10
Figure−11
0.3 max.
+
0.1
φ1.5
0
2
±
0.05
4
±
0.1
1.75
±
0.1
A
B
t
1
4
±
0.1
E
W
Sprocket hole
Carrier cavity
Direction of unreeling
165
°
to180
°
Carrier tape
Top cover tape
Peel
−
off
(
About 300mm
/
min
)
Direction of unreeling
165
°
to180
°
Carrier tape
Top cover tape
Peel
−
off
(About 300mm/min)
Direction of unreeling
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
17/18
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If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
Figure−12
9.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−13 and Table−9.
Plastic reel (Based on EIAJ ET−7200B) Unit: mm
Figure−13
Table−9 Unit: mm
Style A B Note
11.4±1.0 Injection molding
RMC1/32, 1/20, 1/16S, 1/16, 1/10, 1/8, 1/4
+1.0
9
0
13±1.0 Vacuum forming
RMC1/2, 1
+1.0
13
0
17±1.0 Vacuum forming
Note: Marking label shall be marked on a place of Marking A or two place of marking A and B.
9.4 Leader and trailer tape.
(Example)
Figure−14
165
°
to180
°
Carrier tape
Top cover tape
Peel
−
off
(
About 300mm
/
min
)
Direction of unreeling
160mm min
.
100mm min
.
400mm min
.
End
Trailer
Direction of unreeling
Leader
Start
φ
21
±
0.8
2
±
0.5
Marking A
0
φ
180
−1.5
+
1
φ
60
0
φ
13
±
0.2
B
A
Marking B
K M Y
Drawing No:
RMC−K−HTS−0006 /9
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1 Page:
18/18
Product specification contained in this specification are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2015.4.4
10. Marking on package
The label of a minimum package shall be legibly marked with follows.
10.1 Marking A
(1) Classification
(Style, Temperature coefficient of resistance, Rated resistance, Tolerance on rated resistance, Packaging form)
(2) Quantity (3) Lot number (4) Manufacturer’s name or trade mark (5) Others
10.2 Marking B (KAMAYA Control label)
K M Y
Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE
RMC1/32,1/20,1/16S,1/16,1/10,1/8,1/4,1/2,1
製品仕様書類 制定、改訂 履歴書
製品仕様書番号 RMC-K-HTS-0006 版数 第 9 版 頁 1／1
版数 制定・改定日 頁 制定・改訂の内容
1 2002.9. 29 全 新規制定
2 2006.11.1 2 3 定格 定格抵抗値範囲
RMC1/16S：Tol:F, TCR±100：100～1M → 10～1M(Ω)に変更。
RMC1/16：Tol:F, TCR±100：10～1M(Ω) → 10M～10M(Ω)
Tol: G：10～4.7M(Ω) → 10～10M(Ω)
全 RMC1/2,1 を追加（便宜上 RMC1/32,1/20 を追加）
1 1.2 関連規格 EIAJ RC-2134A-1998→EIAJ RC-2134B-2002
2 3 定格 定格抵抗値範囲
RMC1/20：Tol:F, TCR+600～-200：1～9.76 を追加。
3 3 定格 定格電力 RMC1/2：0.5W→0.75W に変更。
13 9.1 関連規格 EIAJ ET-7201A-1996→JIS C 0806-6:2006 に変更
14 10.1 関連規格 EIAJ ET-7103:2004 を追加。
EIAJ ET-7200A:1999→EIAJ ET-7200B:2003 に変更。
17 10.3 テーピング用リール
EIAJ ET-7200A→EIAJ ET-7200B に変更
13±1.0mm 幅真空成形リール追加
3
2007.10.1
17 11 包装に関する表示 2) 表示 B より形状を削除
3 3 定格 定格抵抗値の許容差 RMC1/32：F(±1%)を追加。
定格電力(W) RMC1/4：0.25W→0.33W に変更。
抵抗温度係数(10
-6
/℃) RMC1/20：10～97.6Ω：±300→±200 に変更
4 2009/6/3
17 10 包装に関する表示 2) 表示 B を社内管理ラベルとした。
5 2009/10/1 3 3 定格 RMC1/16 定格電流：1A →2Aに変更。
6 2010/10/1 3 3 定格 RMC1/20 抵抗温度係数と定格抵抗値範囲
TCR:+600 ～ -200x10
-6
/ ℃ :Tol:F:1.0 ～ 9.76( Ω ), J:1.0 ～ 9.1( Ω ) → TCR+:+600 ～
-200x10
-6
/℃:Tol:F:1.0～3.92(Ω), J:1.0～3.9(Ω)に変更。
TCR: +350～-100x10
-6
/℃:Tol:F:4.02～9.76(Ω), J:4.3～9.1(Ω)追加。
7 2012.10.26 全 全面見直し
8 2013.12.1 1,2 RMC1/20,1/16S,1/16,1/10 定格抵抗値の許容差D(±0.5%)追加。
1,2 3 定格 RMC1/8,1/4 定格抵抗値の許容差D(±0.5%)追加。
RMC1/20,1/16S,1/16,1/10,1/8,1/4 定格抵抗値の許容差B(±0.1%)追加。
1Ω未満を削除。
3,9,10,11
RMC1/20 の
3 定格 カテゴリ温度範囲, 3.2 耐候性カテゴリ, 3.4 負荷軽減, 7 性能 No. 8 温度急変
No. 9 一連耐候性 高温(耐熱性), No.11 温度による抵抗値変化, No.13 カテゴリ上限温
度での耐久性
カテゴリ上限温度及び試験温度(℃)：+125 → +155 に変更
9 2015.4.4
4 4 包装形態 バルクケース削除、同仕様を削除。
2015.8.31 5 5 寸法 RMC1/8 表電極 c: 0.45±0.2 →0.5±0.2 裏電極 d: 0.5±0.2 → 0.45±0.2
所長 マネージャー 担当
遠山 遠山 根岸
