(M) MOTOROLA Triple Line Receiver (High Speed) ELECTRICALLY TESTED PER: MPG 10616 The 10616 is a high speed triple differential amplifier designed for use in sens- ing differential signals over long lines. The base bias supply (Vpp) is made available at pin 11 make the device useful as a Schmitt trigger, or in other applica- tion where a stable reference voltage is necessary. Active current sources provide the 10616 with excellent common mode noise rejection. If any amplifier in a package is not used, one input of that amplifier must be connected to Vgp (pin 11) to prevent upsetting the current source bias net- work. Complementary outputs are provided to allow driving twisted pair lines, to en- able cascading of several amplifiers in a chain, or simply to provide complement outputs of the input logic function. 150 mW Max/Pkg (No Load) * tod = 2.0 ns typ (All Output Loaded) tr, tf = 2.0 ns typ (20% - 80%) PIN ASSIGNMENTS FUNCTION OIL FLATS LCC BURN-IN (CONDITION C) Voc1 1 5 2 GND AOQUT 2 6 3 51 9t0VTT AQUT 3 7 4 51 QtoVTT AIN 4 8 5 GND AIN 5 9 7 Ves Bout 6 10 8 51.QtoVTT BouT 7 af] 9 1 Q to VT7 VEE 8 12 10 VEE BIN 9 13 12 GND BIN 10 14 13 VB VeB " 15 14 VeB Cin 12 16 15 GND CIN 13 1 17 VeBB Cout 14 2 18 51 Qto VT CouT 15 3 19 51 Q to VTT Vec2 16 4 20 GND BURN - IN CONDITIONS: VTT = - 2.0 V MAX/ 2.2 V MIN VEE =- 5.7 V MAX/- 5.2 V MIN NOTES: 1. Vpgto be used to supply bias to the 10616 only and bypassed (when used) with 0.01 :F to 0.1 uF capacitor. 2. When the input pin with the bubble goes positive, the output goes posittive. Military 10616 MPO nn AVAILABLE AS: 1) JAN: N/A 2) SMD: WA 3) 883: 10616/BXAJC X = CASE OUTLINE AS FOLLOWS: PACKAGE: CERDIP: E CERFLAT: F Lec: 2 The letter M appears before the slash on LCC. ww Voor OY fe] Voce Aout fs} Cour AQUT Gy | Cout An FE [3] Cin An Ei] 2] Gy Bout Ey [i] VBB Boyt E fo) Bin Vee [2] 2] Bin LOGIC DIAGRAM 4 n 2 5 3 9 d 8 10 ~4 7 12 d 14 13. + 15 " VBB MOTOROLA MILITARY MECL DATA 3-27410616 VIN VouT Vout Voc =+2.0V Coax Pulse Generator Input 0.1 pF + 20% NOTES 1. Alt unused outputs loaded 100 Q to ground. 2. Vin has the following characteristics: Veet = -3.2 Vde a) pulse width = 20 ns. 0.005V b) frequency = 1.0 MHz. ) ty and tf = 1.5ns + 0.2 ns. VIN 2 20 ns VouT VouT Figure 1. Switching Test Circuit and Waveforms MOTOROLA MILITARY MECL DATA 3-275 L queung urelg @ 91 't 8 OLS yus 62 - 82 - g2- Aiddnguemog| 22! : L t el a toh of: a yon tartan tate | Ob b 8 zt OL | zeou] VW S61 S61 Si Hi OL 6 'S bp 6's 'b | 6'S'b queuing jndu| 1 2h eb vl eb ] ae a a queung indul | gga ore'sp} 1] F | o's ezy| st ot OF | s0}a109 vedo l A . . . . . . aBeyoa Addng uh git 8 ors | ey | A | @eb- | veb- | Zeb | pee- | ez1- | SEb- | cog souaijey| SEA . eb el Sk pe ph et | ore toe . . . aBe0A igig'y | OFF 8 gy | ZbOL| 2b Ob A OLt - Sre'0 - $60 - dino u6 LHO, 29 6% 6'V | ess | 6's indino Ubi el el Sk vk veeh | ohe toys . . . abeyon Orta tn OL'h a tae Zi OL | 2h OF A GEOL - Ges'k - og't - d 10a L9QOE@ 67 6's pb | 68'S 'b yndyno MoT] SL vt : eb 2k | eb Ze a ae ae ae a ae abeyon| 9 o'g'eig | 9b 8 esblesy| A gs9'L Zeb Sek Zot 29'h cor yndino MoT A Sk Ph . Eb Zk | Eb Zh ne a a. ne a a aBeHOA!| HO 92 | ott 8 esrisesr| A 880 80'1 90 sze'0 8Z0 60 indino UI A Lind 39, | 33a GD, | Baa Ha LHI, Wa Hla xeW UI xen UNA xew UWA *SJOJOWBIB, A0'Z - } J OOL = POT INdiNG A oO = DDA 11 ud oF BA dnosBqns 2 dnosBans t dnosBans jeuonoung squowuBbissy Uj 49049 eBeyoRd 71q 10; ale paguasaje/ SINOU, 2, SS- Do SZb+ 9, S@+ MO139 SNid O1 Gal idd 3DVLIOA LSAL sun sy Joyous | joquiks ze - zg - ez0+| 104+] o1st-| sszt-] ze4-| seo-| 9.S9-= VL SHOA Q'S - 0} " ser= V1 40}S1S8J 75 OOL & YSno2y) peyeulwa} ese syndjno peureyulew Ss} Wy JeSUI] OOS UBYY ve- gs- | MO] HL + | OOV'L- | OOOF-| eet- | E9O-| Fo 192016 MO} JIE ASJ@ASUEL] PUB PJEOQ JINDIIO peyuud B LO PayUNOW JO Je90S 189} & UI ze- as: teo+r! itt] szpe-| sore-| son-] ezo-} 2. S=Vn SI}INDID BY] ~Peysijqejse ueeq sey LUNUGHINbS jeUsUy JEye a}qQe] }S@} 94} Ul UMOYS 13a, | 33,80,| 2S 1Sq IA LHI, WA HIA eanyeied suoneoioads op au} yea 0} paubisep uaeq sey JNdIO SEES MOL IOAW YyoIeg jso, SOILSIVALOVYVHSD IWOIHLOATSA {s}OA) sanjea eBeyo, js0L + 3TEVL LIAN LNSDSAINO 9L9O0L MOTOROLA MILITARY MECL DATA 3-276Gk vk 2'9'2% 8 oL'b LOlS | bb '2 | 2b6y] su Le ol 6Z oy gZ ol Aejoq uonebedoiq Hd) Gk vk 2'9e'% 8 OLb | bOL'S| brie | 2b'6y} su Le OL 62 o+ G2 ol Aejeq uoyebedolg Hd) Sk pL 2 9% 8 git | eeors| pie | abe} su Lz OL 62 or gz OL aw wej| TH GL bl Z9 2 8 grt | etor's| b'2 | aztey] su Le OL 62 o4 gz OL aw, esi Hy Lind Ta4AQ 994 ada, LNO, Nia xew UW xew UIW xew UW GND 0175 OOL = peor ndyng A O'% = DIA tL dnowGqns OL dnosBqns 6 dnouBqns euonound syuawuBbjssy Ul_g y90Y9 abe xed 41q 10) ase podUdiaj}O1 S}]NOU!d 9, SS- 9, SZ + 9, Sz+ : MO144 SNid OL Galdd 3DVLIOA 1S41 syun sy sJayowesed toquidg ze- zg- ezot| tor+| orst-| sszt-| zeL-| ge'o-| 9,.$5-=VL SI[OA O'? - O} 5. sere V1 JO}SISOJ 75 OO L & YBNosY) peyeula} ale syndjno peuleyurew Ss} Wy FEEL] OOS UBY) a fo. ot | exit a. a. ae tn. = ze e's 9'0 * | Fell OOv't = | 000'F =| eer | 9'0 4978016 MO} 412 BSJBASUBL] PUB PABOG JiNDJIO PayUlId & UO PS}UNOW JO 18490S ]S9} B U! ce- og: reo+! w+] szpt-| sore-| see-| ezo-| 2. S=VL SIWNDIO BY, PeUsiiqeysa uaeq sey WNqlinbe jews) seye 9/qQe} }S9} Uy} UL UMOYS yaa, | a5,/40,! 28g 1Sq Hl, LHI, MA Hia aunjeieduiey suolyeoioeds op ay} jaa 0} peuBlsep useq sey JINDIIO SaaS YOL TOSW Yyoeg qs SOILSIVSLOVHYVHS TVOINLDSATS (suoA) sonzea aBeyon 189) 3TEVL LINIT LNADS3AINO 9L9OL MOTOROLA MILITARY MECL DATA 3-277E. te ann . MOTOROLA SC LOGIC nye o ff eaez2s2 ooazaso 7 f T- 76-20 PACKAGE OUTLINE DIMENSIONS A letter suffix to the MECL logic function part number is used to specify the package style (see drawings below). See appropriate selector guide for specific packaging available for a given device type. _____ & _______ L SUFFIX CERAMIC PACKAGE CASE 620-09 rc iV Hts L colle de Me & SUFFIX CERAMIC PACKAGE CASE 623-05 13 | _| (LW SUFFIX FOR MC10H181 ONLY) NOTES: 1. LEAD POSITIONAL TOLERANCE: [ols o.13 0008) 8] T]A@ [BO] Z OIMENSION 1 TO CENTER OF LEADS WHEN FORMED PARALLEL 4. PACKAGE CONTOUR OPTIONAL (ROUND OA SQUARE CORNERS). 4 DIMENSIONS A AND B ARE DATUMS. 5, DIMENSIONING AND TOLERANCING PER ANS! YL4SM, 1962. ye aii iT RADIUS OF TRUE a Di LTO CENTER OF * POSTION AT SEATING PARE AT RDG LEADS WHEN FORWED MATERIAL CONDITION. *ARALLE 2, PACKAGE INDEX: NOTCH IN LEAD NOTCH IN 2. LEADS WITHEN 0.13 mm CERAMIC OA INK DOT. (0.005) RADIUS OF TRUE 4. OIM L TO CENTER OF LEADS WHEN FORMED Fa ATA EATING PLANE PARALLEL pani CONDITION. (HEN FORMED PARALLEL. P SUFFIX PFA] L SUFFIX Felhe O adhe BE my BO als OE cle OD PSO eae * | 7 CERAMIC PACKAGE CASE 632-08 | 1 riot re ' c+ ht to - A Bo | # font sore K i a py ae 1 i F o -el6 n~ | | Yd elhe Dun Jun | \ T 3 0.25 (0.010) O 025 (0.010) N She tle NOTES: 1. EHMENS:ONING AND TOLERANCING PER ANSI 2 CONTROLLING DIMENSION: INCH. 3, DIMENSION C 10 CENTER OF LEAD WHEN 4, OM F MAY NARROW TO 0.76 (0.090] WHERE THE YIGSM, 1982. FORMED PARALLEL, LEAD ENTERS THE CERAMHC BODY, 1-26= -_ = MOTOROLA :SC - LOGIC PACKAGE OUTLINE DIMENSIONS (continued) nue 0 Pfuaez2s2 ooszssi 9 f 7-90-20 P SUFFIX PLASTIC PACKAGE CASE 646-06 AAAAAASL 4 t ? 1 TPT TY A ROTE 4 i | Ty ms oy +f J ume mod le NOTES: 1. LEADS WITHIN 0.13 mm 10.005] RAD-US OF TAUE POSITION AT SEATLNG PLANE AT MAXUM MATERTAL CONDITION. 2. CHMENSION "L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. OLMENSION B DOES NOT INCLUOE MOLD P SUFFIX PLASTIC PACKAGE CASE 648-08 -{} AAAAAAAY 16 1 t WU ay Lee al ii ape Vt ep 744025 10010) Tas) NOTES. 1. DIMENSION-NG AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING OIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4 OIMERSION 8 DOES NOT INCLUDE MOLD POSITION AT SEATING PLANE AT MAXCMUM MATERIAL CONDITION 2. GIMENSION LTO CENTER OF LEADS WHEN FORMED PARALLEL FLASH. FLASH. 4 ROUNDED CORNERS OPTIONAL. . ROUNDED CORNERS OPTIONAL. P SUFFIX (PW SUFFIX F SUFFIX PLASTIC PACKAGE FOR MC10Hi81 CERAMIC PACKAGE CASE 649-03 ONLY) CASE 650-05 L P Pnnaae A | ey w . | a a t | oO 8 1 ela Dun N mire io [Forsioce [ta [eo | N tt cf 1 | rt kK ~ lel tno rook, Mahe i {} caren Yota yl] Elm NOTES: NOTES: 1. DIMENS:ONING AND TOLERANCING PER +. LEADS WITHIN 0.13 em [0.0652 RAD-US OF TALE ANS! YIA6M, 1992. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND 6 ALLOW FOR UD MISALIGNMENT, ANO GLASS BENISCUS. 4 DIMENSION H SHALL BE MEASURED AT THE POINT OF EXIT OF THE LEAD FROM THE BODY. 5. LEAD NUMBER 1 IDENTIFIED BY TAS ON LEAD CA OOT ON COVER. 6. DIMENSION J INCLUDES SOLDEA LEAD FINISH. 7. LEAD NUMBERS SHOWN FOA REFERENCE ONLY. 1-27a Ep. MOTORCLA SC LOGIC PACKAGE OUTLINE DIMENSIONS (continued) nue 0 Pfese7252 ooazas2 o ff T-90-20 L SUFFIX CERAMIC PACKAGE CASE 693-02 P SUFFIX PLASTIC PACKAGE CASE 707-02 AAAAAAAAY 1 10 p a s pee A | TT is | [ Nae K FH Pag PT \ sume Paty tbe LX +}o2s0008 frfe | [Hozsco Jrfa@} NOTES: 1. CHAMFERAED CONTOUR OPTIONAL. 2. OFM L" TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS AKD TOLERANCES PEA ANSI YI4.5M, 1982. 4. CONTROLUNG DIMENSION: INCH. NOTES: HOTES: 1, POSITIONAL TOLERANCE OF LEADS (0), SHALL 8& T.LEADS WITHEN 0.13 mm (0.005) RAD OF TRUE WITHN 0.25mm(0.010) AT MAXIMUM MATERIAL POSITION AT SEATING PLANE AT MAXIMUM CONDITION, IN RELATION TO SEATING PLANE MATERIAL CONDITION. AND EACH OTHER. 2. OIMENSION LY TO CENTER OF LEADS WHEN 2. DIMENS:ON L TO CENTER OF LEADS WHEN. FORMED PARALLEL FORMED PARALLEL 3. D/MENSKON B DOES NOT INCLUDE MOLD FLASH. P SUFFIX L SUFFIX PLASTIC PACKAGE CERAMIC PACKAGE CASE 724-03 CASE 726-04 T OFTIOMAL LEAD CONAG. [8.1810 L+ r NOTES: 1. LEADS, TRUE POSITIONED WITHEN 0.25 mm {0.010) DIA. AT SEATING PLANE, AT MAXiMUM MATERIAL CONGHTION.. 2. DM L7 TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DiM AY & "B" INCLUDES MENISCUS. 4. F* DEMENSION IS FOA FULL LEADS. HALF LEADS ARE OPTIONAL AT LEAD POSITIONS 1, 9. 10, ANO 18, 1-28a ne & . a) MOTOROLA SC LOGIC PACKAGE OUTLINE DIMENSIONS (continued) 14e 0 Ppeaezas2 coseasa 2 i T-90-20 L SUFFIX CERAMIC PACKAGE CASE 732-03 NOTES: 1. LEADS WITHIN 0.25 om (0.010) OLA, TRUE POSITION AT SEATING PLANE, AT MAXIMUM P SUFFIX PLASTIC PACKAGE ' CASE 738-03 LAE DBA t 20 aw oO 0 8 Tt pe ro co al OT Ry 4 t a cl VU VAIN ef JURE eel. N We wal ghe F ode J PL Dan [+fozsoo1 [r]e | [Fozsoma [t]A@ | NOTES: 1. DIMENSIONING AND TOLERANCING PER ANS! YI4.5M, 1982. 2. CONTROLLING DIMENSION: INCH, 3. DIMENSION L TO CENTER OF LEAD WHEN 2 | phan oO a aol _- qe TIS ADATUM SURFACE. YI4SM, 1982, MOLD PROTRUS:ON, SIDE. ose Uh pelle tk M pl LEs [elozsioc Oris OLA O} ROTES: 1. DIMENSIONS AT AND "B" ARE DATUMS AND 2. OMENSONING AND TOLERANCING PER ANSI 2 CONTROLUNG O:M: AULUMETER. 4. DIMENSION "A" AND B DO NOTINCLUDE 5, MAXIMUM MOLO PROTRUSION 0.15 10.006] PER MATER'AL CONDITION. 2 QML TOCENTER OF LEADS WHEN FORMED FORMED PARALLEL. 2. DIM A AND B INCLUDES MENISCUS. Ss oe D SUFFIX L SUFFIX PLASTIC SOIC PACKAGE CERAMIC PACKAGE CASE 751-03 CASE 758-01 -A:} fH At 4 s Sau! Ere (= Fe a : coe wle_-D tr Gi DESIDE OF LEADS TES: 1, BAMENSON AIS OATUM. 7. POSITIONAL TOLERANCE FOR LEADS: 24 PLACES 2. Ce] is SEATING PLANE. 4, DIMENS?ON L TO CENTER OF LEADS WHEN FORMED PARALLEL. 5. DIMENSION!NG AND-TOLERANCING PER ANST 145, 1973. 1-29Bo ee a MOTOROLA SC LOGIC nue o ff ese72s2 ooszes 4 i T-90-20 7 r= YeRk 8 a a | ocean TROFSTSR q 0 t ef m Zz q n Ww qd H [ an [ho [ ek | Ly | a ; kk Fasano Toro ous) a VIEW D-0 _4 fo Afelcenon [PLOno[ wOro] on OHO! WOP@ 7 aft ssio0n @ [11 LO-vO[NO-FG) ae * * [e}orsiaon [tT] x@rO]L@-uG@ ST _ it mts f aL Le Eefsinen L_, Fame PproweTe-ra DETAR. TF lounam [TIN OlLO-4Gl NOTES: 1. OATUMS -L-, -M-, -N-. AND -P- DETERMINED WHERE TOP OF LEAD SHOULOEA EXIT PLASTIC 8ODY AT MOLD PARTING LINE. 2. DIM Gi, TRUE POSTION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION 1S 0.25 (0.010) PER SIDE. 4, DIMENSIONING AND TOLERANCING PER ANS} Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. sfomnenS fiaua sara FN SUFFIX PLASTIC PACKAGE CASE 776-02 DETAILS Gt [arsno@ [tT] LOuGpR@?rol L FN SUFFIX PLASTIC PACKAGE CASE 775-02 NOTES: 1. DUE TO SPACE LIMITATION, CASE 776-02 SHALL BE REPRESENTED BY A GENERAL (SMALLER) CASE OUTLINE - SAK A '# olasen @ ot sired peut DRAWING RATHER THAN SHOWING | a ALL 28 LEADS. annoan ko u Faso S Pvber i bus: 2. DATUMS -L.. -@-.-N-. AND -P- DETERM.NED Cm Le non a amaeaanen om 7 . aODY Al RNG UN q 2h. Pit rere 3. OM GI, TRUE POSITION TO BE MEASURED AT ro actu Pew a DATUM -T-, SEATING PLANE, q hy 4. DIM R AND U 00 NOT INCLUDE MOLD os i PROTRUSION. ALLOWASLE MOLD PROTRUSION my 7 i (NOTE na | fc kes t Ly tt Low YIASM, 1982. aah Wass Vase sua} 6. CONTROLUNG O-MENS'ON: INCH, A Feo SD eri, Ru Ty Dees VIEW D-D z oe Silougnn D LSP sa her. r$0taoon S tBu SNe BR [4iow307 cried sy Re 5. _ i H youagre Nhe SDs } | o + c Ur) te mel TT Shane: widen ale Kb Seeman ap Eine ET aasSrG] \ petan DETARS ipianoxn SPP aug Gi-+ 1-30nue o Pfosu72s2 ooazass & Ef 7-90-20 MECL Logic Surface Mount WHY SURFACE MOUNT? Surface Mount Technology is now being utilized to offer answers to many problems that have been created in the use of insertion technology. Limitations have been reached with insertion packages and PC board technology. Surface Mount Technology offers the opportunity to continue to advance the State- of-the-Art designs that cannot be accomplished with Insertion Technology. Surface Mount Packages allow more optimum device performance with the smaller Surface Mount configu- ration. Internal fead lengths, parasitic capacitance and inductance that placed limitations on chip performance have been reduced. The lower profile of Surface Mount Packages allows more boards to be utilized in a given amount of space. They are stacked closer together and utilize less total volume than insertion populated PC boards. Printed circuit costs are lowered with the reduction of the number of board layers required. The elimination or reduction of the number of plated through holes in the board, contribute significantly to lower PC board prices. Surface Mount assembly does not require the prepa- ration of components that are common on insertion tech- nology lines. Surface Mount components are sent directly to the assembly line, eliminating an intermediate step. Automatic placement equipment is available that can place Surface Mount components at the rate of a few thousand per hour to hundreds of thousands of com- ponents per hour. Surface Mount Technology is cost effective, allowing the manufacturer the opportunity to produce smaller units and offer increased functions with the same size product. MECL AVAILABILITY IN SURFACE MOUNT Motorola is now offering MECL 10K and MECL 10KH in the PLCC (Plastic Leaded Chip Carrier) packages. MECL in PLCC may be ordered in conventional plastic rails or on Tape and Reel. Refer to the Tape and Reel section for ordering details. TAPE AND REEL Motorola has now added the convenience of Tape and Reel packaging for our growing family of standard Inte- grated Circuit products. The packaging fully conforms to the latest ELA RS-481A specification. The antistatic embossed tape provides a secure cavity sealed with a peel-back cover tape. GENERAL INFORMATION @ Reel Size 13 inch (330 mm) Suffix: R2 Tape Width 16mm @ Units/Reel 1000 MECHANICAL POLARIZATION Typical View from tape side Linear direction of travel ORDERING INFORMATION Minimum Lot Size/Device Type = 3000 Pieces. @ No Partial Reel Counts Available. @ To order devices which are to be delivered in Tape and Reel, add the appropriate suffix to the device number being ordered. EXAMPLE: ORDERING CODE SHIPMENT METHOD MC10100FN Magazines (Rails) MC10100FNR2 13 inch Tape and Reel MC10H100FN Magazines (Rails) MC10H100FNR2 13 inch Tape and Reel MC12015D Magazines (Rails) MC12015DR2 13 inch Tape and Reel DUAL-IN-LINE PACKAGE TO PLCC PIN CONVERSION DATA The following tables give the equivalent /O pinouts of Dual-In-Line (DIL) packages and Plastic Leaded Chip Car- tier (PLCC) packages. Conversion Tables tepinoi |1]2/a|4]s]e[7|8|9[10/11]12)13/14| 15/16 20 PIN PLCC [2|3 7[8| 9 ]10]12}13| 14[15[17]18|19]20 gorin vi. {1|2|3{4{s|6| 7/8] 9{r0[19[12]13]14|15|16]17|18|19]29| 20 PIN PLoc |1/2|3]4| 5] 6] 7] 8|9[10]11]12| 13|14|15] 16] 17] 18] 19[20| 2apin oi |1{2{3]4]s]e]7[8| 9[s0/14]12113{14[15] 16] 17] 18] 19|20|21|22|2324| 3a PIN PLCC |2|3]4] | 6| 2| 9 |ro|s1|12] 13] 14! 16|17|18[ 19] 20]21]23]24|25|26|27)29| 1-31