2002 Microchip Technology Inc. DS21373B-page 1
TC1262
Features
Very Low Dropout Voltage
500mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Over Current and Over Temperature Protection
Applications
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
Device Selection Table
NOTE: xx indicates output voltages.
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
General Description
The TC1262 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Designed specif-
ically for battery-operated systems, the TC1262’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80µA at full load (20 to 60 times lower than
in bipolar regulators).
TC1262 key features include ultra low noise operation,
very low dropout voltage (typically 350mV at full load),
and fast response to step changes in load.
The TC1262 incorporates both over temperature and
over current protection. The TC1262 is stable with an
output capacitor of only 1µF and has a maximum
output current of 500mA. It is available in 3-Pin
SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages.
Typical Application
Part Number Package Junction
Temp. Range
TC1262-xxVDB 3-Pin SOT-223 -40°C to +125°C
TC1262-xxVAB 3-Pin TO-220 -40°C to +125°C
TC1262-xxVEB 3-Pin DDPAK -40°C to +125°C
VIN
V
IN
VOUT
GND
G
ND
V
OU
T
Tab is GND
Front Vi
ew
Front Vi
ew
1
1
2
3
2
Tab is
G
N
D
TC1262
T
C
12
62
V
IN
V
OU
T
T
C
12
62
3
-Pin T
O
-22
0
Tab is
G
N
D
3
-Pin
SO
T-22
3
3-Pin DDPA
K
1
2
G
ND
TC1262
VIN VOUT
C1
1µF
GND
VOUT
VIN +
500mA Fixed Output CMOS LDO
TC1262
DS21373B-page 2
2002 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage..................(VSS 0.3V) to (VIN +0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range......-40°C < TJ<125°C
Storage Temperature..........................-65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1262 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN =V
OUT +1V,I
L=100µA, CL=3.3µF, TA= 25°C, unless otherwise noted. Boldface type
specifications apply for junction temperatures of -40°C to +125°C.
Symbol Parameter Min Typ Max Units Test Conditions
VIN Input Operating Voltage 2.7 6.0 VNote 7
IOUTMAX Maximum Output Current 500 ——mA
VOUT Output Voltage
VR–2.5% VR±0.5%
VR+2.5% VNote 1
VOUT/TV
OUT Temperature Coefficient 40 ppm/°C Note 2
VOUT/VIN Line Regulation .003 0.35 %/V (VR+1V)VIN6V
VOUT/VOUT Load Regulation 0.002 0.01 %/mA IL= 0.1mA to IOUTMAX (Note 3)
VIN-VOUT Dropout Voltage
20
60
200
350
30
130
390
650
mV IL=100µA
IL=100mA
IL=300mA
IL=500mA(Note 4)
IDD Supply Current 80 130 µAI
L=0
PSRR Power Supply Rejection Ratio 64 dB FRE 1kHz
IOUTSC Output Short Circuit Current 1200 mA VOUT =0V
VOUT/PDThermal Regulation 0.04 V/W Note 5
eN Output Noise 260 nV/Hz IL=I
OUTMAX,F
RE =10kHz
Note 1: VRis the regulator output voltage setting.
2:
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA,T
J,θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: The minimum VIN has to justify the conditions: VIN VR+V
DROPOUT and VIN 2.7V for IL= 0.1mA to IOUTMAX.
TC VOUT =(V
OUTMAX –V
OUTMIN)x10
6
VOUT xT
2002 Microchip Technology Inc. DS21373B-page 3
TC1262
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
3.0 DETAILED DESCRIPTION
The TC1262 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1262’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to ILOADMAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 3-1 shows a typical application circuit.
FIGURE 3-1: TYPICAL APPLICATION
CIRCUIT
3.1 Output Capacitor
A1µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1and less than 5,anda
resonant frequency above 1MHz. A 1µF capacitor
should be connected from VIN to GND if there is more
than 10 inches of wire between the regulator and the
AC filter capacitor, or if a battery is used as the power
source. Aluminum electrolytic or tantalum capacitor
types can be used. (Since many aluminum electrolytic
capacitors freeze at approximately -30°C, solid
tantalums are recommended for applications operating
below -25°C.) When operating from sourcesother than
batteries, supply-noise rejection and transient
responsecanbeimprovedbyincreasingthevalueof
the input and output capacitors and employing passive
filtering techniques.
Pin No.
(3-Pin SOT-223)
(3-Pin TO-220)
(3-Pin DDPAK)
Symbol Description
1V
IN Unregulated supply input.
2 GND Ground terminal.
3V
OUT Regulated voltage output.
C1
1µF
Battery
TC1262
VIN VOUT
C2
1µF
GND
VOUT
+
+
+
TC1262
DS21373B-page 4
2002 Microchip Technology Inc.
4.0 THERMAL CONSIDERATIONS
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function ofthe maximum ambienttemperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(θJA).
EQUATION 4-2:
Table 4-1 and Table 4-2 show various values of θ
JA
for
the TC1262 packages.
TABLE 4-1: THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
SOT-223 PACKAGE
*Tab of device attached to topside copper
TABLE 4-2: THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
3-PIN DDPAK/TO-220
PACKAGE
*Tab of device attached to topside copper
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
VINMAX = 3.3V ± 10%
VOUTMIN = 2.7V ± 0.5%
ILOADMAX = 275mA
TJMAX = 125°C
TAMAX =95°C
θJA = 59°C/W (SOT-223)
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD(VINMAX –V
OUTMIN)ILOADMAX
= [(3.3 x 1.1) (2.7 x .995)]275 x 10–3
= 260mW
Maximum allowable power dissipation:
In this example, the TC1262 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN, is found by sustituting the maximum allowable
power dissipation of 508mW into Equation 4-1, from
which VINMAX =4.6V.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
JA)
2500 sq mm 2500 sq mm 2500 sq mm 45°C/W
1000 sq mm 2500 sq mm 2500 sq mm 45°C/W
225 sq mm 2500 sq mm 2500 sq mm 53°C/W
100 sq mm 2500 sq mm 2500 sq mm 59°C/W
1000 sq mm 1000 sq mm 1000 sq mm 52°C/W
1000 sq mm 0 sq mm 1000 sq mm 55°C/W
Where:
PD(VINMAX –V
OUTMIN)ILOADMAX
PD
VINMAX
VOUTMIN
ILOADMAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on VIN
PDMAX =(T
JMAX –T
AMAX)
θJA
Where all terms are previously defined.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
JA)
2500 sq mm 2500 sq mm 2500 sq mm 25°C/W
1000 sq mm 2500 sq mm 2500 sq mm 27°C/W
125 sq mm 2500 sq mm 2500 sq mm 35°C/W
PDMAX =(T
JMAX –T
AMAX)
θJA
= (125 95)
59
= 508mW
2002 Microchip Technology Inc. DS21373B-page 5
TC1262
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples andare provided for informationalpurposesonly. The performance characteristics listed hereinare
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Output Noise vs. Frequency
FREQUENCY (kHz)
NOISE (µV/Hz)
10.0
1.0
0.01 0.01 1 10 100 1000
0.1
0.0
RLOAD = 50µΩ
COUT = 1µF
0.020
0.018
0.016
0.012
0.010
0.008
0.006
0.004
0.002
0.000
0.014
TEMPERATURE (°C)
Line Regulation vs. Temperature
LINE REGULATION (%)
-40°C0°C25°C70°C85°C 125°C -40°C0°C25°C70°C85°C 125°C
0.0100
0.0090
0.0080
0.0070
0.0060
0.0050
0.0040
0.0030
0.0020
0.0010
0.0100
TEMPERATURE (°C)
Load Regulation vs. Temperature
LOAD REGULATION (%/mA)
1mA to 500mA
1mA to 500mA
5V
2.5V
TEMPERATURE (°C)
IDD
(µA)
150
135
120
105
90
75
60
45
30
15
0
I
DD
vs. Temperature
5V
-40°C0°C25°C70°C85°C 125°C0 100 200
300
4
00
500
I
LOAD
(mA)
0 100 2
00
300
4
00
500
I
LOAD
(mA)
2.5V Dropout Volta
g
e vs.
I
L
O
A
D
DROPOUT VOLTAGE (V)
2.5V
0.50
0.40
0.30
0.20
0.10
0.00
0.50
0.40
0.30
0.20
0.10
0.00
L
O
A
D
D
ROPOUT VOLTAGE
(
V
)
2
5
°
C
-4
0
°
C
-40
°
C
0
°
C
0
°
C
7
0
°
C
7
0
°
C
85
°
C
1
1
2
5
°
C
85
°
C
25
°
C
12
5
°
C
2.70
2.50
2.30
2.10
1.90
1.70
1.50
-40°C0°C25°C70°C85°C125°C
TEMPERATURE (°C)
2.5V VOUT vs. Temperature
I
L
=
0
.1m
A
I
L
A
=
300
m
A
I
I
I
L
A
A
=
500
m
A
5.20
5.10
5.00
4.90
4.80
4.70
4.60
4.50
4.40
4.30
4.20
4.10
4.00
-40°C0°C25°C70°C85°C125°C
TEMPERATURE (°C)
5.0V VOUT vs. Temperature
VOUT (V)
VOUT (V)
I
L
=
0
.1m
A
I
I
I
L
I
I
I
L
TC1262
DS21373B-page 6
2002 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Taping Form
Component Taping Orientation for 3-Pin SOT-223 Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
3-Pin SOT-223 12 mm 8 mm 4000 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
W
P
Component Taping Orientation for 3-Pin DDPAK Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
3-Pin DDPAK 24 mm 16 mm 750 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
W
P
2002 Microchip Technology Inc. DS21373B-page 7
TC1262
6.3 Package Dimensions
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30)
.264 (6.70)
.146 (3.70)
.130 (3.30)
.091 (2.30) TYP.
.071
(1.80)
MAX.
.181 (4.60) TYP. .036 (0.91) MIN.
.041 (1.04)
.033 (0.84)
PIN 1
.013 (0.33)
.009 (0.24)
.031 (0.80)
.024 (0.60)
.004 (0.10)
.001 (0.02)
10° MAX.
3-Pin SOT-223
Dimensions: inches (mm)
3-Pin TO-220
.205 (5.21)
.195 (4.95)
PIN 1
.113 (2.87)
.103 (2.62)
.410 (10.41)
.357 (9.06)
.156 (3.96)
.146 (3.71)
DIA.
.258 (6.55)
.230 (5.84)
.560 (14.22)
.518 (13.16)
.105 (2.67)
.095 (2.41)
.037 (0.94)
.027 (0.69)
.055 (1.40)
.045 (1.14)
.244 (6.20)
.234 (5.94)
.185 (4.70)
.165 (4.19)
.055 (1.40)
.045 (1.14)
.594 (15.09)
.569 (14.45)
.115 (2.92)
.095 (2.41)
.020 (0.51)
.012 (0.30)
3° - 7.5°
5 PLCS.
Dimensions: inches (mm)
TC1262
DS21373B-page 8
2002 Microchip Technology Inc.
6.3 Package Dimensions (Continued)
.100 (2.54) TYP.
3-Pin DDPAK
.037 (0.94)
.026 (0.66)
.370 (9.40)
.330 (8.38)
.067 (1.70)
.045 (1.14)
.605 (15.37)
.549 (13.95)
.410 (10.41)
.385 (9.78)
.183 (4.65)
.170 (4.32)
.055 (1.40)
.045 (1.14)
.010 (0.25)
.000 (0.00)
.110 (2.79)
.068 (1.72)
.026 (0.66)
.014 (0.36)
.051 (1.30)
.049 (1.24)
8° MAX.
3° - 7°
(5x)
PIN 1
Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21373B-page 9
TC1262
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1262
DS21373B-page 10 2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc. DS21373B-page 11
TC1262
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ,microID,MPLAB,PIC,PICmicro,PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nologyIncorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro®8-bit MCUs, KEELOQ®code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21373B-page 12
2002 Microchip Technology Inc.
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Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
05/01/02
*DS21373B*
WORLDWIDE SALES AND SERVICE