Board Level Heat Sinks P/N: 411320B02500 * Hole for Device Attachment * Dual Device Cooling Heat Sink * Vertical Mounting via Solderable Pins * RoHS Compliant CUSTOMIZED HEATSINKS 0 400 600 800 1000 80 4 60 3 40 2 20 1 o C 5 0 0 0 * Specialized Plating * Specialized Body Configurations * Contact Applications Engineering 200 100 2 4 6 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 8 10 Thermal Resistance - oC / Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient (Mounting Surface) * Devices: TO-218, TO-220 & TO-247 * Size: 12.7 x 34.9 x 50.8 mm * Material: Aluminum * Weight: 20.9 g * Type: Stamped * Finish: Black Anodized * PCB Mounting: Solderable Pins * Package: Bulk * Accessories: Hardware & Thermal Interface Material TO-218, TO-220 & TO-247 PRODUCT SPECIFICATIONS