METAL GLAZETM GENERAL PURPOSE SURFACE MOUNT POWER RESISTOR ISO-9001 Registered Metal GlazeTM thick film element fired at 1000C to solid ceramic substrate CHP SERIES High temperature dielectric coating * * * * 60/40 Solder over nickel barrier Up to 2 watts 0.1 ohm to 2.2 megohm range Up to 1000 volts 150C maximum operating temperature CHP SPECIFICATIONS: Industry IRC Code1 Footprint Size Type Maximum Working Maximum Power Rating Voltage2 Voltage B 1206 CHP 1/8 1/4W @ 70C 200 400 D 2010 CHP 1/2 1/2W @ 70C 300 600 F 2512 CHP 1 350 700 H 3610 CHP 2 500 1000 1W @ 70C 2W @ 25C 1.33W @ 70C 1 Resistance Range (ohms)3 0.1 to 0.99 1.0 to 1.0 M 20 to 348K 0.1 to 0.99 1.0 to 348K 0.1 to 0.99 1.0 to 2.21M 20 to 348K 0.2 to 0.99 1.0 to 2.21M See page 8 for product dimensions, recommended solder pads, and standard packaging. 2Not to exceed PxR Tolerance (%)3 1, 2, 5 1, 2, 5 0.25, 0.5 1, 2, 5 1, 2, 5 1, 2, 5 1, 2, 5 0.25, 0.5 1, 2, 5 1, 2, 5 TCR (ppm/C)3 100 50, 100 50, 100 100 50, 100 100 50, 100 50, 100 100 50, 100 Product Category Low Range Standard Tight Tolerance Low Range Standard Low Range Standard Tight Tolerance Low Range Standard 3 Consult factory for tighter TCR, tolerance, or resistance values. CHP PERFORMANCE CHARACTERISTICS: Characteristics Temperature Coefficient Thermal Shock Low Temperature Operation Short Time Overload Maximum Change As specified 0.5% +0.01 ohm 0.25% +0.01 ohm 0.5% +0.01 ohm 1% for R>100K ohm High Temperature Exposure 0.5% +0.01 ohm Resistance to Bonding Exposure 0.25% 0.01 ohm Solderability 95% minimum coverage Moisture Resistance 0.5% +0.01 ohm Life Test 0.5% +0.01 ohm 1% +0.01 ohm Terminal Adhesion Strength no mechanical damage 1% + 0.01 ohm Resistance to Board Bending no mechanical damage Test Method MIL-R-55342E Par 4.7.9 (-55C +125C) MIL-R-55342E Par 4.7.3 (-65C +150C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65C @ working voltage) MIL-R-55342E Par 4.7.5 2.5 x PxR for 5 seconds MIL-R-55342E Par 4.7.6 (+150C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260C for 10 seconds) MIL-STD-202, Method 208 (245C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70C intermittent) 1200 gram push from underside of mounted chip for 60 seconds Chip mounted in center of 90mm long board, deflected 5mm so as to exert pull on chip contacts for 10 seconds WIREWOUND AND FILM TECHNOLOGIES DIVISION 736 Greenway Road * Boone, North Carolina 28607-1860 * Tel: 828-264-8861 * Fax: 828-264-8866 * www.irctt.com 1 ISO-9001 Registered CHP REPETITIVE SURGE CURVE: CHP POWER DERATING CURVE: 1000 120% CHP 2 CHP 1/8, 1/2, 1 Peak Power (watts) Percent Relative Power 100% 80% 60% CHP 2 40% CHP 1 100 CHP 1/8 CHP1/2 1/2 CHP 10 20% 0% 30 40 50 60 70 80 90 100 110 120 130 140 150 1 0.0001 .1msec 0.0010 Ambient Temperature (C) 1msec 0.0100 10msec 0.1000 100msec 1.0000 10000msec Surge or Pulse duration (seconds) Note: Use for repetitive pulses where the average power dissipation is not to exceed the component rating at 70C. Surge handling capacity for lowrepetitive surges may be significantly greater than shown above. Contact factory for recommendations. HOW TO ORDER: Sample Part No. CHP 1 - 100 - 2203 - F - 13 IRC Type (CHP 1/8, CHP 1/2, CHP 1, or CHP 2) Temperature Coefficient (50 or 100) Resistance Value (100 ohms and greater - First 3 significant figures plus 4th digit multiplier) Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503 (Less than 100 ohms - "R" is used to designate decimal) Example: 51 ohms = 51R0, 1 ohm = 1R00, 0.25 ohm = R250 Tolerance (C = 0.25%, D = 0.5%, F = 1.0%, G = 2.0%, J = 5.0%) Packaging Code* (BLK = Bulk, 7=7" Reel, 13=13" Reel) *See page 8 for packaging details 2 WIREWOUND AND FILM TECHNOLOGIES DIVISION 736 Greenway Road * Boone, North Carolina 28607-1860 * Tel: 828-264-8861 * Fax: 828-264-8866 * www.irctt.com METAL GLAZETM CYLINDRICAL SURFACE MOUNT RESISTORS ISO-9001 Registered CHP SERIES - GENERAL PURPOSE (pgs. 9, 10) MRC SERIES - HIGH POWER DENSITY (pgs. 11, 12) MCHP SERIES - HIGH RELIABILITY (pg. 13) CHPT SERIES - TEMPERATURE SENSITIVE (pgs. 14, 15) ZCHP SERIES - ZEROHM JUMPERS (pg. 16) * High power - up to 2 watts * Low resistance - down to 0.1 ohm at 1% tolerance * High resistance - up to 2.21 megohm * Precision - 1% standard * Low TCR - 100ppm/C standard * High voltage - up to 1000 volts * Low inductance * Superior surge handling capability * -55C to +150C operating temperature PRODUCT HISTORY: * * * * * * * * The CHP Surface Mount Resistor Series is a member of the RG product family of precision Metal GlazeTM Resistors. The Metal GlazeTM technology, developed by IRC in 1960 to meet the stringent demands of the Military market, provides an unsurpassed combination of ruggedness, performance, and low cost. Since its development, IRC has supplied billions of units to meet the specific requirements not only of the Military, but also to all major users of resistive components requiring reliability, service, and quality at a reasonable price. Proven reliability of the Metal GlazeTM resistor family is supported by well over a billion unit hours of life testing with no failures. Military versions Negative temperature coefficient version Zerohm jumpers Low-profile/minimum board real estate requirement Superb solderability - wave and reflow Established SPC & continuous improvement programs Excellent service and quality record/proven reliability High volume production capability The CHP Resistor was developed in 1980 by IRC to support the automotive move toward surface mount technology. The CHP uses the same highly reliable Metal GlazeTM technology and materials as its leaded counterpart. The termination and encapsulation have been modified to provide compatibility with surface mount technology. Since its development, the CHP has proven its reliability and service record by becoming a "World Class Product" supporting the surface mount needs of the Automotive, Computer, Instrumentation, Telecommunication, and other industrial electronics market. PRODUCT DESCRIPTION: The CHP is a precision surface mount power resistor. Its cylindrical shape is composed of a Metal GlazeTM resistive element fired onto a ceramic core with capless solder terminations. The simplicity of design and construction, provide a cost effective solution to common applications where reliability is a major concern, and also offer some unique features to surface mount technology. The Metal GlazeTM is composed of glass and metal particles which are fired onto the ceramic substrate at approximately 1000C. This technology provides a resistive element that is impervious to environmental conditions without the need for an airtight encapsulation. The inherent ruggedness of this glaze can absorb higher voltage surges and overloads than "thin-film" counterparts. The CHP uses a cylindrical high alumina ceramic for the core of the resistor. This substrate provides excellent thermal conductivity for maximum power dissipation in a minimum of board real estate. It also provides superb mechanical strength to easily withstand stresses presented during board assembly, mounting, and operation. To terminate the CHP, an electroless nickel barrier is applied to the termination area. Solder is then applied by hot-solder dipping. This technique provides reliable electrical continuity through the termination without the use of end-caps or weld joints. Unlike the typical "MELF", there is no "dog-bone" shape resulting from end-caps to interfere with "pick and place" accuracy. The solder termination is free of silver to provide superb solderability performance on both reflow and wave soldering processes. WIREWOUND AND FILM TECHNOLOGIES DIVISION 736 Greenway Road * Boone, North Carolina 28607-1860 * Tel: 828-264-8861 * Fax: 828-264-8866 * www.irctt.com 3 ISO-9001 Registered CHP FAMILY STANDARD SIZES, SOLDER PADS AND PACKAGING: DIMENSIONS (Inches and (mm)): L C W Size Code Industry Footprint Actual Size L W C 0.0570.006 (1.450.15) 0.0200.010 (0.510.25) B 1206 0.1280.007 (3.250.18) C 1206 0.1280.007 (3.250.18) 0.0630.010 (1.600.25) 0.0200.010 (0.510.25) D 2010 0.2000.010 (5.080.25) 0.0790.006 (2.010.15) 0.0300.010 (0.7610.25) E 2010 0.2000.010 (5.080.25) 0.1050.006 (2.670.15) 0.0400.015 (1.020.38) F 2512 0.2510.010 (6.380.25) 0.0790.006 (2.010.15) 0.0400.010 (1.020.25) H 3610 0.3670.010 (9.320.25) 0.1050.006 (2.670.15) 0.0500.010 (1.270.25) RECOMMENDED SOLDER PAD DIMENSIONS (REFLOW): To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide a large repeatable solder fillet to the CHP resistor on reflow processes and will provide maximum heat transfer to the PC board in high power applications. By placing the CHP on the solder paste while the paste is in the "tacky" state, the CHP will be held in position until solder reflow begins. The pad design then uses the surface tension of the molten solder to pull the component to the center of the solder pad. The placement of a via rising above the board level directly beneath the CHP is not recommended. Dimensions (Inches and (mm)) Size Code Industry Footprint A B C B&C 1206 0.076 (1.93) 0.093 (2.36) 0.058 (1.47) 0.098 0.032 (2.49) (0.81) 0.211 (5.36) D 2010 0.111 (2.82) 0.126 (3.20) 0.096 (2.44) 0.152 0.040 (3.86) (1.02) 0.318 (8.08) E 2010 0.170 (4.32) 0.160 (4.06) 0.072 (1.83) 0.132 0.044 0.412 (3.35) (1.12) (10.46) F 2512 0.121 (3.07) 0.126 (3.20) 0.127 (3.23) 0.183 0.040 (4.65) (1.02) H 3610 0.170 (4.32) 0.160 (4.06) 0.213 (5.41) 0.273 0.044 0.553 (6.93) (1.12) (14.05) D E F C F A B A E D 0.369 (9.37) STANDARD REEL PACKAGING PER EIA-481: Size Code Industry Footprint Reel Diameter* Quantity Per Reel 7" 2,500 max. B&C 1206 13" 10,000 max. D 2010 7" 1,500 max. 13" 5,000 max. 7" 1,500 max. 13" 5,000 max. E 2010 Carrier Tape Component Pitch Width 8mm 4mm 12mm 4mm 12mm 4mm F 2512 13" 5,000 max. 12mm 4mm H 3610 7" 1,500 max. 24mm 4mm * The 13" reel is considered standard and will be supplied unless otherwise specified. 4 WIREWOUND AND FILM TECHNOLOGIES DIVISION 736 Greenway Road * Boone, North Carolina 28607-1860 * Tel: 828-264-8861 * Fax: 828-264-8866 * www.irctt.com