1
ISO-9001
Registered
METAL GLAZE™ GENERAL PURPOSE
SURFACE MOUNT POWER RESISTOR
CHP SERIES
· Up to 2 watts
· 0.1 ohm to 2.2 megohm range
· Up to 1000 volts
· 150°C maximum operating temperature
Metal GlazeTM thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over nickel barrier
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road Boone, Nor th Carolina 28607-1860 Tel: 828-264-8861 Fax: 828-264-8866 www.irctt.com
CHP SPECIFICATIONS:
IRC
Type
CHP 1/8
CHP 1/2
CHP 1
CHP 2
Industry
Footprint
1206
2010
2512
3610
Size
Code1
B
D
F
H
Maximum
Power Rating
1/4W @ 70°C
1/2W @ 70°C
1W @ 70°C
2W @ 25°C
1.33W @ 70°C
Maximum
Voltage
400
600
700
1000
Working
Voltage2
200
300
350
500
Resistance
Range (ohms)3
0.1 to 0.99
1.0 to 1.0 M
20 to 348K
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
1.0 to 2.21M
20 to 348K
0.2 to 0.99
1.0 to 2.21M
Tolerance
(±%)3
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)3
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
1See page 8 f or product dimensions , recommended solder pads, and standard packaging. 2Not to exceed 3Consult factory for tighter TCR, tolerance , or resistance values.PxR
CHP PERFORMANCE CHARA CTERISTICS:
Characteristics
Temperature Coefficient
Ther mal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Lif e Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±0.5% +0.01 ohm
±0.25% +0.01 ohm
±0.5% +0.01 ohm
±1% for R>100K ohm
±0.5% +0.01 ohm
±0.25% 0.01 ohm
95% minimum coverage
±0.5% +0.01 ohm
±0.5% +0.01 ohm
±1% +0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
Test Method
MIL-R-55342E P ar 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm so as to
exer t pull on chip contacts for 10 seconds
PxR
2
ISO-9001
Registered
Note: Use for repetitiv e pulses where the av erage power dissipation is not
to exceed the component rating at 70°C . Surge handling capacity f or low-
repetitive surges ma y be significantly greater than sho wn abo ve . Contact
factory for recommendations.
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road Boone, Nor th Carolina 28607-1860 Tel: 828-264-8861 Fax: 828-264-8866 www.irctt.com
0.0001 0.0010 0.0100 0.1000 1.0000
1
10
100
1000
CHP 1/8 CHP 1/2
CHP 1
CHP 2
Peak Power (watts)
CHP REPETITIVE SURGE CUR VE:
.1msec 1msec 10msec 100msec 10000msec
Surge or Pulse duration (seconds)
HOW TO ORDER:
Sample Part No.
IRC T ype
(CHP 1/8, CHP 1/2, CHP 1, or CHP 2)
Temperature Coefficient
(50 or 100)
Resistance V alue
(100 ohms and greater - First 3 significant figures plus 4th digit multiplier)
Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503
(Less than 100 ohms - "R" is used to designate decimal)
Example: 51 ohms = 51R0, 1 ohm = 1R00, 0.25 ohm = R250
Tolerance
(C = 0.25%, D = 0.5%, F = 1.0%, G = 2.0%, J = 5.0%)
Packaging Code*
(BLK = Bulk, 7=7" Reel, 13=13" Reel)
*See page 8 for packaging details
CHP 1 - 100 - 2203 - F - 13
CHP POWER DERATING CURVE:
30 40 50 60 70 80 90 100 110 120 130 140 150
0%
20%
40%
60%
80%
100%
120%
CHP 1/8, 1/2, 1
CHP 2
Percent Relative Power
Ambient Temperature (°C)
CHP 1/2
3
ISO-9001
Registered
METAL GLAZE™ CYLINDRICAL
SURFACE MOUNT RESISTORS
CHP SERIES
- GENERAL PURPOSE (pgs. 9, 10)
MRC SERIES
- HIGH POWER DENSITY (pgs. 11, 12)
MCHP SERIES
- HIGH RELIABILITY (pg. 13)
CHPT SERIES
- TEMPERATURE SENSITIVE (pgs. 14, 15)
ZCHP SERIES
- ZEROHM JUMPERS (pg. 16)
• High pow er - up to 2 watts
• Low resistance - do wn to 0.1 ohm at 1%
tolerance
• High resistance - up to 2.21 megohm
• Precision - ±1% standard
• Low TCR - ±100ppm/°C standard
• High voltage - up to 1000 volts
• Low inductance
• Superior surge handling capability
• -55°C to +150°C operating temperature
• Military versions
• Negative temper ature coefficient v ersion
• Zerohm jumpers
• Low-profile/minimum board real estate requirement
• Superb solderability - wave and reflow
• Established SPC & contin uous improvement programs
• Excellent service and quality record/prov en reliability
• High volume production capability
PRODUCT HISTOR Y:
PRODUCT DESCRIPTION:
The CHP Surf ace Mount Resistor Series is a member of the RG
product family of precision Metal Glaze™ Resistors. The Metal
Glaze™ technology, developed b y IRC in 1960 to meet the strin-
gent demands of the Military mar ket, provides an unsurpassed
combination of ruggedness, performance, and low cost. Since
its development, IRC has supplied billions of units to meet the
specific requirements not only of the Military, but also to all major
users of resistive components requiring reliability, service, and
quality at a reasonable price. Proven reliability of the Metal
Glaze™ resistor family is supported by well over a billion unit
hours of life testing with no failures.
The CHP is a precision surface mount power resistor. Its cylin-
drical shape is composed of a Metal Glaze™ resistive element
fired onto a ceramic core with capless solder terminations. The
simplicity of design and construction, provide a cost effective
solution to common applications where reliability is a major con-
cern, and also offer some unique features to surf ace mount tech-
nology.
The CHP uses a cylindrical high alumina ceramic for the core
of the resistor. This substrate provides excellent thermal con-
ductivity for maximum power dissipation in a minimum of board
real estate. It also provides superb mechanical strength to eas-
ily withstand stresses presented during board assembly, mount-
ing, and operation.
The Metal Glaze™ is composed of glass and metal par ticles
which are fired onto the ceramic substrate at approximately
1000°C. This technology provides a resistive element that is im-
pervious to environmental conditions without the need f or an air-
tight encapsulation. The inherent ruggedness of this glaze can
absorb higher voltage surges and overloads than "thin-film" coun-
terparts.
To ter minate the CHP, an electroless nickel barr ier is applied
to the termination area. Solder is then applied by hot-solder
dipping. This technique provides reliable electrical continuity
through the termination without the use of end-caps or weld joints.
Unlike the typical "MELF", there is no "dog-bone" shape result-
ing from end-caps to interfere with "pick and place" accuracy.
The solder termination is free of silver to provide superb solder-
ability performance on both reflow and wa ve soldering processes.
The CHP Resistor was developed in 1980 by IRC to support the
automotive mo ve toward surf ace mount technology . The CHP uses
the same highly reliable Metal Glaze™ technology and materials
as its leaded counterpart. The termination and encapsulation hav e
been modified to provide compatibility with surf ace mount technol-
ogy. Since its development, the CHP has proven its reliability and
service record by becoming a "World Class Product" supporting
the surface mount needs of the A utomotiv e , Computer , Instrumen-
tation, Telecommunication, and other industrial electronics mar-
ket.
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road Boone, Nor th Carolina 28607-1860 Tel: 828-264-8861 Fax: 828-264-8866 www.irctt.com
4
ISO-9001
Registered
CHP FAMILY STANDARD SIZES, SOLDER PADS AND PA CKAGING:
RECOMMENDED SOLDER PAD DIMENSIONS (REFLO W):
To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide a
large repeatable solder fillet to the CHP resistor on reflow processes and will provide maximum heat transfer to the PC
board in high power applications. By placing the CHP on the solder paste while the paste is in the "tac ky" state, the CHP
will be held in position until solder reflow begins. The pad design then uses the surface tension of the molten solder to
pull the component to the center of the solder pad. The placement of a via rising abov e the board le v el directly beneath
the CHP is not recommended.
DIMENSIONS (Inches and (mm)):
Industry
Footprint
1206
1206
2010
2010
2512
3610
Size Code
B
C
D
E
F
H
Actual Size L
0.128±0.007
(3.25±0.18)
0.128±0.007
(3.25±0.18)
0.200±0.010
(5.08±0.25)
0.200±0.010
(5.08±0.25)
0.251±0.010
(6.38±0.25)
0.367±0.010
(9.32±0.25)
W
0.057±0.006
(1.45±0.15)
0.063±0.010
(1.60±0.25)
0.079±0.006
(2.01±0.15)
0.105±0.006
(2.67±0.15)
0.079±0.006
(2.01±0.15)
0.105±0.006
(2.67±0.15)
C
0.020±0.010
(0.51±0.25)
0.020±0.010
(0.51±0.25)
0.030±0.010
(0.761±0.25)
0.040±0.015
(1.02±0.38)
0.040±0.010
(1.02±0.25)
0.050±0.010
(1.27±0.25)
W
L
C
Size
Code
B&C
D
E
F
H
Industry
Footprint
1206
2010
2010
2512
3610
Dimensions (Inches and (mm))
A
0.076
(1.93)
0.111
(2.82)
0.170
(4.32)
0.121
(3.07)
0.170
(4.32)
B
0.093
(2.36)
0.126
(3.20)
0.160
(4.06)
0.126
(3.20)
0.160
(4.06)
C
0.058
(1.47)
0.096
(2.44)
0.072
(1.83)
0.127
(3.23)
0.213
(5.41)
D
0.098
(2.49)
0.152
(3.86)
0.132
(3.35)
0.183
(4.65)
0.273
(6.93)
F
0.211
(5.36)
0.318
(8.08)
0.412
(10.46)
0.369
(9.37)
0.553
(14.05)
E
0.032
(0.81)
0.040
(1.02)
0.044
(1.12)
0.040
(1.02)
0.044
(1.12)
F
CAA
D
E
B
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road Boone, Nor th Carolina 28607-1860 Tel: 828-264-8861 Fax: 828-264-8866 www.irctt.com
Quantity Per Reel
2,500 max.
10,000 max.
1,500 max.
5,000 max.
1,500 max.
5,000 max.
5,000 max.
1,500 max.
STANDARD REEL PACKAGING PER EIA-481:
Size Code
B&C
D
E
F
H
Industry Footprint
1206
2010
2010
2512
3610
* The 13" reel is considered standard and will be supplied unless otherwise specified.
Reel Diameter*
7"
13"
7"
13"
7"
13"
13"
7"
Carrier T ape
Width
8mm
12mm
12mm
12mm
24mm
Component
Pitch
4mm
4mm
4mm
4mm
4mm