1
Radiation Hardened Adjustable Positive Voltage
Regulator
HS-117RH, HS-117EH
The Radiation Hardened HS-117RH, HS-117EH are adjustable
positive voltage linear regulator capable of operating with
input voltages up to 40VDC. The output voltage is adjustable
from 1.2V to 37V with two external resistors. The device is
capable of sourcing from 5mA to 1.25APEAK (0.5 APEAK for
the TO-39 package). Protection is provided by the on-chip
thermal shutdown and output current limiting circuitry.
The Intersil HS-117RH, HS-117EH has advantages over other
industry standard types, in that circuitry is incorporated to
minimize the effects of radiation and temperature on device
stability.
Constructed with the Intersil dielectrically isolated Rad Hard
Silicon Gate (RSG) process, the HS-117RH, HS-117EH are
immune to single event latch-up and has been specifically
designed to provide highly reliable performance in harsh
radiation environments.
Specifications for Rad Hard QML devices are controlled by the
Defense Logistics Agency (DLA). The SMD numbers listed here
must be used when ordering.
Detailed electrical specifications for the HS-117RH, HS-117EH
are contained in SMD 5962-99547. A “hot-link” is provided on
our website for downloading.
Features
• Electrically Screened to DLA SMD # 5962-99547
• QML Qualified per MIL-PRF-38535 Requirements
• Radiation Environment
- 300 krad (Si) (Max)
-Latch-up Immune
• Superior Temperature Stability
• Overcurrent and Overtemperature Protection
Applications
• Adjustable Linear Voltage Regulators
• Adjustable Linear Current Regulator
Pin Configurations
HS2-117RH
(TO-39 CAN)
BOTTOM VIEW
HSYE-117RH
(SMD.5 CLCC)
BOTTOM VIEW
NOTE: No current JEDEC outline for the SMD.5 package. Refer to SMD
for package dimensions. The TO-257 is a totally isolated metal package
HS9S-117RH
(TO-257AA FLANGE MOUNT)
TOP VIEW
2
13OUT
ADJUST
IN
1 - ADJUST
2 - IN
3 - OUT
1
2
3
ADJUST
OUT
IN
3
2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas Inc. 2003, 2007, 2011, 2012. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
September 4, 2012
FN4560.9
HS-117RH, HS-117EH
2FN4560.9
September 4, 2012
Ordering Information
ORDERING
NUMBER
INTERNAL
MKT. NUMBER
TEMP. RANGE
(°C) PACKAGE PKG DWG. #
5962F9954702VUC HS2-117EH-Q -55 to +125 3 LD METAL CAN T3.C
5962F9954702V9A HS0-117EH-Q -55 to +125 DIE
5962F9954702VXC HS9S-117EH-Q -55 to +125 3 LD TO-257 T3.D
5962F9954702VYC HSYE-117EH-Q -55 to +125 3 PAD LCC J3.A
5962F9954701VUC HS2-117RH-Q -55 to +125 3 LD METAL CAN T3.C
5962F9954701QUC HS2-117RH-8 -55 to +125 3 LD METAL CAN T3.C
5962F9954701VXC HS9S-117RH-Q -55 to +125 3 LD TO-257 T3.D
5962F9954701QXC HS9S-117RH-8 -55 to +125 3 LD TO-257 T3.D
5962F9954701VYC HSYE-117RH-Q -55 to +125 3 PAD LCC J3.A
5962F9954701QYC HSYE-117RH-8 -55 to +125 3 PAD LCC J3.A
HS2-117RH/Proto HS2-117RH/Proto -55 to +125 3 LD TO-257 T3.C
HS9S-117RH/Proto HS9S-117RH/Proto -55 to +125 3 LD TO-257 T3.D
HSYE-117RH/Proto HSYE-117RH/Proto -55 to +125 3 PAD LCC
5962F9954701QUC HS2-117RH-8S9000 -55 to +125 3 LD METAL CAN T3.C
5962F9954701VXC HS9S-117RH-QS9000 -55 to +125 3 LD TO-257 T3.D
5962F9954701VYC HSYE-117RH-QS9000 -55 to +125 3 PAD LCC J3.A
5962F9954701VYC HSYE-117RH-QS9002 -55 to +125 3 PAD LCC J3.A
NOTE:
1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations.
HS-117RH, HS-117EH
3
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4560.9
September 4, 2012
For additional products, see www.intersil.com/product_tree
Die Characteristics
DIE DIMENSIONS
2616mm x 2794mm (103 mils x 110 mils)
483mm ±25.4mm (19 mils ±1 mil)
INTERFACE MATERIALS
Glassivation
Type: Silox (SiO2)
Thickness: 8.0kÅ ±1.0k Å
Top Metallization
Type: AlSiCu
Thickness: 16.0kÅ ±2kÅ
Substrate
Radiation Hardened Silicon Gate,
Dielectric Isolation
Backside Finish
Gold
ASSEMBLY RELATED INFORMATION
Substrate Potential
Unbiased (DI)
ADDITIONAL INFORMATION
Worst Case Current Density
<2.0 x 105 A/cm2
Transistor Count
95
Metallization Mask Layout
HS-117RH, HS-117EH
VOUT
VOUT
VIN
VIN
ADJ VOUTK
