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TransFeed Automotive Series
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
GENERAL DESCRIPTION
AVX has combined the best electrical characteristics of its
TransGuard® Transient Voltage Suppressors (TVS) and its
Feedthru Capacitors into a single chip for state-of-the-art
overvoltage circuit protection and EMI reduction over a
broad range of frequencies. This unique combination of
multilayer ceramic construction in a feedthru configuration
gives the circuit designer a single 0805 chip that responds
to transient events faster than any TVS device on the mar-
ket today, and provides significant EMI attenuation when in
the off-state.
Automotive TransFeeds are designed for automotive appli-
cations and are AEC-Q 200 qualified.
The reduction in parallel inductance, typical of the feedthru
chip construction when compared to the construction of
standard TVS or ceramic capacitor chips, gives the
TransFeed product two very important electrical advan-
tages: (1) faster “turn-on” time. Calculated response times
of <200 pSec are not unusual with this device, and mea-
sured response times range from 200 – 250 pSec. The
TransFeed “turn-on” characteristic is less than half that of
an equivalent TransGuard® part — and TransGuards®
clamp transient voltages faster than any other bipolar TVS
solution such as diodes; (2) the second electrical advantage
of lower parallel inductance, coupled with optimal series
inductance, is the enhanced attenuation characteristics of
the TransFeed product. Not only is there significantly
greater attenuation at a higher self-resonance frequency,
but the roll-off characteristic becomes much flatter, result-
ing in EMI filtering over a much broader frequency spec-
trum. Typical applications include filtering/protection on
Microcontroller I/O Lines, Interface I/O Lines, Power Line
Conditioning and Power Regulation.
Schematic Diagram
Electrical Model
IN OUT
IN LSLS
RVCRP
RON
LP
OUT
TYPICAL APPLICATIONS
• Drive by Wire
• Dimming Mirror Circuit
• Filtering/protection on Microcontroller I/O lines
• Filtering/protection on Interface I/O lines
• Power Line Conditioning
• Power Regulation
• LCD Dashboard driver
Where designers are concerned with both tran-
sient voltage protection and EMI attenuation,
either due to the electrical performance of their
circuits or due to required compliance to specif-
ic EMC regulations, the TransFeed product is an
ideal choice.
GENERAL
CHARACTERISTICS
• Operting Teperature: -55°C to +125°C
• Working Voltage: 5.6Vdc - 18 Vdc
• Case Size: 0805, 0612 4xArray
• Energy Rating: 0.05 - 0.3J
• Current: 15 - 120A
• Max Feedthru Current: 0.2 - 1A
FEATURES
• Bi-directional TVS
• Narrow band, high
attenuation filter
• EMI Filtering over broader
frequency range
• Fastest Response Time to
ESD Strikes
• AEC-Q 200 Qualified
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TRANSFEED ELECTRICAL SPECIFICATIONS
TransFeed Automotive Series
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
AVX Working Working Breakdown Clamping Maximum Transient Peak Typical DC Maximum Jump
Part Number Voltage Voltage Voltage Voltage Leakage Energy Current Cap Resistance Feedthru Start
(DC) (AC) Current Rating Rating Current Voltage
V2AF105A150Y2E _ _ 5.6 4.0 8.5±20% 18 35 0.10 30 800 0.200 0.75 –
V2AF105C150Y1F _ _ 5.6 4.0 8.5±20% 18 35 0.30 120 2500 0.150 1.00 –
V2AF109A200Y2E _ _ 9.0 6.4 12.7±15% 22 25 0.10 30 575 0.200 0.75 –
V2AF109C200Y1F _ _ 9.0 6.4 12.7±15% 22 25 0.30 120 1800 0.150 1.00 –
V2AF114A300Y2E _ _ 14.0 10.0 18.5±12% 32 15 0.10 30 300 0.200 0.75 27.5
V2AF114C300Y1F _ _ 14.0 10.0 18.5±12% 32 15 0.30 120 900 0.150 1.00 27.5
V2AF118A400Y2E _ _ 18.0 13.0 25.5±10% 42 10 0.10 30 200 0.200 0.75 27.5
V2AF118C400Y1F _ _ 18.0 13.0 25.5±10% 42 10 0.30 120 500 0.150 1.00 27.5
V2AF118X500Y3D _ _ 18.0 13.0 25.5±10% 50 10 0.05 20 75 0.250 0.50 27.5
V3AF418A400Y3G _ _ 18.0 13.0 25.5±10% 42 10 0.10 20 150 0.200 0.30 27.5
V3AF418X500Y3G _ _ 18.0 13.0 25.5±10% 50 10 0.05 15 65 0.250 0.20 27.5
Termination Finish Code
Packaging Code
VW(DC) DC Working Voltage (V)
VW(AC) AC Working Voltage (V)
VBTypical Breakdown Voltage (V @ 1mADC)
VB Tol VB Tolerance is ± from Typical Value
VCClamping Voltage (V @ 1A 8x20μS )
ILMaximum Leakage Current at the Working Voltage (μA)
ETTransient Energy Rating (J, 10x1000μS)
IPPeak Current Rating (A, 8x20μS)
Cap Typical Capacitance (pF) @ 1MHz and 0.5 V
DCR DC Resistance (Ohms)
IFT Maximum Feedthru Current (A)
VJUMP Jump Start Voltage (V, 5 min)
Y
Capaci tance
Tolerance
Y = +100/-50%
2
DC
Resistance
1 = 0.150 Ohms
2 = 0.200 Ohms
3 = 0.250 Ohms
E
Feedthru
Current
D = 500 mA
E = 750 mA
F = 1.0 Amp
D
Packaging
Code
Pcs./Reel
D = 1,000
R = 4,000
T = 10,000
V
Varistor
2
Chip Size
2 = 0805
3 = 0612
AF
Automotive
Feedthru
Capacitor
1
No. of
Elements
05
Voltage
05 = 5.6VDC
09 = 9.0VDC
14 = 14.0VDC
18 = 18.0VDC
A
Energy
Rating
X = 0.05J
A = 0.1J
C = 0.3J
150
Varistor
Clamping
Voltage
150 = 18V
200 = 22V
300 = 32V
400 = 42V
500 = 50V
P
Termination Finish
P = Ni/Sn Alloy (Plated)
HOW TO ORDER
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TransFeed Automotive Series
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
BW
T
SX
L
C
L
EW
W
BL
T
P
INPUT OUTPUT
LC
P
SW
DIMENSIONS mm (inches)
LWTBW BL EWX S
0805 2.01 ± 0.20 1.25 ± 0.20 1.143 Max. 0.46 ± 0.10 0.18 + 0.25 -0.08 0.25 ± 0.13 1.02 ± 0.10 0.23 ± 0.05
(0.079 ± 0.008) (0.049 ± 0.008) (0.045 Max.) (0.018 ± 0.004) (0.007 + 0.010 -0.003) (0.010 ± 0.005) (0.040 ± 0.004) (0.009 ± 0.002)
RECOMMENDED SOLDER PAD LAYOUT (Typical Dimensions) mm (inches)
TPSWLC
0805 3.45 (0.136) 0.51 (0.020) 0.76 (0.030) 1.27 (0.050) 1.02 (0.040) 0.46 (0.018)
4 Pad Layout
4
DIMENSIONS mm (inches)
mm (inches)
LW TBWBL ESP
1.60 ± 0.20 3.25 ± 0.15 1.22 Max. 0.41 ± 0.10 0.18 +0.25 -0.08 0.41 ± 0.10 0.76 REF
(0.063 ± 0.008) (0.128 ± 0.006) (0.048 Max.) (0.016 ± 0.004) (0.007 +0.010 -0.003) (0.016 ± 0.004) (0.030 REF)
AB CDE F
0.60 (0.024) 1.60 (0.064) 2.20 (0.088) 0.35 (0.014) 0.76 (0.030) 2.60 (0.104)
TransFeed Automotive Series
TVS Protection and EMI Attenuation in a 4-Element Array
W
BL
ES
P
BW
T
D
L
E
D
A
B
C
AF
V3F4
5
Discrete MLV Model
Where: Rv= Voltage Variable resistance
(per VI curve)
Rp≥10
12 Ω
C = defined by voltage rating and energy level
Ron = turn on resistance
Lp= parallel body inductance
Discrete MLVF Model
Where: Rv= Voltage Variable resistance
(per VI curve)
Rp= Body IR
C = defined by voltage rating and energy level
Ron = turn on resistance
Lp= minimized parallel body inductance
Ls= series body inductance
LSLS
RVCRP
Ron
LP
To Device
Requiring
Protection
Solder Pad Solder Pad
Solder Pad
PCB
Trace
To Device
Requiring
Protection
RVCRP
Ron
LP
Solder Pad
TransFeed Automotive Series
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
PERFORMANCE CHARACTERISTICS
AVX Multilayer Feedthru Varistors (MLVF) are an ideal choice
for system designers with transient strike and broadband
EMI/RFI concerns.
Feedthru Varistors utilize a ZnO varistor material and the
electrode pattern of a feedthru capacitor. This combination
allows the package advantage of the feedthru and material
advantages of the ZnO dielectric to be optimized.
ZnO MLV Feedthrus exhibit electrical and physical advantages
over standard ZnO MLVs. Among them are:
1. Faster Turn on Time
2. Broadband EMI attenuation
3. Small size (relative to discrete MLV and EMI filter schemes)
The electrical model for a ZnO MLV and a ZnO Feedthru MLV
are shown below. The key difference in the model for
the Feedthru is a transformation in parallel to series induc-
tance. The added series inductance helps lower the injected
transient peak current (by 2πfL) resulting in an additional ben-
efit of a lower clamping voltage. The lowered parallel induc-
tance decreases the turn on time for the varistor to <250ps.
FEEDTHRU VARISTORS
TransFeed Automotive Series
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single Chip
PERFORMANCE CHARACTERISTICS
APPLICATIONS
• EMI Suppression
• Broadband I/O Filtering
• Vcc Line Conditioning
FEATURES
• Small Size
• Low ESR
• Ultra-fast Response Time
• Broad S21 Characteristics
MARKET SEGMENTS
• Computers
• Automotive
• Power Supplies
• Multimedia Add-On Cards
• Bar Code Scanners
• Remote Terminals
• Medical Instrumentation
• Test Equipment
• Transceivers
• Cellular Phones / Pagers
A comparison table showing typical element parameters and resulting
performance features for MLV and MLVF is shown above.
MLVF PARAMETER MLV
0805 0805
5ph Lstypical N/A
<600nh Lptypical <1.5nh
<0.025Ω Ron typical <0.1Ω
100pf to 2.5nf C typical 100pf to 5.5nf
see VI curves Rvtypical see VI curves
>0.25 x 1012ΩRptypical >1 x 1012Ω
<250ps Typical turn on time <500ps
Typical frequency response
TYPICAL CIRCUITS REQUIRING
TRANSIENT VOLTAGE
PROTECTION AND EMI FILTERING
The following applications and schematic diagrams
show where TransFeed TVS/ EMI filtering devices might
be used:
• System Board Level Interfaces: (Fig. 1)
Digital to RF
Analog to Digital
Digital to Analog
• Voltage Regulation (Fig. 2)
• Power Conversion Circuits (Fig. 3)
• GaAs FET Protection (Fig. 4)
REGULATOR +
POWER�
MANAGEMENT�
CHIP
ASIC
INTERFACE�
CARD
MAIN�
POWER
+3.3V
+5V
+12V
+3.3V
+1.8V
�
INPUT OUTPUT
Fig. 2 – Voltage Regulators
Fig. 3 – Power Conversion Circuits/Power Switching Circuits
Fig. 4 – GaAs FET Protection
THROTTLE
DRIVE
THROTTLE
ECU
ACCELERATOR
SENSOR
SENSOR
Fig. 5 – Automotive TransFeed - Throttle by Wire
Fig. 1 – System Interface
SPECIFICATION COMPARISON
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