STPS10H100CG-TR - STMicroelectronics

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STPS10H100CT/CG/CR/CFP

July 2003 - Ed: 3F

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER

IF(AV) 2x5A

RRM 100 V

Tj 175°C

VF(max) 0.61 V

MAIN PRODUCT CHARACTERISTICS

■HIGH JUNCTION TEMPERATURE CAPABILITY

FOR CONVERTERS LOCATED IN CONFINED

ENVIRONMENT

■LOW LEAKAGE CURRENT AT HIGH

TEMPERATURE

■LOW STATIC AND DYNAMIC LOSSES AS A

RESULT OF THE SCHOTTKY BARRIER

■AVALANCHE CAPABILITY SPECIFIED

FEATURES AND BENEFITS

Schottky barrier rectifier designed for high

frequency miniature Switched Mode Power

Supplies such as adaptators and on board

DC/DC converters. Packaged in TO-220AB,

TO-220FPAB, D2PAK and I2PAK.

DESCRIPTION

TO-220AB

STPS10H100CT

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 100 V

IF(RMS) RMS forward current 10 A

IF(AV) Average forward

current δ= 0.5 TO-220AB

D2PAK/I

PAK Tc = 165°C per diode

per device 5

10 A

TO-220FPAB Tc = 160°C

IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A

IRRM Repetitive peak reverse current tp=2µssquare F = 1kHz 1 A

PARM Repetitive peak avalanche power tp = 1µs Tj = 25°C 7200 W

Tstg Storage temperature range - 65 to + 175 °C

Tj Maximum operating junction temperature * 175 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

ABSOLUTE RATINGS (limiting values, per diode)

A2 K

D2PAK

STPS10H100CG

I2PAK

STPS10H100CR

dPtot

dTj Rth j a

<−

()

thermal runaway condition for a diode on its own heatsink

TO-220FPAB

STPS10H100CFP

STPS10H100CT/CG/CR/CFP

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Symbol Parameter Value Unit

Rth (j-c) Junction to case D2PAK / I2PAK

TO-220AB Per diode 2.2 °C/W

Total 1.3

Rth (c) Coupling 0.3

Rth (j-c) Junction to case TO-220FPAB Per diode 4.5 °C/W

Total 3.5

Rth (c) Coupling 2.5

When the diodes 1 and 2 are used simultaneously :

∆Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)

THERMAL RESISTANCES

Symbol Parameter Tests conditions Min. Typ. Max. Unit

IR* Reverse leakage current Tj = 25°C VR=V

RRM 3.5 µA

Tj = 125°C 1.3 4.5 mA

VF** Forward voltage drop Tj = 25°CI

= 5 A 0.73 V

Tj = 125°C 0.57 0.61

Tj=25°CI

= 10 A 0.85

Tj = 125°C 0.66 0.71

Pulse test : * tp=5ms,δ<2%

** tp = 380 µs, δ<2%

To evaluate the maximum conduction losses use the following equation :

P=0.51xI

F(AV) +0.02xI

(RMS)

STATIC ELECTRICAL CHARACTERISTICS (per diode)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0 PF(av)(W)

IF(a v) (A)

δ=tp/T tp

δ= 0.2 δ= 0.5

δ= 1

δ= 0.05

δ= 0.1

Fig. 1: Average forward power dissipation versus

average forward current (per diode).

0 25 50 75 100 125 150 175

Tamb(°C)

IF(av)(A)

Rth(j-a)=Rth(j-c)

Rth(j-a)=15°C/W

D²PAK/I²PAK/TO-220AB

TO-220FPAB

Fig. 2: Average forward current versus ambient

temperature (δ=0.5, per diode).

STPS10H100CT/CG/CR/CFP

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1E-3 1E-2 1E-1 1E+0

100

120 IM(A)

Tc=50°C

Tc=75°C

Tc=125°C

t(s)

δ=0.5

Fig. 5-1: Non repetitive surge peak forward

current versus overload duration (maximum

values, per diode)

1E-3 1E-2 1E-1 1E+0

0.0

0.2

0.4

0.6

0.8

1.0 Zth(j-c)/Rth(j-c)

tp(s)

δ=tp/T tp

Single pulse

δ= 0.1

δ= 0.2

δ= 0.5

Fig. 6-1: Relative variation of thermal impedance

junction to case versus pulse duration (per diode).

1E-3 1E-2 1E-1 1E+0

t(s)

IM(A)

Tc=50°C

Tc=75°C

Tc=125°C

δ=0.5

Fig. 5-2: Nonrepetitivesurgepeakforwardcurrent

versus overload duration (maximum values, per

diode)(TO-220FPAB)

1E-3 1E-2 1E-1 1E+0 1E+1

0.0

0.2

0.4

0.6

0.8

1.0

tp(s)

Zth(j-c)/Rth(j-c)

δ=tp/T tp

Single pulse

δ= 0.1

δ= 0.2

δ= 0.5

Fig. 6-2: Relative variation of thermal impedance

junction to case versus pulse duration (per

diode).(TO-220FPAB)

0.2

0.4

0.6

0.8

1.2

0 25 50 75 100 125 150

T (°C)

P(t)

P (25°C)

ARM p

ARM

Fig. 4: Normalized avalanche power derating

versus junction temperature.

0.001

0.01

0.10.01 1

0.1

10 100 1000

t (µs)

P(t)

P (1µs)

ARM p

ARM

Fig. 3: Normalized avalanche power derating ver-

sus pulse duration.

STPS10H100CT/CG/CR/CFP

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0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4

0.1

1.0

10.0

100.0 IFM(A)

Tj=125°C

Typical values

Tj=125°C

Tj=25°C

Tj=150°C

Typical values

VFM(V)

Fig. 9: Forward voltage drop versus forward

current (maximum values, per diode).

0 2 4 6 8 101214161820

80Rth(j-a) (°C/W)

S(Cu ) (cm²)

Fig. 10: Thermal resistance junction to ambient

versus copper surface under tab (Epoxy printed

circuitboardFR4,copperthickness:35µm)

0 102030405060708090100

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

1E+4 IR(µA)

Tj=125°C

Tj=25°C

Tj=150°C

Tj=100°C

VR(V)

Fig. 7: Reverse leakage current versus reverse

voltage applied (typical values, per diode).

1 2 5 10 20 50 100

100

1000 C(pF)

F=1MHz

Tj=25°C

VR(V)

Fig. 8: Junction capacitance versus reverse

voltage applied (typical values, per diode).

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STPS10H100CT/CG/CR/CFP

PACKAGE MECHANICAL DATA

D2PAK

MV2

* FLAT ZONE NO LESSTHAN 2mm

REF. DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

FOOT PRINT in millimeters

8.90 3.70

1.30

5.08

16.90

10.30

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STPS10H100CT/CG/CR/CFP

PACKAGE MECHANICAL DATA

I2PAK

REF.

DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A1 2.49 2.69 0.098 0.106

b 0.70 0.93 0.028 0.037

b1 1.14 1.17 0.044 0.046

b2 1.14 1.17 0.044 0.046

c 0.45 0.60 0.018 0.024

c2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

e 2.40 2.70 0.094 0.106

E 10.0 10.4 0.394 0.409

L 13.1 13.6 0.516 0.535

L1 3.48 3.78 0.137 0.149

L2 1.27 1.40 0.050 0.055

PACKAGE MECHANICAL DATA

TO-220FPAB

G1 F

Dia

REF. DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 4.4 4.6 0.173 0.181

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

E 0.45 0.70 0.018 0.027

F 0.75 1 0.030 0.039

F1 1.15 1.70 0.045 0.067

F2 1.15 1.70 0.045 0.067

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

L2 16 Typ. 0.63 Typ.

L3 28.6 30.6 1.126 1.205

L4 9.8 10.6 0.386 0.417

L5 2.9 3.6 0.114 0.142

L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

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STPS10H100CT/CG/CR/CFP

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Ordering type Marking Package Weight Base qty Delivery mode

STPS10H100CT STPS10H100CT TO-220AB 2.20g 50 Tube

STPS10H100CFP STPS10H100CFP TO-220FPAB 2.0 g 50 Tube

STPS10H100CG STPS10H100CG D2PAK 1.48g 50 Tube

STPS10H100CG-TR STPS10H100CG D2PAK 1.48g 1000 Tape and reel

STPS10H100CR STPS10H100CR I2PAK 1.49g 50 Tube

■Epoxy meets UL94,V0

PACKAGE MECHANICAL DATA

TO-220AB

Dia

L2 F2

REF. DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

F2 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

G1 2.40 2.70 0.094 0.106

H2 10 10.40 0.393 0.409

L2 16.4 typ. 0.645 typ.

L4 13 14 0.511 0.551

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. 3.75 3.85 0.147 0.151

■Cooling method: C.

■Recommended torque value: 0.55 m.N

■Maximum torque value 0.70 m.N