DATA SH EET
Product specification
Supersedes data of 1995 Mar 28
File under Integrated Circuits, IC02
1996 Jun 04
INTEGRATED CIRCUITS
TDA8776
10-bit, 500 Msps Digital-to-Analog
Converter (DAC)
1996 Jun 04 2
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
FEATURES
•10-bit resolution
•Conversion rate up to 500 MHz
•10K/100K ECL input levels
•Internal reference voltage generator
•No deglitching circuit required
•Internal input register
•Power dissipation only 925 mW (typical)
•Internal 50 Ω output load (connected to the analog
ground)
•Very few external components required.
APPLICATIONS
High-speed digital-to-analog conversion for:
•High resolution video and graphics
•Direct Digital Synthesis (DDS)
•Telecommunication
•High-speed modems.
GENERAL DESCRIPTION
The TDA8776 is a 10-bit Digital-to-Analog Converter
(DAC) for high resolution video and other high frequency
applications. It converts the digital input signal into an
analog output voltage at a maximum conversion rate of
500 Msps. No external reference voltage is required and
all digital inputs are 10K/100K-ECL compatible.
QUICK REFERENCE DATA
Notes
1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and CLK is LOW.
2. The analog output voltages (VOUT and VOUT) are negative with respect to AGND (see Table 1). The external output
resistance between AGND and each of these outputs is typically 50 Ω.
3. A warm-up time is necessary to reach optimal performances.
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VEEA analog supply voltage −5.46 −5.20 −4.94 V
VEED digital supply voltage −5.46 −5.20 −4.94 V
VEEI input stages digital supply
voltage note 1 −5.46 −5.20 −4.94 V
IEEA analog supply current note 1 −108 145 mA
IEED digital supply current note 1 −60 85 mA
IEEI input stages digital supply
current note 1 −10 15 mA
VOUT −VOUT full-scale analog output voltage
(peak-to-peak value) notes 1 and 2; ZL=50Ω1.7 2.0 2.5 V
INL DC integral non-linearity note 3 −±0.3 ±0.5 LSB
DNL DC differential non-linearity note 3 −±0.2 ±0.45 LSB
fclk(max) maximum clock frequency 500 −−MHz
tS1 settling time (differential) 10% to 90% full scale; Fig.9 −0.5 −ns
Ptot total power dissipation −925 −mW
TYPE NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA8776K PLCC28 plastic leaded chip carrier; 28 leads SOT261-2
1996 Jun 04 3
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MLD200
10
11
24
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 IGND
22 21 20 19 18 17 16 15 14 13 12
ECL BUFFERS
COLUMN DECODER
ROW
DECODER
DELAY
TDA8776 R-2R DIVIDER
25 34 9 86 7 27
28
25
26
AGND1 CLK CLK
DGND1
DGND2
AGND2
V
VEED1 VEED2 VOUT1 VOUT1 VOUT2
VOUT2
EEI
VEED3
VEEA
1996 Jun 04 4
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
PINNING
SYMBOL PIN DESCRIPTION
n.c. 1 not connected
DGND1 2 digital ground 1
VEED1 3 digital supply voltage 1 (−5.2 V)
VEED2 4 digital supply voltage 2 (−5.2 V)
AGND1 5 analog ground 1
VOUT1 6 analog voltage output 1
VOUT2 7 analog voltage output 2
VOUT1 8 complementary analog voltage
output 1
VOUT2 9 complementary analog voltage
output 2
AGND2 10 analog ground 2
VEED3 11 digital supply voltage 3 (−5.2 V)
IGND 12 input ground for ECL input buffers
D0 13 data input; bit 0 (LSB)
D1 14 data input; bit 1
D2 15 data input; bit 2
D3 16 data input; bit 3
D4 17 data input; bit 4
D5 18 data input; bit 5
D6 19 data input; bit 6
D7 20 data input; bit 7
D8 21 data input; bit 8
D9 22 data input; bit 9 (MSB)
n.c. 23 not connected
VEEA 24 analog supply voltage (−5.2 V)
VEEI 25 input supply voltage for ECL input
buffers (−5.2 V)
CLK 26 complementary clock input
CLK 27 clock input
DGND2 28 digital ground 2
SYMBOL PIN DESCRIPTION
Fig.2 Pin configuration.
handbook, halfpage
5
6
7
8
9
10
11
25
24
23
22
21
20
19
12
13
14
15
16
17
18
4
3
2
1
28
27
26
TDA8776
IGND
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
n.c.
VEEA
VOUT1
VOUT1
VOUT2
VOUT2
VEEI
VEED3
n.c.
CLK
CLK
DGND1
DGND2
VEED2
VEED1
MLD201
AGND1
AGND2
1996 Jun 04 5
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VEEA analog supply voltage −7.0 ±0.3 V
VEED digital supply voltage −7.0 ±0.3 V
VEEI input stages digital supply voltage −7.0 ±0.3 V
VEEA −VEED supply voltage differential −0.5 +0.5 V
AGND −DGND ground voltage differential −0.1 +0.1 V
VIinput voltage VEEI ±0.3 V
IOUT/IOUT total output current ZL=50Ω−5 +50 mA
Tstg storage temperature −55 +150 °C
Tamb operating ambient temperature 0 +70 °C
Tjjunction temperature −+150 °C
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air 55 (typ.) K/W
1996 Jun 04 6
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
CHARACTERISTICS
VEEA =V
24 to V5and V10 =−5.46 to −4.94 V; VEED =V
3
,V
4and V11 to V2and V28 =−5.46 to −4.94 V;
VEEI =V
25 to V12 =−5.46 to −4.94 V; VEED and VEEI shorted together; Tamb = 0 to +70 °C; AGND, DGND and IGND
shorted together; VOUT −VOUT = 2 V (p-p); ZL=50Ω; unless otherwise specified (typical values measured at
VEEA =V
EED =−5.2 V and Tamb =25°C).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VEEA analog supply voltage −5.46 −5.20 −4.94 V
VEED digital supply voltage −5.46 −5.20 −4.94 V
VEEI input stages digital supply voltage note 1 −5.46 −5.20 −4.94 V
IEEA analog supply current note 1 −108 145 mA
IEED digital supply current note 1 −60 85 mA
IEEI input stages digital supply current note 1 −10 15 mA
AGND −DGND ground voltage differential −0.1 −+0.1 V
Inputs
DIGITAL INPUTS (D9 TO D0) AND CLOCK INPUTS (CLK AND CLK)
VIL LOW level input voltage −1.9 −1.8 −1.6 V
VIH HIGH level input voltage −1.2 −0.9 −0.8 V
IIL LOW level input current VI=−1.8 V −−10 µA
IIH HIGH level input current VI=−0.9 V −−20 µA
fclk(max) maximum clock frequency 500 −−MHz
Outputs (referenced to AGND); notes 1 and 2
VOUT −VOUT full-scale analog output voltage
(peak-to-peak value) ZL=50Ω1.7 2.0 2.5 V
ZOoutput impedance −50 −Ω
Transfer function
INL DC integral non-linearity note 3 −±0.3 ±0.5 LSB
DNL DC differential non-linearity note 3 −±0.2 ±0.45 LSB
Spurious free dynamic range (fclk = 500 MHz); VEEA =V
EED = 5.2 V; Tamb =25°C; note 4; see Fig.3
SFDR spurious free dynamic range
fOUT = 10 MHz −65 −69 −dB
fOUT = 50 MHz −−60 −dB
fOUT = 80 MHz −−59 −dB
fOUT = 100 MHz −52 −59 −dB
1996 Jun 04 7
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
Notes
1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and CLK is LOW.
2. The analog output voltages (VOUT and VOUT) are negative with respect to AGND (see Table 1). The external output
resistance between AGND and each of these outputs is typically 50 Ω.
3. Due to on-chip regulator behaviour a warm-up time is necessary to reach optimal performances; a typical time is
1 minute.
4. Devices with higher SFDR (min.) can be delivered on request.
5. The worst case characteristics are obtained at the transition from input code 0 to 1023 and if an external load
impedance greater than 50 Ω is connected between VOUT or VOUT and AGND in parallel with the external 50 Ω load.
The specified values have been measured directly on a 50 Ω load between VOUT and AGND. No further load
impedance between VOUT and AGND has been applied. All input data is latched at the falling edge of the clock.
6. The data set-up (tSU;DAT) is the minimum period preceding the falling edge of the clock that the input data must be
stable in order to be correctly registered. A negative set-up time indicates that the data may be initiated after the
falling edge of the clock and still be recognized. The data hold time (tHD;DAT) is the minimum period following the
falling edge of the clock that the input data must be stable in order to be correctly registered. A negative hold time
indicates that the data may be released prior to the falling edge of the clock and still be recognized.
7. The definition of glitch energy and the measurement set-up are shown in Fig.10. The glitch energy is measured at
the input transition between code 511 to 512.
Table 1 Input coding and DAC output voltages (typical values; referenced to AGND regardless of the offset voltage)
Switching characteristics (fclk = 500 MHz); notes 5 and 6; see Figs 8 and 9
tSU;DAT data set-up time −400 500 ps
tHD;DAT data hold time 100 150 −ps
tPD propagation delay time −0.8 0.9 ns
tS1 settling time 10% to 90% full scale −0.5 −ns
tS2 settling time change to ±1 LSB −2.0 −ns
tdinput to 50% output delay time −1.4 1.5 ns
Output transients; glitches (fclk = 500 MHz); note 7; see Fig.10
Egdifferential glitch energy from code transition 511 to 512 −12pV.s
CODE BINARY INPUT DATA DAC OUTPUT
VOLTAGES (V)
ZL=50Ω
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 VOUT VOUT
0 0000000000 0 −1.0
1 0000000001−0.0010 −0.9990
. .......... . .
5121000000000−0.5 −0.5
. .......... . .
1022 1111111110−0.9990 −0.0010
1023 1111111111−1.0 0
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1996 Jun 04 8
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
Fig.3 Typical spurious free dynamic range (SFDR) as a function of output frequency.
handbook, full pagewidth
50
55
75
SFDR
(dB)
70
60
MGD479
102103
10 f (MHz)
1
65
Fig.4 Typical output spectrum; fclk = 500 MHz; fOUT = 10 MHz.
handbook, full pagewidth
250
20
DAC
OUTPUT
SPECTRUM
(dB) 0
−100 0 50 100 150 200 f (MHz)
MGD470
−20
−40
−60
−80
1996 Jun 04 9
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
Fig.5 Typical output spectrum; fclk = 500 MHz; fOUT = 50 MHz.
handbook, full pagewidth
250
20
DAC
OUTPUT
SPECTRUM
(dB) 0
−100 0 50 100 150 200 f (MHz)
MGD471
−20
−40
−60
−80
Fig.6 Typical output spectrum; fclk = 500 MHz; fOUT = 80 MHz.
handbook, full pagewidth
250
20
DAC
OUTPUT
SPECTRUM
(dB) 0
−100 0 50 100 150 200 f (MHz)
MGD472
−20
−40
−60
−80
1996 Jun 04 10
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
Fig.7 Typical output spectrum; fclk = 500 MHz; fOUT = 100 MHz.
handbook, full pagewidth
250
20
DAC
OUTPUT
SPECTRUM
(dB) 0
−100 0 50 100 150 200 f (MHz)
MGD473
−20
−40
−60
−80
Fig.8 Data set-up and hold times.
The shaded areas indicate when the input data may change and be correctly registered. Data input update must be completed within tbf ns after the
falling edge of the clock (tSU;DAT is negative; tbf ns). Data must be held at least tbf ns after the falling edge (tHD;DAT = tbf ns).
handbook, full pagewidth
HD; DAT
t
input data
CLK
MLD202
SU; DAT
t
0.9 V
1.35 V
1.8 V
0.9 V
1.35 V
1.8 V
stable
1996 Jun 04 11
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
Fig.9 Switching characteristics.
handbook, full pagewidth
MLD203
CLK 1.35 V
code 1023
1.35 V
code 0
input data
(example of a
full-scale input
transition)
10 %
50 %
90 %
1 LSB
1 LSB
1.0 V
(code 1023)
td
S1
t
S2
t
PD
t
VOUT
(code 0)
0 V
1996 Jun 04 12
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
Fig.10 Glitch energy measurement.
The value of the glitch energy is the sum of the shaded areas measured in pV.s.
handbook, full pagewidth
MLD204
HP80000
fclk /10
fclk /10
(1)
(2) D9 MSB
D8
D7
D6
D5
D4
D3
D1
D0 (LSB)
D2
VOUT
VOUT
TDA8776
PULSE
GENERATOR
(MASTER)
MODEL HP8133A
fclk
fclk
(3)
20 GHz
SAMPLING
SCOPE
TEK 11801A
clock
(3)
(1)
(2)
timing diagram
,,
,,
,,
,,
,
code 511
code 512 1 LSB
time
DATA
GENERATOR
VOUT
VOUT
1996 Jun 04 13
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
INTERNAL PIN CONFIGURATIONS
Fig.11 D9 to D0.
handbook, 4 columns
VEEI
D0 to D9
IGND
MLD205
internal reference
Fig.12 Analog outputs.
handbook, halfpage
MLD206
EEA
V
OUT
V
bit
nbit
n
switches and
current generators
AGND
50 Ω50 Ω
VOUT
Fig.13 CLK and CLK.
o
lumns
VEED
CLK CLK
DGND
MLD207
1996 Jun 04 14
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
APPLICATION INFORMATION
Fig.14 Application diagram.
(1) C = 1 µF in parallel with 10 nF in parallel with 1 nF; all three mounted close to the supply pin of the DAC with 1 nF the nearest.
handbook, full pagewidth
MBE379
50 Ω
10
nF
D5
18
50 Ω
10
nF
D4
17
VEED1
DGND2
50 Ω
10
nF
D3
16
50 Ω
10
nF
D2
15
50 Ω
10
nF
D1
14
50 Ω
10
nF
D0
13 IGND
12
D6 19
10 nF
D7 20
10 nF
D8 21
10 nF
D9 22
10 nF
n.c. 23
24
25
VEEA2
VEEI
C(1)
1µF
V
TT 50 Ω digital input matched lines
50 Ω digital
input matched
lines
CLK
26 27
50 Ω
10
nF
1
µF
22
µF
22 µF
12
µH
1 µF
CLK
50
120
Ω
75
Ω
Ω
10
nF
n.c. DGND1 VEED2
C(1)
50 Ω clock input
matched lines
AGND1
281234
5
V
OUT1
6
VOUT2
7
OUT
VOUT1
8
VOUT2
9
OUT
AGND2
10
C(1)
11 VEED3
50 Ω analog
output matched
lines
TDA8776
50 Ω
50 Ω
50 Ω
50 Ω
1
µF 22
µF
LM337T
IN
VEE (−5.2 V)
VTT (−2 V)
OUT
ADJ
1996 Jun 04 15
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT261-2
19
25
28
1
4
511
18
12
26
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk1
k
X
y
e
E
B
D
H
E
H
vMB
D
ZD
A
ZE
e
vMA
0 5 10 mm
scale
92-11-17
95-02-25
pin 1 index
PLCC28: plastic leaded chip carrier; 28 leads SOT261-2
UNIT A A
min. max. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
mm 4.57
4.19 0.51 3.05 0.53
0.33
0.021
0.013
1.27 0.51 2.16 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
D(1)
11.58
11.43
HD
12.57
12.32
E
Z
2.16
D
b1
0.81
0.66
k
1.22
1.07
k1
0.180
0.165 0.020 0.12
A3
0.25
0.01 0.05 0.020 0.085
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
0.456
0.450
11.58
11.43
0.456
0.450 0.495
0.485
12.57
12.32
0.495
0.485
eE
eD
10.92
9.91
0.430
0.390
10.92
9.91
0.430
0.390 0.085
0.032
0.026 0.048
0.042
E
e
inches
E
e
1996 Jun 04 16
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all PLCC
packages.
The choice of heating method may be influenced by larger
PLCC packages (44 leads, or more). If infrared or vapour
phase heating is used and the large packages are not
absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our
“Quality
Reference Handbook”
(order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all PLCC
packages if the following conditions are observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow.
•The package footprint must incorporate solder thieves at
the downstream corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1996 Jun 04 17
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1996 Jun 04 18
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
NOTES
1996 Jun 04 19
Philips Semiconductors Product specification
10-bit, 500 Msps Digital-to-Analog
Converter (DAC) TDA8776
NOTES
Internet: http://www.semiconductors.philips.com/ps/
(1) ADDRESS CONTENT SOURCE April 2, 1998
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1996 SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 805 4455, Fax. +61 2 805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 615 800, Fax. +358 615 80920
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 52 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 648 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Middle East: see Italy
Printed in The Netherlands 537021/1200/02/pp20 Date of release: 1996 Jun 04 Document order number: 9397 750 00887
