USER'S MANUAL ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z Evaluation Boards AN1386 Rev 1.00 December 23, 2009 Table of Contents General Description....................................................................................................................................................................... 2 Installation ..................................................................................................................................................................................... 2 Typical Application Schematic....................................................................................................................................................... 3 Efficiency and Output Ripple/Noise Measurement........................................................................................................................ 4 Schematic ..................................................................................................................................................................................... 5 Bill of Materials .............................................................................................................................................................................. 6 Printed Circuit Board Layer ........................................................................................................................................................... 7 List of Figures Evaluation Board of POL Module .................................................................................................................................................. 2 Quick Start..................................................................................................................................................................................... 3 Quick Start Schematic ................................................................................................................................................................... 3 Wide Input Range Schematic........................................................................................................................................................ 3 Efficiency Measurement Schematic .............................................................................................................................................. 4 Equipment Setup for Efficiency Measurement .............................................................................................................................. 4 Output Ripple/Noise Measurement Method .................................................................................................................................. 4 Schematic ..................................................................................................................................................................................... 5 Top-Over Layer (Component Location) ......................................................................................................................................... 7 Top Layer (Component Side) ........................................................................................................................................................ 7 Middle-1 Layer............................................................................................................................................................................... 8 Middle-2 Layer............................................................................................................................................................................... 8 Bottom Layer (Component Side)................................................................................................................................................... 9 Bottom-Over Layer (Component Location) ................................................................................................................................... 9 List of Tables Test Equipment List ....................................................................................................................................................................... 2 Recommended Operating Specifications ...................................................................................................................................... 2 Typical Output Voltage Setting for each Resistance ..................................................................................................................... 2 Bill of Materials .............................................................................................................................................................................. 6 AN1386 Rev 1.00 December 23, 2009 Page 1 of 10 ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z General Description This app note covers the ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z evaluation boards. Since the modules are a pin for pin drop in with all necessary unique circuitry integrated in the module, the only difference in the BOM is the ISL8201M, ISL8206M, or ISL8204M POL modules. We will refer to a generic eval board, ISL820xMEVAL1Z to cover all three power modules. The ISL820xMEVAL1Z POL module evaluation board is shown in Figure 1. The user can use it to evaluate the performance of the Intersil ISL8201M, ISL8206M, or ISL8204M POL modules. This board consists of power and load connectors for source and load side, switches for PVCC bias selection and On/Off option, and other passive components. The input voltage range is from 1V to 20V, and the output voltage range is from 0.6V to 5V 5V for the ISL8201M or 0.6V to 6V for the ISL8204M and ISL8206M. Additional PVCC bias source is not required when using an input voltage of 5V or 12V. It can connect to the input side directly. However, in wider input ranges, which are above 14V or below 5V, the PVCC bias needs to add an external source, which provides operation bias of the module. The output voltage is initially set at 1.5V for typical evaluation. The user can easily set the output voltage by changing the value of R1 (refer to Figure 8). Installation TABLE 1. TEST EQUIPMENT LIST EQUIPMENT PART NUMBER An adjustable DC Power Supply 30V, 15A, with current limit GW GPC-3060D An electronic load, capable of sinking 20A Chroma 63030/63010 Four channel oscilloscope and probes Tektronix TDS3014 Tektronix P3010 High Precision Digital Voltage Meter ESCORT 3136A High Precision Digital Current Meter ESCORT 3136A Recommended Operating Specification The recommended operating specification for input/output and PVCC bias range is shown as Table 2. TABLE 2. RECOMMENDED OPERATING SPECIFICATIONS PARAMETER TEST CONDITIONS Input Voltage Range (VIN) MIN TYP MAX UNIT 1 - 20 V Fixed +5V Supply 4.5 5.0 5.5 V Fixed +12V Supply 9.6 Wide Range Supply 6.5 - 14.4 V ISL8201M 0.6 - 5 V ISL8204M and ISL8206M 0.6 - 6 V Current Setting for R1 = 6.49k VOUT - 1.5 - V Output Current (Load Current) ISL8201M - - 10 A ISL8206M - - 6 A ISL8204M - - 4 A ISL8201M RSEN-IN = 3.57k - 17 - A ISL8206M RSEN-IN = 4.12k - 8.8 - A ISL8204M RSEN-IN = 2.87k - 6.6 - A Supply Voltage Range (PVCC) Output Voltage Range (VOUT) Current Limit (PVCC = 12V) 12.0 14.4 V Table 3 lists the typical application's various output voltages and its corresponding resistance. FIGURE 1. EVALUATION BOARD OF POL MODULE TABLE 3. TYPICAL OUTPUT VOLTAGE SETTING FOR EACH RESISTANCE VOUT 0.6V 1.05V 1.2V R1 AN1386 Rev 1.00 December 23, 2009 Open 1.5V 1.8V 2.5V 3.3V 5V 13k 9.76k 6.49k 4.87k 3.09k 2.16k 1.33k Page 2 of 10 ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z Selecting Switches Switch S1 selects PVCC bias supply from VIN or an additional supply source. When S1 is pushed up, the PVCC bias connects to the input power side. When S1 is pushed down, the PVCC bias connects to the additional power supply. For typical applications, the PVCC bias voltage is +5V (+10%) or +12V (+20%). It can also supply a wider range from +6.5V to +14.4V. VIN VIN S1 S1 FIGURE 2. QUICK START FOR EVALUATION BOARD +5V/+12V OR +6.5V TO +14.4V +5V/+12V OR +6.5V TO +14.4V SWITCH UP DOWN S1 VIN +5V/+12V or +6.5V to +14.4V Switch S2 selects module Enable (On) or Disable (Off). When S2 is pushed up, the COMP/EN pin of the module is enabled and the module starts initialization and operation. When S2 is pushed down, the COMP/EN pin of the module connects to ground and the module will be shut down. EN EN Figure 3 shows the ISL820xMEVAL1Z application schematic for +5V or +12V input voltage. The PVCC pin can connect to the input supply directly. CPVCC PVCC COMP/EN VIN (+5V/+12V) VIN CIN FB RFB PHASE ISET PGND VOUT VOUT RSEN-EX S2 COUT FIGURE 3. QUICK START SCHEMATIC S2 Typical Application Schematic Typical Application with Separated Power Supply ENABLE DISABLE SWITCH UP DOWN S2 EN Disable Figure 4 shows the ISL820xMEVAL1Z application schematic for a wide input voltage from +1V to +20V. The PVCC supply can source +5V/+12V or +6.5V to +14.4V. PVCC (+5V/+12V OR +6.5V TO +14.4V) Quick Start The evaluation board can be evaluated simply, as shown in Figure 2. The power connection of the evaluation board supplies the input voltage from the DC Power Supply, and the load connection of the evaluation board delivers power to the Electronic Load. If the input voltage is +5V or +12V, the PVCC bias does not require additional supply and it can connect to the input side directly by pushing switch S1 to the up state. CPVCC PVCC COMP/EN FB RFB ISET RSEN-EX VIN PHASE PGND CIN VIN (+1V TO +20V) VOUT VOUT COUT FIGURE 4. WIDE INPUT RANGE SCHEMATIC AN1386 Rev 1.00 December 23, 2009 Page 3 of 10 ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z PVCC C PVCC + - Vin DC Source Iin PVCC VIN COMP/EN VIN Vi FB RSEN-EX + - PHASE PGND DC Source Iout VOUT ISET R FB Ai Cin VOUT Cout Vo DC Load Vout FIGURE 5. EFFICIENCY MEASUREMENT SCHEMATIC Efficiency and Output Ripple/Noise Measurement DC POWER SUPPLY PVCC Figure 5 shows the efficiency measurement schematic for the ISL820xMEVAL1Z POL module. The voltage and current meter can be used to measure input/output voltage and current. In order to obtain an accurate measurement and prevent the voltage drop of PCB or wire trace, the voltage meter must be close to the input/output pin of the POL module. The efficiency equation is shown in Equation 1: P OUT V OUT I OUT Output Power Efficiency = ------------------------------------ = ---------------- = ---------------------------------------Input Power P IN V IN I IN ELECTRONIC LOAD DC POWER SUPPLY Vin Current Meter + + (EQ. 1) The equipment setup for the efficiency measurement on the evaluation board is shown in Figure 6. The measuring point for the input voltage meter is at the C3 terminal, and the measuring point for the output voltage meter is at the C8 terminal (refer to Figure 9). Voltage Meter Voltage Meter - - FIGURE 6. EQUIPMENT SETUP FOR EFFICIENCY MEASUREMENT Output Ripple/Noise Measurement Method The total noise is equal to the sum of the ripple and noise components. Simple steps should be taken to assure that there is minimum pickup noise due to the high frequency events, which can be magnified by the large ground loop formed by the oscilloscope probe ground. This means that even a few inches of ground wire on the oscilloscope probe may result in hundreds of millivolts of noise spikes when improperly routed or terminated. This effect can be overcome by using the short loop measurement method to minimize the measurement loop area for reducing the pickup noise. The short loop measurement method is shown in Figure 7. For ISL820xMEVAL1Z evaluation board, the output ripple/noise measurement point is located at the C8 terminal (refer to Figure 9). AN1386 Rev 1.00 December 23, 2009 SHORT LOOP MEASUREMENT METHOD FIGURE 7. OUTPUT RIPPLE/NOISE MEASUREMENT METHOD Page 4 of 10 ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z AN1386 Rev 1.00 December 23, 2009 FIGURE 8. SCHEMATIC NOTES: 1. R1 is used to set the output voltage of ISL820xMEVAL1Z. Initial setting is 6.49k for 1.5V output voltage. 2. R2 and R3, paralleling with R1, are used to adjust the output voltage of ISL820xMEVAL1Z. 3. R4 is used to set the overcurrent trip level of ISL820xMEVAL1Z. The ISL8201MEVAL1Z has integrated 3.57kISL8206MEVAL1Z has integrated 4.12k, and ISL8204MEVAL1Z has integrated 2.87k 4. R18, C18 and C19 are the snubber network, which can reduce the stress for internal semiconductor. Page 5 of 10 5. R13, R14, C12, C13, C14 and C15 are the external compensation network. The ISL820xMEVAL1Z has integrated the type 3 compensation network inside the module for typical applications. 6. R15, R16, R17, R20, R21, C17, Q2 and Q3 are the power-up sequence circuit. In case of PVCC bias, power-up first, then input voltage. This circuit has to be implemented. ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z TABLE 4. BILL OF MATERIALS SYMBOL COMPONENTS R1 Resistor Chip Resistor 6.49k Generic R2 Resistor Not installed - R3 Resistor Not installed - R4 Resistor Not installed - R8 Resistor Chip Resistor 10 Generic R13 Resistor Not installed - R14 Resistor Not installed - R15 Resistor Not installed - R16 Resistor Not installed - R17 Resistor Not installed - R18 Resistor Not installed - R20 Resistor Not installed R21 Resistor Not installed - C1 Capacitor AL Capacitor 220F/35V SANYO C1A Capacitor Not installed - C2 Capacitor Ceramic Capacitor 10F/25V MURATA/TDK C3 Capacitor Ceramic Capacitor 10F/25V MURATA/TDK C5 Capacitor POS Capacitor 330F/6.3V SANYO C5A Capacitor Not installed - C6 Capacitor Not installed - C6A Capacitor Ceramic Capacitor 22F/10V MURATA/TDK C7 Capacitor Ceramic Capacitor 22F/10V MURATA/TDK C7A Capacitor Not installed MURATA/TDK C8 Capacitor Ceramic Capacitor 22F/10V MURATA/TDK C8A Capacitor Not installed - C9 Capacitor Not installed - C10 Capacitor Ceramic Capacitor 1F/25V YAGEO C11 Capacitor Ceramic Capacitor 1F/25V YAGEO C12 Capacitor Not installed - C13 Capacitor Not installed - C14 Capacitor Not installed - C15 Capacitor Not installed - C17 Capacitor Not installed - C18 Capacitor Not installed - C19 Capacitor Not installed - S1 Switch UT Switch SH S2 Switch UT Switch SH Q2 MOSFET Not installed - Q3 MOSFET Not installed - U1 Module ISL8201M, ISL8206M, or ISL8204M Intersil AN1386 Rev 1.00 December 23, 2009 DESCRIPTION SUPPLIER - Page 6 of 10 ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z Printed Circuit Board Layers FIGURE 9. TOP-OVER LAYER (COMPONENT LOCATION) FIGURE 10. TOP LAYER (COMPONENT SIDE) AN1386 Rev 1.00 December 23, 2009 Page 7 of 10 ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z Printed Circuit Board Layers (Continued) FIGURE 11. MIDDLE-1 LAYER FIGURE 12. ISL820xMEVAL1Z, MIDDLE-2 LAYER AN1386 Rev 1.00 December 23, 2009 Page 8 of 10 ISL8201MEVAL1Z, ISL8204MEVAL1Z, ISL8206MEVAL1Z Printed Circuit Board Layers (Continued) FIGURE 13. BOTTOM LAYER (COMPONENT SIDE MIRRORED) FIGURE 14. BOTTOM-OVER LAYER (COMPONENT LOCATION MIRRORED) AN1386 Rev 1.00 December 23, 2009 Page 9 of 10 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. 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