GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Single Chip With Easy Interface Between
UART and Serial-Port Connector of an
External Modem or Other Computer
Peripheral
D
Five Drivers and Three Receivers Meet or
Exceed the Requirements of ANSI Standard
TIA/EIA-232-F and ITU Recommendation
V.28 Standards
D
Supports Data Rates up to 120 kbit/s
D
Complement to the GD75232
D
Provides Pin-to-Pin Replacement for the
Goldstar GD75323
D
Pin-Out Compatible With SN75196
D
Functional Replacement for the MC145405
description
The GD75323 combines five drivers and three receivers from the trade-standard SN75188 and SN75189
bipolar quadruple drivers and receivers, respectively. The flow-through design of the GD75323 decreases the
part count, reduces the board space required, and allows easy interconnection of the UART and serial-port
connector. The all-bipolar circuits and processing of the GD75323 provide a rugged, low-cost solution for this
function.
The GD75323 complies with the requirements of the ANSI TIA/EIA-232-F and ITU (formerly CCITT) V.28
standards. These standards are for data interchange between a host computer and a peripheral at signal rates
up to 20 kbit/s. The switching speeds of the GD75323 are fast enough to support rates up to 120 kbit/s with lower
capacitive loads (shorter cables). Interoperability at the higher signaling rates cannot be assured unless the
designer has design control of the cable and the interface circuits at both ends. For interoperability at signaling
rates up to 120 kbit/s, use of ANSI Standard TIA/EIA-423-B and TIA/EIA-422-B and ITU Recommendations V.10
and V.11 are recommended.
The GD75323 is characterized for operation over a temperature range of 0°C to 70°C.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
1DA
2DA
3DA
1RY
2RY
4DA
3RY
5DA
GND
VDD
1DY
2DY
3DY
1RA
2RA
4DY
3RA
5DY
VSS
DW OR N PACKAGE
(TOP VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1999, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
9
8
7
6
5
4
3
2
5DY
3RA
4DY
2RA
1RA
3DY
2DY
1DY
5DA
3RY
4DA
2RY
1RY
3DA
2DA
1DA
12
13
14
15
16
17
18
19
logic diagram (positive logic)
1DY1DA
2DY2DA
3DY3DA
1RA1RY
2RA2RY
4DY4DA
3RA3RY
5DY5DA
2
3
4
5
6
7
8
9
19
18
12
13
14
15
16
17
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematic (each driver)
DYx Output
320 Ω
68.5 Ω3.3 kΩ
10.4 kΩ
To Other Drivers
VSS
To Other
Drivers
GND
4.2 kΩ
Input DAx
VDD
75.8 Ω
9.4 kΩ11.6 kΩ
To Other Drivers
Resistor values shown are nominal.
schematic (each receiver)
Input RAx
10 kΩ
3.8 kΩ
9 kΩ5 kΩ1.66 kΩ
GND
R Yx Output
VCC
To Other Receivers
Resistor values shown are nominal.
2 kΩ
To Other Receivers
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) 10 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VDD (see Note 1) 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VSS (see Note 1) –15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI: Driver –15 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver –30 V to 30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (Driver) – 15 V to 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low-level output current, IOL (Receiver) 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DW package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. All voltages are with respect to the network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
recommended operating conditions
MIN NOM MAX UNIT
VDD 7.5 9 13.5
Supply voltage VSS –7.5 –9 –13.5 V
VCC 4.5 5 5.5
High-level input voltage, VIH Driver 1.9 V
Low-level input voltage, VIL Driver 0.8 V
High level out
p
ut current IOH
Driver –6
mA
High
-
le
v
el
o
u
tp
u
t
c
u
rrent
,
I
OH Receiver –0.5
mA
High level out
p
ut current IOL
Driver 6
mA
High
-
le
v
el
o
u
tp
u
t
c
u
rrent
,
I
OL Receiver 16
mA
Operating free-air temperature,TA0 70 °C
supply currents over operating free-air temperature range
PARAMETER TEST CONDITIONS MIN MAX UNIT
All in
p
uts at 1 9 V
No load
VDD = 9 V, VSS = –9 V 25
mA
IDD
Su
pp
ly current from VDD
All
inp
u
ts
at
1
.
9
V
,
No
load
VDD = 12 V, VSS = –12 V 32
mA
I
DD
S
u
ppl
y
c
u
rrent
from
V
DD
All in
p
uts at 0 8 V
No load
VDD = 9 V, VSS = –9 V 7.5
mA
All
inp
u
ts
at
0
.
8
V
,
No
load
VDD = 12 V, VSS = –12 V 9.5
mA
All in
p
uts at 1 9 V
No load
VDD = 9 V, VSS = –9 V –25
mA
ISS
Su
pp
ly current from VSS
All
inp
u
ts
at
1
.
9
V
,
No
load
VDD = 12 V, VSS = –12 V –32
mA
I
SS
S
u
ppl
y
c
u
rrent
from
V
SS
All in
p
uts at 0 8 V
No load
VDD = 9 V, VSS = –9 V –5.3
mA
All
inp
u
ts
at
0
.
8
V
,
No
load
VDD = 12 V, VSS = –12 V –5.3
mA
ICC Supply current from VCC VCC= 5 V, All inputs at 5 V, No load 20 mA
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DRIVER SECTION
electrical characteristics over operating free-air temperature range, VDD = 9 V, VSS = –9 V,
VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage VIL = 0.8 V, RL = 3 kΩ,See Figure 1 6 7.5 V
VOL Low-level output voltage (see Note 3) VIH = 1.9 V, RL = 3 kΩ, See Figure 1 –7.5 –6 V
IIH High-level input current VI = 5 V, See Figure 2 10 µA
IIL Low-level input current VI = 0, See Figure 2 –1.6 mA
IOS(H) High-level short-circuit output current
(see Note 4) VIL = 0.8 V, VO = 0, See Figure 1 –4.5 –9 –19.5 mA
IOS(L) Low-level short-circuit output current V IH = 2 V, VO = 0, See Figure 1 4.5 9 19 mA
roOutput resistance (see Note 5) VCC = VDD = VSS = 0, VO = –2 V to 2 V 300 Ω
NOTES: 3. The algebraic convention, where the more positive (less negative) limit is designated as maximum, is used in this data sheet for logic
levels only, e.g., if –10 V is maximum, the typical value is a more negative voltage.
4. Output short-circuit conditions must maintain the total power dissipation below absolute maximum ratings.
5. Test conditions are those specified by TIA/EIA-232-F and as listed above.
switching characteristics, VDD = 12 V, VSS = –12 V, VCC = 5 V ±10%, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH Propagation delay time, low- to high-level output R
L
= 3 kΩ to 7 kΩ, C
L
= 15 pF, 315 500 ns
tPHL Propagation delay time, high- to low-level output
L,
See Figure 3
L,
75 175 ns
tTLH
Transition time low to high level out
p
ut
RL = 3 kΩ to 7 kΩ,
See Figure 3 CL = 15 pF, 60 100 ns
t
TLH
Transition
time
,
lo
w-
to
high
-
le
v
el
o
u
tp
u
t
RL = 3 kΩ to 7 kΩ,
See Figure 3 and Note 6 CL = 2500 pF, 1.7 2.5 µs
tTHL
T ransition time, high- to low-level output (see RL = 3 kΩ to 7 kΩ,
See Figure 3 CL = 15 pF, 40 75 ns
t
THL
g(
Note 5) RL = 3 kΩ to 7 kΩ,
See Figure 3 and Note 7 CL = 2500 pF, 1.5 2.5 µs
NOTES: 6. Measured between –3-V and 3-V points of the output waveform (TIA/EIA-232-F conditions), all unused inputs are tied either high
or low.
7. Measured between 3-V and –3-V points of the output waveform (TIA/EIA-232-F conditions), all unused inputs are tied either high
or low.
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
RECEIVER SECTION
electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
Ĕ
MAX UNIT
VIT
Positive going in
p
ut threshold voltage
See Figure 5
TA = 25°C 1.75 1.9 2.3
V
IT+
Positi
v
e
-
going
inp
u
t
threshold
v
oltage
See
Fig
u
re
5
TA = 0°C to 70 °C 1.55 2.3
V
VIT– Negative-going input threshold voltage
See Figure 5
0.75 0.97 1.25
V
Vhys Input hysteresis voltage (VIT+ – VIT–)
See
Fig
u
re
5
0.5
VOH
High level out
p
ut voltage
IOH =05mA
VIH = 0.75 V 2.6 4 5
V
V
OH
High
-
le
v
el
o
u
tp
u
t
v
oltage
I
OH = –
0
.
5
mA
Inputs open 2.6
V
VOL Low-level output voltage IOL = 10 mA, VI = 3 V 0.2 0.45 V
IIH
High level in
p
ut current
VI = 25 V, See Figure 5 3.6 8.3
mA
I
IH
High
-
le
v
el
inp
u
t
c
u
rrent
VI = 3 V, See Figure 5 0.43
mA
IIL
Low level in
p
ut current
VI = –25 V, See Figure 5 –3.6 –8.3
mA
I
IL
Lo
w-
le
v
el
inp
u
t
c
u
rrent
VI = –3 V, See Figure 5 –0.43
mA
IOS Short-circuit output current See Figure 4 –3.4 –12 mA
†All typical values are at TA = 25°C, VCC = 5 V, VDD = 9 V, and VSS = –9 V.
switching characteristics, VCC = 5 V, VDD = 12 V, VSS = –12 V, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH Propagation delay time, low- to high-level output 107 500 ns
tPHL Propagation delay time, high- to low-level output CL = 50 pF, RL = 5 kΩ, 42 150 ns
tTLH T ransition time, low- to high-level output
L
See Figure 6
L
175 525 ns
tTHL T ransition time, high- to low-level output 16 60 ns
PARAMETER MEASUREMENT INFORMATION
Figure 1. Driver Test Circuit
for VOH, VOL, IOS(H), and IOS(L
IOS(L)
–IOS(H)
VSS
VDD
VCC
VI
VO
VDD or GND
VSS or GND
RL = 3 kΩ
Figure 2. Driver Test Circuit for IIH and IIL
–IIL
IIH
VSS
VDD
VCC
VI
VI
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Pulse
Generator
See Note B CL
(see Note A)
RL
3 V
0 V
1.5 V 1.5 V
Input
tPHL tPLH
90% 50%
10% 50%
10%
90%
tTHL tTLH
VOH
VOL
TEST CIRCUIT VOLTAGE WAVEFORMS
Input
Output
VSS
VCC
VDD
VO
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
Figure 3. Driver Test Circuit and Voltage Waveforms
Figure 4. Receiver Test Circuit for IOS
VI
VDD
VCC
VSS
–IOS
Figure 5. Receiver Test Circuit
for VIT, VOH, and VOL
VIT, VI
VDD
VCC
VSS
IOL
VOH –IOH
VOL
VSS
Pulse
Generator
See Note B CL
(see Note A)
RL
5 V
–5 V
50% 50%
Input
tPHL tPLH
90% 50%
10% 50%
10%
90%
tTHL tTLH
VOH
VOL
TEST CIRCUIT VOLTAGE WAVEFORMS
Input
VDD
VCC
Output
VO
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
Figure 6. Receiver Propagation and Transition Times
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
DRIVER SECTION
Figure 7
VO – Output Voltage – V
VOLTAGE-TRANSFER CHARACTERISTICS
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VDD = 6 V, VSS = –6 V
9
6
3
0
–3
–6
–9
1.81.61.41.210.80.60.40.2
–12 2
12
VI – Input Voltage – V
0
ÎÎÎÎÎÎÎÎ
VDD = 12 V, VSS = –12 V
ÎÎÎÎÎÎÎÎ
VDD = 9 V, VSS = –9 V
ÎÎÎÎ
ÎÎÎÎ
RL = 3 kΩ
TA = 25°C
VO
Figure 8
IO – Output Current – mA
OUTPUT CURRENT
vs
OUTPUT VOLTAGE
VOH(VI = 0.8 V)
VSS = –9 V
16
12
8
4
0
–4
–8
–12
–16
12840–4–8–12
–20 16
20
VO – Output Voltage – V
–16
ÎÎÎÎÎ
ÎÎÎÎÎ
VOL(VI = 1.9 V)
IO
ÎÎÎ
3-kΩ
ÎÎÎÎÎ
ÎÎÎÎÎ
VDD = 9 V
ÎÎÎÎ
ÎÎÎÎ
TA = 25°C
Load Line
Figure 9
IOS – Short-Circuit Output Current – mA
SHORT-CIRCUIT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
ÎÎÎÎ
ÎÎÎÎ
VO = 0
ÎÎÎÎÎ
VSS = –9 V
70605040302010
9
6
3
0
–3
–6
–9
–12
12
TA – Free-Air Temperature – °C
0
ÎÎÎÎÎ
ÎÎÎÎÎ
VDD = 9 V
ÁÁ
ÁÁ
IOS
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
IOS(H) (VI = 0.8 V)
IOS(L) (VI = 1.9 V)
Figure 10
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
SR – Slew Rate – V/
SLEW RATE
vs
LOAD CAPACITANCE
ÎÎÎÎÎ
TA = 25°C
RL = 3 kΩ
VSS = – 9 V
VDD = 9 V
100
10
1000100
110000
1000
CL – Load Capacitance – pF
µs
10
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
RECEIVER SECTION
Figure 11
– Input Threshold Voltage – V
INPUT THRESHOLD VOLTAGE
vs
FREE-AIR TEMPERATURE
2.2
2
1.8
1.6
1.4
1.2
0.8
0.6
0.4
2.4
TA – Free-Air Temperature – °C
VIT–
VIT +
706050403020100
VIT
Figure 12
INPUT THRESHOLD VOLTAGE
vs
SUPPLY VOLTAGE
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
9876543
010
2
VCC – Supply Voltage – V
2
VIT–
VIT+
– Input Threshold Voltage – V
VIT
Figure 13
Amplitude – V
NOISE REJECTION
ÎÎÎÎ
ÎÎÎÎ
CC = 300 pF
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC = 5 V
TA = 25°C
See Note A
10 tw – Pulse Duration – ns
6
0
1
2
3
4
5
40 100 400 1000 4000
ÁÁÁÁ
ÁÁÁÁ
ÎÎÎÎÎ
ÎÎÎÎÎ
CC = 500 pF
ÁÁÁÁ
ÁÁÁÁ
CC = 12 pF
ÁÁÁ
ÁÁÁ
ÎÎÎÎ
ÎÎÎÎ
CC = 100 pF
NOTE A: This figure shows the maximum amplitude of a
positive-going pulse that, starting from 0 V, does not
cause a change of the output level.
10000
Figure 14
MAXIMUM SUPPLY VOLTAGE
vs
FREE-AIR TEMPERATURE
RL ≥ 3 kΩ (from each output to GND)
14
12
10
8
6
4
2
70605040302010
0
16
TA – Free-Air Temperature – °C
0
– Maximum Supply Voltage – V
DD
V
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
Diodes placed in series with the VDD and VSS leads protect the GD75323 in the fault condition in which the device
outputs are shorted to VDD or VSS, and the power supplies are at low and provide low-impedance paths to
ground (see Figure 15).
VDD
VSS
±15 V Output VDD
VSS
GD75323 GD75323
Figure 15. Power-Supply Protection to Meet Power-Off Fault Conditions of TIA/EIA-232-F
10
9
8
7
6
5
4
3
2
1
GND
5DA
3RY
4DA
2RY
1RY
3DA
2DA
1DA
VCC
VSS
5DY
3RA
4DY
2RA
1RA
3DY
2DY
1DY
VDD
11
12
13
14
15
16
17
18
19
20
43
37
40
13
36
11
41
42
RI
DTR
CTS
SO
RTS
SI
DSR
DCD
RI
DTR
CTS
TX
RTS
RX
DSR
DCD
GD75323
5 V
TL16C450
ACE
1
5
6
9
12 V
–12 V
TIA/EIA-232-F
DB9S
Connector
C2†
C5†
†See Figure 10 to select the correct values for the loading capacitors (C1, C2, C3, C4, and C5), which may be required to meet the RS-232
maximum slew-rate requirement of 30 V/µs. The value of the loading capacitors required depends upon the line length and desired slew rate,
but is typically 330 pF.
NOTE C: To use the receivers only, VDD and VSS both must be powered or tied to ground.
C4†
C3†
C1†
Figure 16. Typical Connection
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
GD75323DW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
GD75323DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
GD75323DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
GD75323DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
GD75323DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
GD75323DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
GD75323N OBSOLETE PDIP N 20 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-May-2007
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
GD75323DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
GD75323DWR SOIC DW 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Nov-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
GD75323DWR SOIC DW 20 2000 346.0 346.0 41.0
GD75323DWR SOIC DW 20 2000 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Nov-2008
Pack Materials-Page 2
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