SFH 487 P
GaAIAs-IR-Lumineszenzdiode (880 nm)
GaAIAs Infrared Emitter (880 nm)
Lead (Pb) Free Product - RoHS Compliant
2007-04-02 1
Wesentliche Merkmale
• GaAlAs-LED mit sehr hohem Wirkungsgrad
• Hohe Zuverlässigkeit
• Hohe Impulsbelastbarkeit
• Gute spektrale Anpassung an
Si-Fotoempfänger
• Gehäusegleich mit SFH 309
Anwendungen
• IR-Fernsteuerung von Fernseh-, Rundfunk-
und Videogeräten, Lichtdimmern
• Lichtschranken bis 500 kHz
• Münzzähler
• Sensorik
• Diskrete Optokoppler
Typ
Type Bestellnummer
Ordering Code Gehäuse
Package
SFH 487 P Q62703Q0517 3-mm-LED-Gehäuse, plan, klares violettes Epoxy-Gieβ
harz, Anschlüsse im 2.54-mm-Raster ( 1/10’’), Anodenkenn-
zeichnung: kürzerer Anschluβ
3 mm LED package (T 1), plane, violet-colored transparent
epoxy resin, solder tabs lead spacing 2.54 mm (1/10’’), an-
ode marking: short lead
Features
• Very highly efficient GaAl As-LED
• High reliability
• High pulse handling capability
• Good spectral match to silicon photodetectors
• Same package as SFH 309
Applications
• IR remote control for hifi and TV sets, video
tape recorder, dimmers
• Light-reflection switches (max. 500 kHz)
• Coin counters
• Sensor technol ogy
• Discrete optocouplers
2007-04-02 2
SFH 487 P
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage VR5 V
Durchlaβstrom
Forward current IF100 mA
Stoβstrom, τ ≤ 10 μs
Surge current IFSM 2.5 A
Verlustleistung
Power dissipation Ptot 200 mW
Wärmewiderstand, freie Beinchenlänge
max. 10 mm
Thermal resistance, lead length between
package bottom and PC-board max. 10 mm
RthJA 375 K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak 880 nm
Spektrale Bandbreite bei 50% von Imax,
IF = 100 mA
Spectral bandwidth at 50% of Imax
Δλ 80 nm
Abstrahlwinkel
Half angle ϕ ± 65 Grad
deg.
Aktive Chipfläche
Active chip area A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area L × B
L × W0.3 × 0.3 mm²
Abstand Chipoberfläche bis Gehäusevorderseite
Distance chip front to case surface H0.4 … 0.8 mm
SFH 487 P
2007-04-02 3
Schaltzeiten, Ie von 10% auf 90% und von 90% auf
10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ie from 10% to 90% and from 90%
to 10%, IF = 100 mA, RL = 50 Ω
tr, tf0.6/0.5 μs
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co 15 pF
Durchlaβspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
VF
1.5 (< 1.8)
3.0 (< 3.8)
V
Sperrstrom
Reverse current
VR = 5 V
IR0.01 (≤ 1) μA
Gesamtstrahlungsfluβ
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe25 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient or Ie or Φe,
IF = 100 mA
TCI – 0.5 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA TCV– 2 mV/K
Temperaturkoeffizient von λpeak, IF = 100 mA
Temperature coefficient of λpeak, IF = 100 mA TCλ0.25 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
2007-04-02 4
SFH 487 P
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol Wert
Value Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie
> 2
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 μs
Ie typ.
30
mW/sr
SFH 487 P
2007-04-02 5
Relative Spectral Emission
Ιrel = f (λ)
Forward Current, IF = f (VF)
Single pulse, tp = 20 μs
Radiation Characteristics Ιrel = f (ϕ)
0
750
Ιrel
OHR00877
800 850 900 950 nm 1000
20
40
60
80
%
100
λ
10
OHR00881
F
V
-3
-2
10
-1
10
0
10
1
10
0123456V8
A
Ι
F
OHR01894
02040 60 80 100 1200.40.60.81.0
100
90
80
70
60
50
0
10203040
0
0.2
0.4
0.6
0.8
1.0
ϕ
Radiant Intensity
Single pulse, tp = 20 μs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
Ie
Ιe 100 mA
= f (IF)
10
OHR00878
Ι
e
F
Ι
-3
-2
10
-1
10
0
10
1
10
2
10
0
10 10
1
10
2
10
4
mA
e
Ι
(100mA)
3
10
10
Ι
F
OHR00886
1
2
10
3
10
4
10
mA
-5
10 s
=D
F
Ι
T
DC
0.005=
D
p
t
T
t
p
p
t
0.5
0.2
0.1
0.01
0.02
0.05
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
Max. Permissible Forward Current
IF = f (TA)
Forward Current vs. Lead Length
between the Package Bottom and
the PC-Board IF = f (I), TA = 25 °C
T
OHR00880
0
F
Ι
0 20 40 60 80 100˚C
mA
25
50
75
100
125
OHR00949
F
Ι
00 5 10 15 20 25 mm 30
20
40
60
80
100
mA
120
2007-04-02 6
SFH 487 P
Maßzeichnung
Package Outlines
Maße in mm / Dimensions in mm.
Empfohlenes Lötpaddesign Wellenlöten (TTW)
Recommended Solder Pad TTW Soldering
Maße in mm (inch) / Dimensions in mm (inch).
1.8
1.2 29
27 4.5
4.0
3.5
2.0
1.7
3.1
2.5
2.54 mm
spacing
ø3.1
ø2.9
0.8
0.4
0.6
0.4 4.0
3.6
0.6
0.4
Chip position
Area not flat
GEX06308
0.7
0.4
Cathode
4 (0.157)
OHLPY985
4.8 (0.189)
SFH 487 P
2007-04-02 7
Lötbedingungen
Soldering Conditions
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organiza tion.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected
to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.
2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the he alth of the user may be endangered.
OHLY0598
0
050 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
